CN107437673B - 电连接器 - Google Patents
电连接器 Download PDFInfo
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- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/658—High frequency shielding arrangements, e.g. against EMI [Electro-Magnetic Interference] or EMP [Electro-Magnetic Pulse]
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Abstract
本发明公开了一种电连接器,包括:一本体,其设有多个接地收容孔和多个信号收容孔上下贯穿本体,且接地收容孔和信号收容孔的内侧面具有导电性;一绝缘件,与本体分开成型,绝缘件仅对应信号收容孔设有多个凸部收容于信号收容孔;多个信号端子,分别设有至少一定位部对应定位于凸部,使得信号端子与信号收容孔不接触;多个接地端子,其与信号端子的结构相同,且分别对应收容于接地收容孔,接地收容孔的内侧面具有一接触区接触接地端子的定位部,且接触区的高度介于凸部的最高点和最低点之间。不仅降低了接地端子和信号端子的加工难度和组装难度,并且保证了电连接器的屏蔽效果,增强了信号传输时的抗干扰能力。
Description
技术领域
本发明涉及一种电连接器,尤其是指一种电性连接芯片模块至电路板的电连接器。
背景技术
专利号为CN201020663926.6的中国专利揭示了一种电连接器,包括一绝缘本体、多个信号端子、一接地件以及多个屏蔽件,所述绝缘本体上设有多个收容管,每一所述信号端子分别对应收容于一所述收容管内,多个所述屏蔽件层层堆叠组装至所述绝缘本体内,每一个所述屏蔽件上开设有多个屏蔽孔,每一所述屏蔽孔对应围设于一所述收容管外围,所述接地件所在的所述收容管上设有一缺槽,所述接地件具有一延伸部伸出所述缺槽,使得延伸部的板缘与所述屏蔽件的板缘电性导接,便可实现对相邻所述二信号端子之间的屏蔽效果,可防止信号传输时发生干扰。
然而,为了避免所述信号端子抵接所述屏蔽件而短路,所述信号端子不设有与所述屏蔽件相抵接的所述延伸部,使得所述信号端子与接地件的结构不同,在实际生产中,增加了所述信号端子与接地件的加工难度,并且,组装时,操作者容易将信号端子错误地组装于接地件所在的收容管中,使得未与所述屏蔽件相抵接,影响了所述电连接器的屏蔽效果,减弱了信号传输时的抗干扰能力。
因此,有必要设计一种新的电连接器,以克服上述问题。
发明内容
本发明的创作目的在于提供一种抗信号干扰能力良好的电连接器。
为了达到上述目的,本发明采用如下技术方案:
一种电连接器,其特征在于,包括:一本体,其设有多个接地收容孔和多个信号收容孔上下贯穿所述本体,且所述接地收容孔和所述信号收容孔的内侧面具有导电性;一绝缘件,与所述本体分开成型,所述绝缘件仅对应多个所述信号收容孔设有多个凸部,所述凸部收容于所述信号收容孔;多个信号端子,对应收容于多个所述信号收容孔,每一所述信号端子具有一平板部及自所述平板部向上弯折延伸形成一弹性臂,所述平板部设有至少一定位部对应定位于所述凸部,使得所述信号端子与所述信号收容孔不接触,所述弹性臂用于接触一芯片模块,所述弹性臂与所述平板部的弯折处位于所述凸部的上方且位于所述信号收容孔内;多个接地端子,其与所述信号端子的结构相同,且对应收容于所述接地收容孔,所述接地收容孔的内侧面具有一接触区接触所述接地端子的所述定位部,且所述接触区的高度介于所述凸部的最高点和最低点之间。
进一步,所述绝缘件对应所述接地端子设有多个开孔,所述本体对应所述开孔设有凸块收容于所述开孔,且所述接地端子穿过所述凸块。
进一步,所述本体具有相对设置的一上表面和一下表面,所述接地收容孔和所述信号收容孔贯穿所述上表面和所述下表面,所述接地收容孔和所述信号收容孔的内侧面相对于所述上表面和所述下表面倾斜,且所述凸部的侧面相对于所述上表面和所述下表面倾斜。
进一步,每一所述信号端子具有一通孔收容于所述凸部且向上超出所述凸部,自所述通孔撕裂形成所述定位部与所述凸部配合定位,所述通孔的长度大于所述定位部的长度。
进一步,所述弹性臂具有自所述平板部向上朝远离所述平板部所在竖直平面的方向弯折延伸形成的一第一臂,及自第一臂返向弯折延伸越过所述平板部所在竖直平面的一第二臂,所述第二臂用于向上抵接所述芯片模块,所述第一臂一侧凸设有一连料部,用于连接一料带,所述连料部平行于所述平板部。
进一步,所述弹性臂具有自所述平板部向上朝远离所述平板部所在竖直平面的方向弯折延伸形成的一第一臂,及自第一臂返向弯折延伸越过所述平板部所在竖直平面的一第二臂,所述第二臂用于向上抵接所述芯片模块,所述信号收容孔具有一挡止面位于所述凸部上方,以在上下方向上挡止所述凸部,且所述第一臂和所述挡止面位于所述平板部的相对两侧。
一种电连接器,其特征在于,包括:一本体,其设有多个接地收容孔和多个信号收容孔上下贯穿所述本体,且所述接地收容孔和所述信号收容孔的内侧面具有导电性,所述本体具有相对设置的一上表面和一下表面,所述接地收容孔和所述信号收容孔贯穿所述上表面和所述下表面,所述接地收容孔和所述信号收容孔的内侧面相对于所述上表面和所述下表面倾斜;一绝缘件,与所述本体分开成型,所述绝缘件仅对应多个所述信号收容孔设有多个凸部,所述凸部收容于所述信号收容孔,且所述凸部的侧面相对于所述上表面和所述下表面倾斜;多个信号端子,对应收容于多个所述信号收容孔,每一所述信号端子设有至少一定位部对应定位于所述凸部,使得所述信号端子与所述信号收容孔不接触,每一所述信号端子还具有一通孔收容于所述凸部且向上超出所述凸部,自所述通孔撕裂形成所述定位部与所述凸部配合定位,所述通孔的长度大于所述定位部的长度;多个接地端子,其与所述信号端子的结构相同,且对应收容于所述接地收容孔,所述接地收容孔的内侧面具有一接触区接触所述接地端子的所述定位部,且所述接触区的高度介于所述凸部的最高点和最低点之间。
与现有技术相比,本发明电连接器具有以下有益效果:
由于所述绝缘件仅对应所述信号收容孔设有多个凸部收容于所述信号收容孔,所述信号端子对应定位于所述凸部,从而所述凸部可以防止所述信号端子与所述信号收容孔的内侧面接触,防止所述信号端子短路;同时,由于所述绝缘件未设凸部收容于所述接地收容孔,从而可以让所述接地端子接触所述接地收容孔的内侧面,以实现接地,保证了所述电连接器的屏蔽效果,进而可以使得所述接地端子和信号端子的结构相同,降低了所述接地端子和信号端子的加工难度;且操作者不再需要区分所述接地端子和信号端子的位置,降低了所述接地端子和信号端子的组装难度,防止因为所述信号端子错误组装于所述接地端子的位置,而导致所述接地端子未接触所述接地收容孔的内侧面,保证了所述电连接器的屏蔽效果,增强了信号传输时的抗干扰能力。
【附图说明】
图1为本发明第一实施例的电连接器的立体分解图;
图2为图1中绝缘件安装在本体的下方后的立体图;
图3为图2中支撑盖安装在本体的上方后的立体图;
图4为图3中沿A-A方向且在芯片模块下压前的剖视图;
图5为图4中沿B-B方向的剖视图;
图6为图4中a部分的放大图;
图7为图4中芯片模块下压后的示意图;
图8为本发明第二实施例的电连接器的立体组合图;
图9为图8的正视图;
图10为本发明第三实施例的电连接器的立体分解图;
图11为图10中绝缘件安装在本体的上方后的立体图;
图12为图11的正视图。
具体实施方式的附图标号说明:
【具体实施方式】
为便于更好的理解本发明的目的、结构、特征以及功效等,现结合附图和具体实施方式对本发明作进一步说明。
如图1至图7为本发明第一实施例的电连接器100,用以电性连接一芯片模块5至一电路板6,其包括:一绝缘件2;位于所述绝缘件2上的一本体1;穿过所述本体1和所述绝缘件2的多个结构相同的信号端子3B和接地端子3A,信号端子3B用于接触芯片模块5的信号垫片,接地端子3A用于接触芯片模块5的接地垫片。
如图1和图2所示,所述本体1具有相对设置的一上表面11和一下表面12,多个接地收容孔13A和信号收容孔13B贯穿所述上表面11和所述下表面12,所述接地收容孔13A和所述信号收容孔13B的内侧面具有导电性,是由于本实施例中,所述本体1的原材料是塑胶材料和金属粉末的混合物,当然,金属粉末也可以为其它导电材料,或者原材料也可以是全部为金属材料,使得所述本体1整体具有导电性(在其它实施例中,所述本体1也可以先由塑胶材料制成,然后在所述接地收容孔13A和所述信号收容孔13B的内侧面镀上金属层,使得所述接地收容孔13A和所述信号收容孔13B的内侧面具有导电性)。所述接地收容孔13A和所述信号收容孔13B的结构不同,所述本体1对应所述接地收容孔13A自所述下表面12向下凸伸形成多个凸块14,所述接地端子3A穿过所述凸块14。所述信号收容孔13B具有一挡止面15。
如图1、图2和图4所示,所述绝缘件2与所述本体1分开成型。所述绝缘件2具有一主体21位于所述下表面12的下方,所述主体21对应多个所述凸块14设有多个开孔23收容所述凸块14,增强了所述绝缘件2与所述本体1之间的定位效果,且所述主体21的底面与所述凸块14的底面平齐,即所述绝缘件2的底面与所述本体1的底面平齐,从而降低了所述电连接器100的高度。所述绝缘件2仅对应所述信号收容孔13B设有多个凸部22收容于所述信号收容孔13B,即所述绝缘件2对应所述接地收容孔13A未设凸部22收容于所述接地收容孔13A。所述凸部22自所述主体21向上延伸形成,且所述凸部22位于所述挡止面15的下方,使所述挡止面15挡止所述凸部22向上移动(在其它实施例中,所述绝缘件2也可以设于所述本体1的上方,此时,所述挡止面15位于所述凸部22的下方,以挡止所述凸部22向下移动)。
如图2和图4所示,每一所述信号端子3B具有一平板部31收容于且定位于所述凸部22,自所述平板部31向上弯折延伸形成一弹性臂32,用于接触所述芯片模块5,所述弹性臂32与所述平板部31的弯折处位于所述凸部22上方,减小了所述凸部22的宽度。自所述平板部31竖直向下延伸形成一焊接部33超出所述下表面12,通过所述焊接部33插入一焊料7而焊接于所述电路板6,所述焊接部33的宽度小于所述平板部31的宽度。
所述弹性臂32具有自所述平板部31向上朝远离所述平板部31所在竖直平面的方向弯折延伸形成的一第一臂321,及自第一臂321返向弯折延伸越过所述平板部31所在竖直平面的一第二臂322,所述第二臂322用于向上抵接所述芯片模块5,所述第一臂321和所述挡止面15位于所述平板部31的相对两侧,降低了所述信号收容孔13B的占用空间。所述第一臂321一侧凸设有一连料部3211,用于连接一料带,所述连料部3211平行于所述平板部31,由于所述第一臂321靠近所述本体1的上表面11,可降低所述连料部3211的高度,以增强所述连料部3211的强度,方便折断料带。
如图2、图5和图6所示,所述平板部31设有定位部定位于所述凸部22,在本实施例中,所述定位部包括第一定位部311和第二定位部312。其中,所述平板部31的板缘凸设有多个所述第一定位部311,自所述平板部31的板面撕裂形成所述第二定位部312,所述第一定位部311和第二定位部312与所述凸部22配合定位(在其它实施例中,也可以仅设有一个所述第一定位部311或者一个所述第二定位部312),使得所述凸部22既可以固定所述信号端子3B,同时所述凸部22又可以让所述信号端子3B与所述信号收容孔13B不接触。所述第二定位部312的下端与所述平板部31连接,且所述第二定位部312和所述第一臂321位于所述平板部31的相对两侧。
所述接地端子3A和所述信号端子3B的结构相同,此处不作重复描述。其中,所述接地端子3A的所述第一定位部311接触所述接地收容孔13A的内侧面,从而所述接地收容孔13A的内侧面形成一接触区,且所述接触区的高度介于所述凸部22的最高点和最低点之间。
如图3、图4和图7所示,本发明电连接器100还包括一支撑盖4设于所述本体1的上表面11,用以支撑所述芯片模块5,避免了所述芯片模块5下压的过程中,所述接地端子3A和信号端子3B被压伤。所述支撑盖4设有多个通槽41分别供所述接地端子3A和信号端子3B穿过,自所述支撑盖4底面向下凸伸多个支撑块42支撑于所述上表面11,使得所述支撑盖4底面与所述上表面11之间具有间隙,从而不仅为所述接地端子3A和信号端子3B提供了变形空间,而且使所述支撑盖4与所述本体1之间具有一较大的散热空间,能够迅速排散由所述芯片模块5工作所产生的大量热量,从而提高了所述芯片模块5运行的稳定性。
如图1、图2和图7所示,组装时,先将所述绝缘件2安装在所述本体1的下方,再将所述接地端子3A和信号端子3B分别对应装入所述接地收容孔13A和信号收容孔13B中,使得所述接地端子3A与接地收容孔13A接触,并且所述信号端子3B固定于所述凸块14,接着将支撑盖4安装在所述本体1的上方。然后,将电连接器100放置于所述电路板6上,利用所述焊料7将所述电连接器100焊接固定于所述电路板6上,再然后将所述芯片模块5安装在所述电连接器100的支撑盖4上,最后对所述芯片模块5施加向下的作用力,使得所述芯片模块5向下抵接所述接地端子3A和信号端子3B,由于所述支撑盖4支撑所述芯片模块5,可避免所述芯片模块5被压坏,及防止所述接地端子3A和信号端子3B受压时过度变形。
如图8至图9为本发明第二实施例的电连接器100,该实施例与上述第一实施例的区别主要在于:所述接地收容孔13A和所述信号收容孔13B的内侧面相对于所述上表面11和所述下表面12倾斜,且所述凸部22的侧面和顶面相对于所述上表面11和所述下表面12倾斜,在所述本体1的高度不变的情况下,增加了所述接地端子3A和信号端子3B的长度,增强了所述接地端子3A和信号端子3B的弹性。
每一所述信号端子3B具有一第一段31A定位于所述凸部22、自所述第一段31A向下延伸形成所述焊接部33、自所述第一段31A向上弯折延伸的一第二段31B、以及自所述第二段31B向上弯折延伸形成一接触部34用于连接所述芯片模块5。所述第一段31A和所述第二段31B大致呈平板状且宽度相同,所述第二段31B大致平行于所述第一段31A,简化了所述信号端子3B的结构,方便了所述信号端子3B的加工。
所述第一段31A具有一通孔313,自所述通孔313撕裂形成所述第二定位部312与所述凸部22配合定位,所述通孔313的长度L1大于所述第二定位部312的长度L2,且所述通孔313向上超出所述凸部22,增强了所述第一段31A的弹性。
所述接地端子3A和所述信号端子3B的结构相同,此处不再重复描述。
如图10至图12为本发明第三实施例的电连接器100,该实施例与上述第一实施例的区别主要在于:所述绝缘件2设于所述本体1的上方,所述电连接器100不设有所述支撑盖4,而是自所述主体21向上延伸形成多个支撑部24,用于支撑所述芯片模块5。
所述凸部22的底面低于所述下表面12,所述下表面12具有导电性,避免了所述信号端子3B由于接触所述下表面12而造成短路。且所述本体1具有自所述下表面12向下凸伸形成一框部16(具有导电性)用于收容所述焊接部33,所述焊接部33可通过所述焊料7与所述框部16接触而实现所述焊接部33与所述框部16电性连接,以增强所述电连接器100的屏蔽效果。
综上所述,本发明电连接器有下列有益效果:
(1)由于所述绝缘件2仅对应所述信号收容孔13B设有多个凸部22收容于所述信号收容孔13B,所述信号端子3B对应定位于所述凸部22,从而所述凸部22可以防止所述信号端子3B与所述信号收容孔13B的内侧面接触,防止所述信号端子3B短路;同时,由于所述绝缘件2未设凸部22收容于所述接地收容孔13A,从而可以让所述接地端子3A接触所述接地收容孔13A的内侧面,以实现接地,保证了所述电连接器100的屏蔽效果,进而可以使得所述接地端子3A和信号端子3B的结构相同,降低了所述接地端子3A和信号端子3B的加工难度;且操作者不再需要区分所述接地端子3A和信号端子3B的位置,降低了所述接地端子3A和信号端子3B的组装难度,防止因为所述信号端子3B错误组装于所述接地端子3A的位置,而导致所述接地端子3A未接触所述接地收容孔13A的内侧面,保证了所述电连接器100的屏蔽效果,增强了信号传输时的抗干扰能力。
(2)所述第一臂321和所述挡止面15位于所述平板部31的相对两侧,降低了所述信号收容孔13B的占用空间。
(3)所述第一臂321一侧凸设有一连料部3211,用于连接一料带,所述连料部3211平行于所述平板部31,由于所述第一臂321靠近所述本体1的上表面11,可降低所述连料部3211的高度,以增强所述连料部3211的强度,方便折断料带。
(4)所述本体1具有自所述下表面12向下凸伸形成一框部16(具有导电性)用于收容所述焊接部33,所述焊接部33可通过所述焊料7与所述框部16实现电性连接,以增强所述电连接器100的屏蔽效果。
以上详细说明仅为本发明之较佳实施例的说明,非因此局限本发明之专利范围,所以,凡运用本创作说明书及图示内容所为之等效技术变化,均包含于本创作之专利范围内。
Claims (7)
1.一种电连接器,其特征在于,包括:
一本体,其设有多个接地收容孔和多个信号收容孔上下贯穿所述本体,且所述接地收容孔和所述信号收容孔的内侧面具有导电性;
一绝缘件,与所述本体分开成型,所述绝缘件仅对应多个所述信号收容孔设有多个凸部,所述凸部收容于所述信号收容孔;
多个信号端子,对应收容于多个所述信号收容孔,每一所述信号端子具有一平板部及自所述平板部向上弯折延伸形成一弹性臂,所述平板部设有至少一定位部对应定位于所述凸部,使得所述信号端子与所述信号收容孔不接触,所述弹性臂用于接触一芯片模块,所述弹性臂与所述平板部的弯折处位于所述凸部的上方且位于所述信号收容孔内;
多个接地端子,其与所述信号端子的结构相同,且对应收容于多个所述接地收容孔,所述接地收容孔的内侧面具有一接触区接触所述接地端子的所述定位部,且所述接触区的高度介于所述凸部的最高点和最低点之间。
2.如权利要求1所述的电连接器,其特征在于:所述绝缘件对应所述接地端子设有多个开孔,所述本体对应所述开孔设有凸块收容于所述开孔,且所述接地端子穿过所述凸块。
3.如权利要求1所述的电连接器,其特征在于:所述本体具有相对设置的一上表面和一下表面,所述接地收容孔和所述信号收容孔贯穿所述上表面和所述下表面,所述接地收容孔和所述信号收容孔的内侧面相对于所述上表面和所述下表面倾斜,且所述凸部的侧面相对于所述上表面和所述下表面倾斜。
4.如权利要求3所述的电连接器,其特征在于:每一所述信号端子具有一通孔收容于所述凸部且向上超出所述凸部,自所述通孔撕裂形成所述定位部与所述凸部配合定位,所述通孔的长度大于所述定位部的长度。
5.如权利要求1所述的电连接器,其特征在于:所述弹性臂具有自所述平板部向上朝远离所述平板部所在竖直平面的方向弯折延伸形成的一第一臂,及自第一臂返向弯折延伸越过所述平板部所在竖直平面的一第二臂,所述第二臂用于向上抵接所述芯片模块,所述第一臂一侧凸设有一连料部,用于连接一料带,所述连料部平行于所述平板部。
6.如权利要求1所述的电连接器,其特征在于:所述弹性臂具有自所述平板部向上朝远离所述平板部所在竖直平面的方向弯折延伸形成的一第一臂,及自第一臂返向弯折延伸越过所述平板部所在竖直平面的一第二臂,所述第二臂用于向上抵接所述芯片模块,所述信号收容孔具有一挡止面位于所述凸部上方,以在上下方向上挡止所述凸部,且所述第一臂和所述挡止面位于所述平板部的相对两侧。
7.一种电连接器,其特征在于,包括:
一本体,其设有多个接地收容孔和多个信号收容孔上下贯穿所述本体,且所述接地收容孔和所述信号收容孔的内侧面具有导电性,所述本体具有相对设置的一上表面和一下表面,所述接地收容孔和所述信号收容孔贯穿所述上表面和所述下表面,所述接地收容孔和所述信号收容孔的内侧面相对于所述上表面和所述下表面倾斜;
一绝缘件,与所述本体分开成型,所述绝缘件仅对应多个所述信号收容孔设有多个凸部,所述凸部收容于所述信号收容孔,且所述凸部的侧面相对于所述上表面和所述下表面倾斜;
多个信号端子,对应收容于多个所述信号收容孔,每一所述信号端子设有至少一定位部对应定位于所述凸部,使得所述信号端子与所述信号收容孔不接触,每一所述信号端子还具有一通孔收容于所述凸部且向上超出所述凸部,自所述通孔撕裂形成所述定位部与所述凸部配合定位,所述通孔的长度大于所述定位部的长度;
多个接地端子,其与所述信号端子的结构相同,且对应收容于所述接地收容孔,所述接地收容孔的内侧面具有一接触区接触所述接地端子的所述定位部,且所述接触区的高度介于所述凸部的最高点和最低点之间。
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US20180375262A1 (en) | 2018-12-27 |
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