TW406454B - High density connector and method of manufacture - Google Patents

High density connector and method of manufacture Download PDF

Info

Publication number
TW406454B
TW406454B TW086113845A TW86113845A TW406454B TW 406454 B TW406454 B TW 406454B TW 086113845 A TW086113845 A TW 086113845A TW 86113845 A TW86113845 A TW 86113845A TW 406454 B TW406454 B TW 406454B
Authority
TW
Taiwan
Prior art keywords
contact
contacts
connector
recess
solder
Prior art date
Application number
TW086113845A
Other languages
English (en)
Inventor
Timothy A Lemke
Timothy W Houtz
Original Assignee
Berg Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=27542146&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=TW406454(B) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/728,194 external-priority patent/US6024584A/en
Priority claimed from US08/778,398 external-priority patent/US6093035A/en
Application filed by Berg Tech Inc filed Critical Berg Tech Inc
Application granted granted Critical
Publication of TW406454B publication Critical patent/TW406454B/zh

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50Fixed connections
    • H01R12/51Fixed connections for rigid printed circuits or like structures
    • H01R12/55Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/716Coupling device provided on the PCB
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/72Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H01R12/722Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
    • H01R12/727Coupling devices presenting arrays of contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0249Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for simultaneous welding or soldering of a plurality of wires to contact elements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0256Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for soldering or welding connectors to a printed circuit board
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0263Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections for positioning or holding parts during soldering or welding process
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3478Applying solder preforms; Transferring prefabricated solder patterns
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49149Assembling terminal to base by metal fusion bonding

Description

第 8611384 麵輪 中文說明書修正頁(89年6月) A7B7 ,“亡日修正j補充 五、發明説明(7 ) I -1 I · 經濟部中央標準局員工消費合作社印製 頭接地/功率觸點之正視圖。 較佳實施例之詳細說昍 -月概括參照圖1 - 2及】2 - 1 3,根據本發明之高密度連接器 第一實施例之一组互相配合之連接器,包括一概括示於圖 號】〇之插座。插座之一基座區段概括示於圖號12。基座較 佳為模製一種能經得起SMT回流溫度之適當絕緣聚合材料 ,例如液晶聚合物(liquid crystal p〇lymer,簡稱1^以 所形成。首先請參照基座區段,此元件包括一有一外側】6 及内側丨8 t底壁1 4。在外側上有外凹座,例如凹座2 〇 , 22 ’ 24 ’ 26及28(圖12)。在内側上有内觸點容納凹座, 例如凹座30,32,34,36及38。中間切口,例如切口 4〇 ,42,44,46及48連接此等内外凹座。每一外凹座有一 底壁及一橫向壁,例如底壁5〇及橫向壁52(圖〗2)。每一内 仏號觸點容納凹座有一底壁及相交之橫向壁,例如底壁Μ 及橫向壁56及58。每一内接地或功率觸點容納凹座也有一底 壁及對角橫向壁,例如,底壁6Q及橫向壁62及64。上述内及 外凹座以及連接中間切口容納接地/功率觸點或信號觸點。 接地或功率觸點較佳為有一概括示於圖號66 ’由二接觸 又』68及70所形成之上區段。此二叉頭各有一會聚區段Η ,一觸點7 4及一向外輻散或引入區段7 6。接地或功率觸點 也包括一通過插座之下壁之中間區段78及222,及一延伸進 入外凹厓之下區段8 〇。如以下將予說明,焊球82,224及 228熔合至下區段8〇。 信號觸點(圖12及13)各包括概括示於圖號84較佳為有一 ,袈----- (請先聞讀背面之注意事項再填寫本f) • I I - ΙΓΙ I ·
*1T 本紙張尺度適财_@@家料(CNS ) A4規格( -10- 40645^ 經濟部中央標準局員工消費合作社印製 A7 一______ B7五、發明説明(1 ) 螢明之背吾 j·發明之領蜂丄本發明係關於電連接器,尤指高1/()密度 連接器,諸如陣列連接器。 ? !.先前發展之_簡,要説明上縮小電予設備尺寸,特別是個人 手提式裝置,以及增加另外之功能至此等設備之慾望,導 致人們不斷想要使所有組件微型化,特別是電連接器。致 力使連接器微型化包括在單排或雙排線型連接器減少端子 間之間距,以便較高數目之1/〇或其他線能藉連接器在電路 基片上配合在分配供容納連接器之緊密限定區域予以互相 連接。伴隨微型化之慾望,人們之偏愛也轉向表面安裝技 術(surface mount techniques,簡稱 SMT),供將組件安 裝在電路板上。增加使用SMT及線型連接器所需要之細微 間距,二者匯合導致趨近SMT供高容量,低成本操作之極 限。減少端子之間距,在焊膏回流時,增加相鄰焊料墊片 或端子橋接之危險。要滿足增加1/〇密度之需要人們曾建議 陣列連接器。此等連接器有一平面陣列之端子安裝在絕緣 基片上,並可提供增進之密度。然而,關於藉SMT技術附 著至電路基片,此等連接器存在有某些困難,因爲大多數( 如非所有)端子之表面安裝尾部必須在連接器主體下面。因 此,所使用之安裝技術必須高度可靠,因爲難以目視檢查 焊料連接,或如果有誤失,並難以修理。積體電路(IC)安 裝在塑膠或陶瓷基片上,人們常使用球形格柵陣列(ban grid array,簡稱BGA),及其他類似包裝。在BGA包裝 ,附著至積體電路包裝之球形焊球位於一般爲使用屏幕或 ______ -4- 本i張尺度適财_家料T^NS ) A4規格(21GX297公楚---- I--------_政-- (請先聞讀背面之注意事項再填寫本頁) 訂 406454 A7 ---—--?Z_____________ 五、發明説明(2 ) 掩模已施加一層焊膏之電路基片之電觸點墊片上。該單元 然後予以加熱至焊膏及焊球之至少一部份或全部熔化並溶 合至形成在電路基片上之下面導電墊片之溫度。積體電路 從而連接至基片,而在積體電路上無需外部引線。 使用B G A及類似之系統將積體電路連接至基片,雖然有 很多優點’但供將電連接器或類似之組件安裝在印刷接線 板(printed wiring board,簡稱PWB)或其他基片上之對 應裝置仍有待開發。對於大多數情況,重要的是,焊球之 基片貼合面爲共平面,以形成一實際平形安裝介面,以便 在最後應用,球將會回流,並均勻焊接至平面印刷電路板 基片。連接器回流至印刷電路板時,既定基片上之焊料共 平面性之任何顯著差異均可能導致不良之焊接性能。爲達 成高焊接可靠性,使用者規定非常嚴密之共平面性需求, 通常約爲0 0 0 4付。焊球之共平面性受焊球之尺寸及其在連 接器上之定位所影響。球之最後尺寸係依焊膏及焊球中最 初可用之總烊料量而定。在施加焊球至連接器觸點後,此 項考慮存在特殊挑戰,因爲容納在焊料塊内之連接器觸點 之容積變化影響焊料塊尺寸之潛在可變化性,並因此影響 連接器上之焊球沿安裝介面之共平面性。 經濟部中央標準局員工消費合作社印製 —^^1 ^^1 m I 1 HI 1 I. i in 一 w 、is 口 (請先閲讀背面之注意事項再填寫本頁) 將連接器焊接至基片所存在之另一問題,爲連接器常有 絕緣外殼,其具有較複雜之形狀,例如有很多腔者。自模 製過程,自觸點插入所致應力之累積,或兩者之結合,可 能導致此等熱塑外殼上之殘留應力。此等外殼可能在最初 或在加熱至在SMT處理所必需之溫度時,諸如使焊球回流 本紙張尺度適用中國國家標準(CNS ) A4規格(2丨〇><297公釐) — 40645( 五、發明説明(3 ) 所必需之溫度,變成翹曲或扭绞。外殼之此等翹曲或扭絞 可能導致連接器組合件與PWB間之尺寸錯配,因爲表面安 裝元件,諸如焊球,在焊接前不足夠與焊膏接觸或接近PWB ,而造成不可靠之焊接。 因此,需要藉表面安裝技術將高密度電連接器可靠及有 效率安裝在基片上。 發明之概诚 根據本發明之電連接器提供高1/0密度,以及藉SMT技術 可靠附著至電路基片。此等連接器沿安裝介面呈現高度共平面 性0 本發明之電連接器爲其中一個或多個端子可藉易熔導電 材料連接至基片者。此易熔導電材料爲焊料塊,較佳爲包 含一種可回流以在端子與電路基片之間提供主電流路徑之 焊球。 本發明之一方面包括供在電連接器之元件上形成外部易 熔導電觸點之方法。根據一種方法,在連接器元件之外側 形成一凹座或觸點。導電觸點之一區段自靠近導體元件之 内側延伸進入外殼外侧上之凹座内。凹座填滿受控制量之 經濟部中央標準局爲工消費合作社印製 焊膏。易熔導電元件,例如焊球,位於外殼外側上之凹座 内。置於凹座内之導電元件然後予以加熱至溫度足以熔化 焊膏’並將易溶導電元件溶合至延伸進入該凹座内之觸點 之區段。 本發明也包含一種供用於電連接器之觸點,其包含—端 子凸片區域,該觸點可連接至易熔導電元件,諸如焊球。 -6- 紙張尺度適用中國國家標準(CNS ) A4規格(2丨Ox297公釐) 五 、發明説明(4 A7 B7 ^〇M54. 經濟部中央標準局員工消費合作社印製 、點之中間區域位於端子凸片與觸點區域之間。中間區 域適=例如藉施加塗布或鍍敷一種非焊料可濕潤材料而抵 杭熔融焊料流動。藉此種配置,便避免焊料自附著至觸點 之區域自焊球芯吸。 提供一避免應力累積在其中之絕緣連接器外殼,藉以保 持連接器之表面安裝介面之共平面性。根據本發明之此一 方面,將-觸點端子插入外殼上之開口。冑口予以構形爲 致使至>其—側有或包含—成形之凸起部,^端子插入開 口時,’適於被端子所變形。藉此種配置,由於很多觸點插 入而避免應力累積,便使外殼之翹曲及扭轉最小。 附圖之簡要銳.明 茲參照附圖進一步説明本發明之方法及連接器,在附圖 中: ,圖1爲本發明之連接器較佳實施例,其插座連接器之頂視 平面圖; 圖2爲圖1中所示插座之部份剖開端視圖; 圖3爲本發明較佳實施例之一種插頭元件之頂視平面圖; 圖4爲圖3中所示插頭元件之部份剖開端視圖; 圖5爲圖Μ中所示插座及插頭元件,在未配合 份剖開端視圖; 1 圖6爲圖5中所示插座及插頭元件,在配合關係 開端視圖; W… 圖73,几及7。分別示在圖5中所示插座端插頭配合時, 第一,第二及第三連續階段之剖開端視圖; . ^—Μ— (請先閲讀背面之注意事項再填寫本頁) 訂 .I I I- I - 1 . • - -I I > .i I - -I · 本纸張尺度適用f國國家標準(CNS ) A4規格(210x7^^7 經濟部中央標準局員工消費合作社印製 40645^ A7 ------ B7 五、發明説明(5 ) 圖8爲圖1中所示之插座,在焊球置於其上前之底視平面 圖; 圖9爲圖8中所示之插座,在焊球置於其上後之底視平面 圖; 圖10爲圖1中之區域χπ之詳細剖開圖; 圖11爲圖4中之剖開區域之放大圖; 圖12爲圖1〇中之剖開區域之放大圖; 圖13爲通過圖10中之13-13之放大剖面圖; 圖1 4爲本發明之插座連接器,其第二較佳實施例之頂視 平面圖; 圖15爲圖14中所示插座之端視圖; 囷16爲本發明之插頭連接器,其第二較佳實施例之頂視 平面圖; 圖17爲圖16中所示插頭之端視圖; 圖18圖中14-17所示配對插座及插頭之端視圖; 圖19爲一用於本發明之插座連接器第三較佳實施例,其 插座之頂視平面圖; 圖20爲圖14中所示插座之端視圖; 圖2 1爲本發明之插頭連接器之第三較佳實施例,其插頭 元件之頂視平面圖; 圖22爲圖2中所示插頭元件之端視圖; 圖23爲圖19-22中所示配對插座及插頭之端視圖; 圖24爲一根據本發明連接器之另一實施例,其片段之側 面刻面圖; 本紙張尺度適用中國國家標準(CNS ) A4規格(210'〆297公釐) :--— I#-- (請先聞讀背面之注意事項再填寫本頁)
、1T 40645^ A7 B7 部份,修改爲形成一較深凹座之 五、發明説明(6 ) 圖24a爲圖24之結構之一 片段圖; 圖25爲圖24中所示逸垃哭 # 丁運接器,其中插頭及插座配合之片段 正視剖面圖; 圖26a及26bf示在本發明之方法之實例⑴,在焊料 回流期間,溫度對時間及距離之曲線圖; 圖27a-27f爲雷射所產生,本發明方法實例3之產品之輪 廓; 圖28a及28b爲X光相片,示本發明之方法實例4之產品; 圖28c及d爲電子顯微鏡相片,示本發明之方法實例4之產 Ο · αα , 圖29爲相似於圖1()之圖’其中省略接地及功率觸點; 圖30爲通過圖13中之xxxi-xxxi之剖面圖; 圖3 1爲纟與本發明之較佳實施例所例示者相似之絕緣 外殼,電腦所產生之預測應力之表示; 圖3 2爲觸點保持力爲如圖29中所示絕緣外殼之肋條變形( 壓縮)量之函數之曲線; 圖33爲用於本發明連接器較佳實施例之插頭信號觸點 之正視圖; 圖34爲一用於本發明連接器較佳實施例之插座信號觸點 之正視圖; 圖35爲一用於本發明連接器較佳實施例之有載體條之插 座接地/功率觸點之正視圖;以及 圖36爲一用於本發明連接器較佳實施例之有載體條之插 -9- 尽紙張尺度適用中國國家標準(CNS ) A*規格(21〇><297公釐) II I 广 ^ "裝 (請先聞讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 第 8611384 麵輪 中文說明書修正頁(89年6月) A7B7 ,“亡日修正j補充 五、發明説明(7 ) I -1 I · 經濟部中央標準局員工消費合作社印製 頭接地/功率觸點之正視圖。 較佳實施例之詳細說昍 -月概括參照圖1 - 2及】2 - 1 3,根據本發明之高密度連接器 第一實施例之一组互相配合之連接器,包括一概括示於圖 號】〇之插座。插座之一基座區段概括示於圖號12。基座較 佳為模製一種能經得起SMT回流溫度之適當絕緣聚合材料 ,例如液晶聚合物(liquid crystal p〇lymer,簡稱1^以 所形成。首先請參照基座區段,此元件包括一有一外側】6 及内側丨8 t底壁1 4。在外側上有外凹座,例如凹座2 〇 , 22 ’ 24 ’ 26及28(圖12)。在内側上有内觸點容納凹座, 例如凹座30,32,34,36及38。中間切口,例如切口 4〇 ,42,44,46及48連接此等内外凹座。每一外凹座有一 底壁及一橫向壁,例如底壁5〇及橫向壁52(圖〗2)。每一内 仏號觸點容納凹座有一底壁及相交之橫向壁,例如底壁Μ 及橫向壁56及58。每一内接地或功率觸點容納凹座也有一底 壁及對角橫向壁,例如,底壁6Q及橫向壁62及64。上述内及 外凹座以及連接中間切口容納接地/功率觸點或信號觸點。 接地或功率觸點較佳為有一概括示於圖號66 ’由二接觸 又』68及70所形成之上區段。此二叉頭各有一會聚區段Η ,一觸點7 4及一向外輻散或引入區段7 6。接地或功率觸點 也包括一通過插座之下壁之中間區段78及222,及一延伸進 入外凹厓之下區段8 〇。如以下將予說明,焊球82,224及 228熔合至下區段8〇。 信號觸點(圖12及13)各包括概括示於圖號84較佳為有一 ,袈----- (請先聞讀背面之注意事項再填寫本f) • I I - ΙΓΙ I ·
*1T 本紙張尺度適财_@@家料(CNS ) A4規格( -10- 經濟部中央標準局員工消費合作社印— 406454 A7 B7 五、發明説明(8 ) 觸點凸起部86之上區段,一引入寶頭88及一加強助9〇。信 號觸點也包括一中間區段92,其通過插座之下壁。信號觸 點各包括一下區段98(圖13),延伸進入外凹座,例如圖 12-13之凹座22,如以下將予解釋,焊球1〇〇熔合至下區段 98 ° 請特別參照圖1 - 2 ’插座之基座區段包括例如概括示於圖 號102之閂鎖結構。此鎖閂結構包括一向上凸片1〇4,其重 疊於一垂直凹槽106,並且其有一向外凸起部1〇8。插座之 基座區段也有其他相似閂鎖結構1丨〇,1 1 2及1 1 4。插座也 包括概括示於116,重疊於基座區段之上區段。此上區段有 一頂壁1 1 8及一周邊側壁1 2 0。此上區段藉例如概括示於圖 號122之閂鎖結構固定至基座區段。此等閂鎖結構各一有側 壁凹座124及一U形鎖閂126,其自頂壁向下延伸,並與側 壁凹座間開。凸片1 〇 4配合於U形鎖問1 2 6與側壁凹座i 2 4 之間’以使U形鎖閂可貼靠基座區段之鎖閂結構1〇2上之向 外凸起部1 0 8。上區段包括其他相似閂鎖結構1 2 8,1 3 0及 1 3 2,其分別貼靠基座區段上之閂鎖結構丨丨〇,u 2及u 4 。上區段116或基座102也可有安裝托座134及136,其分 別有緊固件孔徑1 3 8及1 4 0。在上區段1 1 6之頂壁1 1 8上也 有信號觸點進入孔徑,例如孔徑1 4 2及1 4 4。此等進入孔徑 排列成許多排,對應於基座區段上之諸排信號觸點。細長 接地或功率觸點進入切口,例如切口 1 4 6及1 4 8,插入在此 諸排信號觸點進入孔徑之間。上區段1 1 6在插座1 〇與配合 插頭150之間形成一在下面所説明之配合介面。 -11 - 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) ------,---;----裝-- (請先閲讀背面之注意事項再填寫本頁) ,ιτ 40645
五、發明説明(9 經濟部中央標準局員工消費合作社印裂 請參’、、、圖3-4及圖11,連接器之插頭元件概括示於圖號 、插頭包括一底壁152及一周邊侧壁154。在侧壁有對 置=間隙1 5 6及1 5 8,並有一開口側丨6〇與底壁成對置關係 刀別有緊固件容納孔徑166及168之安装托座162及164 自插頭橫向凸起其可與插座之安裝托座之緊固件容納孔徑138 ,140對準。 請參照圖1 1,在底壁1 5 2内側有内信號觸點容納凹座, 諸士凹座170。内功率或接地觸點容納凹座,諸如凹座I?? ’也在底壁内側上。外信號觸點容納凹座,諸如凹座174, 及外功率或接地觸點容納凹座,諸如在凹座176,與底壁上 之外凹座成對置關係。中間切口 ! 7 8及丨8 〇分別連接外及内 k號觸點容納凹座以及外及内功率或接地觸點容纳凹座。 概括示於圖號182之功率接地觸點經由中間切口 ι8〇安裝在 功率/接地觸點容納凹座内。每一觸點182有一細長内區段 184,一安裝在底壁152之細長中間區段186,及一延伸進 入凹座176内之外區段188。一焊球190溶合至區段188。 外區段188及烊球部份包含在外凹座176内。插頭也包括許 多信號觸點192。此等信號觸點各有一内區段194,一安裝 在底壁之中間區段196,及一延伸進入凹座174内之端子凸 片198。一焊球200熔合至端子凸片198。吾人將會再次看 出,此外區段及焊球部份包含在如在1 7 0之外凹座内。 請參照圖5-7c ’將會看出以上所説明之插頭安裝在電路 基片,諸如剛性PWB 2 02上,並且插座安裝在一相似之 PWB 204上。插頭及插座從而如圖6中所例示,形成板對 12- 本紙乐尺度適用中國國家樣準(CNS ) A4規格(210 X 297公釐) (請先閱讀背面之注意事項再填寫本頁) -裝·
、1T Λ • 1^1 i— n ^^1 406454 A7 ______B7 五、發明説明(10 ) 板互相連接。插頭有一平面陣列之信號觸點諸如丨9 2,焊球 2 0 0溶合至此陣列,以及許多接地/功率觸點,諸如觸點 1 9 2,焊球1 9 0熔合至此等觸點。焊球也利用s μ T技術熔合 至PWB202,以使整個插頭固定至PWB,並在插頭及pWB 上之化號觸點與接地或功率觸點之間完成電接觸。請予察 知’雖然圖5中未例示所有觸點,但所有此等觸點均以相同 方式連接至焊球及連接至PWB。同樣,焊球1〇〇熔合至插 座信號觸點84,並且此等焊球熔合至PWB204。插座接地/ 功率觸點66安裝在切口 134内,並溶合至焊球82,並且此 等焊球熔合至PWB 204。 插頭與插座對準,致使插頭之周邊側壁154重疊插座之上 區段1 1 8之周邊侧壁1 2 0。 經濟部中央標隼局員工消費合作社印製 H· - - - . ί .^ϋ i^i I I I I - I 二 1^1 , I 、νδ (請先閲讀背面之注意事項再填寫本頁) 請特別參照圖7 a - 7 c,更詳示插頭及插座之貼合。圖7 a示 在最初對準後,插頭上之接地/功率觸點進入插座上之接地/ 功率觸點容納切口,並貼靠插座上之對應功率/接地觸點。 信號觸點已經進入插座上之信號觸點切口。圖7b示插頭上 之信號觸點最初貼靠插座上之對應信號觸點,並且插座上 之功率接地觸點變成進一步貼靠在插座上之功率/接地觸點 之對置葉片之間。圖7示插頭上之信號觸點與插座上之信號 觸點完全貼合。插頭上之功率/接地觸點已在插座變成位於 功率/接地觸點叉頭之基座上。 請參照圖8 ’ TF在施加焊球前,插座之基座區段1 2之外側 16。在施加焊球前,信號觸點之端子凸片,例如端子凸片 82,及功率接地觸點,例如端子凸片98,藉觸點插入基座 -13- 本紙張尺度適用中國國家標準(CNS ) Α4規格(21〇χ297公釐) 經濟部中央標準局員工消費合作社印裝 406454; A7 ____」B7五、發明説明(11 ) ? " ' 12之相反表面1 8而配置在對應外凹座,例如外凹座2〇, ,24,26及28内。施加適當組成之大量焊膏,以實際填滿 每一外凹座。然後將焊球施加至基座之外或安裝表面上。較 佳爲,外凹座在橫向範圍小於焊球,因而焊球在凹座之邊 緣支承在靠近觸點之端子凸片之位置。爲使烊球在凹座上 (穩定性最大,凹座之剖面較佳爲圓形或規則之多角形。 如圖9中所示,焊膏有助使焊球保持在每一露出之凹座,例 如,焊球82示爲在凹座20内,以及焊球丨00示爲在凹座22 内。另外之焊球,230, 232及2 34例如示爲在凹座24,26 及28内。一焊球將位於插座之所有外凹座。也請予瞭解, 在如圖8中所示置放焊球前,以及在如圖中"所示置放焊球 後,插頭之外侧將會與插座之外側實際完全相同。在焊球 置放於外凹座後,連接器經歷回流過程,使焊球熔合至端 子凸片。連接器之外側,連同焊球,特別是焊球之外表面 ,形成一實際平面之安裝介面,連接器沿其安裝至一支承 電路基片,諸如PWB。 圖10及13示圖1實施例之一種變化型,其中葉片型觸點 之相對配置對66a及66b代替叉形插座觸點66 ’貼靠接地/ 功率端子1 8 2。 圖14-18例示本發明之一组互相配合連接器之第二較佳實 施例。請特別參照圖14-15,此組包括概括示於圖號236之 插座。此插座包括一概括示於23 8之絕緣外殼,其有一内側 2 4 0,一橫向側2 4 2及一外侧2 4 4。外殼也包括相對對準之 凸起部246及248。在外殼之内侧有觸點25 0,251及252, -14- ^.— 11 -H ^ ~ ^ n n 訂 (諳先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中關家標準(CNS) A4規格(2丨G χ 297公釐) A7 B7 406454 五、發明説明(12 ) II 丨 \I n (請先閱讀背面之注意事項再填寫本頁) 彼此弯成弓形離開,然後聚合至一觸點,其然後再次輻散 。觸點251以與圖丨_13中所示實施例之相同方式安裝在基 座231上。焊球’諸如焊球254,以上述相同方式安裝至觸 點25 1之板侧。請特別參照圖16及17,該組也包括概括示 於25 8之插頭,其包括概括示於26〇之絕緣外殼,有一内侧 262,一周邊橫向側264及一外側266。在外殼之_端有一 對垂直端壁268及270有中間端凹座272。在外殼之相反端 有另一對端壁274及276有中間端凹座278。許多觸點,如 在觸點280,自外殼之内侧延伸,其自如在282之凹座延伸 。一焊球284熔合至每一此等觸點。吾人也將會看出,此等 觸點位於呈一種交錯之排列。例如,觸點2 8 6相對於接觸 280偏置,因而諸排觸點可間開爲更靠近在一起,以增加觸 點密度。請特別參照圖1 8,將會看出,插頭上之每一觸點 諸如觸點280與插座上之數對會聚觸點之一,諸如觸點25〇 及252垂直對準,並且插置在此等會聚觸點之間。吾人也將 會看出,對準凸起部246及248也貼靠插頭上之端部凹座 272及278。在此實施例’不存在使用於圖ι·ΐ3實施例之分 開之接地/功率觸點。如果希望,此種功能可合併至未分開 之觸點對。 經濟部中央標準局員工消費合作社印製 圖1 9 - 2 3示一組互相配合連接器之第三較佳實施例。插頭 概括示於圖號290。此插頭包括概括示於圖號292之外殼, 有一底壁294及一周邊橫向壁296,以及對置對準之凸起部 298及300 〇外殼之底壁有一内側302及一外側304 〇信號 觸點,諸如觸點3 0 6,自内侧3 0 2延伸。吾人將會看出,信 -15- 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X297公釐) 406454 五、發明説明(l3 ) 號觸點也在交替諸排交錯或偏置,以增加觸點密度。插頭 也包括接地或功率觸點310,312,314及316,排列爲靠 近平行於橫向壁一側之插頭侧面之每一側。信號觸點焊球 ,諸如焊球3 18,及功率接地觸點烊球,諸如32〇在底壁之 外侧,其以關於第一實施例所説明之相同方式熔合至其個 別觸點。插座概括示於圖號322,並有一絕緣外殼324,其 包括一底壁326,一周邊橫向壁328,以及對準凸起部容納 凹座330及332。底壁也有一外側334及一内側336。信號 觸點’諸如觸點3 3 8及3 40自内側凸起。在相鄰橫向諸排之 觸點也予以軸向偏置,以允許增加觸點密度。橫向功率或 接地觸點342,344,346及350平行於周邊壁之每一側。 每一信號觸點有一焊球,諸如焊球3 5 2在底壁之外側。也有 焊球,諸如在焊球3 5 4,供附著每一功率或接地插腳❶請特 別參照圖23,吾人將會看出,插頭290貼靠插座322。 如先前所提及,將行藉SMT技術安裝在電路基片上之組 件諸如電連接器,必須符合共平面性之亟需之規範。如果 未保持共平面性之嚴密容限,通常約爲0·003至〇 〇〇4吋, 製造廠商便經驗由錯誤之焊料連接所產生之不希望有之高 故障率。由於觸點插入處理所發生觸點在絕緣外殼上之位 置變化,以及外殼之變形,導致連接器主體之安裝介面之 彎成弓形或翹曲,可發生觸點之表面安裝部份與電路基片 之距離上之變化。根據本發明所作成之連接器使用將連接 器接合至基片之易熔主體細心定位及定其大小之特色,以 及使用觸點固定配置防止會使外殼變形之應力聚集在連接 -16- 本紙張尺度適用中國國家標準(CNS ) Α4規格(2ι〇χ297公楚) (請先聞讀背面之注意事項再填寫本頁) 裝· 、1Τ 經濟部中央標準局員工消費合作社印製 〇e4S4 A7 --—---- B7 五、發明説明(hY ' ----— 器外成’可藉以達成嚴格之共平面性需求。 在圖1-23之實施例,金屬觸點以一種避免在外殼之主體 感生應力〈方式固著賴緣外殼。此種固著爲使用成形之 切或開口,將觸點之固著部份插入其内所達成。在一種 特別用於較小化號觸點之配置,切口之形狀在形狀及尺寸 上,除了 一觸點表面外,與所有表面緊密一致。面對該一 表面之切口之壁有一整體模製之橫向凸起部凸入切口内。 凸起部<末端與切口之對置壁間之距離少於觸點之厚度。 因此凸起部之末梢部在觸點插入切口時被其貼靠並變形。 可變形凸起部施加於觸點之法向力使觸點確實保持在切口 中。因爲凸起部之末梢部可自由變形,故避免應力在外殼累 積在例示之較佳實施例,6起部包含一形成在切口侧壁 之之整體錐形肋條。 經濟部中央標準局員工消費合作社印製 ,-----^------ΐτ (請先閱讀背面之注意事項再填寫本頁) 例不之特定肋條構形,對於採用此肋條之外殼,據信爲 最佳者’但其他類型之外殼可能宜採用略微不同形狀或尺 寸之其他類似肋條。請特別參照圖29及3〇,信號觸點494 保持在切口 496内,並緊靠肋條498。肋條在其貼靠觸點 494之處有—平面表面500,並有對置之斜邊502及504。 觸點494藉與切口 496之背緣及側緣以及肋條498貼靠,而 確實保持在切口内。鄰接表面50〇之肋條之部份在觸點494 被強迫進入切口 496内時,可自由變形,從而減輕由於觸點 插入所產生之任何應力。 同樣,功率/接地觸點保持在切口 508内,並且抵靠可變 形肋條5 10。肋條有一在此處緊靠觸點之末梢部512,及對 -17- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消費合作杜印製 __406454 五 '發明説明(15 ) 置之斜邊514及516。在此種配置’也有對置之肋條,例如 肋條5 1 8。此對置之絕緣肋條也有一末梢部5 2 〇及斜邊5 2 2 及524。對置之可變形肋條可用以固定較大之觸點,及使觸 點在切口定中。精於此項技藝者也將會察知,此等肋條之 特定形狀,尺寸,數目及設置’不同類型之外殼可能有所 不同,並且此等因素將選擇爲致使將外殼内之應力隔離在 可變形肋條至最大可能程度。使用AnSyS,Inc. Qf Houston之ANSYS應力分析軟體所產生之圖31,示使用圖 29及30中所例示之觸點固定配置,高水準之應力基本上被 隔離在肋條,並且延伸實際不超過觸點安裝切口,從而顯 著減少否則可能由於大量觸點插入而產生之外殼翹曲或扭 轉之危險。圖31中所示各種不同應力區域之單位爲N/mm 2 ,並且mm是爲所示位移之單位。圖32示就代表性觸點切4 而言,可變形肋條之末梢部最多約達〇 〇〇〇4吋之變形(壓縮 )之增加,在觸點與外殼之間產生由肋條所加於觸點之法向 力所致之增加之保持力。在〇〇〇〇4吋之變形(壓縮)後,在 保持力僅產生少量之增加。 如先前所提及,利用BGA安裝影響連接器基片安裝面之 共平面性之另一因素,爲焊球尺寸之均一性及焊球相對於 連接器外殼之板安裝面之位置。在先前所説明之較佳實施 例,每觸點之端子凸片位於凹座内。外凹座爲實際均句 大小及形狀。此等凹座提供關於本發明之若干重要特色。 凹座可例如藉簡單之敷著及刮擦作業容納高度均勻量之焊 膏在其中。因此用以將每一焊球固著至觸點之焊料量爲實 : ^--裝-------玎 (讀先閲讀背面之注意事項再填寫本頁)
本紙張尺度適财_家縣 經濟部中央標準局員工消費合作社印製 406454 A7 -----------B7 五 '發明説明(Μ ) 際均勻。在焊球附著至觸點前,凹座定每一焊球在χ_γ方 向之位置。凹座也定烊球在Ζ方向相對於外殼底面之位置, 以及烊球與觸點之端子凸片之距離。進入凹座内之凸片之 額定延伸部份予以設定爲致使在進入凹座内之凸片延伸部 份芝最大容限,凸片不觸及焊球,並從而影響其2方向位置 。然而,在凹座有較均勻及適當量之焊料來自焊膏,保証 坪球熔合至觸點凸片。觸點凸片與焊球間之距離上之任何 變化被置於凹座内之可變量之焊膏所吸收。 爲在用以將焊球附著至觸點之回流步驟使適當量之焊料 保持靠近焊球,並防止烊料芯吸至觸點之貼合面,觸點予 以處理,以抵抗焊料芯吸。請特別參照圖33,觸點526及 528示爲附著至一載體長條53〇。觸點有一觸點貼靠區域 5 3 2通常鍍敷非氧化金屬,諸如金,鈀或鈀之合金。觸點也 有一中央區域534,其一部份形成外殼上之觸點保持區域。 一種抗焊料芯吸或非焊料可濕潤材料予以施加至中央區域 5 3 2。供此目的之一種較佳材料爲鍍鎳。雖然不意爲受任何 特定理論所約束,但此種鍍鎳區域之抗烊料特色,據信爲 在鍍敷後,例如,暴露至周圍空氣若干天而鎳氧化所^生 ,或被其所提高。令人驚訝並且料想不到的是,吾人發現 ,鎳或鎳氧化物障壁防止或減少此等觸點上之焊料芯吸。 對於具有此種鈍化功能之鎳或鎳氧化物鍍敷而言,較佳爲 鍵敷具有丨0微对至丨00微对’更佳約爲50微叶之厚度。其 他抗坪料芯吸材料據信可供此目的使用, 料 塗料。如果整個觸點艘敷一連續外層之坪料可=屬早料 -19- 本紙張尺度適用中國國家標準(CNS ) Α4規格(210X297公餐) ;---_--^------ΐτ (請先閲讀背面之注意事項再填寫本頁) A7 B7 406454 五、發明説明(η ) (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 例如金,此等塗料可能特別有用。觸點凸片區域5 3 6可較佳 予以鍍敷一種焊料接納材料,諸如金,錫或錫合金。較佳 爲,整個觸點將予鍍鎳。在上區段有一貴金屬層選擇性鍍 敷在鎳上面。上區段貴金屬鍍敷較佳爲具有10微吋至1〇〇 微吋,更佳約爲3 0微吋之厚度。在下區段有一烊料可濕潤 金屬層選擇性鍍敷在下區段上。或則,一電鍍層之鉻可代 替鎳層。請參照圖34,插頭信號觸點5 3 8及540示爲附著至 載體長條542。此等觸點各有一鍍金凸片區域544,一鍍鎳 之中央保持及抗芯吸區域536及一鍍貴金屬貼合區域548。 同樣在圖35,接地/功率觸點5 5 0示爲附著至載體長條55 2 。此種觸點有一下鍍金凸片區域554,一鍍鎳之中央抗芯吸 區域556及一上鍵金觸點貼靠區域558。也經發現減低芯吸 之接地/功率觸點550之另一特色爲在凸片區域554之一連 串凹口,諸如凹口 560,562及564。以上所揭示實施例中 所包括之接地/功率觸點550,其另一特色爲垂直切口,諸 如切口 566。請參照圖36,一插頭接地/功率觸點568示爲 有一下鍍金凸片區域570,一中央鍍鎳抗芯吸區域572,及 一上鍍金區域574。吾人將會看出’接地/功率觸點568不 具有分開之載體長條,但有孔徑諸如孔徑576,其允許觸點 本身供此種載體功能。吾人可瞭解,利用每一上述觸點, 錫或其他焊料可濕潤材料可在下區域代替金。對於圖3 3 3 6 中,所示之所有觸點,下鍍金凸片區域之寬度,例如在圖36 中示於wl,較佳將約爲〇.lmm至〇25mm。中央艘金凸片 區域之寬度,例如在圖36中示於W2,較佳將約爲01mm至 •20. —張尺%;用中國國家標準(CNS )祕見^ 2! 〇 χ 297公£ A7 B7 406454
五、發明説明(IS 1 mm ° 請參照圖24-25,示具有另一配置供固定焊球之本發明實 施例。此連接器概括示於圖號324 ^此插座有一底壁326有 一外侧3 2 8及一内側3 3 0。在外側有凹座,諸如在凹座332 ,334 ’ 336 ’ 338,及 340,(圖 25)342 及 344(圖 24)。每 一此等凹座較佳爲有一傾斜底壁36〇有一圓形表面362。在 内侧330有凹座如在凹座346,34 8,3 50,3 5 2,3 54(圖 25)356及358(圖24)。在外部與内之間,凹座有中間切口 ,如在切口 364 , 366,368,370,372(圖 25),374 及 376(圖24)。每一此等切口有一保持凸起部(未示),供以實 際與先前配合圖29及30所討論之相同方式,使觸點保持在 切口内。在内側,插座具有實際與圖1及2中所例示之插座 相同之構造。其包括一較佳爲藉關於圖1及2所討論之閂鎖( 未示),以適當方式固定在基座326之上區段436。上區段 或蓋436有許多開口,諸如開口 452及460,供容納來自配 合插頭或切口,諸如切口 454,456,4ό8(圖25)之個別觸 點’供容納來自配合插頭之接地或功率觸點。信號觸點, 諸如觸點408,及接地/功率觸點爲實際如關於任何先前所 述實施例所説明之形式。例如,接地觸點3 8 2 (圖2 5 )有一下 區段3 84,自其有一凸片3 86。此觸點也有一概括示於圖號 3 8 8,由叉頭3 90及3 92所組成之上區段。每一此等叉頭有 一會聚區段394及一向外輻散引入區段396。凸片386位於 凹座336内。每一信號觸點,諸如觸點4〇8,有一上區段 410有一前ώ起部412及後彎頭414。信號觸點在其貼靠絕 -21- 本紙張尺度朝t目@家縣(CNS )八4祕(21GX 297公釐) (讀先聞讀背面之注意事項再填寫本買) 装· 訂 經濟部中央標準局員工消費合作社印製 A7 406454 ________B7_ 五、發明説明(l9 ) 緣外殼之處也有一中間區段4 16,及一下凸片418位於凹座 334 内。 接地觸點382之凸片386及信號觸點408之凸片418爲在 觸點插入基座3 2 6後,使個別端子3 6 2之尾部繞表面3 6 2弯 曲所形成。每一表面3 62當作是關聯觸點尾部之皆曲心軸。 尾部予以彎曲至傾斜表面360之範園,並允許彈回,致使凸 片橫向於觸點之縱向軸線,並實際平行於表面328。這保證 凸片之高度共平面性。在形成凸片後,將焊膏施加至每一 凸片之外表面。然後將焊球’諸如398,400,402,404 ,406(圖25)4 26及42 8(圖24)施加至凸片,並且該組合件 予以加熱,以使焊膏及焊球熔合至每一凸片。在圖24a中所 示之一種替代性結構,凹座3 34a予以加深,以便表面36〇a 及362a位於距底面328a更遠。因此,如同先前關於圖12及 13所特別討論,焊球398a部份位於凹座334a内,並且其邊 緣使其穩定。因此’使用高度均勻尺寸之焊球時,此等配 置可產生完成之連接器,越過安裝介面呈現觸點之共平面 性0 一具有與先前所説明之插頭大致相同構造之插頭概括示 於圖號430。其包括一底壁432有一外側434及一内側436 。在外側有凹座,如在凹座438,440,442,444及446。 每一此等凹座有一傾斜底壁44 8及一彎曲壁450。觸點切口 452,454, 456, 4 5 8及460與每一此等凹座連接。插頭也 有若干例如概括示於圖號462之功率/接地觸點。每一此等 觸點有一觸點區段464 ’其貼靠插座之接地/功率觸點之又 -22- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) ' I I I I ^ ~訂 (請先聞讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印策 經濟部中央標準局員工消費合作社印製 406454 五、發明説明(2〇 ) 頭。此等觸點也有-貼靠外殼之中間區段466,及—供容納 ¥球470义’焊球凸片468。插頭也包括若干例如概括示於圖 號4 7 6义信號觸點。每—此等信號觸點包括一觸點凹座* 7 8 ,其使彳s號觸點貼靠在插座内,一在此處貼靠外殼之中間 區段480,及一供容納焊球之焊球凸片482。如在486及 488之其他彳s號觸點分別貼靠如在49〇及之其他焊球。 形成焊球凸片並將焊球47〇,474,484,490及492以實際 與先前關於插座所説明之相同方式施加至插頭。 在本發明之方法,導電元件將較佳爲一焊球。然而,精 於此項技藝者將會察知,其可代替具有熔化溫度少於絕緣 王體足熔化溫度之其他易熔材料。易熔元件也可具有球體 以外(其他形狀。焊球或其他導電元件也較佳爲有直徑約 爲凹座寬度之百分之5〇至2〇〇。此種直徑也較佳爲與凹座 之深度相關,並爲該深度之百分之5〇至2〇〇。焊球之容積 較佳約爲凹座之容積之百分之75至百分之15〇,並且更佳· 、·勺爲與凹座相同容積。觸點凸片將延伸進入凹座内足夠之 ,,以提供適當表面積供焊球熔合至凹座,並且通常較佳 爲如先前所提及,延伸進入其内約凹座深度之百分之25至 百分又75,更佳約爲百分之5〇。凹座剖面通常將爲圓形, 正方形或任何其他規則之多角形。導電元件爲焊料時,較 佳爲一種合金,其約在9〇 %Sn及1〇%pb至55%sn及 〇%Pb之範圍。合金更佳爲易溶,其爲63%Sn&37%pb, :、有183 C之溶點。一般將使用一種具有較高錄含量之 硬焊料合金,供配合諸如陶瓷之材料。"硬„焊球軟化時 _______-23-
) A4^ ( 2i〇xl^FT (請先閲讀背面之注意事項再填寫本頁) 裝· 訂 406454五、發明説明(21 A7 B7 經濟部中央榡準局員工消費合作社印裂 ,其在代表性SMT狀況下將會”成蘑菇形,,或略微變形,但 不會熔化。使用一種"軟,,易溶球供附著至pcB,並且通常 在代表性SMT狀況下將會回流,並使其本身重新成形。適 合電子目的之其他已知焊料也據信可接受供在此種方法使 用。此等焊料包括(不限於)電子可接受之錫·銻,錫_銀和錯 -銀合金及銦。在焊球或其他導電元件位於凹座之前,該凹座 通常將會填滿焊膏。 或者,代替先前所説明之焊球,可藉焊膏在凹座内回流 將一在SMT溫度不熔合之材料主體附著至觸點。連接器安 裝介面將會包含許多不易熔合之球體成一緊密共平面陣列 。此種連接器將藉習知SMT技術予以固定在基片上。 雖然據信包括有任何習知有機或無機酸焊料助焊劑之焊 膏或焊油可適合供用於此方法,但無清潔之焊膏或焊油爲 較佳。此種焊膏或焊油將會包括一種呈細微粉末形式懸浮 在一種適當助焊劑處理材料中之焊料合金。此種粉末通常 將爲一種合金,而非幾種成分之混合物。焊料對助焊劑之 比通常將會高,以重量計,在8〇%_95%之範圍,或以容積 計約爲80%。焊料材料懸浮在松脂助焊劑中時,將會形成 焊油。雖然可使用活化或超活化松脂供各種不同之目的, 但松脂助焊劑較佳爲一種白色松脂或低活性松脂助焊劑。 丈τ料合金主細微粉末形式懸浮在有機或無機酸焊料助焊劑 時,將會形成焊膏。此種有機酸可選自乳酸,油酸,硬脂 酸,苯二酸,檸檬酸或其他類似之酸。此等無機酸可選自 氫氣酸,氫氟酸及正磷酸。焊油或焊膏可藉塗刷,網 (請先聞讀背面之注意事項再填寫本頁) .裝· ’良.
經濟部中央標準局員工消費合作社印製 406454 A7 ~----^___ 五、發明説明(22 ) '~" 一 ' 或擠壓至宜已逐漸預熱,以保證良好潤濕之表面予以施加 雖’乂 〇人發現,使用焊膏或焊油時,顯著減少焊料芯吸 至觸點,但據信在使用一種適當之鈍化劑時,也可僅使用 焊膏型焊料助焊劑。此種適當純化劑將包括含氟化物抗焊 料塗料,諸如3M Corporation所出品tFL〇URAD。 較佳爲在一種平板紅外線(IR)焊料回流輸送爐進行加熱 。焊料元件通常將予加熱至溫度約183。至195<>c,但依外 殼之材料而定,可使用具有熔化溫度之焊料。輸送爐較佳 爲以速率約每秒1 0至1 4吋操作,並且將移動通過許多連績 ;加熱階段,總時間約爲5分鐘至1〇分鐘。在插入輸送爐内 之前,連接器外殼,觸點及焊料元件可在升高溫度預熱至 少一小時。在輸送爐’依據適當尖峰溫度,最大梯度及高 於回流溫度之時間,將產生一溫度剖面。尖峰溫度爲外殼 所達到之最高溫度。對於具有! 8 3 熔點之焊料元件,尖峰 溫度通常將在185。(:與丨95Ό之間。最大梯度係以。〇/秒予 以測量,並且規定允許連接器外殼溫度變化多快,俾避免 翹曲或彎曲。對於此方法之大多數應用,最大正梯度最初 較佳爲2°C/秒至15Ό/秒。達到焊料之潤濕點後,負梯度較 佳將爲-2 C /秒至-15 C /秒。本發明方法之一重要方面,爲 间於回流之時間最少。高於回流之時間爲烊料元件保持在 其液相多久之一項度量。吾人發現,烊料在其液相之時間 最少時,便消除或顯著減少烊料自凹座沿觸點向上芯吸。 較佳爲,在板上在180°C與20(TC之間所測量之溫度升高時 間’以及在板上在2 0 0 °C與1 8 0 °C之間所測量之溫度降低時 -25- 本紙張尺度適用中國國家標準(CNS ) Α4規格(210χ297公缝) I---_--^------ΐτ (請先閱讀背面之注意事項再填寫本頁) 406454 A7 B7 五、發明説明(23 ) 間,均將約爲1 〇秒至1 〇〇秒。雖然不意爲受任何特定理論 所約束’但據信在此較短時間,液體焊料元件之表面張力 將會抑制液體流過在凹座基座之觸點容納接受切口。然而 ’在此時間之後,液體焊料將會開始流過觸點容納切口, 並沿觸點向上芯吸。在焊料元件之溫度升高至其熔化溫度 疋前,可能也宜在最初有較高梯度,但在達到熔化溫度, 以減慢溫度增加或減少速率,在其之後,則採用較高梯度 ’直到達到熔化溫度。選擇適當之外殼材料也可能提高結 果。較佳爲外殼材料將整個爲芳族液晶聚酯(Lcp),具有 高玻璃過渡溫度,低熱係數,低水分吸收,高斷裂動度, 良好流動及低黏性,高溫及高閃亮點等特性。 本發明之方法另參照下列實例予以説明。 實例1 製成一以上實際配合圖1-18所説明,供連接器插頭及插 座之絕緣外殼。也使一也實際根據該説明之觸點位於外殼 内。此等觸點爲鈹铜,並在其整個表區域鍍敷金至3〇微米 之厚度。外殼材料爲DUPONT H6 130液晶聚合物(LCP)。 插頭之長度及寬度分別爲52.5mm(包括安裝托座)及 42.36mm。插頭及插座外殼外表面凹座上之斷面呈正方形 ,側面尺寸爲0.62mm及深度爲0.4mm。觸點之約2mm延 伸進入凹座内。其他尺寸通常與以上根據圖1-18之尺寸成 比例。在插頭及插座之外側,凹座均予填滿或實際填滿 Alphametals, Inc· of Jersey City,New Jersey所發售 之CLEANLINE LR 725無清潔焊油。插頭及插座均予在 -26- 本紙張尺度適用中國國家梯準(CNS ) A4規格(210x297公釐) ------7---:-I装 — I (請先閱讀背面之注意事項再填寫本育) 訂 經濟部中央標準局員工消費合作社印裝 經濟部中央標準局員工消費合作社印製 406454 ^ 五、發明説明(24 ) 其外側翻轉在一定量之球形焊球上,以便一焊球嵌入每一 凹座内。所使用之焊球爲ALPHAMETAL無助焊劑 6 3SN/37PB球形焊球,其直徑爲〇3〇叫· + -.001叫",重量約 爲00195克。插頭及插座然後以3m Corporation之一種焊 料抗芯吸材料,FLUOR AD,予以處理。在此處理之後, 插頭及插座然後在對流爐在1 〇 5 X;予以乾燥2小時》然後使 插頭及插座位於以習知強化環氧樹脂印刷電路材料所製成 ,厚度.061吋之分開之電路板上。請參照圖9,將一熱電偶 在插頭之外表面置於位置T。使另一熱電偶在中央位於支承 板表面靠近插頭。插頭及插座然後均在平板紅外線(IR)輸 送機烊料回流爐予以處理。此種型式之爐爲習知者,使插 頭及插座移動通過回流爐中之六區。輸送機速度爲是13忖/ 分。表1中示在每一區之加熱溫度。表2中示插頭及支承板 之最低及最高溫度。表3中示正及負最大梯度。表4中示在 180°C與20(TC之間在板所測量之升高及降低時間。圖26a 中之曲線示插頭之隨時間及距離之溫度,其中粗線爲在支 承板上之熱電偶之溫度,細線爲在插頭外表面上之熱電偶 之溫度。一插頭及插座在焊料回流後之目視檢查,顯示幾 乎所有焊球已在其個別腔内熔合至接觸引線。焊球高於插 頭及插座外表面之高度也顯示較均勻。外殼有不明顯之麵 曲或彎曲。 實例2 以基本上與如在實例1所説明之相同方式製備另—插頭及 插座,並將焊球在凹座置於外側。在實例1中之坪料回节爐 -27- 本紙張尺度適用中國國家標準(CNS ) A4规格(210X297公釐) -----^---^--t------IT (請先聞讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作杜印製 406454 A7_____B7__五、發明説明(25 ) 中處理後若干小時,在大氣壓狀況略微不同時,使另一插 頭及基本上與在實例1中所使用者相似之插座經歷與在實例 1中所使用者相似之回流加熱。表1中示爐狀況。表2中示插 頭及支承板之最低及最高溫度。表3中示正及負最大梯度。 表4中示在180。(:與200。(:之間在板所測量之升高及降低時 間。在圖26a中示隨時間及距離之溫度。吾人將會看出,圖 26b中所示之曲線略微不同於圖26a中所示者,該差異歸因 於不同之周圍大氣狀況。目視檢查所產生之連接器,顯示 與在實例1所達成者相似之結果。 表1 溫度(° C) 實例 #1 #2 #3 #4 #5 #6 1 上 350 未加熱 275 230 310 未加熱 1 下 未加熱未加熱 275 230 310 未加熱 2 上 350 未加熱 275 230 310 未加熱 2 下 未加熱未加熱 275 230 710 未加熱 8 2 本紙張尺度適用中國國家橾準(CNS ) Μ規格(210X297公董) (請先閱讀背面之注意事項再填寫本頁) 406454 A7 __B7 五、發明説明(26〉 連接_板 實例 最高溫度(°C) 時間(分及秒) 最高溫度(C) 時間(分及秒) 1 188 4:37.6 1 232 4:19.8 2 191 4:53.2 2 ----- ----- 2 2 9 表3 正及負最大梯疳。C(故1 連接器 板 5:10.4 實例 最大 達到時間 (分及秒) 最大 達到_時間 (分及秒) 1 +2 0:50.4 +2 0:30.4 1 -2 6:45.2 -3 5:58.8 2 +3 7:08.0 +3 1:14.8 2 -15 6:13.8 -7 表4 6:14.0 在1 80 丨° C與2〇〇° C間之升高時間及降彼咕明 I I I I I I I I — 訂 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 (在板上所測量1 tM- 升高時間(分及秒j 降低時間(分及秒) 1 0:28.8 0:15.2 2 1:31.6 0:40.6 實例3 除了圖26a及26b中所示之特定曲線因爲大氣壓狀況而可 -29- 本紙張尺度適用中國國家標隼(CNS ) A4規格(210X297公釐) 406454 A7 B7 五、發明説明(27 ) 能略微不同外,使用基本上與實例1及2中所説明之相同狀 況作成另一連接器。在此連接器完成後,藉Cyber Optics Corporation of Minneapolis, Minne s ot a 出品之 Las er Point Range Sensor(PRS)在插頭之外表面檢查在六位置 之焊球。請參照圖9 ’雷射自Li導向時,此等位置標示爲區 域2<7a及27b,雷射自l2導向時,標示爲區域27c及27d, 雷射自L3導向時,則標示爲區域27e及27f。在所有此等區 域’在每一此等區域取五焊球分布之雷射輪廓。圖27a_27f 示此等雷射輪廓之再現。表3中示每一此等焊球在其高於括 頭外側平面之最高點之高度。就此諸組之每一組而言,如 圖9中所示最靠近插頭前面之焊球視爲表5中之第一位置, 並爲在圖27a-27f中之曲線圖左邊之焊球。檢查此等結果顯 示在每一組五個焊球具有被視爲可接受之焊球高度之均句 度。 表5 位置高度0 0 1吋) (請先閱讀背面之注意事項再填寫本頁} 裝 -訂_ 經濟部中央標準局員工消費合作社印製 組別 1 2 3 4 5 27a 18.1 18.9 19.5 19.6 19.1 27b 19.2 18.5 17.6 18.5 18.0 27c 20.4 2 1.1 2 1.6 2 1.1 21.4 27d 19.9 20.1 20.1 2 1.2 20.5 27e 18.2 18.9 19.3 18.2 18.7 27f 19.1 18.2 19.0 18.2 18.9 實例4 30- 本紙張尺度適用中國國家標準(CNS ) A4規格(210 X 297公釐) 經濟部中央標準局員工消費合作社印製 406454 A7 ______Β7___ 五、發明説明(28 ) 除了因爲大氣壓狀況,在圖26&及26b所示之特定曲線可 能略微不同外,基本上根據實例1及2中所説明之狀況作成 另一連接器。在幾乎所有情形,焊球熔合至觸點引線均令 人滿意’並且在目視檢查,焊球爲在高於插頭及插座外表 面平面之可接受均勻高度。使用一有圖案匹配插頭及插座 上之烊球之模板將焊膏施加至二厚度爲.061吋之不同電路 板上之導電焊料墊片。使插頭位於一電路板上,並使插座 位於另一電路板上。然後除了輸送機速率減至丨丨吋/秒以外 ’在與在熔合焊球所説明者相似之狀況下,再次在輸送機 爐分開處理插頭及插座。在冷卻後,插頭及插座經發現熔 合至其個別板令人滿意。一示選定焊球之此等χ光相片分別 附於圖28a及28b。橫剖面電子顯微鏡相片攝爲示焊球熔合 至信號觸點引線,以及焊球熔合至印刷電路板材料。此等 電子顯微鏡相片分別示於圖28c及28d。在相鄰信號觸點之 間僅有一短路,並且在觸點與焊球之間以及在焊料球與板 之間,在所有其他點均作成良好之連接。 請予察知,電連接器及其製造方法業經予以説明,其中 連接器可利用BGA技術供安裝在PWB上。令人驚訝及料想 不到的是,吾人發現,在焊球之分布,特別是在焊球之重 量及/或容積,均有較高之均勻度。 雖然本發明業經配合各圖之較佳實施例予以説明,但請 瞭解,可使用其他類似實施例或對於所説明之實施例作成 種種修改及增添,供執行本發明之相同功能,而不自其偏 離。再者,所説明之配置可配合連接器以外之其他組件 n ~ I!·! I n n n 訂 (請先閱讀背面之注意事項再填寫本頁)
406454 A7 B7 五、發明説明(29 ) 用,其包含以絕緣材料所形成,帶有將行熔合至PWB或其 他電基片之元件之外殼。 因此,本發明不應限於任何單一實施例,而是在根據後 附申請專利範圍詳述之幅度及範圍予以解釋。 丨, ^ 裝 訂 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 -32- 本紙張尺度適用中國國家標準(CNS ) A4規格(2!0X29?公釐)

Claims (1)

  1. A8 406454 ?8 _*___ D8 六、申請專利範圍 1. 一種電連接器,適於安裝在一有一導電元件之基片上, 包含: 一觸點,有一連接器部份適於電連接至該導電元件; 一可回流,導電材料之主體,配置在連接器部份上, 該主體適於在連接器與基片之間提供主電流路徑。 2. —種電連接器’適於安裝在一有一導電元件之基片上, 包含: 一絕緣外殼,該外殼有一外側適於面對該基片; 一觸點,有一連接器部份適於電連接至該導電无件; 以及 一可回流,導電材料之主體,配置在連接器部份上, 鄰接外殼之外側。 3 · —種電連接器包含:一絕緣外殼有一底壁有一内側及一外 側,在該外側上有許多切口;許多觸點容納切口,該等 切口各自該底壁延伸至該等凹座之一;一觸點配置在每 一該等切口内,許多可回流,導電材料之主體,每一主 體與一凹座相關聯,並且有其一部份配置在凹座内並熔 合至觸點。 4. 一種電連接器包含: 經濟部中央標準局員工消費合作社印製 1^1 n n^i In i 4 1^1 (^ϋ ^^1 1^1 ^ (請先閱讀背面之注意事項存填寫本頁) 一絕緣構件,有一觸點支承侧及一安裝侧; 一電端子,安裝在絕緣構件上,端子有一觸點部份配 置在絕緣構件之觸點支承側及一安裝部份,安裝部份有 一固著區段至少部份延伸通過絕緣構件;以及 一導熱易熔合區段,自固定區段延伸至絕緣主體安裝 -33- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 406454 ^ C8 ____ D8 六、+請專利範圍 ^ ^ " 侧之外面。 5. —種電組件,適於表面安裝在一電路基片上,包含: 一由絕緣材料形成之主體,該主體有—安裝表面適於 配置爲與電路基片成面對關係,及一在其上向該安裝表 面延伸之開口; 一導電構件,安裝在主體上,該導電構件包括一端子 部份延伸進入向安裝表面之開口,以及 一固定部份,自端子部份延伸至安裝表面,供在電路 基片與導電構件之間建立電連續性,該固定部份包括— 熱易熔合區段。 6. —種電連接器包含: 一安裝介面,供將連接器安裝在一基片上,及一配合 介面供提供電觸點供與配合連接器之觸點貼靠; 許多觸點,安裝在絕緣主體上;以及 一可回流元件,固定在每一觸點上,並自觸點向安裝 介面延伸。 7·—種電連接器包含: 一絕緣外殼,有一配合介面供與一配合連接器配合, 及一安裝介面供安装在一包括導電元件之基片上; 經濟部中央標準局負工消費合作社印製 -----,--1 .裝------訂 (請先閲讀背面之注$項再填寫本頁) 許多觸點,安裝在外殼上,每一觸點有一配合部份適 於貼靠來自配合連接器之觸點,及一連接器部份適.於固 著至基片上之導電元件;以及 許多焊球,每一焊球固定在該等觸點之一冬連接部份。 8.—種電連接器包含: • 34- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局負工消費合作社印裝 40645^ A8 B8 C8 ___D8 六、申請專利範圍 一絕緣基座; 許多觸點,安裝在基座上;以及 許多烊球’每一焊球固定在至少觸點之一上,並形成 一安裝介面供將連接器安裝在基片上。 9. 一種電連接器包含: 一絕緣基座; 許多觸點,安裝在基座上;以及 許多導電元件,有基片貼合面,每一導電元件固定在 至少觸點之一上,並形成一安裝介面供將連接器安裝在 基片上。 10. —種將一外部導電觸點置於一有一基座形成外側及一内 側之電連接器之方法,包含下列步骤: 在基座之外側提供至少一凹座; 提供一導電觸點,自鄰接導體元件之内側延伸至基座 外侧上之凹座; 使一導電元件以至少其一部份位於設在基座外側之凹 座内;以及 將導電元件因著至觸點,同時使導電元件位於凹座内。 11. 一種作成電連接器之方法包含: 將一觸點端子安裝在絕緣構件之一表面,端子之一部 份向絕緣構件之第二表面延伸進入該絕緣構件内;以及 將一易熔合導電主體固著至向第二表面延伸之端子之 一部份。 12·—種電連接器,有一基座有_外側及一内側,並以包含 -35- 本紙張尺度適用巾關家標準(CNS〉A4SI ( 210X297公釐) (請先閲讀背面之注項再填寫本頁) •裳_ 訂. 406454 A8 B8 C8 D8 經濟部中央標準局貝工消費合作社印装 六、申請專利範圍 ' --- 下列之步驟所作成: 在基座之外側提供至少一凹座; 提供-導電觸點,自鄰接導體元件之内側延伸至基座 外側上之凹座; 使-導電元件以至少其-部份位於設在基座外側之凹 座内;以及 將導電元件固著至觸點,同時使導電元件位於凹座内。 13·種作成電連接器之方法包含: 將一觸點端子安裝在絕緣構件之一表面,端子之一部 份向絕緣構件之第二表面延伸進入該絕緣構件内;以及 將一易熔合導電主體固著至向第二表面延伸之端子之 一部份。 14. 一種作成電連接器之方法包含: 將一觸點端子安裝在絕緣構件之一表面,端子之一部 份向絕緣構件之第二表面延伸進入該絕緣構件内;以及 將一實際球形導電構件固著至向第二表面延伸之端子 之一部份。 15. —種電連接器包含: 一連接器主體; 至少一觸點容納開口,供容納一可安裝在連接器主體 之觸點之一部份,該開口有一側壁部份;以及 一可變形構件,位於鄰接該侧壁,並適於被一插入該 開口内之觸點變形及使觸點固著在該開口内。 16. —種在一電連接器之外殼使來自觸點插入該外殼内之應 -36- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) -----,--1 -裝------訂 (请先聞讀背面之注意事項再填寫本頁) 406454 eg C8 D8 ^+請專利範圍 力累積最小之方法,包含下列步驟: 提供一外殼,其上有許多觸點容納開口; 將觸點插入該開口内; 使一可變形結構貼合在該開口内,同時將觸點作爲觸 點插入;以及 使觸點實際插入至鄰接可變形構件之開口之部位在外 殼所感生之任何應力局部化。 17.—種供電連接器之觸點包含: 一中間部份; 一觸點貼合部份,自中間部份延伸,該觸點貼合部份 適於貼合一配合觸點; 一焊料端子部份,自中間部份延伸,並適於容納將行 熔合於其上之焊料;以及 該中間區段上有一塗層,供抵抗焊料自端子部份芯吸 至貼合部份,該塗層包含一層鎳。 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 -37- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)
TW086113845A 1996-10-10 1997-09-23 High density connector and method of manufacture TW406454B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US08/728,194 US6024584A (en) 1996-10-10 1996-10-10 High density connector
US08/777,579 US6164983A (en) 1996-10-10 1996-12-31 High density connector
US08/778,398 US6093035A (en) 1996-06-28 1996-12-31 Contact for use in an electrical connector
US08/778,380 US6079991A (en) 1996-10-10 1996-12-31 Method for placing contact on electrical connector
US08/777,806 US6358068B1 (en) 1996-10-10 1996-12-31 Stress resistant connector and method for reducing stress in housing thereof

Publications (1)

Publication Number Publication Date
TW406454B true TW406454B (en) 2000-09-21

Family

ID=27542146

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086113845A TW406454B (en) 1996-10-10 1997-09-23 High density connector and method of manufacture

Country Status (17)

Country Link
US (6) US6325644B1 (zh)
EP (1) EP0836243B1 (zh)
JP (1) JP3413080B2 (zh)
KR (1) KR100450547B1 (zh)
CN (3) CN1510788B (zh)
AT (5) ATE340424T1 (zh)
AU (2) AU5145498A (zh)
BR (1) BR9712296B1 (zh)
CA (1) CA2267293C (zh)
CZ (1) CZ298529B6 (zh)
DE (6) DE69736721T2 (zh)
HU (1) HU229923B1 (zh)
PL (2) PL192431B1 (zh)
RU (1) RU2208279C2 (zh)
SG (1) SG71046A1 (zh)
TW (1) TW406454B (zh)
WO (2) WO1998015989A1 (zh)

Families Citing this family (147)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW406454B (en) * 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US6139336A (en) 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
US6155860A (en) * 1998-01-31 2000-12-05 Berg Technology, Inc. Socket for electrical component
US6093042A (en) * 1998-12-10 2000-07-25 Berg Technology, Inc. High density connector with low insertion force
US6116921A (en) * 1998-02-16 2000-09-12 The Whitaker Corporation Electrical connector having recessed solderball foot
DE19813932A1 (de) * 1998-03-28 1999-09-30 Wuerth Elektronik Gmbh & Co Kg Befestigungsanordnung eines Steckverbinders an einer Leiterplatte
US6530790B1 (en) * 1998-11-24 2003-03-11 Teradyne, Inc. Electrical connector
US6354850B1 (en) 1998-12-15 2002-03-12 Fci Americas Technology, Inc. Electrical connector with feature for limiting the effects of coefficient of thermal expansion differential
JP2000277885A (ja) * 1999-03-25 2000-10-06 Berg Technol Inc 電気コネクタおよびその製造方法
JP2000323215A (ja) 1999-04-28 2000-11-24 Berg Technol Inc 電気コネクタ
US6193523B1 (en) 1999-04-29 2001-02-27 Berg Technology, Inc. Contact for electrical connector
US6193537B1 (en) 1999-05-24 2001-02-27 Berg Technology, Inc. Hermaphroditic contact
US6398558B1 (en) 1999-08-04 2002-06-04 Fci Americas Technology, Inc. Electrical connector and contact therefor
US6595788B2 (en) * 1999-10-14 2003-07-22 Berg Technology, Inc. Electrical connector with continuous strip contacts
TW484251B (en) 1999-10-19 2002-04-21 Berg Tech Inc Electrical connector with strain relief
US6805278B1 (en) 1999-10-19 2004-10-19 Fci America Technology, Inc. Self-centering connector with hold down
US6264490B1 (en) 1999-11-22 2001-07-24 Berg Technology, Inc. Electrical connector having female contact
US6830462B1 (en) * 1999-12-13 2004-12-14 Fci Americas Technology, Inc. Electrical connector housing
US6471526B1 (en) 1999-12-16 2002-10-29 Fci Americas Technology, Inc. Electrical connector with strain relief feature
US6758702B2 (en) 2000-02-24 2004-07-06 Fci Americas Technology, Inc. Electrical connector with compression contacts
US6527597B1 (en) 2000-03-07 2003-03-04 Fci Americas Technology, Inc. Modular electrical connector
US6431877B1 (en) 2000-03-31 2002-08-13 Fci Americas Technology, Inc. Electrical connector comprising base with center aperture
US6558170B1 (en) 2000-11-22 2003-05-06 Fci Americas Technology, Inc. Strain relief for BGA connector
US6468091B2 (en) * 2001-03-09 2002-10-22 Delphi Technologies, Inc. Electrical distribution center
JP2002298939A (ja) * 2001-03-28 2002-10-11 Fci Japan Kk 基板の接続構造、メモリ基板の接続構造およびメモリ基板の保持構造
US6743049B2 (en) 2002-06-24 2004-06-01 Advanced Interconnections Corporation High speed, high density interconnection device
US6860741B2 (en) 2002-07-30 2005-03-01 Avx Corporation Apparatus and methods for retaining and placing electrical components
US6851954B2 (en) 2002-07-30 2005-02-08 Avx Corporation Electrical connectors and electrical components
US6928727B2 (en) * 2002-07-30 2005-08-16 Avx Corporation Apparatus and method for making electrical connectors
US6885102B2 (en) * 2002-08-26 2005-04-26 Intel Corporation Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
TW545716U (en) * 2002-09-09 2003-08-01 Hon Hai Prec Ind Co Ltd Electrical contact
US6791845B2 (en) 2002-09-26 2004-09-14 Fci Americas Technology, Inc. Surface mounted electrical components
US6623284B1 (en) 2003-01-07 2003-09-23 Hon Hai Precision Ind. Co., Ltd. Electrical connector
US6900389B2 (en) 2003-01-10 2005-05-31 Fci Americas Technology, Inc. Cover for ball-grid array connector
KR100443999B1 (ko) * 2003-02-28 2004-08-21 주식회사 파이컴 인쇄회로기판용 상호 접속체, 이의 제조방법 및 이를구비한 상호 접속 조립체
US20040198082A1 (en) * 2003-04-07 2004-10-07 Victor Zaderej Method of making an electrical connector
US6918776B2 (en) * 2003-07-24 2005-07-19 Fci Americas Technology, Inc. Mezzanine-type electrical connector
US6793506B1 (en) * 2003-08-27 2004-09-21 Molex Incorporated Board-to-board electrical connector assembly
US20050283974A1 (en) * 2004-06-23 2005-12-29 Richard Robert A Methods of manufacturing an electrical connector incorporating passive circuit elements
US7285018B2 (en) 2004-06-23 2007-10-23 Amphenol Corporation Electrical connector incorporating passive circuit elements
US6979238B1 (en) * 2004-06-28 2005-12-27 Samtec, Inc. Connector having improved contacts with fusible members
US7422447B2 (en) * 2004-08-19 2008-09-09 Fci Americas Technology, Inc. Electrical connector with stepped housing
US7179108B2 (en) * 2004-09-08 2007-02-20 Advanced Interconnections Corporation Hermaphroditic socket/adapter
US7214104B2 (en) * 2004-09-14 2007-05-08 Fci Americas Technology, Inc. Ball grid array connector
JP2006164594A (ja) * 2004-12-03 2006-06-22 Molex Inc 基板対基板コネクタ
US20060148283A1 (en) * 2004-12-30 2006-07-06 Minich Steven E Surface-mount electrical connector with strain-relief features
US8668564B2 (en) * 2005-01-24 2014-03-11 Solution Champion Limited Jackpot method and system
US7172438B2 (en) 2005-03-03 2007-02-06 Samtec, Inc. Electrical contacts having solder stops
US20060196857A1 (en) * 2005-03-03 2006-09-07 Samtec, Inc. Methods of manufacturing electrical contacts having solder stops
US20060228912A1 (en) * 2005-04-07 2006-10-12 Fci Americas Technology, Inc. Orthogonal backplane connector
US7371129B2 (en) * 2005-04-27 2008-05-13 Samtec, Inc. Elevated height electrical connector
EP1924854B1 (en) * 2005-08-16 2016-04-13 Oridion Medical 1987 Ltd. Breath sampling device and method for using same
US7097465B1 (en) * 2005-10-14 2006-08-29 Hon Hai Precision Ind. Co., Ltd. High density connector with enhanced structure
US8044502B2 (en) 2006-03-20 2011-10-25 Gryphics, Inc. Composite contact for fine pitch electrical interconnect assembly
US7226298B1 (en) * 2006-03-29 2007-06-05 Fci Americas Technology, Inc. Electrical connector with segmented housing
US7553182B2 (en) * 2006-06-09 2009-06-30 Fci Americas Technology, Inc. Electrical connectors with alignment guides
US7500871B2 (en) 2006-08-21 2009-03-10 Fci Americas Technology, Inc. Electrical connector system with jogged contact tails
DE102006055086B3 (de) * 2006-11-21 2008-06-19 Tyco Electronics Amp Gmbh Einpressstift für elektrische Kontakte aus Drahtmaterial
DE102006059766B3 (de) * 2006-12-18 2008-04-10 Adc Gmbh Steckverbinder für Leiterplatten
US7497736B2 (en) 2006-12-19 2009-03-03 Fci Americas Technology, Inc. Shieldless, high-speed, low-cross-talk electrical connector
US7553170B2 (en) 2006-12-19 2009-06-30 Fci Americas Technology, Inc. Surface mount connectors
US7811100B2 (en) * 2007-07-13 2010-10-12 Fci Americas Technology, Inc. Electrical connector system having a continuous ground at the mating interface thereof
US7635278B2 (en) * 2007-08-30 2009-12-22 Fci Americas Technology, Inc. Mezzanine-type electrical connectors
DE202007012719U1 (de) * 2007-09-11 2007-11-22 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Mehrfach-Mikro-HF-Kontaktanordnung
JP4862796B2 (ja) * 2007-09-28 2012-01-25 山一電機株式会社 高速伝送用高密度コネクタ
US8251745B2 (en) * 2007-11-07 2012-08-28 Fci Americas Technology Llc Electrical connector system with orthogonal contact tails
US8147254B2 (en) * 2007-11-15 2012-04-03 Fci Americas Technology Llc Electrical connector mating guide
US8764464B2 (en) 2008-02-29 2014-07-01 Fci Americas Technology Llc Cross talk reduction for high speed electrical connectors
US7682207B2 (en) * 2008-07-24 2010-03-23 Illinois Tool Works Inc. Carrier strip for electrical contacts
JP2010040428A (ja) * 2008-08-07 2010-02-18 Smk Corp スイッチ
US8277241B2 (en) 2008-09-25 2012-10-02 Fci Americas Technology Llc Hermaphroditic electrical connector
US7736183B2 (en) * 2008-10-13 2010-06-15 Tyco Electronics Corporation Connector assembly with variable stack heights having power and signal contacts
US7740489B2 (en) 2008-10-13 2010-06-22 Tyco Electronics Corporation Connector assembly having a compressive coupling member
US7896698B2 (en) * 2008-10-13 2011-03-01 Tyco Electronics Corporation Connector assembly having multiple contact arrangements
US7867032B2 (en) * 2008-10-13 2011-01-11 Tyco Electronics Corporation Connector assembly having signal and coaxial contacts
CN102282731B (zh) 2008-11-14 2015-10-21 莫列斯公司 共振修正连接器
WO2010068671A1 (en) 2008-12-12 2010-06-17 Molex Incorporated Resonance modifying connector
US7976326B2 (en) * 2008-12-31 2011-07-12 Fci Americas Technology Llc Gender-neutral electrical connector
TWM364980U (en) * 2009-02-23 2009-09-11 Hon Hai Prec Ind Co Ltd Electrical connector
US9277649B2 (en) 2009-02-26 2016-03-01 Fci Americas Technology Llc Cross talk reduction for high-speed electrical connectors
EP2401755B1 (en) * 2009-02-27 2018-06-06 Littelfuse, Inc. Tuning fork terminal slow blow fuse
US8366485B2 (en) 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US8119926B2 (en) * 2009-04-01 2012-02-21 Advanced Interconnections Corp. Terminal assembly with regions of differing solderability
US8969734B2 (en) 2009-04-01 2015-03-03 Advanced Interconnections Corp. Terminal assembly with regions of differing solderability
US8113851B2 (en) * 2009-04-23 2012-02-14 Tyco Electronics Corporation Connector assemblies and systems including flexible circuits
CN101987332B (zh) * 2009-08-04 2012-10-03 富士康(昆山)电脑接插件有限公司 加固片及其制造方法
JP5350962B2 (ja) 2009-09-30 2013-11-27 富士通株式会社 電子部品、基板ユニット及び情報処理装置
TW201114114A (en) * 2009-10-14 2011-04-16 Hon Hai Prec Ind Co Ltd Electrical connector contact and electroplating method thereof
US8267721B2 (en) 2009-10-28 2012-09-18 Fci Americas Technology Llc Electrical connector having ground plates and ground coupling bar
US8616919B2 (en) 2009-11-13 2013-12-31 Fci Americas Technology Llc Attachment system for electrical connector
US8734657B2 (en) * 2010-02-19 2014-05-27 R.S.M. Electron Power, Inc. Liquid barrier and method for making a liquid barrier
US7918683B1 (en) 2010-03-24 2011-04-05 Tyco Electronics Corporation Connector assemblies and daughter card assemblies configured to engage each other along a side interface
US9142932B2 (en) * 2010-04-20 2015-09-22 Hon Hai Precision Industry Co., Ltd. Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder joint
US8382524B2 (en) 2010-05-21 2013-02-26 Amphenol Corporation Electrical connector having thick film layers
US20110287663A1 (en) 2010-05-21 2011-11-24 Gailus Mark W Electrical connector incorporating circuit elements
DE102010030063A1 (de) * 2010-06-15 2011-12-15 Robert Bosch Gmbh Elektrische Verbindungsanordnung
TWM402514U (en) * 2010-09-09 2011-04-21 Hon Hai Prec Ind Co Ltd Electrical connector
CN202189913U (zh) * 2011-03-29 2012-04-11 番禺得意精密电子工业有限公司 电连接器
US8183155B1 (en) * 2011-03-30 2012-05-22 Hon Hai Precision Ind. Co., Ltd. Lower profile connector assembly
JP5736262B2 (ja) * 2011-07-14 2015-06-17 モレックス インコーポレイテドMolex Incorporated 多接点コネクタ
JP5869282B2 (ja) * 2011-10-03 2016-02-24 タイコエレクトロニクスジャパン合同会社 電気コネクタ
US8591257B2 (en) 2011-11-17 2013-11-26 Amphenol Corporation Electrical connector having impedance matched intermediate connection points
EP2624034A1 (en) 2012-01-31 2013-08-07 Fci Dismountable optical coupling device
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
US9543703B2 (en) * 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
CN203056150U (zh) * 2012-11-29 2013-07-10 富士康(昆山)电脑接插件有限公司 卡缘连接器
USD745852S1 (en) 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
US8894423B2 (en) * 2013-02-28 2014-11-25 Samtec, Inc. Contact with anti-rotation elements and solder flow abatement
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector
JP2014216123A (ja) * 2013-04-24 2014-11-17 タイコエレクトロニクスジャパン合同会社 電気コネクタ組立体及びその実装構造
US9048565B2 (en) * 2013-06-12 2015-06-02 Ironwood Electronics, Inc. Adapter apparatus with deflectable element socket contacts
JP6325389B2 (ja) * 2014-08-01 2018-05-16 日本航空電子工業株式会社 コネクタ組立体
CN104283043B (zh) * 2014-09-30 2016-08-24 实盈电子(东莞)有限公司 球形bga插座连接器及与其适配的球形bga插头连接器
CN107112665B (zh) 2014-10-23 2020-10-02 安费诺富加宜(亚洲)私人有限公司 夹层式电连接器
JP5813847B1 (ja) * 2014-10-27 2015-11-17 日本航空電子工業株式会社 防水コネクタ
RU2583765C1 (ru) * 2014-11-05 2016-05-10 Российская Федерация, от имени которой выступает Государственная корпорация по атомной энергии "Росатом" - Госкорпорация "Росатом" Способ автоматической коммутации электрических цепей и устройство для его реализации
US9660333B2 (en) * 2014-12-22 2017-05-23 Raytheon Company Radiator, solderless interconnect thereof and grounding element thereof
WO2016178356A1 (ja) * 2015-05-01 2016-11-10 株式会社村田製作所 多極コネクタ
WO2017022171A1 (ja) * 2015-08-05 2017-02-09 京セラコネクタプロダクツ株式会社 プラグコネクタ
US9793634B2 (en) 2016-03-04 2017-10-17 International Business Machines Corporation Electrical contact assembly for printed circuit boards
TWM533354U (en) * 2016-06-14 2016-12-01 Foxconn Interconnect Technology Ltd Electrical connector
US20180083379A1 (en) * 2016-09-16 2018-03-22 Advanced Interconnections Corp. Hermaphroditic spacer connector
US9877404B1 (en) 2017-01-27 2018-01-23 Ironwood Electronics, Inc. Adapter apparatus with socket contacts held in openings by holding structures
US10404014B2 (en) 2017-02-17 2019-09-03 Fci Usa Llc Stacking electrical connector with reduced crosstalk
JP2018174018A (ja) 2017-03-31 2018-11-08 タイコエレクトロニクスジャパン合同会社 ソケット
DE102017003159A1 (de) * 2017-03-31 2018-10-04 Yamaichi Electronics Deutschland Gmbh Kontaktpinstecker und Verfahren zum Herstellen eines Kontaktpinsteckers
US10405448B2 (en) 2017-04-28 2019-09-03 Fci Usa Llc High frequency BGA connector
US10320098B2 (en) 2017-04-28 2019-06-11 Fci Usa Llc High frequency BGA connector
CN107437673B (zh) * 2017-06-23 2019-04-26 番禺得意精密电子工业有限公司 电连接器
CN109659750B (zh) * 2017-10-12 2021-09-17 富士康(昆山)电脑接插件有限公司 电连接器及其制造方法
CN207753200U (zh) * 2017-12-26 2018-08-21 东莞舜威电业有限公司 公插头、母插座以及连接器
KR102631586B1 (ko) * 2018-07-06 2024-02-02 샘텍, 인코포레이티드 상부 및 저부 스티칭된 콘택트를 갖는 커넥터
US11081828B2 (en) 2019-05-10 2021-08-03 Semiconductor Components Industries, Llc Power module housing
US10756009B1 (en) * 2019-09-18 2020-08-25 International Business Machines Corporation Efficient placement of grid array components
TWI741395B (zh) * 2019-10-23 2021-10-01 音賜股份有限公司 適於pcb上安裝電聲元件的方法及電聲元件結構
KR102127352B1 (ko) * 2020-04-24 2020-06-26 주식회사 애크멕스 반도체 릴레이의 단자 조립 장치 및 방법
USD958092S1 (en) * 2020-11-20 2022-07-19 Samtec, Inc. Contact
CN114552251A (zh) * 2020-11-26 2022-05-27 莫列斯有限公司 端子及插座连接器
CN114744423A (zh) * 2020-12-24 2022-07-12 山一电机株式会社 连接器套件以及封盖
CN114678709A (zh) * 2020-12-24 2022-06-28 山一电机株式会社 连接器以及连接器套件
US20220263257A1 (en) * 2021-05-27 2022-08-18 Joseph Stecewycz Automotive battery with integral electrical contact slots
CN117546377A (zh) * 2022-05-09 2024-02-09 亚萨基北美有限公司 顺应引脚适配器板

Family Cites Families (497)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2740075A (en) * 1956-03-27 Metal rectifier assemblies
US270225A (en) * 1883-01-09 Geometrical block
US614839A (en) 1898-11-29 Method of forming electrical connections
NL19851C (zh) 1925-09-30
US2289512A (en) 1940-07-30 1942-07-14 William R Mckenney Terminal connector
US2364124A (en) 1942-02-24 1944-12-05 Myrick N Bolles Electrical connection
US2385915A (en) 1944-03-20 1945-10-02 Hagedorn David Oakley Connector socket
US2702255A (en) 1948-01-28 1955-02-15 American Motors Corp Surface treated plastic materials and method for producing same
US2698527A (en) * 1951-08-15 1955-01-04 Borg Warner Universal joint assembly
US2699527A (en) * 1952-01-08 1955-01-11 Kamowski Charles Spark plug shorting device
US2794176A (en) 1953-05-21 1957-05-28 Utica Drop Forge & Tool Corp Terminal construction
US2879977A (en) * 1957-07-11 1959-03-31 Trought Associates Inc Mounting device
US2938068A (en) 1957-10-28 1960-05-24 Itt Electrical connectors
US2980881A (en) 1958-04-14 1961-04-18 United Carr Fastener Corp Connector and snap-in contact therefor
US3020650A (en) * 1959-11-20 1962-02-13 Acf Ind Inc Dynamic servo driven magnetostrictive delay line
US3022481A (en) * 1960-02-26 1962-02-20 Stepoway Theodore Electrical connector
US3130351A (en) 1961-09-14 1964-04-21 George J Giel Modular circuitry apparatus
BE635318A (zh) 1962-07-23
US3172718A (en) * 1963-03-20 1965-03-09 Electronic Fittings Corp Multiple contact receptacle for printed circuit boards and the like
US3249910A (en) 1963-07-19 1966-05-03 Douglas A Venn Electrical connector with solder resistant surfaces
US3173737A (en) * 1963-08-05 1965-03-16 Amp Inc Connector with tab terminal latching means
US3283291A (en) 1964-04-08 1966-11-01 United Carr Inc Electrical means and method of making at least a portion of the same
US3293590A (en) 1964-06-18 1966-12-20 Jr Alfred F Woolsey Microcircuit socket
US3320658A (en) 1964-06-26 1967-05-23 Ibm Method of making electrical connectors and connections
US3289148A (en) 1964-07-29 1966-11-29 Litton Systems Inc Connectors
FR1483542A (zh) 1965-06-28 1967-09-06
US3383648A (en) 1965-08-20 1968-05-14 Milton Ross Controls Co Inc Miniature sockets
US3431541A (en) * 1966-03-04 1969-03-04 Alcon Metal Products Inc Combination mounting pin and solder well terminal
US3399372A (en) 1966-04-15 1968-08-27 Ibm High density connector package
US3563630A (en) * 1966-12-07 1971-02-16 North American Rockwell Rectangular dielectric optical wave-guide of width about one-half wave-length of the transmitted light
US3518610A (en) 1967-03-03 1970-06-30 Elco Corp Voltage/ground plane assembly
FR1537908A (fr) * 1967-07-19 1968-08-30 Cit Alcatel Dispositif de raccordement électrique
US3464054A (en) 1968-01-15 1969-08-26 Sylvania Electric Prod Electrical connector
US3553630A (en) * 1968-01-29 1971-01-05 Elco Corp Low insertion force connector
US3530422A (en) 1968-03-25 1970-09-22 Elco Corp Connector and method for attaching same to printed circuit board
US3526869A (en) 1969-01-21 1970-09-01 Itt Cam actuated printed circuit board connector
US3621444A (en) 1970-06-01 1971-11-16 Elco Corp Integrated circuit module electrical connector
US3683317A (en) 1970-07-20 1972-08-08 Cambridge Thermionic Corp Minimal insertion force connector
US3665375A (en) 1970-07-23 1972-05-23 Berg Electronics Inc Connector block and method of making the same
US3673548A (en) 1970-10-19 1972-06-27 Itt Printed circuit board connector
US3681738A (en) * 1971-02-02 1972-08-01 Berg Electronics Inc Circuit board socket
US3732525A (en) 1971-03-26 1973-05-08 Amp Inc Electrical contact terminal and connector
US3737838A (en) 1971-11-17 1973-06-05 Itt Printed circuit board connector
US3719981A (en) 1971-11-24 1973-03-13 Rca Corp Method of joining solder balls to solder bumps
US3797108A (en) * 1972-01-10 1974-03-19 Bunker Ramo Method for fabricating selectively plated electrical contacts
US3742430A (en) 1972-02-24 1973-06-26 Ford Motor Co Electrical terminal
US3780433A (en) 1972-05-01 1973-12-25 Amp Inc A method of making an electrical connection using a coined post with solder stripe
US3826000A (en) 1972-05-18 1974-07-30 Essex International Inc Terminating of electrical conductors
GB1434833A (en) * 1972-06-02 1976-05-05 Siemens Ag Solder carrying electrical connector wires
US3864004A (en) * 1972-11-30 1975-02-04 Du Pont Circuit board socket
JPS5141222B2 (zh) 1972-12-06 1976-11-09
US3865462A (en) 1973-03-07 1975-02-11 Amp Inc Preloaded contact and latchable housing assembly
US3838382A (en) 1973-07-13 1974-09-24 Itt Retention system for electrical contacts
US3868166A (en) * 1973-07-16 1975-02-25 Elfab Corp Printed circuit board connector having contacts arranged in a staggered grid array
US3866999A (en) * 1973-11-16 1975-02-18 Ife Co Electronic microelement assembly
US3899234A (en) 1974-03-20 1975-08-12 Amp Inc Low insertion force cam actuated printed circuit board connector
US3971610A (en) 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors
US3989331A (en) 1974-08-21 1976-11-02 Augat, Inc. Dual-in-line socket
DE2448296A1 (de) * 1974-10-10 1976-04-22 Draloric Electronic Anschlusselement fuer elektronische bauelemente
US3989344A (en) 1974-12-26 1976-11-02 Bunker Ramo Corporation Two-position contact for printed circuit cards
JPS5535238B2 (zh) 1975-01-24 1980-09-12
FR2310641A1 (fr) 1975-05-05 1976-12-03 Amp Inc Procede de fabrication d'un connecteur electrique
US4004195A (en) * 1975-05-12 1977-01-18 Rca Corporation Heat-sink assembly for high-power stud-mounted semiconductor device
US4140361A (en) 1975-06-06 1979-02-20 Sochor Jerzy R Flat receptacle contact for extremely high density mounting
US4077694A (en) * 1975-06-24 1978-03-07 Amp Incorporated Circuit board connector
US3999955A (en) 1975-07-15 1976-12-28 Allegheny Ludlum Industries, Inc. Strip for lead frames
US4045868A (en) 1975-07-21 1977-09-06 Elfab Corporation Method of fabrication and assembly of electrical connector
US4019803A (en) 1975-10-15 1977-04-26 E. I. Du Pont De Nemours And Company Solder substrate clip
CA1063730A (en) * 1975-11-11 1979-10-02 Robert F. Cobaugh Printed circuit board assembly
GB1580210A (en) * 1975-12-29 1980-11-26 Raychem Corp Connector
US4119818A (en) 1976-01-02 1978-10-10 Burndy Corporation Interconnecting module
US4037270A (en) 1976-05-24 1977-07-19 Control Data Corporation Circuit packaging and cooling
US4056302A (en) 1976-06-04 1977-11-01 International Business Machines Corporation Electrical connection structure and method
US4047782A (en) 1976-06-23 1977-09-13 Amp Incorporated Rotary cam low insertion force connector with top actuation
US4065998A (en) * 1976-06-30 1978-01-03 The United States Of America As Represented By The Secretary Of The Army Gun lock and firing mechanism for 30mm cannon
US4034469A (en) 1976-09-03 1977-07-12 Ibm Corporation Method of making conduction-cooled circuit package
US4085998A (en) 1976-12-29 1978-04-25 Western Electric Company, Inc. Dual clip connector
US4106841A (en) 1977-03-11 1978-08-15 Bunker Ramo Corporation Electrical connector for printed circuit boards
US4094564A (en) 1977-03-17 1978-06-13 A P Products Incorporated Multiple conductor electrical connector with ground bus
US4095866A (en) 1977-05-19 1978-06-20 Ncr Corporation High density printed circuit board and edge connector assembly
US4394530A (en) 1977-09-19 1983-07-19 Kaufman Lance R Power switching device having improved heat dissipation means
US4274700A (en) 1977-10-12 1981-06-23 Bunker Ramo Corporation Low cost electrical connector
FR2409123A1 (fr) 1977-11-16 1979-06-15 Comatel Perfectionnements apportes aux contacts a souder
US4159861A (en) 1977-12-30 1979-07-03 International Telephone And Telegraph Corporation Zero insertion force connector
US4165909A (en) 1978-02-09 1979-08-28 Amp Incorporated Rotary zif connector edge board lock
US4189204A (en) * 1978-03-16 1980-02-19 Eaton Corporation Integrated wire termination system with reflow bonded retainer
US4166667A (en) 1978-04-17 1979-09-04 Gte Sylvania, Incorporated Circuit board connector
US4226496A (en) 1978-04-21 1980-10-07 Elfab Corporation Circuit board edge connector
US4184735A (en) * 1978-05-22 1980-01-22 Elfab Corporation Discrete connector
US4186909A (en) * 1978-05-23 1980-02-05 Dynex/Rivett, Inc. Fail-to-neutral module
US4179177A (en) 1978-08-23 1979-12-18 Gte Sylvania Incorporated Circuit board connector
US4242790A (en) * 1978-09-28 1981-01-06 The Bendix Corporation Method of making an electrical connector contact
US4251852A (en) * 1979-06-18 1981-02-17 International Business Machines Corporation Integrated circuit package
US4298237A (en) 1979-12-20 1981-11-03 Bell Telephone Laboratories, Incorporated Printed wiring board interconnection apparatus
US4338652A (en) 1980-02-26 1982-07-06 Westinghouse Electric Corp. Stack module and stack loader therefor
US4303294A (en) 1980-03-17 1981-12-01 Amp Incorporated Compound spring contact
US4431252A (en) * 1980-05-27 1984-02-14 Ford Motor Company Printed circuit board edge connector
US4343523A (en) 1980-05-27 1982-08-10 Ford Motor Company Printed circuit board edge connector
US4396935A (en) 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
US4342068A (en) 1980-11-10 1982-07-27 Teknational Industries Inc. Mounting assembly for semiconductor devices and particularly power transistors
US4397086A (en) 1981-01-26 1983-08-09 The Bendix Corporation Method of fabricating a socket type electrical contact
US4396140A (en) 1981-01-27 1983-08-02 Bell Telephone Laboratories, Incorporated Method of bonding electronic components
US4427249A (en) * 1981-02-02 1984-01-24 Amp Incorporated Low height ADS connector
US4802862A (en) 1981-03-30 1989-02-07 North American Specialties Corporation Solderable electrical contact
US4395086A (en) 1981-04-20 1983-07-26 The Bendix Corporation Electrical contact for electrical connector assembly
US4431262A (en) * 1981-10-06 1984-02-14 Tolles Walter E Conformable optical couplers
US4546542A (en) 1981-10-08 1985-10-15 Symbex Corporation Method and apparatus for making fork contacts
US4403819A (en) 1981-11-20 1983-09-13 Amp Incorporated Edge board lock
EP0082902B1 (fr) 1981-12-29 1985-11-27 International Business Machines Corporation Procédé pour souder les broches aux oeillets des conducteurs formés sur un substrat céramique
US4380518A (en) 1982-01-04 1983-04-19 Western Electric Company, Inc. Method of producing solder spheres
US4605278A (en) 1985-05-24 1986-08-12 North American Specialties Corporation Solder-bearing leads
US4728305A (en) 1985-10-31 1988-03-01 North American Specialties Corp. Solder-bearing leads
FR2522201A1 (fr) 1982-02-24 1983-08-26 Alsthom Cgee Piece de connexion electrique polyvalente
DE3215635A1 (de) * 1982-04-27 1983-11-03 Goldhofer Fahrzeugwerk Gmbh & Co, 8940 Memmingen Hydraulische hebevorrichtung zur montage eines kranauslegers
US4498725A (en) * 1982-06-02 1985-02-12 Amp Incorporated Electrical connector
US4447109A (en) 1982-06-04 1984-05-08 Western Electric Company, Inc. Connector pin
US4537461A (en) 1982-07-28 1985-08-27 At&T Technologies, Inc. Lead having a solder-preform and preform-carrying finger engageable directly with a contact pad
US4570338A (en) * 1982-09-20 1986-02-18 At&T Technologies, Inc. Methods of forming a screw terminal
US4637542A (en) * 1982-09-22 1987-01-20 Control Data Corporation Process for soldering and desoldering apertured leadless packages
JPS5958850A (ja) 1982-09-29 1984-04-04 Fujitsu Ltd Icソケツト
US4482937A (en) 1982-09-30 1984-11-13 Control Data Corporation Board to board interconnect structure
JPS5998591A (ja) 1982-11-27 1984-06-06 松下電器産業株式会社 両面回路接続方法
US4539621A (en) 1982-12-20 1985-09-03 Motorola, Inc. Integrated circuit carrier and assembly
US4487468A (en) 1982-12-27 1984-12-11 Amp Incorporated Card edge connector locking device
US4441118A (en) 1983-01-13 1984-04-03 Olin Corporation Composite copper nickel alloys with improved solderability shelf life
US4519658A (en) 1983-01-24 1985-05-28 Thomas & Betts Corporation Electronic package assembly and accessory component therefor
US4442938A (en) 1983-03-22 1984-04-17 Advanced Interconnections Socket terminal positioning method and construction
US4705205A (en) 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4664309A (en) 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4585291A (en) 1983-09-14 1986-04-29 Burndy Corporation Dual-in-line connector assembly
JPS6072663A (ja) 1983-09-28 1985-04-24 Fujitsu Ltd 低融点金属球接続方法
US4463060A (en) 1983-11-15 1984-07-31 E. I. Du Pont De Nemours And Company Solderable palladium-nickel coatings and method of making said coatings
US4556268A (en) 1983-11-23 1985-12-03 Burndy Corporation Circuit board connector system having independent contact segments
US4842538A (en) 1983-11-23 1989-06-27 Burndy Corporation Low insertion force circuit board connector assembly
US4502745A (en) * 1983-12-19 1985-03-05 At&T Technologies, Inc. Progressively-increasing clamping force lead and lead-substrate assembly
US4829818A (en) 1983-12-27 1989-05-16 Honeywell Inc. Flow sensor housing
US4565917B1 (en) * 1984-01-18 1999-06-08 Vitronics Corp Multi-zone thermal process system utilizing nonfocused infared panel emitters
BR8504783A (pt) 1984-01-23 1985-12-24 Telemecanique Electrique Dispositivo de montagem e de conexao para semicondutor de potencia
DE3587933T2 (de) * 1984-02-27 1995-05-11 Whitaker Corp Verfahren, um einen Schaltungsträgerkontakt in ein Gehäuse einzusetzen.
US4560221A (en) 1984-05-14 1985-12-24 Amp Incorporated High density zero insertion force connector
DE3422337A1 (de) * 1984-06-15 1985-12-19 Beisler GmbH, 8758 Goldbach Vorrichtung zum aufnehmen eines flexiblen flaechigen werkstueckes von einer unterlage
GB8417646D0 (en) 1984-07-11 1984-08-15 Smiths Industries Plc Electrical contacts
US4684194A (en) 1984-07-16 1987-08-04 Trw Inc. Zero insertion force connector
US4750266A (en) 1984-07-24 1988-06-14 Brandeau Edward P Flat cable connector assembly
US4720156A (en) * 1984-08-13 1988-01-19 Tritec, Inc. Manually operated electrical connector for printed circuit boards
US4717354A (en) * 1984-11-19 1988-01-05 Amp Incorporated Solder cup connector
US4843313A (en) 1984-12-26 1989-06-27 Hughes Aircraft Company Integrated circuit package carrier and test device
US4678250A (en) 1985-01-08 1987-07-07 Methode Electronics, Inc. Multi-pin electrical header
US4671590A (en) 1985-03-06 1987-06-09 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4768972A (en) 1985-03-06 1988-09-06 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4671592A (en) 1985-03-06 1987-06-09 Minnesota Mining And Manufacturing Company Test clip for PLCC
US4623208A (en) 1985-04-03 1986-11-18 Wells Electronic, Inc. Leadless chip carrier socket
US4661375A (en) 1985-04-22 1987-04-28 At&T Technologies, Inc. Method for increasing the height of solder bumps
US5139448A (en) 1985-05-24 1992-08-18 North American Specialties Corporation Solder-bearing lead
US4693528A (en) 1985-05-31 1987-09-15 Amp Incorporated Surface mount connector with floating terminals
EP0205876A1 (de) * 1985-06-19 1986-12-30 Siemens Aktiengesellschaft Mehrpolige Steckvorrichtung mit einer Zentrierleiste mit einer Schirmvorrichtung
US4884335A (en) 1985-06-21 1989-12-05 Minnesota Mining And Manufacturing Company Surface mount compatible connector system with solder strip and mounting connector to PCB
US4641426A (en) 1985-06-21 1987-02-10 Associated Enterprises, Inc. Surface mount compatible connector system with mechanical integrity
US4783722A (en) * 1985-07-16 1988-11-08 Nippon Telegraph And Telephone Corporation Interboard connection terminal and method of manufacturing the same
US4808119A (en) * 1985-08-30 1989-02-28 Pfaff Wayne Zero insertion force mounting housings for electronic device packages
US4654509A (en) * 1985-10-07 1987-03-31 Epsilon Limited Partnership Method and apparatus for substrate heating in an axially symmetric epitaxial deposition apparatus
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
JPS6293964A (ja) 1985-10-21 1987-04-30 Dai Ichi Seiko Co Ltd Ic検査用ソケツト
FR2590084B1 (fr) 1985-11-08 1987-11-20 Souriau & Cie Connecteur electrique, notamment connecteur etanche en immersion dans un liquide
US4669796A (en) 1985-11-22 1987-06-02 Wells Electronics, Inc. RAM connector
US4705338A (en) 1985-12-13 1987-11-10 E. I. Du Pont De Nemours And Company Zero insertion force connector
US4799897A (en) 1985-12-30 1989-01-24 Dai-Ichi Seiko Kabushiki Kaisha IC tester socket
JPS62160676A (ja) 1985-12-31 1987-07-16 日本テキサス・インスツルメンツ株式会社 ソケツト
GB8601746D0 (en) * 1986-01-24 1986-02-26 British Telecomm Heat sink
JPS62177875A (ja) * 1986-01-31 1987-08-04 ケル株式会社 フラツトケ−ブルコネクタ
US4726793A (en) 1986-02-06 1988-02-23 Amp Incorporated Electrical socket, application tool and method for positioning electrical sockets on circuit boards for surface soldering
JPH061312B2 (ja) 1986-02-20 1994-01-05 富士写真フイルム株式会社 液晶駆動制御装置
US4678255A (en) 1986-04-03 1987-07-07 Wells Electronics, Inc. Chip connector
US4718863A (en) * 1986-05-02 1988-01-12 Thomas & Betts Corporation Jumper cable having clips for solder connections
US4767344A (en) * 1986-08-22 1988-08-30 Burndy Corporation Solder mounting of electrical contacts
JPH0775182B2 (ja) * 1986-09-02 1995-08-09 日本テキサス・インスツルメンツ株式会社 ソケツト
DE3684602D1 (de) 1986-10-08 1992-04-30 Ibm Verfahren zum herstellen von loetkontakten fuer ein keramisches modul ohne steckerstifte.
US4722470A (en) 1986-12-01 1988-02-02 International Business Machines Corporation Method and transfer plate for applying solder to component leads
US4762500A (en) 1986-12-04 1988-08-09 Amp Incorporated Impedance matched electrical connector
US4934968A (en) 1986-12-22 1990-06-19 Amp Incorporated Nickel plated contact surface having preferred crystallographic orientation
JP2533511B2 (ja) * 1987-01-19 1996-09-11 株式会社日立製作所 電子部品の接続構造とその製造方法
US5086337A (en) * 1987-01-19 1992-02-04 Hitachi, Ltd. Connecting structure of electronic part and electronic device using the structure
US5085602A (en) * 1987-02-18 1992-02-04 Sanders Associates, Inc. Electrical circuit board mounting apparatus and method
US4769557A (en) 1987-02-19 1988-09-06 Allen-Bradley Company, Inc. Modular electric load controller
US5019940A (en) 1987-02-24 1991-05-28 Thermalloy Incorporated Mounting apparatus for electronic device packages
US4750889A (en) 1987-02-27 1988-06-14 Minnesota Mining & Manufacturing Company Through-board electrical component header having integral solder mask
US4734057A (en) * 1987-03-02 1988-03-29 Burndy Corporation Connector assembly
US4740180A (en) 1987-03-16 1988-04-26 Molex Incorporated Low insertion force mating electrical contact
DE3760698D1 (en) * 1987-03-20 1989-11-09 Winchester Electronics Zweigwe Pluggable connector for contacting directly a printed circuit board
US4840305A (en) 1987-03-30 1989-06-20 Westinghouse Electric Corp. Method for vapor phase soldering
US4718857A (en) * 1987-04-10 1988-01-12 Burndy Corporation Electrical connectors and clips and methods of use
DE3712691C1 (en) * 1987-04-14 1988-06-23 Prym Werke William Electrical connecting pin, especially a coil former pin, and a method for its production
US4759491A (en) 1987-05-18 1988-07-26 American Telephone And Telegraph Company Method and apparatus for applying bonding material to component leads
US4750890A (en) 1987-06-18 1988-06-14 The J. M. Ney Company Test socket for an integrated circuit package
US5029748A (en) 1987-07-10 1991-07-09 Amp Incorporated Solder preforms in a cast array
JPH0795554B2 (ja) 1987-09-14 1995-10-11 株式会社日立製作所 はんだ球整列装置
JPH01102827A (ja) 1987-10-14 1989-04-20 Fuji Electric Co Ltd 電磁リレーの接点ばね装置の製造方法
US5438481A (en) 1987-11-17 1995-08-01 Advanced Interconnections Corporation Molded-in lead frames
US4934967A (en) 1987-12-15 1990-06-19 Amp Incorporated Socket for pin grid array
US4846734A (en) 1988-01-22 1989-07-11 Burndy Corporation Vertical edge card connectors
JP2573016B2 (ja) 1988-02-27 1997-01-16 アンプ インコーポレーテッド マイクロ入出力ピンおよびその製造方法
US4986462A (en) * 1988-03-02 1991-01-22 General Dynamics Corporation Method for cleaning and/or fluxing circuit card assemblies
US5048549A (en) 1988-03-02 1991-09-17 General Dynamics Corp., Air Defense Systems Div. Apparatus for cleaning and/or fluxing circuit card assemblies
DE68913318T2 (de) 1988-03-11 1994-09-15 Ibm Elastomerische Verbinder für elektronische Bausteine und für Prüfungen.
US4871315A (en) 1988-03-30 1989-10-03 Burndy Corporation Ribbon cable connector
US4896470A (en) * 1988-04-21 1990-01-30 Varitech Industries, Inc. Tendon tensioning anchor
US4824389A (en) 1988-04-26 1989-04-25 Precision Connector Designs, Inc. Socket for electronic component
US4889500A (en) 1988-05-23 1989-12-26 Burndy Corporation Controlled impedance connector assembly
US4886470A (en) 1988-05-24 1989-12-12 Amp Incorporated Burn-in socket for gull wing integrated circuit package
US4836792A (en) 1988-06-13 1989-06-06 Chrysler Motors Corporation Connector
US4984359A (en) * 1988-07-21 1991-01-15 Amp Incorporated Method of making a solder containing electrical connector
FR2634945B1 (fr) * 1988-07-27 1996-04-26 Videocolor Procede de fabrication d'un tube de television en couleurs a haute definition et tube de television trichrome a haute definition
JPH0225172U (zh) 1988-08-06 1990-02-19
JPH0278893A (ja) 1988-09-14 1990-03-19 Sanden Corp 熱交換器とその製造方法
US4916523A (en) 1988-09-19 1990-04-10 Advanced Micro Devices, Inc. Electrical connections via unidirectional conductive elastomer for pin carrier outside lead bond
US4912841A (en) 1988-10-06 1990-04-03 Burndy Corporation Dense wire bundle extracting tool
US4941833A (en) 1988-10-06 1990-07-17 Burndy Corporation Controlled impedance plug and receptacle
US4911643A (en) 1988-10-11 1990-03-27 Beta Phase, Inc. High density and high signal integrity connector
US4881908A (en) 1988-10-11 1989-11-21 Beta Phase, Inc. High density and high signal integrity connector
US4869672A (en) 1989-04-17 1989-09-26 Amp Incorporated Dual purpose card edge connector
DE3837975A1 (de) 1988-11-09 1990-05-10 Telefunken Electronic Gmbh Elektronisches steuergeraet
US4854882A (en) 1988-12-12 1989-08-08 Augat Inc. Floatable surface mount terminal
US4934961A (en) * 1988-12-21 1990-06-19 Burndy Corporation Bi-level card edge connector and method of making the same
US4965658A (en) 1988-12-29 1990-10-23 York International Corporation System for mounting and cooling power semiconductor devices
US5024372A (en) 1989-01-03 1991-06-18 Motorola, Inc. Method of making high density solder bumps and a substrate socket for high density solder bumps
US4948030A (en) 1989-01-30 1990-08-14 Motorola, Inc. Bond connection for components
DE69018846T2 (de) 1989-02-10 1995-08-24 Fujitsu Ltd Keramische Packung vom Halbleiteranordnungstyp und Verfahren zum Zusammensetzen derselben.
US4961709A (en) 1989-02-13 1990-10-09 Burndy Corporation Vertical action contact spring
US4900261A (en) * 1989-02-23 1990-02-13 Positronic Industries, Inc. Electrical connector system
US5168320A (en) 1989-03-13 1992-12-01 Lutz Carl D Colorimeter
NL8900676A (nl) 1989-03-20 1990-10-16 Philips Nv Substraat met interconnectiestructuren.
US5073117A (en) 1989-03-30 1991-12-17 Texas Instruments Incorporated Flip-chip test socket adaptor and method
US5006792A (en) 1989-03-30 1991-04-09 Texas Instruments Incorporated Flip-chip test socket adaptor and method
US4900279A (en) * 1989-04-24 1990-02-13 Die Tech, Inc. Solder terminal
US4953060A (en) 1989-05-05 1990-08-28 Ncr Corporation Stackable integrated circuit chip package with improved heat removal
US5041901A (en) 1989-05-10 1991-08-20 Hitachi, Ltd. Lead frame and semiconductor device using the same
US5016795A (en) 1989-05-18 1991-05-21 Porteous Paul D Dental paste cup with multi-facet inner base
US5098311A (en) 1989-06-12 1992-03-24 Ohio Associated Enterprises, Inc. Hermaphroditic interconnect system
US4892487A (en) * 1989-06-15 1990-01-09 Ibm Corporation Connector assembly with movable carriage
US5299730A (en) 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
IL96196A (en) 1989-11-01 1995-03-30 Raychem Ltd Electrically conductive polymeric preparation
US5038467A (en) 1989-11-09 1991-08-13 Advanced Interconnections Corporation Apparatus and method for installation of multi-pin components on circuit boards
US5015192A (en) 1989-11-13 1991-05-14 Itt Corporation Contact retention and sealing system
US5021002A (en) 1989-12-20 1991-06-04 Burndy Corporation Snap-lock electrical connector with quick release
JP2590450B2 (ja) 1990-02-05 1997-03-12 株式会社村田製作所 バンプ電極の形成方法
US5065281A (en) 1990-02-12 1991-11-12 Rogers Corporation Molded integrated circuit package incorporating heat sink
US5031025A (en) 1990-02-20 1991-07-09 Unisys Corporation Hermetic single chip integrated circuit package
US4975079A (en) 1990-02-23 1990-12-04 International Business Machines Corp. Connector assembly for chip testing
US5090926A (en) 1991-02-26 1992-02-25 North American Specialties Corporation Solderable lead
JPH0412483A (ja) 1990-04-27 1992-01-17 Kel Corp Icソケット
JPH088552Y2 (ja) 1990-05-29 1996-03-06 モレックス インコーポレーテッド 狭ピッチ用ボードとボードの接続用電気コネクタ
US5035631A (en) 1990-06-01 1991-07-30 Burndy Corporation Ground shielded bi-level card edge connector
US5046957A (en) 1990-06-25 1991-09-10 Amp Incorporated Solder plate assembly and method
US5046972A (en) 1990-07-11 1991-09-10 Amp Incorporated Low insertion force connector and contact
US5060844A (en) 1990-07-18 1991-10-29 International Business Machines Corporation Interconnection structure and test method
US5088190A (en) * 1990-08-30 1992-02-18 Texas Instruments Incorporated Method of forming an apparatus for burn in testing of integrated circuit chip
US5140405A (en) 1990-08-30 1992-08-18 Micron Technology, Inc. Semiconductor assembly utilizing elastomeric single axis conductive interconnect
JPH0638382Y2 (ja) 1990-09-10 1994-10-05 モレックス インコーポレーテッド 基板と基板を接続する為の表面実装用コネクタ
US5241134A (en) 1990-09-17 1993-08-31 Yoo Clarence S Terminals of surface mount components
US5258330A (en) 1990-09-24 1993-11-02 Tessera, Inc. Semiconductor chip assemblies with fan-in leads
US5183418A (en) * 1990-10-01 1993-02-02 Yazaki Corporation Connector
US5111991A (en) 1990-10-22 1992-05-12 Motorola, Inc. Method of soldering components to printed circuit boards
US5178564A (en) * 1990-11-19 1993-01-12 Molex Incorporated Electrical connector with solder mask
US5184802A (en) * 1990-12-13 1993-02-09 Hickory Springs Manufacturing Company Wire grid for box spring bedding assembly
US5090116A (en) * 1990-12-21 1992-02-25 Amp Incorporated Method of assembling a connector to a circuit element and soldering lead frame for use therein
US5093987A (en) 1990-12-21 1992-03-10 Amp Incorporated Method of assembling a connector to a circuit element and soldering component for use therein
US5096435A (en) 1991-01-03 1992-03-17 Burndy Corporation Bi-level card edge connector with selectively movable contacts for use with different types of cards
US5272295A (en) 1991-01-23 1993-12-21 Sumitomo Electric Industries, Ltd. Electric contact and method for producing the same
GB9118841D0 (en) 1991-09-03 1991-10-16 Raychem Sa Nv Electrical connector
US5098306A (en) 1991-02-20 1992-03-24 Burndy Corporation Card edge connector with switching contacts
JPH04105468U (ja) 1991-02-22 1992-09-10 第一電子工業株式会社 電気コネクタ
US5145104A (en) * 1991-03-21 1992-09-08 International Business Machines Corporation Substrate soldering in a reducing atmosphere
US5303466A (en) 1991-03-25 1994-04-19 Daiichi Denshi Kogyo Kabushiki Kaisha Method of mounting surface connector
US5167545A (en) 1991-04-01 1992-12-01 Metcal, Inc. Connector containing fusible material and having intrinsic temperature control
US5350292A (en) * 1991-04-04 1994-09-27 Magnetek Electrical half connector with contact-centering vanes
US5131871A (en) * 1991-04-16 1992-07-21 Molex Incorporated Universal contact pin electrical connector
US5118027A (en) 1991-04-24 1992-06-02 International Business Machines Corporation Method of aligning and mounting solder balls to a substrate
US5199885A (en) 1991-04-26 1993-04-06 Amp Incorporated Electrical connector having terminals which cooperate with an edge of a circuit board
US5127839A (en) 1991-04-26 1992-07-07 Amp Incorporated Electrical connector having reliable terminals
US5314361A (en) 1991-05-02 1994-05-24 The Whitaker Corporation Electrical contact with recessed wire connecting portion
US5237203A (en) 1991-05-03 1993-08-17 Trw Inc. Multilayer overlay interconnect for high-density packaging of circuit elements
US5188320A (en) * 1991-05-06 1993-02-23 Polka John G Nursing bottle holder
WO1992021150A1 (en) 1991-05-23 1992-11-26 Motorola, Inc. Integrated circuit chip carrier
US5184961A (en) * 1991-06-20 1993-02-09 Burndy Corporation Modular connector frame
US5104324A (en) 1991-06-26 1992-04-14 Amp Incorporated Multichip module connector
US5258648A (en) 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
US5120237A (en) 1991-07-22 1992-06-09 Fussell Don L Snap on cable connector
US5229016A (en) 1991-08-08 1993-07-20 Microfab Technologies, Inc. Method and apparatus for dispensing spherical-shaped quantities of liquid solder
US5261155A (en) 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
US5203075A (en) 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5222649A (en) 1991-09-23 1993-06-29 International Business Machines Apparatus for soldering a semiconductor device to a circuitized substrate
US5207372A (en) 1991-09-23 1993-05-04 International Business Machines Method for soldering a semiconductor device to a circuitized substrate
US5169320A (en) 1991-09-27 1992-12-08 Hercules Defense Electronics Systems, Inc. Shielded and wireless connector for electronics
US5168425A (en) 1991-10-16 1992-12-01 General Electric Company Mounting arrangements for high voltage/high power semiconductors
US5281772A (en) 1991-10-28 1994-01-25 Delco Electronics Corporation Electrical connector having energy-formed solder stops and methods of making and using the same
US5281160A (en) * 1991-11-07 1994-01-25 Burndy Corporation Zero disengagement force connector with wiping insertion
US5188535A (en) * 1991-11-18 1993-02-23 Molex Incorporated Low profile electrical connector
US5305879A (en) 1991-12-03 1994-04-26 Burndy Corporation Package for card edge connectors
US5184962A (en) * 1991-12-05 1993-02-09 Burndy Corporation Electrical spring contact
US5188525A (en) * 1992-01-02 1993-02-23 Texas Trunk Company, Inc. Fuel converter for gasoline powered lanterns
US5255839A (en) 1992-01-02 1993-10-26 Motorola, Inc. Method for solder application and reflow
US5236368A (en) 1992-01-06 1993-08-17 Burndy Corporation Printed circuit board and outrigger edge connector assembly and method of assembling the same
US5292559A (en) 1992-01-10 1994-03-08 Amp Incorporated Laser transfer process
US5338208A (en) 1992-02-04 1994-08-16 International Business Machines Corporation High density electronic connector and method of assembly
GB9205088D0 (en) 1992-03-09 1992-04-22 Amp Holland Shielded back plane connector
US5483421A (en) * 1992-03-09 1996-01-09 International Business Machines Corporation IC chip attachment
US5227718A (en) 1992-03-10 1993-07-13 Virginia Panel Corporation Double-headed spring contact probe assembly
US5576631A (en) 1992-03-10 1996-11-19 Virginia Panel Corporation Coaxial double-headed spring contact probe assembly
US5420519A (en) 1992-03-10 1995-05-30 Virginia Panel Corporation Double-headed spring contact probe assembly
JP2748768B2 (ja) 1992-03-19 1998-05-13 株式会社日立製作所 薄膜多層配線基板およびその製造方法
US5197887A (en) 1992-03-27 1993-03-30 International Business Machines Corporation High density circuit connector
US5334038A (en) 1992-03-27 1994-08-02 International Business Machines Corp. High density connector with sliding actuator
US5269453A (en) 1992-04-02 1993-12-14 Motorola, Inc. Low temperature method for forming solder bump interconnections to a plated circuit trace
GB2269335A (en) 1992-08-04 1994-02-09 Ibm Solder particle deposition
US5244143A (en) 1992-04-16 1993-09-14 International Business Machines Corporation Apparatus and method for injection molding solder and applications thereof
JP3378591B2 (ja) * 1992-04-30 2003-02-17 株式会社リコー 用紙クランプ装置および用紙処理装置
DE4217205C2 (de) * 1992-05-23 1994-09-08 Amphenol Tuchel Elect Steckverbinder
US5176528A (en) * 1992-06-11 1993-01-05 Molex Incorporated Pin and socket electrical connnector assembly
US5254019A (en) 1992-07-08 1993-10-19 Burndy Corporation Configurable coded electrical plug and socket
US5274528A (en) 1992-08-03 1993-12-28 Burndy Corporation Power distribution and limiter assembly
US5287617A (en) * 1992-08-11 1994-02-22 Advanced Interconnections Corporation Apparatus for extracting an integrated circuit package installed in a socket on a circuit board
US5380212A (en) * 1992-08-14 1995-01-10 Hewlett Packard Company Conductive elastomeric interface for a pin grid array
US5308248A (en) 1992-08-31 1994-05-03 International Business Machines Corp. High density interconnection system
US5284287A (en) 1992-08-31 1994-02-08 Motorola, Inc. Method for attaching conductive balls to a substrate
JP2885258B2 (ja) * 1992-09-11 1999-04-19 矢崎総業株式会社 圧接端子金具
US5345061A (en) 1992-09-15 1994-09-06 Vitronics Corporation Convection/infrared solder reflow apparatus utilizing controlled gas flow
EP0589560B1 (en) * 1992-09-23 1997-10-22 The Whitaker Corporation Electrical overstress protection apparatus
US5305185A (en) 1992-09-30 1994-04-19 Samarov Victor M Coplanar heatsink and electronics assembly
US5515604A (en) * 1992-10-07 1996-05-14 Fujitsu Limited Methods for making high-density/long-via laminated connectors
JP3338527B2 (ja) * 1992-10-07 2002-10-28 富士通株式会社 高密度積層形のコネクタ、及び、コネクタの設計方法
US5334053A (en) 1992-10-19 1994-08-02 Burndy Corporation Dual-beam electrical contact with preload tabs
DE4237545A1 (de) * 1992-11-06 1994-05-11 Bayer Ag Kupferphthalocyanin-Flüssigformierung
US5830014A (en) 1992-11-25 1998-11-03 Berg Technology, Inc. Electrical connector
JPH0746624B2 (ja) * 1992-12-10 1995-05-17 山一電機株式会社 Icキャリア用ソケット
US5306546A (en) 1992-12-22 1994-04-26 Hughes Aircraft Company Multi chip module substrate
JPH0828583B2 (ja) * 1992-12-23 1996-03-21 インターナショナル・ビジネス・マシーンズ・コーポレイション 多層プリント回路基板およびその製作方法、およびボール・ディスペンサ
US5479319A (en) * 1992-12-30 1995-12-26 Interconnect Systems, Inc. Multi-level assemblies for interconnecting integrated circuits
US5342221A (en) 1993-01-08 1994-08-30 Molex Incorporated Keying system for electrical connectors
US5302853A (en) 1993-01-25 1994-04-12 The Whitaker Corporation Land grid array package
US5310357A (en) 1993-02-22 1994-05-10 Berg Technology, Inc. Blade-like terminal having a passive latch
US5324569A (en) 1993-02-26 1994-06-28 Hewlett-Packard Company Composite transversely plastic interconnect for microchip carrier
US5489750A (en) 1993-03-11 1996-02-06 Matsushita Electric Industrial Co., Ltd. Method of mounting an electronic part with bumps on a circuit board
US5613882A (en) 1993-03-19 1997-03-25 The Whitaker Corporation Connector latch and polarizing structure
US5329426A (en) 1993-03-22 1994-07-12 Digital Equipment Corporation Clip-on heat sink
US5275330A (en) 1993-04-12 1994-01-04 International Business Machines Corp. Solder ball connect pad-on-via assembly process
US5355283A (en) 1993-04-14 1994-10-11 Amkor Electronics, Inc. Ball grid array with via interconnection
US5575686A (en) 1993-04-14 1996-11-19 Burndy Corporation Stacked printed circuit boards connected in series
US5279028A (en) 1993-04-30 1994-01-18 The Whitaker Corporation Method of making a pin grid array and terminal for use therein
US5288959A (en) * 1993-04-30 1994-02-22 The Whitaker Corporation Device for electrically interconnecting opposed contact arrays
US5380213A (en) * 1993-05-21 1995-01-10 Burndy Corporation Electrical connector with improved ejectors and assembly
US5518410A (en) * 1993-05-24 1996-05-21 Enplas Corporation Contact pin device for IC sockets
US5467913A (en) 1993-05-31 1995-11-21 Citizen Watch Co., Ltd. Solder ball supply device
US5398863A (en) 1993-07-23 1995-03-21 Tessera, Inc. Shaped lead structure and method
US5382179A (en) * 1993-08-12 1995-01-17 Burndy Corporation Electrical connection system with mounting track
US5389006A (en) * 1993-08-13 1995-02-14 Burndy Corporation Lightweight entertainment connector
US5357074A (en) 1993-08-17 1994-10-18 The Whitaker Corporation Electrical interconnection device
US5358417A (en) * 1993-08-27 1994-10-25 The Whitaker Corporation Surface mountable electrical connector
US5399108A (en) 1993-09-08 1995-03-21 Tongrand Limited LIF PGA socket and contact therein and method making the same
US5354218A (en) 1993-09-16 1994-10-11 Molex Incorporated Electrical connector with improved terminal latching means
US5427535A (en) 1993-09-24 1995-06-27 Aries Electronics, Inc. Resilient electrically conductive terminal assemblies
US5346118A (en) 1993-09-28 1994-09-13 At&T Bell Laboratories Surface mount solder assembly of leadless integrated circuit packages to substrates
US5378160A (en) 1993-10-01 1995-01-03 Bourns, Inc. Compliant stacking connector for printed circuit boards
US5413491A (en) 1993-10-13 1995-05-09 Burndy Corporation Small form factor connectors with center ground plate
US5607609A (en) 1993-10-25 1997-03-04 Fujitsu Ltd. Process and apparatus for soldering electronic components to printed circuit board, and assembly of electronic components and printed circuit board obtained by way of soldering
US5442852A (en) 1993-10-26 1995-08-22 Pacific Microelectronics Corporation Method of fabricating solder ball array
US5591941A (en) 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
WO1995014312A1 (en) 1993-11-15 1995-05-26 Berg Technology, Inc. Solderable connector for high density electronic assemblies
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
TW270248B (zh) 1993-11-17 1996-02-11 Whitaker Corp
JPH07142489A (ja) 1993-11-17 1995-06-02 Matsushita Electric Ind Co Ltd バンプの形成方法
US5460537A (en) 1993-12-10 1995-10-24 Burndy Corporation Printed circuit board stabilizer for a card edge connector
US5475317A (en) 1993-12-23 1995-12-12 Epi Technologies, Inc. Singulated bare die tester and method of performing forced temperature electrical tests and burn-in
JP3008768B2 (ja) 1994-01-11 2000-02-14 松下電器産業株式会社 バンプの形成方法
US5495668A (en) * 1994-01-13 1996-03-05 The Furukawa Electric Co., Ltd. Manufacturing method for a supermicro-connector
US5377902A (en) 1994-01-14 1995-01-03 Microfab Technologies, Inc. Method of making solder interconnection arrays
JPH07211381A (ja) * 1994-01-19 1995-08-11 Yazaki Corp 二重係止コネクタの係止方法及び構造
US5395250A (en) 1994-01-21 1995-03-07 The Whitaker Corporation Low profile board to board connector
US5429522A (en) 1994-01-21 1995-07-04 Burndy Corporation Protected communications socket
US5435482A (en) 1994-02-04 1995-07-25 Lsi Logic Corporation Integrated circuit having a coplanar solder ball contact array
US5431332A (en) 1994-02-07 1995-07-11 Motorola, Inc. Method and apparatus for solder sphere placement using an air knife
US5469330A (en) 1994-02-14 1995-11-21 Karabatsos; Chris Heat sink header assembly
US5422790A (en) 1994-02-18 1995-06-06 Chen; Pao-Chin Computer chip mounting hardware for heat dissipation
TW268158B (zh) 1994-03-07 1996-01-11 Framatome Connectors Int
US5800184A (en) 1994-03-08 1998-09-01 International Business Machines Corporation High density electrical interconnect apparatus and method
US5541449A (en) 1994-03-11 1996-07-30 The Panda Project Semiconductor chip carrier affording a high-density external interface
JP3667786B2 (ja) 1994-03-17 2005-07-06 インテル・コーポレーション Icソケットおよびそのプリント基板との導通接続状態の検査方法
US5491303A (en) 1994-03-21 1996-02-13 Motorola, Inc. Surface mount interposer
US5478259A (en) 1994-03-28 1995-12-26 Burndy Corporation Card edge connector with combined shielding and voltage drain protection
US5734555A (en) 1994-03-30 1998-03-31 Intel Corporation Shared socket multi-chip module and/or piggyback pin grid array package
US5498167A (en) 1994-04-13 1996-03-12 Molex Incorporated Board to board electrical connectors
JP3102259B2 (ja) 1994-04-21 2000-10-23 株式会社村田製作所 高圧コネクタ
JPH07335350A (ja) 1994-06-07 1995-12-22 Ueruzu Japan Kk Icソケット
US5419710A (en) 1994-06-10 1995-05-30 Pfaff; Wayne K. Mounting apparatus for ball grid array device
US5511985A (en) 1994-06-16 1996-04-30 Burndy Corporation Angled card edge connector
US5562462A (en) 1994-07-19 1996-10-08 Matsuba; Stanley Reduced crosstalk and shielded adapter for mounting an integrated chip package on a circuit board like member
US5516030A (en) 1994-07-20 1996-05-14 Compaq Computer Corporation Method and apparatus for assembling ball grid array components on printed circuit boards by reflowing before placement
US5717252A (en) * 1994-07-25 1998-02-10 Mitsui High-Tec, Inc. Solder-ball connected semiconductor device with a recessed chip mounting area
JP3311867B2 (ja) 1994-07-26 2002-08-05 株式会社日立製作所 ボールグリッドアレイ型半導体装置およびその製造方法
US5451165A (en) 1994-07-27 1995-09-19 Minnesota Mining And Manufacturing Company Temporary package for bare die test and burn-in
US5539153A (en) 1994-08-08 1996-07-23 Hewlett-Packard Company Method of bumping substrates by contained paste deposition
US5492266A (en) 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
EP0780028B1 (en) 1994-09-06 1998-04-15 The Whitaker Corporation Ball grid array socket
JPH0878574A (ja) * 1994-09-08 1996-03-22 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
US5519580A (en) 1994-09-09 1996-05-21 Intel Corporation Method of controlling solder ball size of BGA IC components
US5499487A (en) 1994-09-14 1996-03-19 Vanguard Automation, Inc. Method and apparatus for filling a ball grid array
US5542174A (en) 1994-09-15 1996-08-06 Intel Corporation Method and apparatus for forming solder balls and solder columns
JP3084648B2 (ja) 1994-09-19 2000-09-04 株式会社三井ハイテック 半導体装置
JP3142723B2 (ja) * 1994-09-21 2001-03-07 シャープ株式会社 半導体装置及びその製造方法
US5671121A (en) 1994-09-29 1997-09-23 Intel Corporation Kangaroo multi-package interconnection concept
JPH08111581A (ja) 1994-10-07 1996-04-30 Nippon Avionics Co Ltd ボールグリッドアレイプリント配線板の半田付け方法
US5462456A (en) 1994-10-11 1995-10-31 The Whitaker Corporation Contact retention device for an electrical connector
US5477933A (en) 1994-10-24 1995-12-26 At&T Corp. Electronic device interconnection techniques
US5499311A (en) 1994-12-16 1996-03-12 International Business Machines Corporation Receptacle for connecting parallel fiber optic cables to a multichip module
KR0138309B1 (ko) * 1994-12-20 1998-05-15 김광호 슈퍼임포즈회로
JP3805365B2 (ja) 1994-12-23 2006-08-02 シンジェンタ リミテッド 化合物
US5531021A (en) 1994-12-30 1996-07-02 Intel Corporation Method of making solder shape array package
US5593322A (en) * 1995-01-17 1997-01-14 Dell Usa, L.P. Leadless high density connector
JPH08255638A (ja) * 1995-03-17 1996-10-01 Sumitomo Wiring Syst Ltd 圧接端子
JPH08279670A (ja) 1995-04-07 1996-10-22 Hitachi Ltd 電子部品の表面実装構造
US5652463A (en) 1995-05-26 1997-07-29 Hestia Technologies, Inc. Transfer modlded electronic package having a passage means
TW267265B (en) 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
EP1594184B1 (en) 1995-06-12 2009-11-04 Fci Low cross talk and impedance controlled electrical connector and electrical cable assembly
US5817973A (en) 1995-06-12 1998-10-06 Berg Technology, Inc. Low cross talk and impedance controlled electrical cable assembly
JP3132985B2 (ja) 1995-06-12 2001-02-05 ソニー株式会社 コンタクトにおける接続端子部構造
US5709555A (en) * 1995-06-22 1998-01-20 Framatome Connectors Usa Inc. High density card edge connection system with outrigger and sequentially connected contacts
US5545051A (en) 1995-06-28 1996-08-13 The Whitaker Corporation Board to board matable assembly
US5646447A (en) 1996-06-03 1997-07-08 Pcd Inc. Top loading cam activated test socket for ball grid arrays
US5850691A (en) 1995-07-20 1998-12-22 Dell Usa, L. P. Method for securing an electronic component to a pin grid array socket
US5766023A (en) 1995-08-04 1998-06-16 Framatome Connectors Usa Inc. Electrical connector with high speed and high density contact strip
US5535513A (en) * 1995-08-25 1996-07-16 The Whitaker Corporation Method for making surface mountable connectors
US5692310A (en) 1995-09-26 1997-12-02 Wolff; Denny Attachment for a power saw to make plumb cuts
US5691041A (en) 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer
US5742481A (en) 1995-10-04 1998-04-21 Advanced Interconnections Corporation Removable terminal support member for integrated circuit socket/adapter assemblies
CA2234698C (en) 1995-10-11 2003-01-07 Heidelberger Bauchemie Gmbh Process for foaming acyloxysilane-containing silicone materials
US5702255A (en) 1995-11-03 1997-12-30 Advanced Interconnections Corporation Ball grid array socket assembly
US5875546A (en) 1995-11-03 1999-03-02 North American Specialties Corporation Method of forming solder-holding clips for applying solder to connectors
US5716222A (en) * 1995-11-03 1998-02-10 Advanced Interconnections Corporation Ball grid array including modified hard ball contacts and apparatus for attaching hard ball contacts to a ball grid array
US5746608A (en) * 1995-11-30 1998-05-05 Taylor; Attalee S. Surface mount socket for an electronic package, and contact for use therewith
US5692920A (en) 1995-12-14 1997-12-02 Molex Incorporated Zero insertion force electrical connector and terminal
US5647756A (en) 1995-12-19 1997-07-15 Minnesota Mining And Manufacturing Integrated circuit test socket having toggle clamp lid
US5796589A (en) * 1995-12-20 1998-08-18 Intel Corporation Ball grid array integrated circuit package that has vias located within the solder pads of a package
JP3653131B2 (ja) * 1995-12-28 2005-05-25 日本発条株式会社 導電性接触子
US5833498A (en) * 1995-12-28 1998-11-10 Berg Technology, Inc. Electrical connector having improved retention feature and receptacle for use therein
GB2309827B (en) 1996-01-30 1998-04-22 Samsung Electronics Co Ltd Surface complemental heat dissipation device
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US5643009A (en) 1996-02-26 1997-07-01 The Whitaker Corporation Electrical connector having a pivot lock
US5718607A (en) 1996-03-01 1998-02-17 Molex Incorporated System for terminating the shield of a high speed cable
US5730630A (en) 1996-03-12 1998-03-24 Teradyne, Inc. Apparatus for mounting connector to circuit board
US5730606A (en) 1996-04-02 1998-03-24 Aries Electronics, Inc. Universal production ball grid array socket
US5761048A (en) 1996-04-16 1998-06-02 Lsi Logic Corp. Conductive polymer ball attachment for grid array semiconductor packages
US6007348A (en) 1996-05-07 1999-12-28 Advanced Intercommunications Corporation Solder ball terminal
WO1997045896A1 (en) * 1996-05-30 1997-12-04 The Whitaker Corporation Surface mountable electrical connector
KR100186329B1 (ko) 1996-06-14 1999-03-20 문정환 고체 촬상 소자용 반도체 패키지
US5828031A (en) 1996-06-27 1998-10-27 International Business Machines Corporation Head transducer to suspension lead termination by solder ball place/reflow
US6024584A (en) * 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
US6093035A (en) * 1996-06-28 2000-07-25 Berg Technology, Inc. Contact for use in an electrical connector
US6016254A (en) * 1996-07-15 2000-01-18 Pfaff; Wayne K. Mounting apparatus for grid array packages
US5904581A (en) 1996-07-17 1999-05-18 Minnesota Mining And Manufacturing Company Electrical interconnection system and device
US5706176A (en) * 1996-07-22 1998-01-06 Xerox Corporation Butted chip array with beveled chips
US5735697A (en) 1996-09-27 1998-04-07 Itt Corporation Surface mount connector
TW406454B (en) * 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US6042389A (en) * 1996-10-10 2000-03-28 Berg Technology, Inc. Low profile connector
US6139336A (en) 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
US5891994A (en) * 1997-07-11 1999-04-06 Thymon L.L.C. Methods and compositions for impairing multiplication of HIV-1
US5877554A (en) 1997-11-03 1999-03-02 Advanced Interconnections Corp. Converter socket terminal
US6079891A (en) * 1997-11-04 2000-06-27 Axiohm Printer device for printing a strip medium
US6116921A (en) * 1998-02-16 2000-09-12 The Whitaker Corporation Electrical connector having recessed solderball foot
US5917703A (en) 1998-04-17 1999-06-29 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
US6020635A (en) * 1998-07-07 2000-02-01 Advanced Interconnections Corporation Converter socket terminal
US6206735B1 (en) 1998-08-28 2001-03-27 Teka Interconnection Systems, Inc. Press fit print circuit board connector
US5980322A (en) 1998-09-01 1999-11-09 3Com Corporation Electrical connector having a fusible link for use between media connectors and computer communications cards
TW392975U (en) 1998-09-29 2000-06-01 Hon Hai Prec Ind Co Ltd Electrical connector
US6021045A (en) * 1998-10-26 2000-02-01 Chip Coolers, Inc. Heat sink assembly with threaded collar and multiple pressure capability
US6394819B1 (en) * 1998-10-29 2002-05-28 The Whitaker Corporation Dielectric member for absorbing thermal expansion and contraction at electrical interfaces
TW388572U (en) * 1998-12-22 2000-04-21 Hon Hai Prec Ind Co Ltd Electrical connector
TW421335U (en) 1998-12-24 2001-02-01 Hon Hai Prec Ind Co Ltd Receptacle connector
US6155845A (en) * 1998-12-28 2000-12-05 Hon Hai Precision Ind. Co., Ltd. Electrical contact for ball grid array socket
CN2381069Y (zh) * 1999-07-16 2000-05-31 深圳市华为技术有限公司 具有信号指示的光接口板
US6217348B1 (en) * 1999-08-09 2001-04-17 Hon Hai Precision Ind. Co., Ltd. Electrical connector
US6329631B1 (en) 1999-09-07 2001-12-11 Ray Yueh Solder strip exclusively for semiconductor packaging
US6352437B1 (en) * 1999-10-20 2002-03-05 John O. Tate Solder ball terminal
US6213787B1 (en) 1999-12-16 2001-04-10 Advanced Interconnections Corporation Socket/adapter system
US6545890B2 (en) 1999-12-20 2003-04-08 Synqor, Inc. Flanged terminal pins for dc/dc converters
US6256202B1 (en) 2000-02-18 2001-07-03 Advanced Interconnections Corporation Integrated circuit intercoupling component with heat sink
WO2002004999A2 (en) * 2000-07-10 2002-01-17 Massachusetts Institute Of Technology Graded index waveguide
US6257899B1 (en) * 2000-07-26 2001-07-10 Hon Hai Precision Ind. Co., Ltd. Soft internal touch contact for IC socket
US20020061687A1 (en) 2000-11-21 2002-05-23 Teka Interconnections Systems, Inc. Solder bearing grid array
JP2002171086A (ja) 2000-11-29 2002-06-14 Pioneer Electronic Corp 部 品
US6641410B2 (en) 2001-06-07 2003-11-04 Teradyne, Inc. Electrical solder ball contact
US6702594B2 (en) * 2001-12-14 2004-03-09 Hon Hai Precision Ind. Co., Ltd. Electrical contact for retaining solder preform
TW519310U (en) * 2001-12-18 2003-01-21 Via Tech Inc Electric connection apparatus
TW595811U (en) * 2002-05-17 2004-06-21 Hon Hai Prec Ind Co Ltd Electrical connector
US6743049B2 (en) 2002-06-24 2004-06-01 Advanced Interconnections Corporation High speed, high density interconnection device
US6623284B1 (en) 2003-01-07 2003-09-23 Hon Hai Precision Ind. Co., Ltd. Electrical connector
JPWO2006064863A1 (ja) * 2004-12-17 2008-06-12 イビデン株式会社 プリント配線板

Also Published As

Publication number Publication date
DE69736720T2 (de) 2007-09-13
US6325644B1 (en) 2001-12-04
US7186123B2 (en) 2007-03-06
PL192236B1 (pl) 2006-09-29
JP3413080B2 (ja) 2003-06-03
US8167630B2 (en) 2012-05-01
EP0836243A3 (en) 1999-05-06
US20110076897A1 (en) 2011-03-31
CN1179636A (zh) 1998-04-22
DE69736721T2 (de) 2007-09-13
HUP9904238A3 (en) 2003-05-28
KR100450547B1 (ko) 2004-10-01
US7476110B2 (en) 2009-01-13
US20080032524A1 (en) 2008-02-07
CN1200483C (zh) 2005-05-04
DE69736721D1 (de) 2006-11-02
CN1655405B (zh) 2012-07-11
DE69737252D1 (de) 2007-03-08
US20050079763A1 (en) 2005-04-14
CN1510788A (zh) 2004-07-07
ATE340422T1 (de) 2006-10-15
AU730360B2 (en) 2001-03-08
WO1998015989A1 (en) 1998-04-16
CA2267293C (en) 2002-12-17
DE69736722T2 (de) 2007-09-13
DE69736682T2 (de) 2007-09-13
AU4815697A (en) 1998-05-05
US20060068635A1 (en) 2006-03-30
HUP9904238A2 (hu) 2000-03-28
DE69736682D1 (de) 2006-10-26
ATE340424T1 (de) 2006-10-15
DE69737252T2 (de) 2007-08-30
BR9712296B1 (pt) 2013-04-02
DE29724822U1 (de) 2004-05-27
EP0836243A2 (en) 1998-04-15
CN1655405A (zh) 2005-08-17
US7168964B2 (en) 2007-01-30
EP0836243B1 (en) 2007-01-17
ATE340423T1 (de) 2006-10-15
US7802999B2 (en) 2010-09-28
BR9712296A (pt) 2000-01-25
CZ298529B6 (cs) 2007-10-24
WO1998015991A1 (en) 1998-04-16
CZ122299A3 (cs) 2000-01-12
DE69736720D1 (de) 2006-11-02
US20090191731A1 (en) 2009-07-30
DE69736722D1 (de) 2006-11-02
CN1510788B (zh) 2011-12-07
RU2208279C2 (ru) 2003-07-10
SG71046A1 (en) 2000-03-21
JPH10162909A (ja) 1998-06-19
ATE339785T1 (de) 2006-10-15
AU5145498A (en) 1998-05-05
PL192431B1 (pl) 2006-10-31
PL332869A1 (en) 1999-10-25
CA2267293A1 (en) 1998-04-16
ATE352112T1 (de) 2007-02-15
HU229923B1 (en) 2015-01-28

Similar Documents

Publication Publication Date Title
TW406454B (en) High density connector and method of manufacture
US6079991A (en) Method for placing contact on electrical connector
US6093035A (en) Contact for use in an electrical connector
WO1998015991A9 (en) High density connector and method of manufacture
KR100517098B1 (ko) 볼 형태의 접점면을 구비한 고밀도 커넥터
JP2002151224A (ja) 高密度コネクタ
EP1311029B1 (en) High density connector and method of manufacture
CA2497606C (en) High density connector and method of manufacture
CA2455080C (en) High density connector and method of manufacture
CA2404792C (en) High density connector and method of manufacture
MXPA99003323A (en) High density connector and method of manufacture

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MK4A Expiration of patent term of an invention patent