TWI316044B - Methods and apparatus for material control system interface - Google Patents
Methods and apparatus for material control system interfaceInfo
- Publication number
- TWI316044B TWI316044B TW094105942A TW94105942A TWI316044B TW I316044 B TWI316044 B TW I316044B TW 094105942 A TW094105942 A TW 094105942A TW 94105942 A TW94105942 A TW 94105942A TW I316044 B TWI316044 B TW I316044B
- Authority
- TW
- Taiwan
- Prior art keywords
- methods
- control system
- system interface
- material control
- interface
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q10/00—Administration; Management
- G06Q10/06—Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/0053—Cutting members therefor having a special cutting edge section or blade section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
- B26D1/0006—Cutting members therefor
- B26D2001/006—Cutting members therefor the cutting blade having a special shape, e.g. a special outline, serrations
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31002—Computer controlled agv conveys workpieces between buffer and cell
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32266—Priority orders
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32277—Agv schedule integrated into cell schedule
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Economics (AREA)
- Entrepreneurship & Innovation (AREA)
- Strategic Management (AREA)
- Human Resources & Organizations (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Operations Research (AREA)
- Development Economics (AREA)
- Theoretical Computer Science (AREA)
- General Business, Economics & Management (AREA)
- Tourism & Hospitality (AREA)
- Game Theory and Decision Science (AREA)
- Manufacturing & Machinery (AREA)
- Educational Administration (AREA)
- Marketing (AREA)
- Automation & Control Theory (AREA)
- Forests & Forestry (AREA)
- Mechanical Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US54858804P | 2004-02-28 | 2004-02-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW200535078A TW200535078A (en) | 2005-11-01 |
TWI316044B true TWI316044B (en) | 2009-10-21 |
Family
ID=35067599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW094105942A TWI316044B (en) | 2004-02-28 | 2005-02-25 | Methods and apparatus for material control system interface |
Country Status (4)
Country | Link |
---|---|
US (3) | US7177716B2 (zh) |
KR (1) | KR20060043261A (zh) |
CN (1) | CN100426452C (zh) |
TW (1) | TWI316044B (zh) |
Families Citing this family (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3975360B2 (ja) * | 2003-10-31 | 2007-09-12 | セイコーエプソン株式会社 | 供給制御システムおよび方法、プログラム並びに情報記憶媒体 |
US20050209721A1 (en) * | 2003-11-06 | 2005-09-22 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
US7218983B2 (en) * | 2003-11-06 | 2007-05-15 | Applied Materials, Inc. | Method and apparatus for integrating large and small lot electronic device fabrication facilities |
US7720557B2 (en) * | 2003-11-06 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
US20050167554A1 (en) * | 2003-11-13 | 2005-08-04 | Rice Michael R. | Kinematic pin with shear member and substrate carrier for use therewith |
JP4490124B2 (ja) * | 2004-01-23 | 2010-06-23 | セイコーエプソン株式会社 | 搬送状況提示システムおよび方法、プログラム並びに情報記憶媒体 |
US7413069B2 (en) * | 2004-02-28 | 2008-08-19 | Applied Materials, Inc. | Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility |
TWI316044B (en) * | 2004-02-28 | 2009-10-21 | Applied Materials Inc | Methods and apparatus for material control system interface |
US7831459B2 (en) * | 2004-03-26 | 2010-11-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | System and method for balancing production capacity |
US7477958B2 (en) * | 2005-05-11 | 2009-01-13 | International Business Machines Corporation | Method of release and product flow management for a manufacturing facility |
US8573097B2 (en) * | 2005-12-14 | 2013-11-05 | Siemens Product Lifecycle Management Software Inc. | System and method for automatic local return for lathe NC-machining cycle interruption |
CN101213640B (zh) * | 2006-02-07 | 2010-08-04 | 东京毅力科创株式会社 | 基板处理装置的控制装置及基板处理装置的控制方法 |
US7623936B1 (en) * | 2006-02-16 | 2009-11-24 | Advanced Micro Devices, Inc. | Determining scheduling priority using queue time optimization |
US7672748B2 (en) * | 2006-04-17 | 2010-03-02 | Chartered Semiconductor Manufacturing, Ltd. | Automated manufacturing systems and methods |
CN101443247B (zh) * | 2006-05-12 | 2011-06-15 | 村田机械株式会社 | 搬送系统和搬送方法 |
KR101042655B1 (ko) * | 2006-07-27 | 2011-06-20 | 가부시키가이샤 아드반테스트 | 전자부품 이송방법 및 전자부품 핸들링 장치 |
US20080125900A1 (en) * | 2006-09-15 | 2008-05-29 | Maxim Carmen A | Method and apparatus for scheduling material transport in a semiconductor manufacturing facility |
US8160736B2 (en) * | 2007-01-31 | 2012-04-17 | Globalfoundries Singapore Pte. Ltd. | Methods and apparatus for white space reduction in a production facility |
TW200846262A (en) * | 2007-02-05 | 2008-12-01 | Applied Materials Inc | Small lot loadport configurations |
US7356378B1 (en) * | 2007-04-03 | 2008-04-08 | Taiwan Semiconductor Manufacturing Company | Method and system for smart vehicle route selection |
US20080294282A1 (en) * | 2007-05-24 | 2008-11-27 | Applied Materials, Inc. | Use of logical lots in semiconductor substrate processing |
DE102007025339A1 (de) * | 2007-05-31 | 2008-12-04 | Advanced Micro Devices, Inc., Sunnyvale | Verfahren und System zum Entfernen leerer Trägerbehälter von Prozessanlagen durch Steuern einer Zuordnung zwischen Steuerungsaufgaben und Trägerbehälter |
US20090089772A1 (en) * | 2007-09-28 | 2009-04-02 | International Business Machines Corporation | Arrangement for scheduling jobs with rules and events |
US8369976B2 (en) * | 2008-06-23 | 2013-02-05 | International Business Machines Corporation | Method for compensating for tool processing variation in the routing of wafers/lots |
US8095230B2 (en) | 2008-06-24 | 2012-01-10 | International Business Machines Corporation | Method for optimizing the routing of wafers/lots based on yield |
TWI380145B (en) * | 2008-07-25 | 2012-12-21 | Inotera Memories Inc | A cross-fab control system and a method for using the said system |
US8367565B2 (en) * | 2008-12-31 | 2013-02-05 | Archers Inc. | Methods and systems of transferring, docking and processing substrates |
US20100162954A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Integrated facility and process chamber for substrate processing |
US8110511B2 (en) * | 2009-01-03 | 2012-02-07 | Archers Inc. | Methods and systems of transferring a substrate to minimize heat loss |
US7897525B2 (en) * | 2008-12-31 | 2011-03-01 | Archers Inc. | Methods and systems of transferring, docking and processing substrates |
US20100162955A1 (en) * | 2008-12-31 | 2010-07-01 | Lawrence Chung-Lai Lei | Systems and methods for substrate processing |
US8483866B2 (en) * | 2009-04-30 | 2013-07-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Automated materials handling system having multiple categories of overhead buffers |
JP5445006B2 (ja) * | 2009-10-05 | 2014-03-19 | 東京エレクトロン株式会社 | 基板処理装置、基板処理方法及び記憶媒体 |
JP5392190B2 (ja) * | 2010-06-01 | 2014-01-22 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
TWI549217B (zh) * | 2014-01-10 | 2016-09-11 | 華亞科技股份有限公司 | 載具重組系統以及載具重組方法 |
US9576834B2 (en) * | 2015-03-16 | 2017-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Stocker and method for dispatching wafer carrier in stocker |
US10146439B2 (en) * | 2016-04-13 | 2018-12-04 | Samsung Electronics Co., Ltd. | System and method for high performance lockless scalable target |
CN112309887B (zh) * | 2019-07-29 | 2023-03-21 | 华润微电子(重庆)有限公司 | 晶圆制造的预派工方法、电子装置、计算机设备和系统 |
CN111276429B (zh) * | 2020-01-19 | 2021-07-20 | 长江存储科技有限责任公司 | 半导体机台控制方法、装置及存储介质 |
Family Cites Families (125)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3845286A (en) * | 1973-02-05 | 1974-10-29 | Ibm | Manufacturing control system for processing workpieces |
JPS5337999B2 (zh) * | 1973-07-24 | 1978-10-12 | ||
US4027246A (en) * | 1976-03-26 | 1977-05-31 | International Business Machines Corporation | Automated integrated circuit manufacturing system |
US4049123A (en) | 1976-06-01 | 1977-09-20 | Western Electric Company, Inc. | Methods of and apparatus for sorting articles in accordance with their resistivity and thickness |
US4166527A (en) * | 1977-08-01 | 1979-09-04 | Stelron Cam Company | Device for picking up and placing articles on movable conveyors and assembly lines and to an endless construction and to an article pickup and deposit device therefor |
JPS5591839A (en) | 1978-12-29 | 1980-07-11 | Seiko Epson Corp | Production of electronic parts |
JPS5828860A (ja) | 1981-08-12 | 1983-02-19 | Nec Corp | 半導体装置及びその製造方法 |
JPS6049623A (ja) | 1983-08-29 | 1985-03-18 | Nec Kansai Ltd | 半導体装置の製造方法 |
US4722659A (en) | 1986-05-16 | 1988-02-02 | Thermco Systems, Inc. | Semiconductor wafer carrier transport apparatus |
US4852717A (en) | 1986-11-12 | 1989-08-01 | Fmc Corporation | Computer controlled light contact feeder |
JPS63234511A (ja) | 1987-03-24 | 1988-09-29 | Nec Kyushu Ltd | 半導体基板処理装置 |
US4974166A (en) | 1987-05-18 | 1990-11-27 | Asyst Technologies, Inc. | Processing systems with intelligent article tracking |
DE3874892T2 (de) | 1987-05-21 | 1993-05-06 | Hine Design Inc | Verfahren und einrichtung zum ausrichten von siliciumplaettchen. |
KR0133681B1 (ko) | 1987-10-12 | 1998-04-23 | 후쿠다 켄조오 | 웨이퍼 캐리어 반송용 처크 |
JPH01181156A (ja) | 1988-01-13 | 1989-07-19 | Nec Corp | 部品管理方式 |
JPH0657384B2 (ja) | 1988-04-05 | 1994-08-03 | 日立精機株式会社 | 生産ライン情報管理方法 |
JPH0215647A (ja) | 1988-07-01 | 1990-01-19 | Mitsubishi Electric Corp | 半導体製造装置 |
US5064337A (en) | 1988-07-19 | 1991-11-12 | Tokyo Electron Limited | Handling apparatus for transferring carriers and a method of transferring carriers |
US5183378A (en) * | 1990-03-20 | 1993-02-02 | Tokyo Electron Sagami Limited | Wafer counter having device for aligning wafers |
US5668056A (en) * | 1990-12-17 | 1997-09-16 | United Microelectronics Corporation | Single semiconductor wafer transfer method and manufacturing system |
JPH05128131A (ja) | 1991-10-31 | 1993-05-25 | Nec Corp | 外注管理システム |
US5256204A (en) * | 1991-12-13 | 1993-10-26 | United Microelectronics Corporation | Single semiconductor water transfer method and manufacturing system |
JPH05290053A (ja) | 1992-04-07 | 1993-11-05 | Toshiba Corp | 多品種少量生産管理システムにおける流し化情報の提供方法 |
US5442561A (en) * | 1992-05-12 | 1995-08-15 | Nippon Telegraph And Telephone Corporation | Production management system and its application method |
ATE129360T1 (de) * | 1992-08-04 | 1995-11-15 | Ibm | Unter druck stehende koppelsysteme zum transferieren von einem halbleiterwafer zwischen einem tragbaren abdichtbaren unter druckstehenden behälter und einer bearbeitungsanlage. |
ES2078717T3 (es) * | 1992-08-04 | 1995-12-16 | Ibm | Aparato de reparticion con un sistema de distribucion y alimentacion de gas para manipular y almacenar recipientes transportables estancos a presion. |
ES2101070T3 (es) * | 1992-08-04 | 1997-07-01 | Ibm | Recipientes portatiles estancos a presion para almacenar una rebanada de semiconductor en un ambiente gaseoso protector. |
ES2078718T3 (es) * | 1992-08-04 | 1995-12-16 | Ibm | Estructuras de cadenas de fabricacion a base de transportadores totalmente automatizados e informatizados adaptados a recipientes transportables estancos a presion. |
JPH06132696A (ja) | 1992-10-20 | 1994-05-13 | Tokico Ltd | 基板搬送装置 |
KR100303075B1 (ko) * | 1992-11-06 | 2001-11-30 | 조셉 제이. 스위니 | 집적회로 웨이퍼 이송 방법 및 장치 |
JP2912108B2 (ja) | 1993-03-03 | 1999-06-28 | 三菱マテリアルシリコン株式会社 | 半導体ウェーハの生産管理システム |
KR100221983B1 (ko) | 1993-04-13 | 1999-09-15 | 히가시 데쓰로 | 처리장치 |
US5570990A (en) | 1993-11-05 | 1996-11-05 | Asyst Technologies, Inc. | Human guided mobile loader stocker |
DE69403890T2 (de) * | 1994-01-14 | 1998-01-08 | International Business Machines Corp., Armonk, N.Y. | Zusammenbau-/Ausbau-Einrichtung für abdichtbaren unter Druck stehenden Transportbehälter |
US5544350A (en) * | 1994-07-05 | 1996-08-06 | Taiwan Semiconductor Manufacturing Co. | Ratio of running work in progress |
US5696689A (en) * | 1994-11-25 | 1997-12-09 | Nippondenso Co., Ltd. | Dispatch and conveyer control system for a production control system of a semiconductor substrate |
US5884392A (en) * | 1994-12-23 | 1999-03-23 | International Business Machines Corporation | Automatic assembler/disassembler apparatus adapted to pressurized sealable transportable containers |
JP3334415B2 (ja) | 1995-03-10 | 2002-10-15 | 株式会社デンソー | 生産制御装置 |
US5612886A (en) * | 1995-05-12 | 1997-03-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Method and system for dynamic dispatching in semiconductor manufacturing plants |
JPH0950951A (ja) * | 1995-08-04 | 1997-02-18 | Nikon Corp | リソグラフィ方法およびリソグラフィ装置 |
JPH09115817A (ja) | 1995-10-13 | 1997-05-02 | Nikon Corp | 露光方法及び装置 |
US5751581A (en) | 1995-11-13 | 1998-05-12 | Advanced Micro Devices | Material movement server |
JP2702466B2 (ja) * | 1995-11-24 | 1998-01-21 | 山形日本電気株式会社 | 半導体ウェーハの生産方法及びその生産装置 |
JPH10112490A (ja) * | 1996-10-03 | 1998-04-28 | Nidek Co Ltd | 半導体ウェハ搬送装置 |
US5818716A (en) * | 1996-10-18 | 1998-10-06 | Taiwan Semiconductor Manufacturing Company Ltd. | Dynamic lot dispatching required turn rate factory control system and method of operation thereof |
US5928389A (en) | 1996-10-21 | 1999-07-27 | Applied Materials, Inc. | Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool |
JPH10135096A (ja) | 1996-10-30 | 1998-05-22 | Nittetsu Semiconductor Kk | 半導体製造におけるスケジューリング方法 |
US6540466B2 (en) * | 1996-12-11 | 2003-04-01 | Applied Materials, Inc. | Compact apparatus and method for storing and loading semiconductor wafer carriers |
US5957648A (en) * | 1996-12-11 | 1999-09-28 | Applied Materials, Inc. | Factory automation apparatus and method for handling, moving and storing semiconductor wafer carriers |
EP0850720B1 (en) | 1996-12-24 | 2002-09-18 | Datasensor S.p.A. | Manufacturing process for an article |
US6009890A (en) | 1997-01-21 | 2000-01-04 | Tokyo Electron Limited | Substrate transporting and processing system |
US5825650A (en) * | 1997-03-11 | 1998-10-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for determining standard cycle time of a stage dynamically |
US5980183A (en) | 1997-04-14 | 1999-11-09 | Asyst Technologies, Inc. | Integrated intrabay buffer, delivery, and stocker system |
DE19715974A1 (de) | 1997-04-17 | 1998-10-22 | Merck Patent Gmbh | Versorgungssystem für Chemikalien und dessen Verwendung |
JPH10326729A (ja) | 1997-05-26 | 1998-12-08 | Toshiba Corp | 製造システム |
US6579052B1 (en) | 1997-07-11 | 2003-06-17 | Asyst Technologies, Inc. | SMIF pod storage, delivery and retrieval system |
JPH1159829A (ja) * | 1997-08-08 | 1999-03-02 | Mitsubishi Electric Corp | 半導体ウェハカセット搬送装置、半導体ウェハカセット搬送装置で用いられるストッカ、ならびに半導体ウェハカセット搬送装置で用いられるストッカ入庫作業制御方法、ストッカ出庫作業制御方法、自動搬送車制御方法、およびストッカ在庫照合方法 |
US6053688A (en) * | 1997-08-25 | 2000-04-25 | Cheng; David | Method and apparatus for loading and unloading wafers from a wafer carrier |
US6183186B1 (en) | 1997-08-29 | 2001-02-06 | Daitron, Inc. | Wafer handling system and method |
US5971585A (en) * | 1997-09-09 | 1999-10-26 | International Business Machines Corporation | Best can do matching of assets with demand in microelectronics manufacturing |
US6128588A (en) * | 1997-10-01 | 2000-10-03 | Sony Corporation | Integrated wafer fab time standard (machine tact) database |
JPH11121582A (ja) | 1997-10-15 | 1999-04-30 | Mitsubishi Electric Corp | 半導体ウェハ製造設備制御方法および半導体ウェハ製造設備 |
JPH11176717A (ja) | 1997-12-15 | 1999-07-02 | Sony Corp | 半導体装置の生産方法および半導体装置の生産管理方法とその装置 |
JPH11204615A (ja) * | 1998-01-19 | 1999-07-30 | Speedfam Co Ltd | ローディングロボットのウェーハローディング、アンローディング機構 |
US5974465A (en) * | 1998-01-21 | 1999-10-26 | 3Com Corporation | Method and apparatus for prioritizing the enqueueing of outbound data packets in a network device |
US6039316A (en) | 1998-03-02 | 2000-03-21 | Xerox Corporation | Multi-hierarchical control system for controlling object motion with smart matter |
JP4502414B2 (ja) | 1998-04-09 | 2010-07-14 | Okiセミコンダクタ株式会社 | 生産管理情報出力装置及び生産管理情報出力方法 |
FR2779421B1 (fr) | 1998-06-08 | 2000-08-18 | Incam Solutions | Dispositif adaptateur pour des boites de confinement d'au moins un objet plat sous atmosphere ultrapropre |
US6256550B1 (en) | 1998-08-07 | 2001-07-03 | Taiwan Semiconductor Manufacturing Company | Overall equipment effectiveness on-line categories system and method |
US6411859B1 (en) * | 1998-08-28 | 2002-06-25 | Advanced Micro Devices, Inc. | Flow control in a semiconductor fabrication facility |
KR100646906B1 (ko) | 1998-09-22 | 2006-11-17 | 동경 엘렉트론 주식회사 | 기판처리장치 및 기판처리방법 |
US7039495B1 (en) | 1998-12-08 | 2006-05-02 | Advance Micro Devices, Inc. | Management of multiple types of empty carriers in automated material handling systems |
US6240335B1 (en) | 1998-12-14 | 2001-05-29 | Palo Alto Technologies, Inc. | Distributed control system architecture and method for a material transport system |
US6662076B1 (en) * | 1999-02-10 | 2003-12-09 | Advanced Micro Devices, Inc. | Management of move requests from a factory system to an automated material handling system |
US6745093B1 (en) | 1999-03-17 | 2004-06-01 | Hitachi, Ltd. | Vacuum process apparatus and method of operating the same |
US6415260B1 (en) * | 1999-04-21 | 2002-07-02 | Taiwan Semiconductor Manufacturing Co., Ltd | Dynamic capacity demand forecast system |
DE19922936B4 (de) | 1999-05-19 | 2004-04-29 | Infineon Technologies Ag | Anlage zur Bearbeitung von Wafern |
JP2003502771A (ja) * | 1999-06-22 | 2003-01-21 | ブルックス オートメーション インコーポレイテッド | マイクロエレクトロニクス製作に使用するラントゥーラン制御器 |
US6196001B1 (en) * | 1999-10-12 | 2001-03-06 | Alliedsignal Inc. | Environment controlled WIP cart |
DE19952195A1 (de) | 1999-10-29 | 2001-05-17 | Infineon Technologies Ag | Anlage zur Bearbeitung von Wafern |
US6873963B1 (en) | 1999-11-30 | 2005-03-29 | Daimlerchrysler Corporation | Shipment tracking analysis and reporting system (STARS) |
JP2001189363A (ja) | 2000-01-04 | 2001-07-10 | Mitsubishi Electric Corp | 半導体装置製造設備およびその制御方法 |
EP1255294A4 (en) | 2000-01-17 | 2009-01-21 | Ebara Corp | SEMI-SLIDE TRANSPORT CONTROL APPARATUS AND METHOD OF TRANSPORTING SEMICONDUCTED DISCS |
US6431814B1 (en) * | 2000-02-02 | 2002-08-13 | Advanced Micro Devices, Inc. | Integrated wafer stocker and sorter with integrity verification system |
US6714830B2 (en) | 2000-02-28 | 2004-03-30 | Canon Kabushiki Kaisha | Push-type scheduling for semiconductor fabrication |
ATE248761T1 (de) * | 2000-03-17 | 2003-09-15 | Witron Logistik & Inf Gmbh | System zum kommissionieren von in regallagern befindlichen artikeln |
US6641350B2 (en) | 2000-04-17 | 2003-11-04 | Hitachi Kokusai Electric Inc. | Dual loading port semiconductor processing equipment |
AU5269401A (en) * | 2000-05-09 | 2001-11-20 | Tokyo Electron Limited | Semiconductor manufacturing system and control method thereof |
JP2001345241A (ja) | 2000-05-31 | 2001-12-14 | Tokyo Electron Ltd | 基板処理システム及び基板処理方法 |
JP2001351848A (ja) | 2000-06-07 | 2001-12-21 | Tokyo Electron Ltd | 基板処理システム及び基板処理方法 |
JP4915033B2 (ja) | 2000-06-15 | 2012-04-11 | 株式会社ニコン | 露光装置、基板処理装置及びリソグラフィシステム、並びにデバイス製造方法 |
JP4180787B2 (ja) | 2000-12-27 | 2008-11-12 | 東京エレクトロン株式会社 | 基板処理装置および基板処理方法 |
US6622055B2 (en) * | 2001-01-16 | 2003-09-16 | United Microelectronics Corp. | Method of control management of production line |
US20020147960A1 (en) * | 2001-01-26 | 2002-10-10 | Applied Materials, Inc. | Method and apparatus for determining scheduling for wafer processing in cluster tools with integrated metrology and defect control |
US6854583B1 (en) | 2001-02-06 | 2005-02-15 | Middlesex General Industries, Inc. | Conveyorized storage and transportation system |
KR100410991B1 (ko) | 2001-02-22 | 2003-12-18 | 삼성전자주식회사 | 반도체 제조장치의 로드포트 |
JP2002313880A (ja) | 2001-04-19 | 2002-10-25 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
DE10120701A1 (de) * | 2001-04-27 | 2002-10-31 | Infineon Technologies Ag | Verfahren zur Steuerung eines Prozeßgerätes zur sequentiellen Verarbeitung von Halbleiterwafern |
US6681350B2 (en) * | 2001-05-05 | 2004-01-20 | Cadence Design Systems, Inc. | Method and apparatus for testing memory cells for data retention faults |
US6675066B2 (en) | 2001-05-25 | 2004-01-06 | George Koch Sons, Llc | Conveyor line process control system and method |
JP4017842B2 (ja) | 2001-06-20 | 2007-12-05 | 株式会社ルネサステクノロジ | 半導体デバイスの製造方法およびそのシステム |
US6580967B2 (en) | 2001-06-26 | 2003-06-17 | Applied Materials, Inc. | Method for providing distributed material management and flow control in an integrated circuit factory |
JP2003045901A (ja) | 2001-08-01 | 2003-02-14 | Sony Corp | 素子の転写方法及びこれを用いた素子の配列方法、画像表示装置の製造方法 |
JP2003142547A (ja) | 2001-08-24 | 2003-05-16 | Hirata Corp | ワーク搬送装置 |
JP2003124286A (ja) | 2001-10-18 | 2003-04-25 | Mitsubishi Electric Corp | 工程間搬送システムおよび工程間搬送方法 |
AUPR866401A0 (en) | 2001-11-02 | 2001-11-29 | MacKinlay, Robert | Method and system for conveyor belt monitoring |
US6673638B1 (en) * | 2001-11-14 | 2004-01-06 | Kla-Tencor Corporation | Method and apparatus for the production of process sensitive lithographic features |
US7695234B2 (en) | 2001-12-04 | 2010-04-13 | Rorze Corporation | Device for temporarily loading, storing and unloading a container |
CN1449011A (zh) * | 2002-03-28 | 2003-10-15 | 华邦电子股份有限公司 | 集成电路制造的推拉双向式派工方法 |
US6716651B2 (en) | 2002-04-25 | 2004-04-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for identifying a wafer cassette |
US8170899B2 (en) * | 2002-05-29 | 2012-05-01 | Oracle International Corporation | Supply chain reservation |
US6640148B1 (en) | 2002-06-03 | 2003-10-28 | Advanced Micro Devices, Inc. | Method and apparatus for scheduled controller execution based upon impending lot arrival at a processing tool in an APC framework |
US7234584B2 (en) | 2002-08-31 | 2007-06-26 | Applied Materials, Inc. | System for transporting substrate carriers |
US7243003B2 (en) | 2002-08-31 | 2007-07-10 | Applied Materials, Inc. | Substrate carrier handler that unloads substrate carriers directly from a moving conveyor |
US7487099B2 (en) * | 2002-09-10 | 2009-02-03 | International Business Machines Corporation | Method, system, and storage medium for resolving transport errors relating to automated material handling system transaction |
US6715602B1 (en) | 2002-11-15 | 2004-04-06 | The Goodyear Tire & Rubber Company | Sensor system for conveyor belt |
US7077264B2 (en) | 2003-01-27 | 2006-07-18 | Applied Material, Inc. | Methods and apparatus for transporting substrate carriers |
US7221993B2 (en) * | 2003-01-27 | 2007-05-22 | Applied Materials, Inc. | Systems and methods for transferring small lot size substrate carriers between processing tools |
JP2004296506A (ja) * | 2003-03-25 | 2004-10-21 | Dainippon Screen Mfg Co Ltd | 基板処理方法およびその装置 |
US20050096775A1 (en) * | 2003-10-31 | 2005-05-05 | Yu-Chih Wang | Method and system of automatic carrier transfer |
US20050209721A1 (en) | 2003-11-06 | 2005-09-22 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
US20070276531A1 (en) | 2003-11-06 | 2007-11-29 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
TWI348450B (en) | 2003-11-13 | 2011-09-11 | Applied Materials Inc | Break-away positioning conveyor mount for accommodating conveyor belt bends |
US7051870B2 (en) | 2003-11-26 | 2006-05-30 | Applied Materials, Inc. | Suspension track belt |
TWI316044B (en) * | 2004-02-28 | 2009-10-21 | Applied Materials Inc | Methods and apparatus for material control system interface |
-
2005
- 2005-02-25 TW TW094105942A patent/TWI316044B/zh not_active IP Right Cessation
- 2005-02-25 US US11/067,311 patent/US7177716B2/en not_active Expired - Fee Related
- 2005-02-28 CN CNB2005100697172A patent/CN100426452C/zh not_active Expired - Fee Related
- 2005-02-28 KR KR1020050016716A patent/KR20060043261A/ko not_active Application Discontinuation
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2007
- 2007-01-24 US US11/626,509 patent/US7603196B2/en not_active Expired - Fee Related
- 2007-08-14 US US11/838,284 patent/US7522969B2/en not_active Expired - Fee Related
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US7522969B2 (en) | 2009-04-21 |
US20050273190A1 (en) | 2005-12-08 |
US7177716B2 (en) | 2007-02-13 |
TW200535078A (en) | 2005-11-01 |
KR20060043261A (ko) | 2006-05-15 |
CN1681083A (zh) | 2005-10-12 |
CN100426452C (zh) | 2008-10-15 |
US20070276530A1 (en) | 2007-11-29 |
US7603196B2 (en) | 2009-10-13 |
US20070124010A1 (en) | 2007-05-31 |
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