TW406454B - High density connector and method of manufacture - Google Patents
High density connector and method of manufacture Download PDFInfo
- Publication number
- TW406454B TW406454B TW086113845A TW86113845A TW406454B TW 406454 B TW406454 B TW 406454B TW 086113845 A TW086113845 A TW 086113845A TW 86113845 A TW86113845 A TW 86113845A TW 406454 B TW406454 B TW 406454B
- Authority
- TW
- Taiwan
- Prior art keywords
- contact
- contacts
- connector
- recess
- solder
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/727—Coupling devices presenting arrays of contacts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0249—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0256—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0263—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
- Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
- Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49149—Assembling terminal to base by metal fusion bonding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Use Of Switch Circuits For Exchanges And Methods Of Control Of Multiplex Exchanges (AREA)
Description
第 8611384 麵輪 中文說明書修正頁(89年6月) A7B7 ,“亡日修正j補充 五、發明説明(7 ) I -1 I · 經濟部中央標準局員工消費合作社印製 頭接地/功率觸點之正視圖。 較佳實施例之詳細說昍 -月概括參照圖1 - 2及】2 - 1 3,根據本發明之高密度連接器 第一實施例之一组互相配合之連接器,包括一概括示於圖 號】〇之插座。插座之一基座區段概括示於圖號12。基座較 佳為模製一種能經得起SMT回流溫度之適當絕緣聚合材料 ,例如液晶聚合物(liquid crystal p〇lymer,簡稱1^以 所形成。首先請參照基座區段,此元件包括一有一外側】6 及内側丨8 t底壁1 4。在外側上有外凹座,例如凹座2 〇 , 22 ’ 24 ’ 26及28(圖12)。在内側上有内觸點容納凹座, 例如凹座30,32,34,36及38。中間切口,例如切口 4〇 ,42,44,46及48連接此等内外凹座。每一外凹座有一 底壁及一橫向壁,例如底壁5〇及橫向壁52(圖〗2)。每一内 仏號觸點容納凹座有一底壁及相交之橫向壁,例如底壁Μ 及橫向壁56及58。每一内接地或功率觸點容納凹座也有一底 壁及對角橫向壁,例如,底壁6Q及橫向壁62及64。上述内及 外凹座以及連接中間切口容納接地/功率觸點或信號觸點。 接地或功率觸點較佳為有一概括示於圖號66 ’由二接觸 又』68及70所形成之上區段。此二叉頭各有一會聚區段Η ,一觸點7 4及一向外輻散或引入區段7 6。接地或功率觸點 也包括一通過插座之下壁之中間區段78及222,及一延伸進 入外凹厓之下區段8 〇。如以下將予說明,焊球82,224及 228熔合至下區段8〇。 信號觸點(圖12及13)各包括概括示於圖號84較佳為有一 ,袈----- (請先聞讀背面之注意事項再填寫本f) • I I - ΙΓΙ I ·
*1T 本紙張尺度適财_@@家料(CNS ) A4規格( -10- 40645^ 經濟部中央標準局員工消費合作社印製 A7 一______ B7五、發明説明(1 ) 螢明之背吾 j·發明之領蜂丄本發明係關於電連接器,尤指高1/()密度 連接器,諸如陣列連接器。 ? !.先前發展之_簡,要説明上縮小電予設備尺寸,特別是個人 手提式裝置,以及增加另外之功能至此等設備之慾望,導 致人們不斷想要使所有組件微型化,特別是電連接器。致 力使連接器微型化包括在單排或雙排線型連接器減少端子 間之間距,以便較高數目之1/〇或其他線能藉連接器在電路 基片上配合在分配供容納連接器之緊密限定區域予以互相 連接。伴隨微型化之慾望,人們之偏愛也轉向表面安裝技 術(surface mount techniques,簡稱 SMT),供將組件安 裝在電路板上。增加使用SMT及線型連接器所需要之細微 間距,二者匯合導致趨近SMT供高容量,低成本操作之極 限。減少端子之間距,在焊膏回流時,增加相鄰焊料墊片 或端子橋接之危險。要滿足增加1/〇密度之需要人們曾建議 陣列連接器。此等連接器有一平面陣列之端子安裝在絕緣 基片上,並可提供增進之密度。然而,關於藉SMT技術附 著至電路基片,此等連接器存在有某些困難,因爲大多數( 如非所有)端子之表面安裝尾部必須在連接器主體下面。因 此,所使用之安裝技術必須高度可靠,因爲難以目視檢查 焊料連接,或如果有誤失,並難以修理。積體電路(IC)安 裝在塑膠或陶瓷基片上,人們常使用球形格柵陣列(ban grid array,簡稱BGA),及其他類似包裝。在BGA包裝 ,附著至積體電路包裝之球形焊球位於一般爲使用屏幕或 ______ -4- 本i張尺度適财_家料T^NS ) A4規格(21GX297公楚---- I--------_政-- (請先聞讀背面之注意事項再填寫本頁) 訂 406454 A7 ---—--?Z_____________ 五、發明説明(2 ) 掩模已施加一層焊膏之電路基片之電觸點墊片上。該單元 然後予以加熱至焊膏及焊球之至少一部份或全部熔化並溶 合至形成在電路基片上之下面導電墊片之溫度。積體電路 從而連接至基片,而在積體電路上無需外部引線。 使用B G A及類似之系統將積體電路連接至基片,雖然有 很多優點’但供將電連接器或類似之組件安裝在印刷接線 板(printed wiring board,簡稱PWB)或其他基片上之對 應裝置仍有待開發。對於大多數情況,重要的是,焊球之 基片貼合面爲共平面,以形成一實際平形安裝介面,以便 在最後應用,球將會回流,並均勻焊接至平面印刷電路板 基片。連接器回流至印刷電路板時,既定基片上之焊料共 平面性之任何顯著差異均可能導致不良之焊接性能。爲達 成高焊接可靠性,使用者規定非常嚴密之共平面性需求, 通常約爲0 0 0 4付。焊球之共平面性受焊球之尺寸及其在連 接器上之定位所影響。球之最後尺寸係依焊膏及焊球中最 初可用之總烊料量而定。在施加焊球至連接器觸點後,此 項考慮存在特殊挑戰,因爲容納在焊料塊内之連接器觸點 之容積變化影響焊料塊尺寸之潛在可變化性,並因此影響 連接器上之焊球沿安裝介面之共平面性。 經濟部中央標準局員工消費合作社印製 —^^1 ^^1 m I 1 HI 1 I. i in 一 w 、is 口 (請先閲讀背面之注意事項再填寫本頁) 將連接器焊接至基片所存在之另一問題,爲連接器常有 絕緣外殼,其具有較複雜之形狀,例如有很多腔者。自模 製過程,自觸點插入所致應力之累積,或兩者之結合,可 能導致此等熱塑外殼上之殘留應力。此等外殼可能在最初 或在加熱至在SMT處理所必需之溫度時,諸如使焊球回流 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨〇><297公釐) — 40645( 五、發明説明(3 ) 所必需之溫度,變成翹曲或扭绞。外殼之此等翹曲或扭絞 可能導致連接器組合件與PWB間之尺寸錯配,因爲表面安 裝元件,諸如焊球,在焊接前不足夠與焊膏接觸或接近PWB ,而造成不可靠之焊接。 因此,需要藉表面安裝技術將高密度電連接器可靠及有 效率安裝在基片上。 發明之概诚 根據本發明之電連接器提供高1/0密度,以及藉SMT技術 可靠附著至電路基片。此等連接器沿安裝介面呈現高度共平面 性0 本發明之電連接器爲其中一個或多個端子可藉易熔導電 材料連接至基片者。此易熔導電材料爲焊料塊,較佳爲包 含一種可回流以在端子與電路基片之間提供主電流路徑之 焊球。 本發明之一方面包括供在電連接器之元件上形成外部易 熔導電觸點之方法。根據一種方法,在連接器元件之外側 形成一凹座或觸點。導電觸點之一區段自靠近導體元件之 内側延伸進入外殼外侧上之凹座内。凹座填滿受控制量之 經濟部中央標準局爲工消費合作社印製 焊膏。易熔導電元件,例如焊球,位於外殼外側上之凹座 内。置於凹座内之導電元件然後予以加熱至溫度足以熔化 焊膏’並將易溶導電元件溶合至延伸進入該凹座内之觸點 之區段。 本發明也包含一種供用於電連接器之觸點,其包含—端 子凸片區域,該觸點可連接至易熔導電元件,諸如焊球。 -6- 紙張尺度適用中國國家標準(CNS ) A4規格(2丨Ox297公釐) 五 、發明説明(4 A7 B7 ^〇M54. 經濟部中央標準局員工消費合作社印製 、點之中間區域位於端子凸片與觸點區域之間。中間區 域適=例如藉施加塗布或鍍敷一種非焊料可濕潤材料而抵 杭熔融焊料流動。藉此種配置,便避免焊料自附著至觸點 之區域自焊球芯吸。 提供一避免應力累積在其中之絕緣連接器外殼,藉以保 持連接器之表面安裝介面之共平面性。根據本發明之此一 方面,將-觸點端子插入外殼上之開口。冑口予以構形爲 致使至>其—側有或包含—成形之凸起部,^端子插入開 口時,’適於被端子所變形。藉此種配置,由於很多觸點插 入而避免應力累積,便使外殼之翹曲及扭轉最小。 附圖之簡要銳.明 茲參照附圖進一步説明本發明之方法及連接器,在附圖 中: ,圖1爲本發明之連接器較佳實施例,其插座連接器之頂視 平面圖; 圖2爲圖1中所示插座之部份剖開端視圖; 圖3爲本發明較佳實施例之一種插頭元件之頂視平面圖; 圖4爲圖3中所示插頭元件之部份剖開端視圖; 圖5爲圖Μ中所示插座及插頭元件,在未配合 份剖開端視圖; 1 圖6爲圖5中所示插座及插頭元件,在配合關係 開端視圖; W… 圖73,几及7。分別示在圖5中所示插座端插頭配合時, 第一,第二及第三連續階段之剖開端視圖; . ^—Μ— (請先閲讀背面之注意事項再填寫本頁) 訂 .I I I- I - 1 . • - -I I > .i I - -I · 本纸張尺度適用f國國家標準(CNS ) A4規格(210x7^^7 經濟部中央標準局員工消費合作社印製 40645^ A7 ------ B7 五、發明説明(5 ) 圖8爲圖1中所示之插座,在焊球置於其上前之底視平面 圖; 圖9爲圖8中所示之插座,在焊球置於其上後之底視平面 圖; 圖10爲圖1中之區域χπ之詳細剖開圖; 圖11爲圖4中之剖開區域之放大圖; 圖12爲圖1〇中之剖開區域之放大圖; 圖13爲通過圖10中之13-13之放大剖面圖; 圖1 4爲本發明之插座連接器,其第二較佳實施例之頂視 平面圖; 圖15爲圖14中所示插座之端視圖; 囷16爲本發明之插頭連接器,其第二較佳實施例之頂視 平面圖; 圖17爲圖16中所示插頭之端視圖; 圖18圖中14-17所示配對插座及插頭之端視圖; 圖19爲一用於本發明之插座連接器第三較佳實施例,其 插座之頂視平面圖; 圖20爲圖14中所示插座之端視圖; 圖2 1爲本發明之插頭連接器之第三較佳實施例,其插頭 元件之頂視平面圖; 圖22爲圖2中所示插頭元件之端視圖; 圖23爲圖19-22中所示配對插座及插頭之端視圖; 圖24爲一根據本發明連接器之另一實施例,其片段之側 面刻面圖; 本紙張尺度適用中國國家標準(CNS ) A4規格(210'〆297公釐) :--— I#-- (請先聞讀背面之注意事項再填寫本頁)
、1T 40645^ A7 B7 部份,修改爲形成一較深凹座之 五、發明説明(6 ) 圖24a爲圖24之結構之一 片段圖; 圖25爲圖24中所示逸垃哭 # 丁運接器,其中插頭及插座配合之片段 正視剖面圖; 圖26a及26bf示在本發明之方法之實例⑴,在焊料 回流期間,溫度對時間及距離之曲線圖; 圖27a-27f爲雷射所產生,本發明方法實例3之產品之輪 廓; 圖28a及28b爲X光相片,示本發明之方法實例4之產品; 圖28c及d爲電子顯微鏡相片,示本發明之方法實例4之產 Ο · αα , 圖29爲相似於圖1()之圖’其中省略接地及功率觸點; 圖30爲通過圖13中之xxxi-xxxi之剖面圖; 圖3 1爲纟與本發明之較佳實施例所例示者相似之絕緣 外殼,電腦所產生之預測應力之表示; 圖3 2爲觸點保持力爲如圖29中所示絕緣外殼之肋條變形( 壓縮)量之函數之曲線; 圖33爲用於本發明連接器較佳實施例之插頭信號觸點 之正視圖; 圖34爲一用於本發明連接器較佳實施例之插座信號觸點 之正視圖; 圖35爲一用於本發明連接器較佳實施例之有載體條之插 座接地/功率觸點之正視圖;以及 圖36爲一用於本發明連接器較佳實施例之有載體條之插 -9- 尽紙張尺度適用中國國家標準(CNS ) A*規格(21〇><297公釐) II I 广 ^ "裝 (請先聞讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 第 8611384 麵輪 中文說明書修正頁(89年6月) A7B7 ,“亡日修正j補充 五、發明説明(7 ) I -1 I · 經濟部中央標準局員工消費合作社印製 頭接地/功率觸點之正視圖。 較佳實施例之詳細說昍 -月概括參照圖1 - 2及】2 - 1 3,根據本發明之高密度連接器 第一實施例之一组互相配合之連接器,包括一概括示於圖 號】〇之插座。插座之一基座區段概括示於圖號12。基座較 佳為模製一種能經得起SMT回流溫度之適當絕緣聚合材料 ,例如液晶聚合物(liquid crystal p〇lymer,簡稱1^以 所形成。首先請參照基座區段,此元件包括一有一外側】6 及内側丨8 t底壁1 4。在外側上有外凹座,例如凹座2 〇 , 22 ’ 24 ’ 26及28(圖12)。在内側上有内觸點容納凹座, 例如凹座30,32,34,36及38。中間切口,例如切口 4〇 ,42,44,46及48連接此等内外凹座。每一外凹座有一 底壁及一橫向壁,例如底壁5〇及橫向壁52(圖〗2)。每一内 仏號觸點容納凹座有一底壁及相交之橫向壁,例如底壁Μ 及橫向壁56及58。每一内接地或功率觸點容納凹座也有一底 壁及對角橫向壁,例如,底壁6Q及橫向壁62及64。上述内及 外凹座以及連接中間切口容納接地/功率觸點或信號觸點。 接地或功率觸點較佳為有一概括示於圖號66 ’由二接觸 又』68及70所形成之上區段。此二叉頭各有一會聚區段Η ,一觸點7 4及一向外輻散或引入區段7 6。接地或功率觸點 也包括一通過插座之下壁之中間區段78及222,及一延伸進 入外凹厓之下區段8 〇。如以下將予說明,焊球82,224及 228熔合至下區段8〇。 信號觸點(圖12及13)各包括概括示於圖號84較佳為有一 ,袈----- (請先聞讀背面之注意事項再填寫本f) • I I - ΙΓΙ I ·
*1T 本紙張尺度適财_@@家料(CNS ) A4規格( -10- 經濟部中央標準局員工消費合作社印— 406454 A7 B7 五、發明説明(8 ) 觸點凸起部86之上區段,一引入寶頭88及一加強助9〇。信 號觸點也包括一中間區段92,其通過插座之下壁。信號觸 點各包括一下區段98(圖13),延伸進入外凹座,例如圖 12-13之凹座22,如以下將予解釋,焊球1〇〇熔合至下區段 98 ° 請特別參照圖1 - 2 ’插座之基座區段包括例如概括示於圖 號102之閂鎖結構。此鎖閂結構包括一向上凸片1〇4,其重 疊於一垂直凹槽106,並且其有一向外凸起部1〇8。插座之 基座區段也有其他相似閂鎖結構1丨〇,1 1 2及1 1 4。插座也 包括概括示於116,重疊於基座區段之上區段。此上區段有 一頂壁1 1 8及一周邊側壁1 2 0。此上區段藉例如概括示於圖 號122之閂鎖結構固定至基座區段。此等閂鎖結構各一有側 壁凹座124及一U形鎖閂126,其自頂壁向下延伸,並與側 壁凹座間開。凸片1 〇 4配合於U形鎖問1 2 6與側壁凹座i 2 4 之間’以使U形鎖閂可貼靠基座區段之鎖閂結構1〇2上之向 外凸起部1 0 8。上區段包括其他相似閂鎖結構1 2 8,1 3 0及 1 3 2,其分別貼靠基座區段上之閂鎖結構丨丨〇,u 2及u 4 。上區段116或基座102也可有安裝托座134及136,其分 別有緊固件孔徑1 3 8及1 4 0。在上區段1 1 6之頂壁1 1 8上也 有信號觸點進入孔徑,例如孔徑1 4 2及1 4 4。此等進入孔徑 排列成許多排,對應於基座區段上之諸排信號觸點。細長 接地或功率觸點進入切口,例如切口 1 4 6及1 4 8,插入在此 諸排信號觸點進入孔徑之間。上區段1 1 6在插座1 〇與配合 插頭150之間形成一在下面所説明之配合介面。 -11 - 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) ------,---;----裝-- (請先閲讀背面之注意事項再填寫本頁) ,ιτ 40645
五、發明説明(9 經濟部中央標準局員工消費合作社印裂 請參’、、、圖3-4及圖11,連接器之插頭元件概括示於圖號 、插頭包括一底壁152及一周邊侧壁154。在侧壁有對 置=間隙1 5 6及1 5 8,並有一開口側丨6〇與底壁成對置關係 刀別有緊固件容納孔徑166及168之安装托座162及164 自插頭橫向凸起其可與插座之安裝托座之緊固件容納孔徑138 ,140對準。 請參照圖1 1,在底壁1 5 2内側有内信號觸點容納凹座, 諸士凹座170。内功率或接地觸點容納凹座,諸如凹座I?? ’也在底壁内側上。外信號觸點容納凹座,諸如凹座174, 及外功率或接地觸點容納凹座,諸如在凹座176,與底壁上 之外凹座成對置關係。中間切口 ! 7 8及丨8 〇分別連接外及内 k號觸點容納凹座以及外及内功率或接地觸點容纳凹座。 概括示於圖號182之功率接地觸點經由中間切口 ι8〇安裝在 功率/接地觸點容納凹座内。每一觸點182有一細長内區段 184,一安裝在底壁152之細長中間區段186,及一延伸進 入凹座176内之外區段188。一焊球190溶合至區段188。 外區段188及烊球部份包含在外凹座176内。插頭也包括許 多信號觸點192。此等信號觸點各有一内區段194,一安裝 在底壁之中間區段196,及一延伸進入凹座174内之端子凸 片198。一焊球200熔合至端子凸片198。吾人將會再次看 出,此外區段及焊球部份包含在如在1 7 0之外凹座内。 請參照圖5-7c ’將會看出以上所説明之插頭安裝在電路 基片,諸如剛性PWB 2 02上,並且插座安裝在一相似之 PWB 204上。插頭及插座從而如圖6中所例示,形成板對 12- 本紙乐尺度適用中國國家樣準(CNS ) A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -裝·
、1T Λ • 1^1 i— n ^^1 406454 A7 ______B7 五、發明説明(10 ) 板互相連接。插頭有一平面陣列之信號觸點諸如丨9 2,焊球 2 0 0溶合至此陣列,以及許多接地/功率觸點,諸如觸點 1 9 2,焊球1 9 0熔合至此等觸點。焊球也利用s μ T技術熔合 至PWB202,以使整個插頭固定至PWB,並在插頭及pWB 上之化號觸點與接地或功率觸點之間完成電接觸。請予察 知’雖然圖5中未例示所有觸點,但所有此等觸點均以相同 方式連接至焊球及連接至PWB。同樣,焊球1〇〇熔合至插 座信號觸點84,並且此等焊球熔合至PWB204。插座接地/ 功率觸點66安裝在切口 134内,並溶合至焊球82,並且此 等焊球熔合至PWB 204。 插頭與插座對準,致使插頭之周邊側壁154重疊插座之上 區段1 1 8之周邊侧壁1 2 0。 經濟部中央標隼局員工消費合作社印製 H· - - - . ί .^ϋ i^i I I I I - I 二 1^1 , I 、νδ (請先閲讀背面之注意事項再填寫本頁) 請特別參照圖7 a - 7 c,更詳示插頭及插座之貼合。圖7 a示 在最初對準後,插頭上之接地/功率觸點進入插座上之接地/ 功率觸點容納切口,並貼靠插座上之對應功率/接地觸點。 信號觸點已經進入插座上之信號觸點切口。圖7b示插頭上 之信號觸點最初貼靠插座上之對應信號觸點,並且插座上 之功率接地觸點變成進一步貼靠在插座上之功率/接地觸點 之對置葉片之間。圖7示插頭上之信號觸點與插座上之信號 觸點完全貼合。插頭上之功率/接地觸點已在插座變成位於 功率/接地觸點叉頭之基座上。 請參照圖8 ’ TF在施加焊球前,插座之基座區段1 2之外側 16。在施加焊球前,信號觸點之端子凸片,例如端子凸片 82,及功率接地觸點,例如端子凸片98,藉觸點插入基座 -13- 本紙張尺度適用中國國家標準(CNS ) Α4規格(21〇χ297公釐) 經濟部中央標準局員工消費合作社印裝 406454; A7 ____」B7五、發明説明(11 ) ? " ' 12之相反表面1 8而配置在對應外凹座,例如外凹座2〇, ,24,26及28内。施加適當組成之大量焊膏,以實際填滿 每一外凹座。然後將焊球施加至基座之外或安裝表面上。較 佳爲,外凹座在橫向範圍小於焊球,因而焊球在凹座之邊 緣支承在靠近觸點之端子凸片之位置。爲使烊球在凹座上 (穩定性最大,凹座之剖面較佳爲圓形或規則之多角形。 如圖9中所示,焊膏有助使焊球保持在每一露出之凹座,例 如,焊球82示爲在凹座20内,以及焊球丨00示爲在凹座22 内。另外之焊球,230, 232及2 34例如示爲在凹座24,26 及28内。一焊球將位於插座之所有外凹座。也請予瞭解, 在如圖8中所示置放焊球前,以及在如圖中"所示置放焊球 後,插頭之外侧將會與插座之外側實際完全相同。在焊球 置放於外凹座後,連接器經歷回流過程,使焊球熔合至端 子凸片。連接器之外側,連同焊球,特別是焊球之外表面 ,形成一實際平面之安裝介面,連接器沿其安裝至一支承 電路基片,諸如PWB。 圖10及13示圖1實施例之一種變化型,其中葉片型觸點 之相對配置對66a及66b代替叉形插座觸點66 ’貼靠接地/ 功率端子1 8 2。 圖14-18例示本發明之一组互相配合連接器之第二較佳實 施例。請特別參照圖14-15,此組包括概括示於圖號236之 插座。此插座包括一概括示於23 8之絕緣外殼,其有一内側 2 4 0,一橫向側2 4 2及一外侧2 4 4。外殼也包括相對對準之 凸起部246及248。在外殼之内侧有觸點25 0,251及252, -14- ^.— 11 -H ^ ~ ^ n n 訂 (諳先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中關家標準(CNS) A4規格(2丨G χ 297公釐) A7 B7 406454 五、發明説明(12 ) II 丨 \I n (請先閱讀背面之注意事項再填寫本頁) 彼此弯成弓形離開,然後聚合至一觸點,其然後再次輻散 。觸點251以與圖丨_13中所示實施例之相同方式安裝在基 座231上。焊球’諸如焊球254,以上述相同方式安裝至觸 點25 1之板侧。請特別參照圖16及17,該組也包括概括示 於25 8之插頭,其包括概括示於26〇之絕緣外殼,有一内侧 262,一周邊橫向側264及一外側266。在外殼之_端有一 對垂直端壁268及270有中間端凹座272。在外殼之相反端 有另一對端壁274及276有中間端凹座278。許多觸點,如 在觸點280,自外殼之内侧延伸,其自如在282之凹座延伸 。一焊球284熔合至每一此等觸點。吾人也將會看出,此等 觸點位於呈一種交錯之排列。例如,觸點2 8 6相對於接觸 280偏置,因而諸排觸點可間開爲更靠近在一起,以增加觸 點密度。請特別參照圖1 8,將會看出,插頭上之每一觸點 諸如觸點280與插座上之數對會聚觸點之一,諸如觸點25〇 及252垂直對準,並且插置在此等會聚觸點之間。吾人也將 會看出,對準凸起部246及248也貼靠插頭上之端部凹座 272及278。在此實施例’不存在使用於圖ι·ΐ3實施例之分 開之接地/功率觸點。如果希望,此種功能可合併至未分開 之觸點對。 經濟部中央標準局員工消費合作社印製 圖1 9 - 2 3示一組互相配合連接器之第三較佳實施例。插頭 概括示於圖號290。此插頭包括概括示於圖號292之外殼, 有一底壁294及一周邊橫向壁296,以及對置對準之凸起部 298及300 〇外殼之底壁有一内側302及一外側304 〇信號 觸點,諸如觸點3 0 6,自内侧3 0 2延伸。吾人將會看出,信 -15- 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X297公釐) 406454 五、發明説明(l3 ) 號觸點也在交替諸排交錯或偏置,以增加觸點密度。插頭 也包括接地或功率觸點310,312,314及316,排列爲靠 近平行於橫向壁一側之插頭侧面之每一側。信號觸點焊球 ,諸如焊球3 18,及功率接地觸點烊球,諸如32〇在底壁之 外侧,其以關於第一實施例所説明之相同方式熔合至其個 別觸點。插座概括示於圖號322,並有一絕緣外殼324,其 包括一底壁326,一周邊橫向壁328,以及對準凸起部容納 凹座330及332。底壁也有一外側334及一内側336。信號 觸點’諸如觸點3 3 8及3 40自内側凸起。在相鄰橫向諸排之 觸點也予以軸向偏置,以允許增加觸點密度。橫向功率或 接地觸點342,344,346及350平行於周邊壁之每一側。 每一信號觸點有一焊球,諸如焊球3 5 2在底壁之外側。也有 焊球,諸如在焊球3 5 4,供附著每一功率或接地插腳❶請特 別參照圖23,吾人將會看出,插頭290貼靠插座322。 如先前所提及,將行藉SMT技術安裝在電路基片上之組 件諸如電連接器,必須符合共平面性之亟需之規範。如果 未保持共平面性之嚴密容限,通常約爲0·003至〇 〇〇4吋, 製造廠商便經驗由錯誤之焊料連接所產生之不希望有之高 故障率。由於觸點插入處理所發生觸點在絕緣外殼上之位 置變化,以及外殼之變形,導致連接器主體之安裝介面之 彎成弓形或翹曲,可發生觸點之表面安裝部份與電路基片 之距離上之變化。根據本發明所作成之連接器使用將連接 器接合至基片之易熔主體細心定位及定其大小之特色,以 及使用觸點固定配置防止會使外殼變形之應力聚集在連接 -16- 本紙張尺度適用中國國家標準(CNS ) Α4規格(2ι〇χ297公楚) (請先聞讀背面之注意事項再填寫本頁) 裝· 、1Τ 經濟部中央標準局員工消費合作社印製 〇e4S4 A7 --—---- B7 五、發明説明(hY ' ----— 器外成’可藉以達成嚴格之共平面性需求。 在圖1-23之實施例,金屬觸點以一種避免在外殼之主體 感生應力〈方式固著賴緣外殼。此種固著爲使用成形之 切或開口,將觸點之固著部份插入其内所達成。在一種 特別用於較小化號觸點之配置,切口之形狀在形狀及尺寸 上,除了 一觸點表面外,與所有表面緊密一致。面對該一 表面之切口之壁有一整體模製之橫向凸起部凸入切口内。 凸起部<末端與切口之對置壁間之距離少於觸點之厚度。 因此凸起部之末梢部在觸點插入切口時被其貼靠並變形。 可變形凸起部施加於觸點之法向力使觸點確實保持在切口 中。因爲凸起部之末梢部可自由變形,故避免應力在外殼累 積在例示之較佳實施例,6起部包含一形成在切口侧壁 之之整體錐形肋條。 經濟部中央標準局員工消費合作社印製 ,-----^------ΐτ (請先閱讀背面之注意事項再填寫本頁) 例不之特定肋條構形,對於採用此肋條之外殼,據信爲 最佳者’但其他類型之外殼可能宜採用略微不同形狀或尺 寸之其他類似肋條。請特別參照圖29及3〇,信號觸點494 保持在切口 496内,並緊靠肋條498。肋條在其貼靠觸點 494之處有—平面表面500,並有對置之斜邊502及504。 觸點494藉與切口 496之背緣及側緣以及肋條498貼靠,而 確實保持在切口内。鄰接表面50〇之肋條之部份在觸點494 被強迫進入切口 496内時,可自由變形,從而減輕由於觸點 插入所產生之任何應力。 同樣,功率/接地觸點保持在切口 508内,並且抵靠可變 形肋條5 10。肋條有一在此處緊靠觸點之末梢部512,及對 -17- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消費合作杜印製 __406454 五 '發明説明(15 ) 置之斜邊514及516。在此種配置’也有對置之肋條,例如 肋條5 1 8。此對置之絕緣肋條也有一末梢部5 2 〇及斜邊5 2 2 及524。對置之可變形肋條可用以固定較大之觸點,及使觸 點在切口定中。精於此項技藝者也將會察知,此等肋條之 特定形狀,尺寸,數目及設置’不同類型之外殼可能有所 不同,並且此等因素將選擇爲致使將外殼内之應力隔離在 可變形肋條至最大可能程度。使用AnSyS,Inc. Qf Houston之ANSYS應力分析軟體所產生之圖31,示使用圖 29及30中所例示之觸點固定配置,高水準之應力基本上被 隔離在肋條,並且延伸實際不超過觸點安裝切口,從而顯 著減少否則可能由於大量觸點插入而產生之外殼翹曲或扭 轉之危險。圖31中所示各種不同應力區域之單位爲N/mm 2 ,並且mm是爲所示位移之單位。圖32示就代表性觸點切4 而言,可變形肋條之末梢部最多約達〇 〇〇〇4吋之變形(壓縮 )之增加,在觸點與外殼之間產生由肋條所加於觸點之法向 力所致之增加之保持力。在〇〇〇〇4吋之變形(壓縮)後,在 保持力僅產生少量之增加。 如先前所提及,利用BGA安裝影響連接器基片安裝面之 共平面性之另一因素,爲焊球尺寸之均一性及焊球相對於 連接器外殼之板安裝面之位置。在先前所説明之較佳實施 例,每觸點之端子凸片位於凹座内。外凹座爲實際均句 大小及形狀。此等凹座提供關於本發明之若干重要特色。 凹座可例如藉簡單之敷著及刮擦作業容納高度均勻量之焊 膏在其中。因此用以將每一焊球固著至觸點之焊料量爲實 : ^--裝-------玎 (讀先閲讀背面之注意事項再填寫本頁)
本紙張尺度適财_家縣 經濟部中央標準局員工消費合作社印製 406454 A7 -----------B7 五 '發明説明(Μ ) 際均勻。在焊球附著至觸點前,凹座定每一焊球在χ_γ方 向之位置。凹座也定烊球在Ζ方向相對於外殼底面之位置, 以及烊球與觸點之端子凸片之距離。進入凹座内之凸片之 額定延伸部份予以設定爲致使在進入凹座内之凸片延伸部 份芝最大容限,凸片不觸及焊球,並從而影響其2方向位置 。然而,在凹座有較均勻及適當量之焊料來自焊膏,保証 坪球熔合至觸點凸片。觸點凸片與焊球間之距離上之任何 變化被置於凹座内之可變量之焊膏所吸收。 爲在用以將焊球附著至觸點之回流步驟使適當量之焊料 保持靠近焊球,並防止烊料芯吸至觸點之貼合面,觸點予 以處理,以抵抗焊料芯吸。請特別參照圖33,觸點526及 528示爲附著至一載體長條53〇。觸點有一觸點貼靠區域 5 3 2通常鍍敷非氧化金屬,諸如金,鈀或鈀之合金。觸點也 有一中央區域534,其一部份形成外殼上之觸點保持區域。 一種抗焊料芯吸或非焊料可濕潤材料予以施加至中央區域 5 3 2。供此目的之一種較佳材料爲鍍鎳。雖然不意爲受任何 特定理論所約束,但此種鍍鎳區域之抗烊料特色,據信爲 在鍍敷後,例如,暴露至周圍空氣若干天而鎳氧化所^生 ,或被其所提高。令人驚訝並且料想不到的是,吾人發現 ,鎳或鎳氧化物障壁防止或減少此等觸點上之焊料芯吸。 對於具有此種鈍化功能之鎳或鎳氧化物鍍敷而言,較佳爲 鍵敷具有丨0微对至丨00微对’更佳約爲50微叶之厚度。其 他抗坪料芯吸材料據信可供此目的使用, 料 塗料。如果整個觸點艘敷一連續外層之坪料可=屬早料 -19- 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公餐) ;---_--^------ΐτ (請先閲讀背面之注意事項再填寫本頁) A7 B7 406454 五、發明説明(η ) (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 例如金,此等塗料可能特別有用。觸點凸片區域5 3 6可較佳 予以鍍敷一種焊料接納材料,諸如金,錫或錫合金。較佳 爲,整個觸點將予鍍鎳。在上區段有一貴金屬層選擇性鍍 敷在鎳上面。上區段貴金屬鍍敷較佳爲具有10微吋至1〇〇 微吋,更佳約爲3 0微吋之厚度。在下區段有一烊料可濕潤 金屬層選擇性鍍敷在下區段上。或則,一電鍍層之鉻可代 替鎳層。請參照圖34,插頭信號觸點5 3 8及540示爲附著至 載體長條542。此等觸點各有一鍍金凸片區域544,一鍍鎳 之中央保持及抗芯吸區域536及一鍍貴金屬貼合區域548。 同樣在圖35,接地/功率觸點5 5 0示爲附著至載體長條55 2 。此種觸點有一下鍍金凸片區域554,一鍍鎳之中央抗芯吸 區域556及一上鍵金觸點貼靠區域558。也經發現減低芯吸 之接地/功率觸點550之另一特色爲在凸片區域554之一連 串凹口,諸如凹口 560,562及564。以上所揭示實施例中 所包括之接地/功率觸點550,其另一特色爲垂直切口,諸 如切口 566。請參照圖36,一插頭接地/功率觸點568示爲 有一下鍍金凸片區域570,一中央鍍鎳抗芯吸區域572,及 一上鍍金區域574。吾人將會看出’接地/功率觸點568不 具有分開之載體長條,但有孔徑諸如孔徑576,其允許觸點 本身供此種載體功能。吾人可瞭解,利用每一上述觸點, 錫或其他焊料可濕潤材料可在下區域代替金。對於圖3 3 3 6 中,所示之所有觸點,下鍍金凸片區域之寬度,例如在圖36 中示於wl,較佳將約爲〇.lmm至〇25mm。中央艘金凸片 區域之寬度,例如在圖36中示於W2,較佳將約爲01mm至 •20. —張尺%;用中國國家標準(CNS )祕見^ 2! 〇 χ 297公£ A7 B7 406454
五、發明説明(IS 1 mm ° 請參照圖24-25,示具有另一配置供固定焊球之本發明實 施例。此連接器概括示於圖號324 ^此插座有一底壁326有 一外侧3 2 8及一内側3 3 0。在外側有凹座,諸如在凹座332 ,334 ’ 336 ’ 338,及 340,(圖 25)342 及 344(圖 24)。每 一此等凹座較佳爲有一傾斜底壁36〇有一圓形表面362。在 内侧330有凹座如在凹座346,34 8,3 50,3 5 2,3 54(圖 25)356及358(圖24)。在外部與内之間,凹座有中間切口 ,如在切口 364 , 366,368,370,372(圖 25),374 及 376(圖24)。每一此等切口有一保持凸起部(未示),供以實 際與先前配合圖29及30所討論之相同方式,使觸點保持在 切口内。在内側,插座具有實際與圖1及2中所例示之插座 相同之構造。其包括一較佳爲藉關於圖1及2所討論之閂鎖( 未示),以適當方式固定在基座326之上區段436。上區段 或蓋436有許多開口,諸如開口 452及460,供容納來自配 合插頭或切口,諸如切口 454,456,4ό8(圖25)之個別觸 點’供容納來自配合插頭之接地或功率觸點。信號觸點, 諸如觸點408,及接地/功率觸點爲實際如關於任何先前所 述實施例所説明之形式。例如,接地觸點3 8 2 (圖2 5 )有一下 區段3 84,自其有一凸片3 86。此觸點也有一概括示於圖號 3 8 8,由叉頭3 90及3 92所組成之上區段。每一此等叉頭有 一會聚區段394及一向外輻散引入區段396。凸片386位於 凹座336内。每一信號觸點,諸如觸點4〇8,有一上區段 410有一前ώ起部412及後彎頭414。信號觸點在其貼靠絕 -21- 本紙張尺度朝t目@家縣(CNS )八4祕(21GX 297公釐) (讀先聞讀背面之注意事項再填寫本買) 装· 訂 經濟部中央標準局員工消費合作社印製 A7 406454 ________B7_ 五、發明説明(l9 ) 緣外殼之處也有一中間區段4 16,及一下凸片418位於凹座 334 内。 接地觸點382之凸片386及信號觸點408之凸片418爲在 觸點插入基座3 2 6後,使個別端子3 6 2之尾部繞表面3 6 2弯 曲所形成。每一表面3 62當作是關聯觸點尾部之皆曲心軸。 尾部予以彎曲至傾斜表面360之範園,並允許彈回,致使凸 片橫向於觸點之縱向軸線,並實際平行於表面328。這保證 凸片之高度共平面性。在形成凸片後,將焊膏施加至每一 凸片之外表面。然後將焊球’諸如398,400,402,404 ,406(圖25)4 26及42 8(圖24)施加至凸片,並且該組合件 予以加熱,以使焊膏及焊球熔合至每一凸片。在圖24a中所 示之一種替代性結構,凹座3 34a予以加深,以便表面36〇a 及362a位於距底面328a更遠。因此,如同先前關於圖12及 13所特別討論,焊球398a部份位於凹座334a内,並且其邊 緣使其穩定。因此’使用高度均勻尺寸之焊球時,此等配 置可產生完成之連接器,越過安裝介面呈現觸點之共平面 性0 一具有與先前所説明之插頭大致相同構造之插頭概括示 於圖號430。其包括一底壁432有一外側434及一内側436 。在外側有凹座,如在凹座438,440,442,444及446。 每一此等凹座有一傾斜底壁44 8及一彎曲壁450。觸點切口 452,454, 456, 4 5 8及460與每一此等凹座連接。插頭也 有若干例如概括示於圖號462之功率/接地觸點。每一此等 觸點有一觸點區段464 ’其貼靠插座之接地/功率觸點之又 -22- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ' I I I I ^ ~訂 (請先聞讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印策 經濟部中央標準局員工消費合作社印製 406454 五、發明説明(2〇 ) 頭。此等觸點也有-貼靠外殼之中間區段466,及—供容納 ¥球470义’焊球凸片468。插頭也包括若干例如概括示於圖 號4 7 6义信號觸點。每—此等信號觸點包括一觸點凹座* 7 8 ,其使彳s號觸點貼靠在插座内,一在此處貼靠外殼之中間 區段480,及一供容納焊球之焊球凸片482。如在486及 488之其他彳s號觸點分別貼靠如在49〇及之其他焊球。 形成焊球凸片並將焊球47〇,474,484,490及492以實際 與先前關於插座所説明之相同方式施加至插頭。 在本發明之方法,導電元件將較佳爲一焊球。然而,精 於此項技藝者將會察知,其可代替具有熔化溫度少於絕緣 王體足熔化溫度之其他易熔材料。易熔元件也可具有球體 以外(其他形狀。焊球或其他導電元件也較佳爲有直徑約 爲凹座寬度之百分之5〇至2〇〇。此種直徑也較佳爲與凹座 之深度相關,並爲該深度之百分之5〇至2〇〇。焊球之容積 較佳約爲凹座之容積之百分之75至百分之15〇,並且更佳· 、·勺爲與凹座相同容積。觸點凸片將延伸進入凹座内足夠之 ,,以提供適當表面積供焊球熔合至凹座,並且通常較佳 爲如先前所提及,延伸進入其内約凹座深度之百分之25至 百分又75,更佳約爲百分之5〇。凹座剖面通常將爲圓形, 正方形或任何其他規則之多角形。導電元件爲焊料時,較 佳爲一種合金,其約在9〇 %Sn及1〇%pb至55%sn及 〇%Pb之範圍。合金更佳爲易溶,其爲63%Sn&37%pb, :、有183 C之溶點。一般將使用一種具有較高錄含量之 硬焊料合金,供配合諸如陶瓷之材料。"硬„焊球軟化時 _______-23-
) A4^ ( 2i〇xl^FT (請先閲讀背面之注意事項再填寫本頁) 裝· 訂 406454五、發明説明(21 A7 B7 經濟部中央榡準局員工消費合作社印裂 ,其在代表性SMT狀況下將會”成蘑菇形,,或略微變形,但 不會熔化。使用一種"軟,,易溶球供附著至pcB,並且通常 在代表性SMT狀況下將會回流,並使其本身重新成形。適 合電子目的之其他已知焊料也據信可接受供在此種方法使 用。此等焊料包括(不限於)電子可接受之錫·銻,錫_銀和錯 -銀合金及銦。在焊球或其他導電元件位於凹座之前,該凹座 通常將會填滿焊膏。 或者,代替先前所説明之焊球,可藉焊膏在凹座内回流 將一在SMT溫度不熔合之材料主體附著至觸點。連接器安 裝介面將會包含許多不易熔合之球體成一緊密共平面陣列 。此種連接器將藉習知SMT技術予以固定在基片上。 雖然據信包括有任何習知有機或無機酸焊料助焊劑之焊 膏或焊油可適合供用於此方法,但無清潔之焊膏或焊油爲 較佳。此種焊膏或焊油將會包括一種呈細微粉末形式懸浮 在一種適當助焊劑處理材料中之焊料合金。此種粉末通常 將爲一種合金,而非幾種成分之混合物。焊料對助焊劑之 比通常將會高,以重量計,在8〇%_95%之範圍,或以容積 計約爲80%。焊料材料懸浮在松脂助焊劑中時,將會形成 焊油。雖然可使用活化或超活化松脂供各種不同之目的, 但松脂助焊劑較佳爲一種白色松脂或低活性松脂助焊劑。 丈τ料合金主細微粉末形式懸浮在有機或無機酸焊料助焊劑 時,將會形成焊膏。此種有機酸可選自乳酸,油酸,硬脂 酸,苯二酸,檸檬酸或其他類似之酸。此等無機酸可選自 氫氣酸,氫氟酸及正磷酸。焊油或焊膏可藉塗刷,網 (請先聞讀背面之注意事項再填寫本頁) .裝· ’良.
經濟部中央標準局員工消費合作社印製 406454 A7 ~----^___ 五、發明説明(22 ) '~" 一 ' 或擠壓至宜已逐漸預熱,以保證良好潤濕之表面予以施加 雖’乂 〇人發現,使用焊膏或焊油時,顯著減少焊料芯吸 至觸點,但據信在使用一種適當之鈍化劑時,也可僅使用 焊膏型焊料助焊劑。此種適當純化劑將包括含氟化物抗焊 料塗料,諸如3M Corporation所出品tFL〇URAD。 較佳爲在一種平板紅外線(IR)焊料回流輸送爐進行加熱 。焊料元件通常將予加熱至溫度約183。至195<>c,但依外 殼之材料而定,可使用具有熔化溫度之焊料。輸送爐較佳 爲以速率約每秒1 0至1 4吋操作,並且將移動通過許多連績 ;加熱階段,總時間約爲5分鐘至1〇分鐘。在插入輸送爐内 之前,連接器外殼,觸點及焊料元件可在升高溫度預熱至 少一小時。在輸送爐’依據適當尖峰溫度,最大梯度及高 於回流溫度之時間,將產生一溫度剖面。尖峰溫度爲外殼 所達到之最高溫度。對於具有! 8 3 熔點之焊料元件,尖峰 溫度通常將在185。(:與丨95Ό之間。最大梯度係以。〇/秒予 以測量,並且規定允許連接器外殼溫度變化多快,俾避免 翹曲或彎曲。對於此方法之大多數應用,最大正梯度最初 較佳爲2°C/秒至15Ό/秒。達到焊料之潤濕點後,負梯度較 佳將爲-2 C /秒至-15 C /秒。本發明方法之一重要方面,爲 间於回流之時間最少。高於回流之時間爲烊料元件保持在 其液相多久之一項度量。吾人發現,烊料在其液相之時間 最少時,便消除或顯著減少烊料自凹座沿觸點向上芯吸。 較佳爲,在板上在180°C與20(TC之間所測量之溫度升高時 間’以及在板上在2 0 0 °C與1 8 0 °C之間所測量之溫度降低時 -25- 本紙張尺度適用中國國家標準(CNS ) Α4規格(210χ297公缝) I---_--^------ΐτ (請先閱讀背面之注意事項再填寫本頁) 406454 A7 B7 五、發明説明(23 ) 間,均將約爲1 〇秒至1 〇〇秒。雖然不意爲受任何特定理論 所約束’但據信在此較短時間,液體焊料元件之表面張力 將會抑制液體流過在凹座基座之觸點容納接受切口。然而 ’在此時間之後,液體焊料將會開始流過觸點容納切口, 並沿觸點向上芯吸。在焊料元件之溫度升高至其熔化溫度 疋前,可能也宜在最初有較高梯度,但在達到熔化溫度, 以減慢溫度增加或減少速率,在其之後,則採用較高梯度 ’直到達到熔化溫度。選擇適當之外殼材料也可能提高結 果。較佳爲外殼材料將整個爲芳族液晶聚酯(Lcp),具有 高玻璃過渡溫度,低熱係數,低水分吸收,高斷裂動度, 良好流動及低黏性,高溫及高閃亮點等特性。 本發明之方法另參照下列實例予以説明。 實例1 製成一以上實際配合圖1-18所説明,供連接器插頭及插 座之絕緣外殼。也使一也實際根據該説明之觸點位於外殼 内。此等觸點爲鈹铜,並在其整個表區域鍍敷金至3〇微米 之厚度。外殼材料爲DUPONT H6 130液晶聚合物(LCP)。 插頭之長度及寬度分別爲52.5mm(包括安裝托座)及 42.36mm。插頭及插座外殼外表面凹座上之斷面呈正方形 ,側面尺寸爲0.62mm及深度爲0.4mm。觸點之約2mm延 伸進入凹座内。其他尺寸通常與以上根據圖1-18之尺寸成 比例。在插頭及插座之外側,凹座均予填滿或實際填滿 Alphametals, Inc· of Jersey City,New Jersey所發售 之CLEANLINE LR 725無清潔焊油。插頭及插座均予在 -26- 本紙張尺度適用中國國家梯準(CNS ) A4規格(210x297公釐) ------7---:-I装 — I (請先閱讀背面之注意事項再填寫本育) 訂 經濟部中央標準局員工消費合作社印裝 經濟部中央標準局員工消費合作社印製 406454 ^ 五、發明説明(24 ) 其外側翻轉在一定量之球形焊球上,以便一焊球嵌入每一 凹座内。所使用之焊球爲ALPHAMETAL無助焊劑 6 3SN/37PB球形焊球,其直徑爲〇3〇叫· + -.001叫",重量約 爲00195克。插頭及插座然後以3m Corporation之一種焊 料抗芯吸材料,FLUOR AD,予以處理。在此處理之後, 插頭及插座然後在對流爐在1 〇 5 X;予以乾燥2小時》然後使 插頭及插座位於以習知強化環氧樹脂印刷電路材料所製成 ,厚度.061吋之分開之電路板上。請參照圖9,將一熱電偶 在插頭之外表面置於位置T。使另一熱電偶在中央位於支承 板表面靠近插頭。插頭及插座然後均在平板紅外線(IR)輸 送機烊料回流爐予以處理。此種型式之爐爲習知者,使插 頭及插座移動通過回流爐中之六區。輸送機速度爲是13忖/ 分。表1中示在每一區之加熱溫度。表2中示插頭及支承板 之最低及最高溫度。表3中示正及負最大梯度。表4中示在 180°C與20(TC之間在板所測量之升高及降低時間。圖26a 中之曲線示插頭之隨時間及距離之溫度,其中粗線爲在支 承板上之熱電偶之溫度,細線爲在插頭外表面上之熱電偶 之溫度。一插頭及插座在焊料回流後之目視檢查,顯示幾 乎所有焊球已在其個別腔内熔合至接觸引線。焊球高於插 頭及插座外表面之高度也顯示較均勻。外殼有不明顯之麵 曲或彎曲。 實例2 以基本上與如在實例1所説明之相同方式製備另—插頭及 插座,並將焊球在凹座置於外側。在實例1中之坪料回节爐 -27- 本紙張尺度適用中國國家標準(CNS ) A4规格(210X297公釐) -----^---^--t------IT (請先聞讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作杜印製 406454 A7_____B7__五、發明説明(25 ) 中處理後若干小時,在大氣壓狀況略微不同時,使另一插 頭及基本上與在實例1中所使用者相似之插座經歷與在實例 1中所使用者相似之回流加熱。表1中示爐狀況。表2中示插 頭及支承板之最低及最高溫度。表3中示正及負最大梯度。 表4中示在180。(:與200。(:之間在板所測量之升高及降低時 間。在圖26a中示隨時間及距離之溫度。吾人將會看出,圖 26b中所示之曲線略微不同於圖26a中所示者,該差異歸因 於不同之周圍大氣狀況。目視檢查所產生之連接器,顯示 與在實例1所達成者相似之結果。 表1 溫度(° C) 實例 #1 #2 #3 #4 #5 #6 1 上 350 未加熱 275 230 310 未加熱 1 下 未加熱未加熱 275 230 310 未加熱 2 上 350 未加熱 275 230 310 未加熱 2 下 未加熱未加熱 275 230 710 未加熱 8 2 本紙張尺度適用中國國家橾準(CNS ) Μ規格(210X297公董) (請先閱讀背面之注意事項再填寫本頁) 406454 A7 __B7 五、發明説明(26〉 連接_板 實例 最高溫度(°C) 時間(分及秒) 最高溫度(C) 時間(分及秒) 1 188 4:37.6 1 232 4:19.8 2 191 4:53.2 2 ----- ----- 2 2 9 表3 正及負最大梯疳。C(故1 連接器 板 5:10.4 實例 最大 達到時間 (分及秒) 最大 達到_時間 (分及秒) 1 +2 0:50.4 +2 0:30.4 1 -2 6:45.2 -3 5:58.8 2 +3 7:08.0 +3 1:14.8 2 -15 6:13.8 -7 表4 6:14.0 在1 80 丨° C與2〇〇° C間之升高時間及降彼咕明 I I I I I I I I — 訂 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 (在板上所測量1 tM- 升高時間(分及秒j 降低時間(分及秒) 1 0:28.8 0:15.2 2 1:31.6 0:40.6 實例3 除了圖26a及26b中所示之特定曲線因爲大氣壓狀況而可 -29- 本紙張尺度適用中國國家標隼(CNS ) A4規格(210X297公釐) 406454 A7 B7 五、發明説明(27 ) 能略微不同外,使用基本上與實例1及2中所説明之相同狀 況作成另一連接器。在此連接器完成後,藉Cyber Optics Corporation of Minneapolis, Minne s ot a 出品之 Las er Point Range Sensor(PRS)在插頭之外表面檢查在六位置 之焊球。請參照圖9 ’雷射自Li導向時,此等位置標示爲區 域2<7a及27b,雷射自l2導向時,標示爲區域27c及27d, 雷射自L3導向時,則標示爲區域27e及27f。在所有此等區 域’在每一此等區域取五焊球分布之雷射輪廓。圖27a_27f 示此等雷射輪廓之再現。表3中示每一此等焊球在其高於括 頭外側平面之最高點之高度。就此諸組之每一組而言,如 圖9中所示最靠近插頭前面之焊球視爲表5中之第一位置, 並爲在圖27a-27f中之曲線圖左邊之焊球。檢查此等結果顯 示在每一組五個焊球具有被視爲可接受之焊球高度之均句 度。 表5 位置高度0 0 1吋) (請先閱讀背面之注意事項再填寫本頁} 裝 -訂_ 經濟部中央標準局員工消費合作社印製 組別 1 2 3 4 5 27a 18.1 18.9 19.5 19.6 19.1 27b 19.2 18.5 17.6 18.5 18.0 27c 20.4 2 1.1 2 1.6 2 1.1 21.4 27d 19.9 20.1 20.1 2 1.2 20.5 27e 18.2 18.9 19.3 18.2 18.7 27f 19.1 18.2 19.0 18.2 18.9 實例4 30- 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) 經濟部中央標準局員工消費合作社印製 406454 A7 ______Β7___ 五、發明説明(28 ) 除了因爲大氣壓狀況,在圖26&及26b所示之特定曲線可 能略微不同外,基本上根據實例1及2中所説明之狀況作成 另一連接器。在幾乎所有情形,焊球熔合至觸點引線均令 人滿意’並且在目視檢查,焊球爲在高於插頭及插座外表 面平面之可接受均勻高度。使用一有圖案匹配插頭及插座 上之烊球之模板將焊膏施加至二厚度爲.061吋之不同電路 板上之導電焊料墊片。使插頭位於一電路板上,並使插座 位於另一電路板上。然後除了輸送機速率減至丨丨吋/秒以外 ’在與在熔合焊球所説明者相似之狀況下,再次在輸送機 爐分開處理插頭及插座。在冷卻後,插頭及插座經發現熔 合至其個別板令人滿意。一示選定焊球之此等χ光相片分別 附於圖28a及28b。橫剖面電子顯微鏡相片攝爲示焊球熔合 至信號觸點引線,以及焊球熔合至印刷電路板材料。此等 電子顯微鏡相片分別示於圖28c及28d。在相鄰信號觸點之 間僅有一短路,並且在觸點與焊球之間以及在焊料球與板 之間,在所有其他點均作成良好之連接。 請予察知,電連接器及其製造方法業經予以説明,其中 連接器可利用BGA技術供安裝在PWB上。令人驚訝及料想 不到的是,吾人發現,在焊球之分布,特別是在焊球之重 量及/或容積,均有較高之均勻度。 雖然本發明業經配合各圖之較佳實施例予以説明,但請 瞭解,可使用其他類似實施例或對於所説明之實施例作成 種種修改及增添,供執行本發明之相同功能,而不自其偏 離。再者,所説明之配置可配合連接器以外之其他組件 n ~ I!·! I n n n 訂 (請先閱讀背面之注意事項再填寫本頁)
406454 A7 B7 五、發明説明(29 ) 用,其包含以絕緣材料所形成,帶有將行熔合至PWB或其 他電基片之元件之外殼。 因此,本發明不應限於任何單一實施例,而是在根據後 附申請專利範圍詳述之幅度及範圍予以解釋。 丨, ^ 裝 訂 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 -32- 本紙張尺度適用中國國家標準(CNS ) A4規格(2!0X29?公釐)
Claims (1)
- A8 406454 ?8 _*___ D8 六、申請專利範圍 1. 一種電連接器,適於安裝在一有一導電元件之基片上, 包含: 一觸點,有一連接器部份適於電連接至該導電元件; 一可回流,導電材料之主體,配置在連接器部份上, 該主體適於在連接器與基片之間提供主電流路徑。 2. —種電連接器’適於安裝在一有一導電元件之基片上, 包含: 一絕緣外殼,該外殼有一外側適於面對該基片; 一觸點,有一連接器部份適於電連接至該導電无件; 以及 一可回流,導電材料之主體,配置在連接器部份上, 鄰接外殼之外側。 3 · —種電連接器包含:一絕緣外殼有一底壁有一内側及一外 側,在該外側上有許多切口;許多觸點容納切口,該等 切口各自該底壁延伸至該等凹座之一;一觸點配置在每 一該等切口内,許多可回流,導電材料之主體,每一主 體與一凹座相關聯,並且有其一部份配置在凹座内並熔 合至觸點。 4. 一種電連接器包含: 經濟部中央標準局員工消費合作社印製 1^1 n n^i In i 4 1^1 (^ϋ ^^1 1^1 ^ (請先閱讀背面之注意事項存填寫本頁) 一絕緣構件,有一觸點支承侧及一安裝侧; 一電端子,安裝在絕緣構件上,端子有一觸點部份配 置在絕緣構件之觸點支承側及一安裝部份,安裝部份有 一固著區段至少部份延伸通過絕緣構件;以及 一導熱易熔合區段,自固定區段延伸至絕緣主體安裝 -33- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 406454 ^ C8 ____ D8 六、+請專利範圍 ^ ^ " 侧之外面。 5. —種電組件,適於表面安裝在一電路基片上,包含: 一由絕緣材料形成之主體,該主體有—安裝表面適於 配置爲與電路基片成面對關係,及一在其上向該安裝表 面延伸之開口; 一導電構件,安裝在主體上,該導電構件包括一端子 部份延伸進入向安裝表面之開口,以及 一固定部份,自端子部份延伸至安裝表面,供在電路 基片與導電構件之間建立電連續性,該固定部份包括— 熱易熔合區段。 6. —種電連接器包含: 一安裝介面,供將連接器安裝在一基片上,及一配合 介面供提供電觸點供與配合連接器之觸點貼靠; 許多觸點,安裝在絕緣主體上;以及 一可回流元件,固定在每一觸點上,並自觸點向安裝 介面延伸。 7·—種電連接器包含: 一絕緣外殼,有一配合介面供與一配合連接器配合, 及一安裝介面供安装在一包括導電元件之基片上; 經濟部中央標準局負工消費合作社印製 -----,--1 .裝------訂 (請先閲讀背面之注$項再填寫本頁) 許多觸點,安裝在外殼上,每一觸點有一配合部份適 於貼靠來自配合連接器之觸點,及一連接器部份適.於固 著至基片上之導電元件;以及 許多焊球,每一焊球固定在該等觸點之一冬連接部份。 8.—種電連接器包含: • 34- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局負工消費合作社印裝 40645^ A8 B8 C8 ___D8 六、申請專利範圍 一絕緣基座; 許多觸點,安裝在基座上;以及 許多烊球’每一焊球固定在至少觸點之一上,並形成 一安裝介面供將連接器安裝在基片上。 9. 一種電連接器包含: 一絕緣基座; 許多觸點,安裝在基座上;以及 許多導電元件,有基片貼合面,每一導電元件固定在 至少觸點之一上,並形成一安裝介面供將連接器安裝在 基片上。 10. —種將一外部導電觸點置於一有一基座形成外側及一内 側之電連接器之方法,包含下列步骤: 在基座之外側提供至少一凹座; 提供一導電觸點,自鄰接導體元件之内側延伸至基座 外侧上之凹座; 使一導電元件以至少其一部份位於設在基座外側之凹 座内;以及 將導電元件因著至觸點,同時使導電元件位於凹座内。 11. 一種作成電連接器之方法包含: 將一觸點端子安裝在絕緣構件之一表面,端子之一部 份向絕緣構件之第二表面延伸進入該絕緣構件内;以及 將一易熔合導電主體固著至向第二表面延伸之端子之 一部份。 12·—種電連接器,有一基座有_外側及一内側,並以包含 -35- 本紙張尺度適用巾關家標準(CNS〉A4SI ( 210X297公釐) (請先閲讀背面之注項再填寫本頁) •裳_ 訂. 406454 A8 B8 C8 D8 經濟部中央標準局貝工消費合作社印装 六、申請專利範圍 ' --- 下列之步驟所作成: 在基座之外側提供至少一凹座; 提供-導電觸點,自鄰接導體元件之内側延伸至基座 外側上之凹座; 使-導電元件以至少其-部份位於設在基座外側之凹 座内;以及 將導電元件固著至觸點,同時使導電元件位於凹座内。 13·種作成電連接器之方法包含: 將一觸點端子安裝在絕緣構件之一表面,端子之一部 份向絕緣構件之第二表面延伸進入該絕緣構件内;以及 將一易熔合導電主體固著至向第二表面延伸之端子之 一部份。 14. 一種作成電連接器之方法包含: 將一觸點端子安裝在絕緣構件之一表面,端子之一部 份向絕緣構件之第二表面延伸進入該絕緣構件内;以及 將一實際球形導電構件固著至向第二表面延伸之端子 之一部份。 15. —種電連接器包含: 一連接器主體; 至少一觸點容納開口,供容納一可安裝在連接器主體 之觸點之一部份,該開口有一側壁部份;以及 一可變形構件,位於鄰接該侧壁,並適於被一插入該 開口内之觸點變形及使觸點固著在該開口内。 16. —種在一電連接器之外殼使來自觸點插入該外殼内之應 -36- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -----,--1 -裝------訂 (请先聞讀背面之注意事項再填寫本頁) 406454 eg C8 D8 ^+請專利範圍 力累積最小之方法,包含下列步驟: 提供一外殼,其上有許多觸點容納開口; 將觸點插入該開口内; 使一可變形結構貼合在該開口内,同時將觸點作爲觸 點插入;以及 使觸點實際插入至鄰接可變形構件之開口之部位在外 殼所感生之任何應力局部化。 17.—種供電連接器之觸點包含: 一中間部份; 一觸點貼合部份,自中間部份延伸,該觸點貼合部份 適於貼合一配合觸點; 一焊料端子部份,自中間部份延伸,並適於容納將行 熔合於其上之焊料;以及 該中間區段上有一塗層,供抵抗焊料自端子部份芯吸 至貼合部份,該塗層包含一層鎳。 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 -37- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
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TW406454B true TW406454B (en) | 2000-09-21 |
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TW086113845A TW406454B (en) | 1996-10-10 | 1997-09-23 | High density connector and method of manufacture |
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JP (1) | JP3413080B2 (zh) |
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CN (3) | CN1200483C (zh) |
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AU (2) | AU5145498A (zh) |
BR (1) | BR9712296B1 (zh) |
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DE (6) | DE69737252T2 (zh) |
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PL (2) | PL192431B1 (zh) |
RU (1) | RU2208279C2 (zh) |
SG (1) | SG71046A1 (zh) |
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