TWI316044B - Methods and apparatus for material control system interface - Google Patents

Methods and apparatus for material control system interface

Info

Publication number
TWI316044B
TWI316044B TW094105942A TW94105942A TWI316044B TW I316044 B TWI316044 B TW I316044B TW 094105942 A TW094105942 A TW 094105942A TW 94105942 A TW94105942 A TW 94105942A TW I316044 B TWI316044 B TW I316044B
Authority
TW
Taiwan
Prior art keywords
methods
control system
system interface
material control
interface
Prior art date
Application number
TW094105942A
Other languages
English (en)
Other versions
TW200535078A (en
Inventor
David C Duffin
Daniel R Jessop
Michael Teferra
Amitabh Puri
Glade L Warner
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW200535078A publication Critical patent/TW200535078A/zh
Application granted granted Critical
Publication of TWI316044B publication Critical patent/TWI316044B/zh

Links

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B26D2001/0053—Cutting members therefor having a special cutting edge section or blade section
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/0006—Cutting members therefor
    • B26D2001/006—Cutting members therefor the cutting blade having a special shape, e.g. a special outline, serrations
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/31—From computer integrated manufacturing till monitoring
    • G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32266—Priority orders
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/32—Operator till task planning
    • G05B2219/32277—Agv schedule integrated into cell schedule
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Economics (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Strategic Management (AREA)
  • Human Resources & Organizations (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Development Economics (AREA)
  • Theoretical Computer Science (AREA)
  • General Business, Economics & Management (AREA)
  • Tourism & Hospitality (AREA)
  • Game Theory and Decision Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Educational Administration (AREA)
  • Marketing (AREA)
  • Automation & Control Theory (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW094105942A 2004-02-28 2005-02-25 Methods and apparatus for material control system interface TWI316044B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US54858804P 2004-02-28 2004-02-28

Publications (2)

Publication Number Publication Date
TW200535078A TW200535078A (en) 2005-11-01
TWI316044B true TWI316044B (en) 2009-10-21

Family

ID=35067599

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094105942A TWI316044B (en) 2004-02-28 2005-02-25 Methods and apparatus for material control system interface

Country Status (4)

Country Link
US (3) US7177716B2 (zh)
KR (1) KR20060043261A (zh)
CN (1) CN100426452C (zh)
TW (1) TWI316044B (zh)

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3975360B2 (ja) * 2003-10-31 2007-09-12 セイコーエプソン株式会社 供給制御システムおよび方法、プログラム並びに情報記憶媒体
US20050209721A1 (en) * 2003-11-06 2005-09-22 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US7218983B2 (en) * 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
US7720557B2 (en) * 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
CN1640797A (zh) * 2003-11-13 2005-07-20 应用材料有限公司 具有剪切构件的动态销和使用该动态销的衬底载体
JP4490124B2 (ja) * 2004-01-23 2010-06-23 セイコーエプソン株式会社 搬送状況提示システムおよび方法、プログラム並びに情報記憶媒体
TWI290875B (en) * 2004-02-28 2007-12-11 Applied Materials Inc Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
TWI316044B (en) * 2004-02-28 2009-10-21 Applied Materials Inc Methods and apparatus for material control system interface
US7831459B2 (en) * 2004-03-26 2010-11-09 Taiwan Semiconductor Manufacturing Co., Ltd. System and method for balancing production capacity
US7477958B2 (en) * 2005-05-11 2009-01-13 International Business Machines Corporation Method of release and product flow management for a manufacturing facility
US8573097B2 (en) * 2005-12-14 2013-11-05 Siemens Product Lifecycle Management Software Inc. System and method for automatic local return for lathe NC-machining cycle interruption
KR100929944B1 (ko) * 2006-02-07 2009-12-04 도쿄엘렉트론가부시키가이샤 기판 처리 장치의 제어 장치 및 기판 처리 장치의 제어 프로그램을 기록한 기억 매체
US7623936B1 (en) * 2006-02-16 2009-11-24 Advanced Micro Devices, Inc. Determining scheduling priority using queue time optimization
US7672748B2 (en) * 2006-04-17 2010-03-02 Chartered Semiconductor Manufacturing, Ltd. Automated manufacturing systems and methods
CN101443247B (zh) * 2006-05-12 2011-06-15 村田机械株式会社 搬送系统和搬送方法
JP5186370B2 (ja) * 2006-07-27 2013-04-17 株式会社アドバンテスト 電子部品移送方法および電子部品ハンドリング装置
US20080125900A1 (en) * 2006-09-15 2008-05-29 Maxim Carmen A Method and apparatus for scheduling material transport in a semiconductor manufacturing facility
US8160736B2 (en) * 2007-01-31 2012-04-17 Globalfoundries Singapore Pte. Ltd. Methods and apparatus for white space reduction in a production facility
WO2008097588A1 (en) * 2007-02-05 2008-08-14 Applied Materials, Inc. Small lot loadport configurations
US7356378B1 (en) * 2007-04-03 2008-04-08 Taiwan Semiconductor Manufacturing Company Method and system for smart vehicle route selection
US20080294282A1 (en) * 2007-05-24 2008-11-27 Applied Materials, Inc. Use of logical lots in semiconductor substrate processing
DE102007025339A1 (de) * 2007-05-31 2008-12-04 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter
US20090089772A1 (en) * 2007-09-28 2009-04-02 International Business Machines Corporation Arrangement for scheduling jobs with rules and events
US8369976B2 (en) * 2008-06-23 2013-02-05 International Business Machines Corporation Method for compensating for tool processing variation in the routing of wafers/lots
US8095230B2 (en) 2008-06-24 2012-01-10 International Business Machines Corporation Method for optimizing the routing of wafers/lots based on yield
TWI380145B (en) * 2008-07-25 2012-12-21 Inotera Memories Inc A cross-fab control system and a method for using the said system
US20100162954A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Integrated facility and process chamber for substrate processing
US7897525B2 (en) * 2008-12-31 2011-03-01 Archers Inc. Methods and systems of transferring, docking and processing substrates
US20100162955A1 (en) * 2008-12-31 2010-07-01 Lawrence Chung-Lai Lei Systems and methods for substrate processing
US8367565B2 (en) * 2008-12-31 2013-02-05 Archers Inc. Methods and systems of transferring, docking and processing substrates
US8110511B2 (en) * 2009-01-03 2012-02-07 Archers Inc. Methods and systems of transferring a substrate to minimize heat loss
US8483866B2 (en) * 2009-04-30 2013-07-09 Taiwan Semiconductor Manufacturing Co., Ltd. Automated materials handling system having multiple categories of overhead buffers
JP5445006B2 (ja) * 2009-10-05 2014-03-19 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP5392190B2 (ja) * 2010-06-01 2014-01-22 東京エレクトロン株式会社 基板処理システム及び基板処理方法
TWI549217B (zh) * 2014-01-10 2016-09-11 華亞科技股份有限公司 載具重組系統以及載具重組方法
US9576834B2 (en) * 2015-03-16 2017-02-21 Taiwan Semiconductor Manufacturing Co., Ltd. Stocker and method for dispatching wafer carrier in stocker
US10146439B2 (en) * 2016-04-13 2018-12-04 Samsung Electronics Co., Ltd. System and method for high performance lockless scalable target
CN112309887B (zh) * 2019-07-29 2023-03-21 华润微电子（重庆）有限公司 晶圆制造的预派工方法、电子装置、计算机设备和系统
CN111276429B (zh) * 2020-01-19 2021-07-20 长江存储科技有限责任公司 半导体机台控制方法、装置及存储介质

Family Cites Families (125)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3845286A (en) 1973-02-05 1974-10-29 Ibm Manufacturing control system for processing workpieces
JPS5337999B2 (zh) * 1973-07-24 1978-10-12
US4027246A (en) 1976-03-26 1977-05-31 International Business Machines Corporation Automated integrated circuit manufacturing system
US4049123A (en) 1976-06-01 1977-09-20 Western Electric Company, Inc. Methods of and apparatus for sorting articles in accordance with their resistivity and thickness
US4166527A (en) 1977-08-01 1979-09-04 Stelron Cam Company Device for picking up and placing articles on movable conveyors and assembly lines and to an endless construction and to an article pickup and deposit device therefor
JPS5591839A (en) 1978-12-29 1980-07-11 Seiko Epson Corp Production of electronic parts
JPS5828860A (ja) 1981-08-12 1983-02-19 Nec Corp 半導体装置及びその製造方法
JPS6049623A (ja) 1983-08-29 1985-03-18 Nec Kansai Ltd 半導体装置の製造方法
US4722659A (en) 1986-05-16 1988-02-02 Thermco Systems, Inc. Semiconductor wafer carrier transport apparatus
US4852717A (en) 1986-11-12 1989-08-01 Fmc Corporation Computer controlled light contact feeder
JPS63234511A (ja) 1987-03-24 1988-09-29 Nec Kyushu Ltd 半導体基板処理装置
US4974166A (en) 1987-05-18 1990-11-27 Asyst Technologies, Inc. Processing systems with intelligent article tracking
JPH03501840A (ja) 1987-05-21 1991-04-25 ハイン・デザイン・インコーポレイテッド シリコンウエハの整列方法及びその装置
KR0133681B1 (ko) 1987-10-12 1998-04-23 후쿠다 켄조오 웨이퍼 캐리어 반송용 처크
JPH01181156A (ja) 1988-01-13 1989-07-19 Nec Corp 部品管理方式
JPH0657384B2 (ja) 1988-04-05 1994-08-03 日立精機株式会社 生産ライン情報管理方法
JPH0215647A (ja) 1988-07-01 1990-01-19 Mitsubishi Electric Corp 半導体製造装置
US5064337A (en) 1988-07-19 1991-11-12 Tokyo Electron Limited Handling apparatus for transferring carriers and a method of transferring carriers
US5183378A (en) 1990-03-20 1993-02-02 Tokyo Electron Sagami Limited Wafer counter having device for aligning wafers
US5668056A (en) 1990-12-17 1997-09-16 United Microelectronics Corporation Single semiconductor wafer transfer method and manufacturing system
JPH05128131A (ja) 1991-10-31 1993-05-25 Nec Corp 外注管理システム
US5256204A (en) 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
JPH05290053A (ja) 1992-04-07 1993-11-05 Toshiba Corp 多品種少量生産管理システムにおける流し化情報の提供方法
US5442561A (en) * 1992-05-12 1995-08-15 Nippon Telegraph And Telephone Corporation Production management system and its application method
ATE129359T1 (de) 1992-08-04 1995-11-15 Ibm Verteilungseinrichtung mit gaszufuhr- abgabevorrichtung zum handhaben und speichern von abdichtbaren tragbaren unter druck stehenden behältern.
EP0582016B1 (en) 1992-08-04 1997-04-23 International Business Machines Corporation Pressurized sealable transportable containers for storing a semiconductor wafer in a protective gaseous environment
EP0582018B1 (en) 1992-08-04 1995-10-18 International Business Machines Corporation Pressurized interface apparatus for transferring a semiconductor wafer between a pressurized sealable transportable container and a processing equipment
ATE129361T1 (de) 1992-08-04 1995-11-15 Ibm Fertigungsstrasse architektur mit vollautomatisierten und rechnergesteuerten fördereinrichtungen geeignet für abdichtbaren tragbaren unter druck stehenden behältern.
JPH06132696A (ja) 1992-10-20 1994-05-13 Tokico Ltd 基板搬送装置
KR100303075B1 (ko) 1992-11-06 2001-11-30 조셉 제이. 스위니 집적회로 웨이퍼 이송 방법 및 장치
JP2912108B2 (ja) 1993-03-03 1999-06-28 三菱マテリアルシリコン株式会社 半導体ウェーハの生産管理システム
KR100221983B1 (ko) 1993-04-13 1999-09-15 히가시 데쓰로 처리장치
US5570990A (en) 1993-11-05 1996-11-05 Asyst Technologies, Inc. Human guided mobile loader stocker
DE69403890T2 (de) 1994-01-14 1998-01-08 Ibm Zusammenbau-/Ausbau-Einrichtung für abdichtbaren unter Druck stehenden Transportbehälter
US5544350A (en) 1994-07-05 1996-08-06 Taiwan Semiconductor Manufacturing Co. Ratio of running work in progress
US5696689A (en) * 1994-11-25 1997-12-09 Nippondenso Co., Ltd. Dispatch and conveyer control system for a production control system of a semiconductor substrate
US5884392A (en) 1994-12-23 1999-03-23 International Business Machines Corporation Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable containers
JP3334415B2 (ja) 1995-03-10 2002-10-15 株式会社デンソー 生産制御装置
US5612886A (en) 1995-05-12 1997-03-18 Taiwan Semiconductor Manufacturing Company Ltd. Method and system for dynamic dispatching in semiconductor manufacturing plants
JPH0950951A (ja) 1995-08-04 1997-02-18 Nikon Corp リソグラフィ方法およびリソグラフィ装置
JPH09115817A (ja) 1995-10-13 1997-05-02 Nikon Corp 露光方法及び装置
US5751581A (en) 1995-11-13 1998-05-12 Advanced Micro Devices Material movement server
JP2702466B2 (ja) * 1995-11-24 1998-01-21 山形日本電気株式会社 半導体ウェーハの生産方法及びその生産装置
JPH10112490A (ja) 1996-10-03 1998-04-28 Nidek Co Ltd 半導体ウェハ搬送装置
US5818716A (en) 1996-10-18 1998-10-06 Taiwan Semiconductor Manufacturing Company Ltd. Dynamic lot dispatching required turn rate factory control system and method of operation thereof
US5928389A (en) 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
JPH10135096A (ja) 1996-10-30 1998-05-22 Nittetsu Semiconductor Kk 半導体製造におけるスケジューリング方法
US5957648A (en) 1996-12-11 1999-09-28 Applied Materials, Inc. Factory automation apparatus and method for handling, moving and storing semiconductor wafer carriers
US6540466B2 (en) 1996-12-11 2003-04-01 Applied Materials, Inc. Compact apparatus and method for storing and loading semiconductor wafer carriers
EP0850720B1 (en) 1996-12-24 2002-09-18 Datasensor S.p.A. Manufacturing process for an article
US6009890A (en) 1997-01-21 2000-01-04 Tokyo Electron Limited Substrate transporting and processing system
US5825650A (en) 1997-03-11 1998-10-20 Taiwan Semiconductor Manufacturing Co., Ltd. Method for determining standard cycle time of a stage dynamically
US5980183A (en) 1997-04-14 1999-11-09 Asyst Technologies, Inc. Integrated intrabay buffer, delivery, and stocker system
DE19715974A1 (de) 1997-04-17 1998-10-22 Merck Patent Gmbh Versorgungssystem für Chemikalien und dessen Verwendung
JPH10326729A (ja) 1997-05-26 1998-12-08 Toshiba Corp 製造システム
US6579052B1 (en) 1997-07-11 2003-06-17 Asyst Technologies, Inc. SMIF pod storage, delivery and retrieval system
JPH1159829A (ja) 1997-08-08 1999-03-02 Mitsubishi Electric Corp 半導体ウェハカセット搬送装置、半導体ウェハカセット搬送装置で用いられるストッカ、ならびに半導体ウェハカセット搬送装置で用いられるストッカ入庫作業制御方法、ストッカ出庫作業制御方法、自動搬送車制御方法、およびストッカ在庫照合方法
US6053688A (en) 1997-08-25 2000-04-25 Cheng; David Method and apparatus for loading and unloading wafers from a wafer carrier
US6183186B1 (en) 1997-08-29 2001-02-06 Daitron, Inc. Wafer handling system and method
US5971585A (en) 1997-09-09 1999-10-26 International Business Machines Corporation Best can do matching of assets with demand in microelectronics manufacturing
US6128588A (en) 1997-10-01 2000-10-03 Sony Corporation Integrated wafer fab time standard (machine tact) database
JPH11121582A (ja) 1997-10-15 1999-04-30 Mitsubishi Electric Corp 半導体ウェハ製造設備制御方法および半導体ウェハ製造設備
JPH11176717A (ja) 1997-12-15 1999-07-02 Sony Corp 半導体装置の生産方法および半導体装置の生産管理方法とその装置
JPH11204615A (ja) 1998-01-19 1999-07-30 Speedfam Co Ltd ローディングロボットのウェーハローディング、アンローディング機構
US5974465A (en) * 1998-01-21 1999-10-26 3Com Corporation Method and apparatus for prioritizing the enqueueing of outbound data packets in a network device
US6039316A (en) 1998-03-02 2000-03-21 Xerox Corporation Multi-hierarchical control system for controlling object motion with smart matter
JP4502414B2 (ja) 1998-04-09 2010-07-14 Ｏｋｉセミコンダクタ株式会社 生産管理情報出力装置及び生産管理情報出力方法
FR2779421B1 (fr) 1998-06-08 2000-08-18 Incam Solutions Dispositif adaptateur pour des boites de confinement d'au moins un objet plat sous atmosphere ultrapropre
US6256550B1 (en) 1998-08-07 2001-07-03 Taiwan Semiconductor Manufacturing Company Overall equipment effectiveness on-line categories system and method
US6411859B1 (en) * 1998-08-28 2002-06-25 Advanced Micro Devices, Inc. Flow control in a semiconductor fabrication facility
KR100646906B1 (ko) * 1998-09-22 2006-11-17 동경 엘렉트론 주식회사 기판처리장치 및 기판처리방법
US7039495B1 (en) 1998-12-08 2006-05-02 Advance Micro Devices, Inc. Management of multiple types of empty carriers in automated material handling systems
US6240335B1 (en) 1998-12-14 2001-05-29 Palo Alto Technologies, Inc. Distributed control system architecture and method for a material transport system
US6662076B1 (en) 1999-02-10 2003-12-09 Advanced Micro Devices, Inc. Management of move requests from a factory system to an automated material handling system
US6745093B1 (en) 1999-03-17 2004-06-01 Hitachi, Ltd. Vacuum process apparatus and method of operating the same
US6415260B1 (en) 1999-04-21 2002-07-02 Taiwan Semiconductor Manufacturing Co., Ltd Dynamic capacity demand forecast system
DE19922936B4 (de) 1999-05-19 2004-04-29 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
CN1239969C (zh) 1999-06-22 2006-02-01 布鲁克斯自动化公司 用于微电子学器件生产的逐次运行控制器
US6196001B1 (en) 1999-10-12 2001-03-06 Alliedsignal Inc. Environment controlled WIP cart
DE19952195A1 (de) 1999-10-29 2001-05-17 Infineon Technologies Ag Anlage zur Bearbeitung von Wafern
US6873963B1 (en) 1999-11-30 2005-03-29 Daimlerchrysler Corporation Shipment tracking analysis and reporting system (STARS)
JP2001189363A (ja) 2000-01-04 2001-07-10 Mitsubishi Electric Corp 半導体装置製造設備およびその制御方法
KR100823237B1 (ko) 2000-01-17 2008-04-18 가부시키가이샤 에바라 세이사꾸쇼 기판반송제어장치 및 기판반송방법
US6431814B1 (en) 2000-02-02 2002-08-13 Advanced Micro Devices, Inc. Integrated wafer stocker and sorter with integrity verification system
US6714830B2 (en) 2000-02-28 2004-03-30 Canon Kabushiki Kaisha Push-type scheduling for semiconductor fabrication
ATE248761T1 (de) * 2000-03-17 2003-09-15 Witron Logistik & Inf Gmbh System zum kommissionieren von in regallagern befindlichen artikeln
US6641350B2 (en) 2000-04-17 2003-11-04 Hitachi Kokusai Electric Inc. Dual loading port semiconductor processing equipment
AU5269401A (en) * 2000-05-09 2001-11-20 Tokyo Electron Limited Semiconductor manufacturing system and control method thereof
JP2001345241A (ja) 2000-05-31 2001-12-14 Tokyo Electron Ltd 基板処理システム及び基板処理方法
JP2001351848A (ja) 2000-06-07 2001-12-21 Tokyo Electron Ltd 基板処理システム及び基板処理方法
JP4915033B2 (ja) 2000-06-15 2012-04-11 株式会社ニコン 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法
JP4180787B2 (ja) 2000-12-27 2008-11-12 東京エレクトロン株式会社 基板処理装置および基板処理方法
US6622055B2 (en) 2001-01-16 2003-09-16 United Microelectronics Corp. Method of control management of production line
US20020147960A1 (en) * 2001-01-26 2002-10-10 Applied Materials, Inc. Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control
US6854583B1 (en) 2001-02-06 2005-02-15 Middlesex General Industries, Inc. Conveyorized storage and transportation system
KR100410991B1 (ko) 2001-02-22 2003-12-18 삼성전자주식회사 반도체 제조장치의 로드포트
JP2002313880A (ja) 2001-04-19 2002-10-25 Hitachi Ltd 半導体集積回路装置の製造方法
DE10120701A1 (de) 2001-04-27 2002-10-31 Infineon Technologies Ag Verfahren zur Steuerung eines Prozeßgerätes zur sequentiellen Verarbeitung von Halbleiterwafern
US6681350B2 (en) * 2001-05-05 2004-01-20 Cadence Design Systems, Inc. Method and apparatus for testing memory cells for data retention faults
US6675066B2 (en) 2001-05-25 2004-01-06 George Koch Sons, Llc Conveyor line process control system and method
JP4017842B2 (ja) 2001-06-20 2007-12-05 株式会社ルネサステクノロジ 半導体デバイスの製造方法およびそのシステム
US6580967B2 (en) 2001-06-26 2003-06-17 Applied Materials, Inc. Method for providing distributed material management and flow control in an integrated circuit factory
JP2003045901A (ja) 2001-08-01 2003-02-14 Sony Corp 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法
JP2003142547A (ja) 2001-08-24 2003-05-16 Hirata Corp ワーク搬送装置
JP2003124286A (ja) 2001-10-18 2003-04-25 Mitsubishi Electric Corp 工程間搬送システムおよび工程間搬送方法
AUPR866401A0 (en) 2001-11-02 2001-11-29 MacKinlay, Robert Method and system for conveyor belt monitoring
US6673638B1 (en) 2001-11-14 2004-01-06 Kla-Tencor Corporation Method and apparatus for the production of process sensitive lithographic features
KR100577622B1 (ko) 2001-12-04 2006-05-10 로제 가부시키가이샤 용기의 일시적 반입, 유치, 반출용 장치
CN1449011A (zh) * 2002-03-28 2003-10-15 华邦电子股份有限公司 集成电路制造的推拉双向式派工方法
US6716651B2 (en) 2002-04-25 2004-04-06 Taiwan Semiconductor Manufacturing Co., Ltd Method and apparatus for identifying a wafer cassette
US8170899B2 (en) * 2002-05-29 2012-05-01 Oracle International Corporation Supply chain reservation
US6640148B1 (en) 2002-06-03 2003-10-28 Advanced Micro Devices, Inc. Method and apparatus for scheduled controller execution based upon impending lot arrival at a processing tool in an APC framework
US7234584B2 (en) 2002-08-31 2007-06-26 Applied Materials, Inc. System for transporting substrate carriers
US7243003B2 (en) 2002-08-31 2007-07-10 Applied Materials, Inc. Substrate carrier handler that unloads substrate carriers directly from a moving conveyor
US7487099B2 (en) 2002-09-10 2009-02-03 International Business Machines Corporation Method, system, and storage medium for resolving transport errors relating to automated material handling system transaction
US6715602B1 (en) 2002-11-15 2004-04-06 The Goodyear Tire & Rubber Company Sensor system for conveyor belt
US7077264B2 (en) 2003-01-27 2006-07-18 Applied Material, Inc. Methods and apparatus for transporting substrate carriers
US7221993B2 (en) * 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
JP2004296506A (ja) 2003-03-25 2004-10-21 Dainippon Screen Mfg Co Ltd 基板処理方法およびその装置
US20050096775A1 (en) * 2003-10-31 2005-05-05 Yu-Chih Wang Method and system of automatic carrier transfer
US20070276531A1 (en) 2003-11-06 2007-11-29 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US20050209721A1 (en) 2003-11-06 2005-09-22 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
TWI348450B (en) 2003-11-13 2011-09-11 Applied Materials Inc Break-away positioning conveyor mount for accommodating conveyor belt bends
US7051870B2 (en) 2003-11-26 2006-05-30 Applied Materials, Inc. Suspension track belt
TWI316044B (en) 2004-02-28 2009-10-21 Applied Materials Inc Methods and apparatus for material control system interface

Also Published As

Publication number Publication date
US7522969B2 (en) 2009-04-21
US7177716B2 (en) 2007-02-13
US7603196B2 (en) 2009-10-13
US20070276530A1 (en) 2007-11-29
TW200535078A (en) 2005-11-01
US20050273190A1 (en) 2005-12-08
KR20060043261A (ko) 2006-05-15
US20070124010A1 (en) 2007-05-31
CN100426452C (zh) 2008-10-15
CN1681083A (zh) 2005-10-12

Similar Documents

Publication Publication Date Title
TWI316044B (en) Methods and apparatus for material control system interface
GB0426807D0 (en) Flow control apparatus and method
TWI371296B (en) Control system and method for an exercise apparatus
EP1761842A4 (en) PROCESS AND DEVICE FOR INTEGRITY CONTROL
EP1744804A4 (en) METHOD AND SYSTEM FOR CONTROLLING GASTRIC VOLUME
HK1069522A1 (en) Control apparatus and control method
EP1838566A4 (en) DIRECTION CONTROL METHOD AND APPARATUS
HK1079035A1 (en) Apparatus and method for heating works
IL181595A0 (en) Process control system and method
EP1932127A4 (en) DEVICE CONTROL SYSTEM, METHOD AND DEVICE
EP1809986A4 (en) METHOD AND DEVICES FOR CONTROLLING UNCONDITIONED VEHICLES
EP1878210A4 (en) METHOD AND APPARATUS FOR NON-DISTURBING CALL MODIFICATION
TWI348644B (en) Update-startup apparatus and update-startup control method
ZA200608495B (en) Method and apparatus for diverting material
HK1116716A1 (en) Pressurized-training apparatus and control method for the same
EP1817763A4 (en) DISPLAY DEVICE AND CONTROL PROCEDURE THEREFOR
EP1851992A4 (en) METHOD AND APPARATUS FOR AMBIENT SOUND PROCESSING, USER INTERFACE AND CONTROL SYSTEM
EP1667485A4 (en) DEVICE AND METHOD FOR CONTROLLING
EP1813097A4 (en) DISPLAY DEVICE AND CONTROL METHOD THEREFOR
EP1812847A4 (en) DISPLAY DEVICE, CONTROL PROCESS THEREFOR AND DISPLAY SYSTEM
GB0325322D0 (en) Control method and apparatus
GB0408415D0 (en) Control device and method
EP1787190A4 (en) DISPLAY DEVICE AND METHOD FOR THEIR CONTROL
HK1100688A1 (en) Parking apparatus and control method for the same
EP1813099A4 (en) TV AND METHOD FOR ITS CONTROL

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees