TWI402893B - 曝光方法 - Google Patents
曝光方法 Download PDFInfo
- Publication number
- TWI402893B TWI402893B TW097127865A TW97127865A TWI402893B TW I402893 B TWI402893 B TW I402893B TW 097127865 A TW097127865 A TW 097127865A TW 97127865 A TW97127865 A TW 97127865A TW I402893 B TWI402893 B TW I402893B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- nozzle member
- liquid
- exposure
- exposure apparatus
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 39
- 239000007788 liquid Substances 0.000 claims description 338
- 239000000758 substrate Substances 0.000 claims description 236
- 230000003287 optical effect Effects 0.000 claims description 178
- 230000007246 mechanism Effects 0.000 claims description 89
- 238000011084 recovery Methods 0.000 claims description 66
- 238000007654 immersion Methods 0.000 claims description 58
- 238000004519 manufacturing process Methods 0.000 claims description 15
- 238000012545 processing Methods 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 6
- 230000000704 physical effect Effects 0.000 claims description 6
- 238000005259 measurement Methods 0.000 description 35
- 238000005286 illumination Methods 0.000 description 26
- 230000001133 acceleration Effects 0.000 description 19
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 17
- 238000013016 damping Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 230000006866 deterioration Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 238000001514 detection method Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 238000003384 imaging method Methods 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- 239000005871 repellent Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 230000004075 alteration Effects 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 2
- 239000010627 cedar oil Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 239000010436 fluorite Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000001459 lithography Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 239000010702 perfluoropolyether Substances 0.000 description 2
- 230000010363 phase shift Effects 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 210000001747 pupil Anatomy 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 206010010071 Coma Diseases 0.000 description 1
- 229910000737 Duralumin Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 210000000887 face Anatomy 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000004108 freeze drying Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B27/00—Photographic printing apparatus
- G03B27/32—Projection printing apparatus, e.g. enlarger, copying camera
- G03B27/42—Projection printing apparatus, e.g. enlarger, copying camera for automatic sequential copying of the same original
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Microscoopes, Condenser (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004089348 | 2004-03-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200921762A TW200921762A (en) | 2009-05-16 |
| TWI402893B true TWI402893B (zh) | 2013-07-21 |
Family
ID=35056454
Family Applications (7)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097127865A TWI402893B (zh) | 2004-03-25 | 2005-03-23 | 曝光方法 |
| TW106109736A TWI628697B (zh) | 2004-03-25 | 2005-03-23 | 曝光裝置、及元件製造方法 |
| TW100139028A TWI486719B (zh) | 2004-03-25 | 2005-03-23 | 曝光方法 |
| TW104127306A TWI606485B (zh) | 2004-03-25 | 2005-03-23 | 曝光裝置、曝光方法、及元件製造方法 |
| TW094108912A TWI358746B (en) | 2004-03-25 | 2005-03-23 | Exposure apparatus and device manufacturing method |
| TW101149735A TWI518744B (zh) | 2004-03-25 | 2005-03-23 | 曝光裝置、曝光方法、及元件製造方法 |
| TW106145839A TW201816844A (zh) | 2004-03-25 | 2005-03-23 | 曝光裝置、曝光方法、及元件製造方法 |
Family Applications After (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106109736A TWI628697B (zh) | 2004-03-25 | 2005-03-23 | 曝光裝置、及元件製造方法 |
| TW100139028A TWI486719B (zh) | 2004-03-25 | 2005-03-23 | 曝光方法 |
| TW104127306A TWI606485B (zh) | 2004-03-25 | 2005-03-23 | 曝光裝置、曝光方法、及元件製造方法 |
| TW094108912A TWI358746B (en) | 2004-03-25 | 2005-03-23 | Exposure apparatus and device manufacturing method |
| TW101149735A TWI518744B (zh) | 2004-03-25 | 2005-03-23 | 曝光裝置、曝光方法、及元件製造方法 |
| TW106145839A TW201816844A (zh) | 2004-03-25 | 2005-03-23 | 曝光裝置、曝光方法、及元件製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (7) | US8111373B2 (OSRAM) |
| JP (13) | JP4525676B2 (OSRAM) |
| KR (8) | KR20180042456A (OSRAM) |
| TW (7) | TWI402893B (OSRAM) |
| WO (1) | WO2005093791A1 (OSRAM) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE467902T1 (de) | 2004-01-05 | 2010-05-15 | Nikon Corp | Belichtungsvorrichtung, belichtungsverfahren und bauelementeherstellungsverfahren |
| KR20180042456A (ko) * | 2004-03-25 | 2018-04-25 | 가부시키가이샤 니콘 | 노광 장치 및 디바이스 제조 방법 |
| US7486381B2 (en) | 2004-05-21 | 2009-02-03 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| KR101259190B1 (ko) | 2004-06-17 | 2013-04-29 | 가부시키가이샤 니콘 | 액침 리소그래피 렌즈에 대한 유체 압력 보상 |
| KR101285905B1 (ko) | 2004-07-01 | 2013-07-12 | 가부시키가이샤 니콘 | 액침 리소그래피용 동적 유체 제어 시스템 |
| EP1796146B1 (en) | 2004-09-17 | 2013-01-16 | Nikon Corporation | Exposure apparatus, exposure method, and method for manufacturing device |
| US7180571B2 (en) | 2004-12-08 | 2007-02-20 | Asml Netherlands B.V. | Lithographic projection apparatus and actuator |
| JP5239337B2 (ja) * | 2005-04-28 | 2013-07-17 | 株式会社ニコン | 露光方法及び露光装置、並びにデバイス製造方法 |
| JP2007012954A (ja) * | 2005-07-01 | 2007-01-18 | Canon Inc | 露光装置 |
| US7411658B2 (en) | 2005-10-06 | 2008-08-12 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7804577B2 (en) | 2005-11-16 | 2010-09-28 | Asml Netherlands B.V. | Lithographic apparatus |
| JP4514225B2 (ja) * | 2005-11-16 | 2010-07-28 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| US7864292B2 (en) | 2005-11-16 | 2011-01-04 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| KR101340138B1 (ko) * | 2005-12-08 | 2013-12-10 | 가부시키가이샤 니콘 | 기판 보지 장치, 노광 장치, 노광 방법 및 디바이스 제조방법 |
| US7701551B2 (en) | 2006-04-14 | 2010-04-20 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| DE102006023876A1 (de) * | 2006-05-19 | 2007-11-22 | Carl Zeiss Smt Ag | Optische Abbildungseinrichtung |
| US8027023B2 (en) | 2006-05-19 | 2011-09-27 | Carl Zeiss Smt Gmbh | Optical imaging device and method for reducing dynamic fluctuations in pressure difference |
| US7656502B2 (en) * | 2006-06-22 | 2010-02-02 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US20080198348A1 (en) * | 2007-02-20 | 2008-08-21 | Nikon Corporation | Apparatus and methods for minimizing force variation from immersion liquid in lithography systems |
| KR101538245B1 (ko) * | 2007-07-18 | 2015-07-20 | 가부시키가이샤 니콘 | 계측 방법, 스테이지 장치, 및 노광 장치 |
| NL1035908A1 (nl) | 2007-09-25 | 2009-03-26 | Asml Netherlands Bv | Lithographic apparatus and device manufacturing method. |
| KR101408783B1 (ko) | 2007-12-07 | 2014-06-17 | 삼성전자주식회사 | 반도체 소자의 제조장치 및 이를 이용한 반도체 소자의제조방법 |
| US8233139B2 (en) * | 2008-03-27 | 2012-07-31 | Nikon Corporation | Immersion system, exposure apparatus, exposing method, and device fabricating method |
| NL2003392A (en) | 2008-09-17 | 2010-03-18 | Asml Netherlands Bv | Lithographic apparatus and a method of operating the apparatus. |
| US9494870B2 (en) | 2012-10-12 | 2016-11-15 | Nikon Corporation | Exposure apparatus, exposing method, device manufacturing method, program, and recording medium |
| US9785051B2 (en) * | 2012-10-15 | 2017-10-10 | Asml Netherlands B.V. | Actuation mechanism, optical apparatus, lithography apparatus and method of manufacturing devices |
| JP6119242B2 (ja) * | 2012-12-27 | 2017-04-26 | 株式会社ニコン | 露光装置、露光方法、及びデバイス製造方法 |
| US10534277B2 (en) * | 2014-03-26 | 2020-01-14 | Nikon Corporation | Movable body apparatus, exposure apparatus, manufacturing method of flat panel display, and device manufacturing method |
| US10890748B2 (en) | 2014-05-29 | 2021-01-12 | Rarecyte, Inc. | Automated substrate loading |
| US10802260B2 (en) | 2014-05-29 | 2020-10-13 | Rarecyte, Inc. | Automated substrate loading |
| CN106415356B (zh) | 2014-05-29 | 2019-03-26 | 瑞尔赛特股份有限公司 | 用来将基板保持在二级装置内的设备 |
| US11300769B2 (en) | 2014-05-29 | 2022-04-12 | Rarecyte, Inc. | Automated substrate loading |
| US11422352B2 (en) | 2014-05-29 | 2022-08-23 | Rarecyte, Inc. | Automated substrate loading |
| JP7069177B2 (ja) | 2016-09-21 | 2022-05-17 | ネクストキュア インコーポレイテッド | シグレック－１５に対する抗体及びその使用方法 |
| JP6506785B2 (ja) * | 2017-02-02 | 2019-04-24 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | リソグラフィ用テンプレートの製造方法、プログラム及び基板処理装置 |
| WO2018147114A1 (ja) | 2017-02-08 | 2018-08-16 | 日立化成株式会社 | 電荷輸送性材料及びその利用 |
| CN113678046B (zh) | 2019-03-01 | 2024-08-13 | 瑞尔赛特股份有限公司 | 将基底保持在辅助装置中 |
| CN112684665B (zh) * | 2020-12-25 | 2024-06-25 | 浙江启尔机电技术有限公司 | 一种浸液供给回收装置 |
| KR102584513B1 (ko) | 2020-12-31 | 2023-10-06 | 세메스 주식회사 | 온도 변화가 수반되는 분위기에 제공되는 기판 지지 부재의 수평 측정용 기판형 센서, 이를 이용한 수평 측정 방법 및 비일시적 컴퓨터 판독가능 매체 |
| CN114690577B (zh) * | 2020-12-31 | 2024-10-25 | 上海微电子装备（集团）股份有限公司 | 一种管路柔性适应装置及浸没式光刻机 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW350980B (en) * | 1996-08-20 | 1999-01-21 | Tokyo Electron Ltd | Display processing method |
Family Cites Families (222)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1242527A (en) * | 1967-10-20 | 1971-08-11 | Kodak Ltd | Optical instruments |
| US4346164A (en) | 1980-10-06 | 1982-08-24 | Werner Tabarelli | Photolithographic method for the manufacture of integrated circuits |
| US4509852A (en) | 1980-10-06 | 1985-04-09 | Werner Tabarelli | Apparatus for the photolithographic manufacture of integrated circuit elements |
| JPS57153433A (en) | 1981-03-18 | 1982-09-22 | Hitachi Ltd | Manufacturing device for semiconductor |
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