ES2101070T3 - Recipientes portatiles estancos a presion para almacenar una rebanada de semiconductor en un ambiente gaseoso protector. - Google Patents
Recipientes portatiles estancos a presion para almacenar una rebanada de semiconductor en un ambiente gaseoso protector.Info
- Publication number
- ES2101070T3 ES2101070T3 ES92480109T ES92480109T ES2101070T3 ES 2101070 T3 ES2101070 T3 ES 2101070T3 ES 92480109 T ES92480109 T ES 92480109T ES 92480109 T ES92480109 T ES 92480109T ES 2101070 T3 ES2101070 T3 ES 2101070T3
- Authority
- ES
- Spain
- Prior art keywords
- holder
- interior space
- reservoir
- wafer
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/70741—Handling masks outside exposure position, e.g. reticle libraries
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
- G03F7/7075—Handling workpieces outside exposure position, e.g. SMIF box
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67353—Closed carriers specially adapted for a single substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
- H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Library & Information Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Casings For Electric Apparatus (AREA)
- Packages (AREA)
Abstract
Un recipiente portátil estanco a presión (100) que comprende: un depósito de casete (123) de forma prácticamente paralelepípeda, constituido fundamentalmente por un alojamiento en forma de caja (102) que define un espacio interior (103) que comprende una abertura de acceso principal (104) sobre la cara lateral delantera, adaptado a la transferencia de entrada y de salida de un objeto, estando provisto dicho alojamiento de una pared interna (106) que separa dicho espacio interior (103) en dos regiones: una primera región (103A) que se denomina depósito y una segunda región (103B) que se denomina receptáculo que está destinado a recibir dicho objeto, estando provista dicha pared interna de medios de agujeros adaptados para permitir la circulación de una gas entre dichas primera y segunda regiones, un medio de válvula de inyección de gas (129) insertado en una abertura hecha en dicho alojamiento en comunicación con dicho depósito, estando adaptado dicho medio de inyección de gas para ser unidoa una instalación de alimentación de gas neutro ultra puro comprimido (700) afin de establecer una primera presión estática o nominal determinada p en el interior de dicho espacio interior que presenta una presión diferencial positiva Wp con relación al ambiente exterior af n de crear una sobrepresión entre estos, un medio de soporte (108) destinado a mantener firmemente y con precisión un objeto en el interior de dicho receptáculo, y un medio de puerta (124) que se adapta de manera estanca a dicha abertura de acceso principal (104).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP92480109A EP0582016B1 (en) | 1992-08-04 | 1992-08-04 | Pressurized sealable transportable containers for storing a semiconductor wafer in a protective gaseous environment |
Publications (1)
Publication Number | Publication Date |
---|---|
ES2101070T3 true ES2101070T3 (es) | 1997-07-01 |
Family
ID=8211796
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ES92480109T Expired - Lifetime ES2101070T3 (es) | 1992-08-04 | 1992-08-04 | Recipientes portatiles estancos a presion para almacenar una rebanada de semiconductor en un ambiente gaseoso protector. |
Country Status (7)
Country | Link |
---|---|
US (1) | US5390785A (es) |
EP (1) | EP0582016B1 (es) |
JP (1) | JP2644166B2 (es) |
AT (1) | ATE152286T1 (es) |
CA (1) | CA2094438C (es) |
DE (1) | DE69219329T2 (es) |
ES (1) | ES2101070T3 (es) |
Families Citing this family (73)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5785186A (en) * | 1994-10-11 | 1998-07-28 | Progressive System Technologies, Inc. | Substrate housing and docking system |
US5713711A (en) * | 1995-01-17 | 1998-02-03 | Bye/Oasis | Multiple interface door for wafer storage and handling container |
US5833726A (en) * | 1995-05-26 | 1998-11-10 | Extraction System, Inc. | Storing substrates between process steps within a processing facility |
GB2337363A (en) * | 1995-07-08 | 1999-11-17 | Samsung Electronics Co Ltd | Equipment for semiconductor fabrication |
KR100207446B1 (ko) * | 1995-07-08 | 1999-07-15 | 윤종용 | 반도체 제조관리용 카세트, 이의 제조방법 및 카세트 인식장치의 설치방법 |
US5561915A (en) * | 1995-07-12 | 1996-10-08 | Vandergriff; Johnie B. | Storage container with sealed storage compartment for a purging gas cartridge |
US5997588A (en) * | 1995-10-13 | 1999-12-07 | Advanced Semiconductor Materials America, Inc. | Semiconductor processing system with gas curtain |
DE19540963C2 (de) * | 1995-11-03 | 1999-05-20 | Jenoptik Jena Gmbh | Transportbehälter für scheibenförmige Objekte |
FR2747112B1 (fr) * | 1996-04-03 | 1998-05-07 | Commissariat Energie Atomique | Dispositif de transport d'objets plats et procede de transfert de ces objets entre ledit dispositif et une machine de traitement |
US5711427A (en) * | 1996-07-12 | 1998-01-27 | Fluoroware, Inc. | Wafer carrier with door |
US5827118A (en) * | 1996-08-28 | 1998-10-27 | Seh America, Inc. | Clean storage unit air flow system |
US6010399A (en) * | 1996-12-02 | 2000-01-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Use of a sensor to control the fan filter unit of a standard mechanical inter face |
TW510004B (en) | 1997-08-29 | 2002-11-11 | Nikon Corp | Photomask case, conveying device, and conveying method |
US6189238B1 (en) * | 1998-11-30 | 2001-02-20 | Lucent Technologies Inc. | Portable purge system for transporting materials |
JP3556519B2 (ja) * | 1999-04-30 | 2004-08-18 | 信越ポリマー株式会社 | 基板収納容器の識別構造及び基板収納容器の識別方法 |
US6612797B1 (en) * | 1999-05-18 | 2003-09-02 | Asyst Technologies, Inc. | Cassette buffering within a minienvironment |
US6318953B1 (en) * | 1999-07-12 | 2001-11-20 | Asyst Technologies, Inc. | SMIF-compatible open cassette enclosure |
DE10059633A1 (de) | 2000-12-01 | 2002-06-20 | Hte Ag | Verfahren und Vorrichtung zur Überführung von luftempfindlichen Substanzen |
US7219802B2 (en) * | 2001-04-01 | 2007-05-22 | Entegris, Inc. | Thin wafer insert |
KR100407568B1 (ko) * | 2001-06-01 | 2003-12-01 | 삼성전자주식회사 | 장치설치영역 내에 지지대를 갖는 반도체 제조 장치 |
US6619903B2 (en) * | 2001-08-10 | 2003-09-16 | Glenn M. Friedman | System and method for reticle protection and transport |
US7604306B1 (en) | 2001-08-23 | 2009-10-20 | Taiwan Semiconductor Manufacturing Company | Reticle box transport cart |
US7121414B2 (en) * | 2001-12-28 | 2006-10-17 | Brooks Automation, Inc. | Semiconductor cassette reducer |
WO2003096410A1 (fr) * | 2002-05-10 | 2003-11-20 | Tokyo Electron Limited | Dispositif de traitement de substrat |
US7789401B2 (en) * | 2002-07-03 | 2010-09-07 | Securitypoint Holdings, Llc. | Carts for use in security screening |
CA2491151C (en) * | 2002-07-03 | 2016-02-23 | Security Point Media | Advertising trays for security screening |
US20070132580A1 (en) * | 2002-07-03 | 2007-06-14 | Ambrefe Joseph T Jr | Trays for use in security screening |
EP1396759A3 (en) * | 2002-08-30 | 2006-08-02 | ASML Netherlands B.V. | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
EP1394611A1 (en) * | 2002-08-30 | 2004-03-03 | ASML Netherlands BV | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
US7234584B2 (en) * | 2002-08-31 | 2007-06-26 | Applied Materials, Inc. | System for transporting substrate carriers |
US7243003B2 (en) | 2002-08-31 | 2007-07-10 | Applied Materials, Inc. | Substrate carrier handler that unloads substrate carriers directly from a moving conveyor |
US20050095110A1 (en) * | 2002-08-31 | 2005-05-05 | Lowrance Robert B. | Method and apparatus for unloading substrate carriers from substrate carrier transport system |
US7930061B2 (en) * | 2002-08-31 | 2011-04-19 | Applied Materials, Inc. | Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback |
US7506746B2 (en) | 2002-08-31 | 2009-03-24 | Applied Materials, Inc. | System for transporting substrate carriers |
US7258520B2 (en) * | 2002-08-31 | 2007-08-21 | Applied Materials, Inc. | Methods and apparatus for using substrate carrier movement to actuate substrate carrier door opening/closing |
US7684895B2 (en) | 2002-08-31 | 2010-03-23 | Applied Materials, Inc. | Wafer loading station that automatically retracts from a moving conveyor in response to an unscheduled event |
US20090308030A1 (en) * | 2003-01-27 | 2009-12-17 | Applied Materials, Inc. | Load port configurations for small lot size substrate carriers |
US7578647B2 (en) * | 2003-01-27 | 2009-08-25 | Applied Materials, Inc. | Load port configurations for small lot size substrate carriers |
US7778721B2 (en) * | 2003-01-27 | 2010-08-17 | Applied Materials, Inc. | Small lot size lithography bays |
US7611318B2 (en) * | 2003-01-27 | 2009-11-03 | Applied Materials, Inc. | Overhead transfer flange and support for suspending a substrate carrier |
US7221993B2 (en) * | 2003-01-27 | 2007-05-22 | Applied Materials, Inc. | Systems and methods for transferring small lot size substrate carriers between processing tools |
US7097714B2 (en) * | 2003-09-17 | 2006-08-29 | Intersil Americas Inc. | Particulate removal from an electrostatic chuck |
JP2005123292A (ja) * | 2003-10-15 | 2005-05-12 | Canon Inc | 収納装置、当該収納装置を用いた露光方法 |
US7218983B2 (en) * | 2003-11-06 | 2007-05-15 | Applied Materials, Inc. | Method and apparatus for integrating large and small lot electronic device fabrication facilities |
US20050209721A1 (en) * | 2003-11-06 | 2005-09-22 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
US7720557B2 (en) * | 2003-11-06 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for enhanced operation of substrate carrier handlers |
DE102004006287A1 (de) * | 2004-02-09 | 2005-09-15 | Siemens Ag | Verfahren zur Qualitätskontrolle der Produktion in wenigstens einem Reinraum |
US7274971B2 (en) | 2004-02-28 | 2007-09-25 | Applied Materials, Inc. | Methods and apparatus for electronic device manufacturing system monitoring and control |
US7413069B2 (en) * | 2004-02-28 | 2008-08-19 | Applied Materials, Inc. | Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility |
TWI316044B (en) | 2004-02-28 | 2009-10-21 | Applied Materials Inc | Methods and apparatus for material control system interface |
US7611319B2 (en) * | 2004-06-16 | 2009-11-03 | Applied Materials, Inc. | Methods and apparatus for identifying small lot size substrate carriers |
TW200614411A (en) * | 2004-09-04 | 2006-05-01 | Applied Materials Inc | Substrate carrier having reduced height |
JP2006128188A (ja) * | 2004-10-26 | 2006-05-18 | Nikon Corp | 基板搬送装置、基板搬送方法および露光装置 |
US7528936B2 (en) * | 2005-02-27 | 2009-05-05 | Entegris, Inc. | Substrate container with pressure equalization |
US7723701B1 (en) | 2005-07-29 | 2010-05-25 | South Bay Technology, Inc. | Specimen preservation systems and methods |
TW200725784A (en) * | 2005-11-21 | 2007-07-01 | Applied Materials Inc | Apparatus and methods for a substrate carrier having an inflatable seal |
US20070141280A1 (en) * | 2005-12-16 | 2007-06-21 | Applied Materials, Inc. | Substrate carrier having an interior lining |
US20070258796A1 (en) * | 2006-04-26 | 2007-11-08 | Englhardt Eric A | Methods and apparatus for transporting substrate carriers |
US7418982B2 (en) | 2006-05-17 | 2008-09-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Substrate carrier and facility interface and apparatus including same |
US9105673B2 (en) * | 2007-05-09 | 2015-08-11 | Brooks Automation, Inc. | Side opening unified pod |
US9516460B2 (en) | 2008-03-28 | 2016-12-06 | Securitypoint Holdings Llc | Systems and methods for security checkpoint condition information and sharing |
US9116513B2 (en) | 2008-03-28 | 2015-08-25 | Securitypoint Holdings, Inc. | Methods and systems for efficient security screening |
TW201111952A (en) * | 2009-09-25 | 2011-04-01 | Pegatron Corp | Computer |
TWI430929B (zh) * | 2011-04-19 | 2014-03-21 | Gudeng Prec Ind Co Ltd | 傳送盒 |
SG194239A1 (en) | 2012-04-09 | 2013-11-29 | Semiconductor Tech & Instr Inc | End handler |
JP5981307B2 (ja) * | 2012-11-07 | 2016-08-31 | 東京エレクトロン株式会社 | 処理方法及び処理装置 |
DE102015117290A1 (de) * | 2015-10-09 | 2017-04-13 | Max Petek Reinraumtechnik | Reinraumvorrichtung |
US10518985B2 (en) * | 2016-05-31 | 2019-12-31 | Wood's Powr-Grip Co., Inc. | Control systems and methods for vacuum lift equipment |
TWI579215B (zh) | 2016-10-07 | 2017-04-21 | 家登精密工業股份有限公司 | 垂直固定機構傳送盒及使用其之傳送方法 |
CN108107672B (zh) | 2016-11-25 | 2021-03-02 | 上海微电子装备(集团)股份有限公司 | 一种掩模版版盒 |
DE102017105699B4 (de) | 2017-03-16 | 2021-08-05 | Manuel Mikczinski | Schutzgehäuse mit gasdicht miteinander verbundenen Seitenwänden |
WO2022103576A1 (en) * | 2020-11-13 | 2022-05-19 | Applied Materials, Inc. | Apparatus and system for delivering gas to a process chamber |
CN114735625B (zh) * | 2022-04-13 | 2024-04-05 | 浙江大学杭州国际科创中心 | 一种非晶碳膜加工用惰性物质植入设备 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5895812A (ja) * | 1981-12-01 | 1983-06-07 | Nippon Kogaku Kk <Nikon> | 基板の収納容器及び収納容器の装着装置 |
JPS61282229A (ja) * | 1985-06-05 | 1986-12-12 | Canon Inc | 防塵カセツト |
US4674939A (en) * | 1984-07-30 | 1987-06-23 | Asyst Technologies | Sealed standard interface apparatus |
US4776462A (en) * | 1985-09-27 | 1988-10-11 | Canon Kabushiki Kaisha | Container for a sheet-like article |
JPH06102478B2 (ja) * | 1985-12-03 | 1994-12-14 | 株式会社ジャパンエナジー | 半導体ウェーハー包装容器 |
US4739882A (en) * | 1986-02-13 | 1988-04-26 | Asyst Technologies | Container having disposable liners |
JPH068472B2 (ja) * | 1986-02-26 | 1994-02-02 | 日産自動車株式会社 | 繊維強化型複合材料用繊維成形体の製造方法 |
US4724874A (en) * | 1986-05-01 | 1988-02-16 | Asyst Technologies | Sealable transportable container having a particle filtering system |
DE3637880C2 (de) * | 1986-11-06 | 1994-09-01 | Meissner & Wurst | Transportierbares Behältnis zur Handhabung von Halbleiterelementen während ihrer Herstellung sowie Verfahren zur partikelfreien Übergabe von Produkten |
FR2620049B2 (fr) * | 1986-11-28 | 1989-11-24 | Commissariat Energie Atomique | Procede de traitement, stockage et/ou transfert d'un objet dans une atmosphere de haute proprete, et conteneur pour la mise en oeuvre de ce procede |
JPS63178958A (ja) * | 1986-12-27 | 1988-07-23 | キヤノン株式会社 | 防塵容器 |
JPH0227356A (ja) * | 1988-07-15 | 1990-01-30 | Fujitsu Ltd | 防塵型板状体保管ケース |
JPH0221741U (es) * | 1988-07-28 | 1990-02-14 | ||
JPH0712093B2 (ja) * | 1988-08-03 | 1995-02-08 | 信越半導体株式会社 | 発光半導体素子基板及びその製造方法 |
JPH03214645A (ja) * | 1990-01-18 | 1991-09-19 | Mitsubishi Electric Corp | 半導体ウエハの収納・搬送装置 |
DE4024973C2 (de) * | 1990-08-07 | 1994-11-03 | Ibm | Anordnung zum Lagern, Transportieren und Einschleusen von Substraten |
US5255783A (en) * | 1991-12-20 | 1993-10-26 | Fluoroware, Inc. | Evacuated wafer container |
-
1992
- 1992-08-04 ES ES92480109T patent/ES2101070T3/es not_active Expired - Lifetime
- 1992-08-04 DE DE69219329T patent/DE69219329T2/de not_active Expired - Lifetime
- 1992-08-04 EP EP92480109A patent/EP0582016B1/en not_active Expired - Lifetime
- 1992-08-04 AT AT92480109T patent/ATE152286T1/de active
-
1993
- 1993-04-20 CA CA002094438A patent/CA2094438C/en not_active Expired - Fee Related
- 1993-06-29 JP JP5158472A patent/JP2644166B2/ja not_active Expired - Fee Related
- 1993-08-03 US US08/101,599 patent/US5390785A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
DE69219329T2 (de) | 1997-10-30 |
CA2094438C (en) | 1998-04-21 |
EP0582016B1 (en) | 1997-04-23 |
CA2094438A1 (en) | 1994-02-05 |
JP2644166B2 (ja) | 1997-08-25 |
ATE152286T1 (de) | 1997-05-15 |
DE69219329D1 (de) | 1997-05-28 |
JPH06104331A (ja) | 1994-04-15 |
US5390785A (en) | 1995-02-21 |
EP0582016A1 (en) | 1994-02-09 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2101070T3 (es) | Recipientes portatiles estancos a presion para almacenar una rebanada de semiconductor en un ambiente gaseoso protector. | |
EP0591085A1 (en) | Gas purge system for isolation enclosure for contamination sensitive items | |
ATE95970T1 (de) | Behaelter zur aufbewahrung und befoerderung von siliciumscheiben. | |
ES2077702T3 (es) | Caja cilindrica con dispositivo de cierre. | |
DE3377906D1 (en) | Box for storing a stack of pictures | |
US5918393A (en) | Collectible display device for multiple displays | |
AR060057A2 (es) | Metodo para permitir que el propelente y el producto que se carga a presion ingresen a un sistema de valvula de aerosol tipo "bolsa en valvula" en un envase | |
AR248118A1 (es) | Protector para ser usado con un envase externo que contiene un articulo y combinacion del mismo con un perforador y un separador. | |
HK1006696A1 (en) | Method of packaging an article using thermally shrinkable film | |
AR029254A1 (es) | Un sistema de envase y un cierre que comprende dicho envase | |
EP0783753B1 (en) | Storage of sensitive media | |
DE60220638D1 (de) | Sicherheitssiegel | |
ES2099629T3 (es) | Portadocumentos convertible en sobre. | |
AR000616A1 (es) | Miembro de recipiente y disposición de empaque protector que incluye dicho miembro de recipiente | |
ES2191917T3 (es) | Embalaje con precinto. | |
ES2047381T3 (es) | Procedimiento de fabricacion de recipientes provistos de un cierre pelable. | |
JPH03269535A (ja) | マスク収納容器 | |
ES8204037A1 (es) | Perfeccionamientos en los sistemas de deposito de objetos de valor. | |
IT226842Z2 (it) | Serratura per valige borse e simili | |
IL83770A (en) | Pocket safe box | |
DE69101510D1 (de) | Neue Verpackung für flüssige oder pulverförmige Güter. | |
SE9001511D0 (sv) | Foerfarande, lagring och transport av peraettikssyraloesningar samt transport- och lagringssystem foer peraettiksyraloesningar | |
GB2190362A (en) | Transparent, electrostatic protective container with readily accessible identification means | |
GR3005871T3 (es) | ||
PA8576401A1 (es) | Metodo y envasado para contenedores presurizados |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG2A | Definitive protection |
Ref document number: 582016 Country of ref document: ES |