USD922329S1 - Press-fit pin case - Google Patents

Press-fit pin case Download PDF

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Publication number
USD922329S1
USD922329S1 US29/697,995 US201929697995F USD922329S US D922329 S1 USD922329 S1 US D922329S1 US 201929697995 F US201929697995 F US 201929697995F US D922329 S USD922329 S US D922329S
Authority
US
United States
Prior art keywords
press
fit pin
pin case
case
design
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
US29/697,995
Inventor
Jihwan Kim
Yushuang YAO
Bosung WON
Atapol Prajuckamol
Olaf Zschieschang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deutsche Bank AG New York Branch
Original Assignee
Semiconductor Components Industries LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Components Industries LLC filed Critical Semiconductor Components Industries LLC
Priority to US29/697,995 priority Critical patent/USD922329S1/en
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: ZSCHIESCHANG, OLAF, PRAJUCKAMOL, ATAPOL, YAO, YUSHUANG, KIM, JIHWAN, WON, BOSUNG
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Assigned to DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT reassignment DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT CORRECTIVE ASSIGNMENT TO CORRECT THE EXCLUSION OF FAIRCHILD SEMICONDUCTOR CORPORATION OF CONVEYING PARTY PREVIOUSLY RECORDED ON REEL 051145 FRAME 0062. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Assignors: FAIRCHILD SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Application granted granted Critical
Publication of USD922329S1 publication Critical patent/USD922329S1/en
Assigned to FAIRCHILD SEMICONDUCTOR CORPORATION, SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC reassignment FAIRCHILD SEMICONDUCTOR CORPORATION RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT REEL 051145, FRAME 0062 Assignors: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/502—Bases; Cases composed of different pieces
    • H01R13/504—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
    • H01R13/5045—Bases; Cases composed of different pieces different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together different pieces being assembled by press-fit
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
    • H01R13/621—Bolt, set screw or screw clamp
    • H01R13/6215—Bolt, set screw or screw clamp using one or more bolts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1401—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means
    • H05K7/1402—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards
    • H05K7/1404—Mounting supporting structure in casing or on frame or rack comprising clamping or extracting means for securing or extracting printed circuit boards by edge clamping, e.g. wedges

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

FIG. 1 is a top perspective view of a press-fit pin case showing our new design;
FIG. 2 is a top plan view of the press-fit pin case;
FIG. 3 is a bottom plan view of the press-fit pin case;
FIG. 4 is a first side elevation view of the press-fit pin case;
FIG. 5 is a second side elevation view of the press-fit pin case;
FIG. 6 is a first end elevation view of the press-fit pin case; and,
FIG. 7 is a second end elevation view of the press-fit pin case.
Any broken lines in the drawings are for purposes of depicting portions and form no part of the claimed design. All evenly spaced broken lines are directed to the environment. The dot-dash lines depict the bounds of the claimed design, and form no part of the claimed design. In addition, the unshaded surfaces that directly adjoin the claimed solid line edge form no part of the claimed design.

Claims (1)

    CLAIM
  1. What is claimed is an ornamental design for a press-fit pin case, as shown and described herein.
US29/697,995 2019-05-10 2019-07-12 Press-fit pin case Active USD922329S1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US29/697,995 USD922329S1 (en) 2019-05-10 2019-07-12 Press-fit pin case

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962846209P 2019-05-10 2019-05-10
US29/697,995 USD922329S1 (en) 2019-05-10 2019-07-12 Press-fit pin case
US16/510,385 US11081828B2 (en) 2019-05-10 2019-07-12 Power module housing

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US16/510,385 Continuation US11081828B2 (en) 2019-05-10 2019-07-12 Power module housing

Publications (1)

Publication Number Publication Date
USD922329S1 true USD922329S1 (en) 2021-06-15

Family

ID=73047338

Family Applications (2)

Application Number Title Priority Date Filing Date
US16/510,385 Active US11081828B2 (en) 2019-05-10 2019-07-12 Power module housing
US29/697,995 Active USD922329S1 (en) 2019-05-10 2019-07-12 Press-fit pin case

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US16/510,385 Active US11081828B2 (en) 2019-05-10 2019-07-12 Power module housing

Country Status (1)

Country Link
US (2) US11081828B2 (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4723919A (en) * 1986-07-11 1988-02-09 Gte Products Corporation Telephone interface connection device
US6024584A (en) * 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
US6093035A (en) * 1996-06-28 2000-07-25 Berg Technology, Inc. Contact for use in an electrical connector
US6325644B1 (en) * 1996-10-10 2001-12-04 Berg Technology, Inc. High density connector and method of manufacture
USD550628S1 (en) * 2006-04-26 2007-09-11 Tyco Electronics Corporation Electrical connector receptacle
US7950962B2 (en) * 2008-01-29 2011-05-31 Sumitomo Wiring Systems, Ltd. Connector with tapered ribs for improving resin flow
USD741813S1 (en) * 2014-07-25 2015-10-27 Ipex Technologies Inc. Electrical junction box lid
USD745852S1 (en) * 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
USD768086S1 (en) * 2015-06-11 2016-10-04 Ipex Technologies Inc. Hinged electrical junction box
USD770984S1 (en) * 2015-06-11 2016-11-08 Ipex Technologies Inc. Hinged electrical junction box
EP2940718B1 (en) 2014-04-30 2018-04-18 Vincotech GmbH Assembly for cooling a power module
WO2018159230A1 (en) * 2017-02-28 2018-09-07 パナソニックＩｐマネジメント株式会社 Method for manufacturing capacitor
US10396481B2 (en) * 2014-10-23 2019-08-27 Fci Usa Llc Mezzanine electrical connector
USD887366S1 (en) * 2017-07-20 2020-06-16 Appleton Grp Llc Power supply housing

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4723919A (en) * 1986-07-11 1988-02-09 Gte Products Corporation Telephone interface connection device
US6093035A (en) * 1996-06-28 2000-07-25 Berg Technology, Inc. Contact for use in an electrical connector
US6024584A (en) * 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
US6325644B1 (en) * 1996-10-10 2001-12-04 Berg Technology, Inc. High density connector and method of manufacture
USD550628S1 (en) * 2006-04-26 2007-09-11 Tyco Electronics Corporation Electrical connector receptacle
US7950962B2 (en) * 2008-01-29 2011-05-31 Sumitomo Wiring Systems, Ltd. Connector with tapered ribs for improving resin flow
USD745852S1 (en) * 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
EP2940718B1 (en) 2014-04-30 2018-04-18 Vincotech GmbH Assembly for cooling a power module
USD741813S1 (en) * 2014-07-25 2015-10-27 Ipex Technologies Inc. Electrical junction box lid
US10396481B2 (en) * 2014-10-23 2019-08-27 Fci Usa Llc Mezzanine electrical connector
USD770984S1 (en) * 2015-06-11 2016-11-08 Ipex Technologies Inc. Hinged electrical junction box
USD768086S1 (en) * 2015-06-11 2016-10-04 Ipex Technologies Inc. Hinged electrical junction box
WO2018159230A1 (en) * 2017-02-28 2018-09-07 パナソニックＩｐマネジメント株式会社 Method for manufacturing capacitor
USD887366S1 (en) * 2017-07-20 2020-06-16 Appleton Grp Llc Power supply housing

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Infineon. Link: https://www.infineon.com/dgdl/Infineon-AN2009-01_Mounting_Instructions_Easy_PressFIT-ApplicationNotes-v02_04-EN.pdf?fileId=db3a30431ed1d7b2011ef425e7c75c5c. Jun. 17, 2019. Assembly Instructions for the Easy-PressFIT Modules. (Year: 2019). *
Vincotech, "10-Ex12PMA0335C-L188A48x_FD," datasheet, rev. 2, May 11, 2018.
Vincotech, "Vincotech Adds flor E1/E2 Product Family," Aug. 2018 Product News, Oct. 21, 2018.

Also Published As

Publication number Publication date
US11081828B2 (en) 2021-08-03
US20200358221A1 (en) 2020-11-12

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