|
JP3249765B2
(ja)
*
|
1997-05-07 |
2002-01-21 |
東京エレクトロン株式会社 |
基板処理装置
|
|
TW277139B
(esLanguage)
*
|
1993-09-16 |
1996-06-01 |
Hitachi Seisakusyo Kk |
|
|
US6544379B2
(en)
|
1993-09-16 |
2003-04-08 |
Hitachi, Ltd. |
Method of holding substrate and substrate holding system
|
|
US5822171A
(en)
*
|
1994-02-22 |
1998-10-13 |
Applied Materials, Inc. |
Electrostatic chuck with improved erosion resistance
|
|
US6133557A
(en)
*
|
1995-01-31 |
2000-10-17 |
Kyocera Corporation |
Wafer holding member
|
|
US5679404A
(en)
*
|
1995-06-07 |
1997-10-21 |
Saint-Gobain/Norton Industrial Ceramics Corporation |
Method for depositing a substance with temperature control
|
|
US6902683B1
(en)
*
|
1996-03-01 |
2005-06-07 |
Hitachi, Ltd. |
Plasma processing apparatus and plasma processing method
|
|
JPH09256153A
(ja)
*
|
1996-03-15 |
1997-09-30 |
Anelva Corp |
基板処理装置
|
|
US5885353A
(en)
|
1996-06-21 |
1999-03-23 |
Micron Technology, Inc. |
Thermal conditioning apparatus
|
|
KR100238202B1
(ko)
*
|
1996-08-21 |
2000-01-15 |
윤종용 |
서셉터를 구비한 반도체소자 제조장치 및 서셉터 제조방법
|
|
US6258287B1
(en)
*
|
1996-08-28 |
2001-07-10 |
Georgia Tech Research Corporation |
Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment
|
|
JPH10240356A
(ja)
|
1997-02-21 |
1998-09-11 |
Anelva Corp |
基板処理装置の基板温度制御法と基板温度制御性判定法
|
|
US6053983A
(en)
*
|
1997-05-08 |
2000-04-25 |
Tokyo Electron, Ltd. |
Wafer for carrying semiconductor wafers and method detecting wafers on carrier
|
|
US5989349A
(en)
*
|
1997-06-24 |
1999-11-23 |
Applied Materials, Inc. |
Diagnostic pedestal assembly for a semiconductor wafer processing system
|
|
US6576064B2
(en)
*
|
1997-07-10 |
2003-06-10 |
Sandia Corporation |
Support apparatus for semiconductor wafer processing
|
|
TW524873B
(en)
|
1997-07-11 |
2003-03-21 |
Applied Materials Inc |
Improved substrate supporting apparatus and processing chamber
|
|
US6177023B1
(en)
|
1997-07-11 |
2001-01-23 |
Applied Komatsu Technology, Inc. |
Method and apparatus for electrostatically maintaining substrate flatness
|
|
WO1999048139A2
(en)
*
|
1998-03-18 |
1999-09-23 |
Applied Materials, Inc. |
Apparatus for reducing heat loss
|
|
US6464843B1
(en)
*
|
1998-03-31 |
2002-10-15 |
Lam Research Corporation |
Contamination controlling method and apparatus for a plasma processing chamber
|
|
US6368665B1
(en)
*
|
1998-04-29 |
2002-04-09 |
Microcoating Technologies, Inc. |
Apparatus and process for controlled atmosphere chemical vapor deposition
|
|
JP3333135B2
(ja)
*
|
1998-06-25 |
2002-10-07 |
東京エレクトロン株式会社 |
熱処理装置及び熱処理方法
|
|
JP2000021869A
(ja)
*
|
1998-06-30 |
2000-01-21 |
Tokyo Electron Ltd |
真空処理装置
|
|
JP2000021964A
(ja)
|
1998-07-06 |
2000-01-21 |
Ngk Insulators Ltd |
静電チャックのパーティクル発生低減方法および半導体製造装置
|
|
US6107206A
(en)
*
|
1998-09-14 |
2000-08-22 |
Taiwan Semiconductor Manufacturing Company |
Method for etching shallow trenches in a semiconductor body
|
|
TW432580B
(en)
*
|
1998-09-29 |
2001-05-01 |
Applied Materials Inc |
Piezoelectric method and apparatus for semiconductor wafer detection
|
|
DE19853092B4
(de)
*
|
1998-11-18 |
2004-10-21 |
Leica Microsystems Lithography Gmbh |
Übernahme- und Haltesystem für ein Substrat
|
|
US6238160B1
(en)
*
|
1998-12-02 |
2001-05-29 |
Taiwan Semiconductor Manufacturing Company, Ltd' |
Method for transporting and electrostatically chucking a semiconductor wafer or the like
|
|
KR100541398B1
(ko)
*
|
1998-12-29 |
2006-03-14 |
삼성전자주식회사 |
고밀도 플라즈마 화학 기상 증착 공정
|
|
JP3352418B2
(ja)
*
|
1999-01-28 |
2002-12-03 |
キヤノン株式会社 |
減圧処理方法及び減圧処理装置
|
|
JP2001209981A
(ja)
*
|
1999-02-09 |
2001-08-03 |
Ricoh Co Ltd |
光ディスク基板成膜装置、光ディスク基板成膜方法、基板ホルダーの製造方法、基板ホルダー、光ディスクおよび相変化記録型光ディスク
|
|
JP3846092B2
(ja)
*
|
1999-02-24 |
2006-11-15 |
松下電器産業株式会社 |
プラズマ処理装置および方法
|
|
US6635577B1
(en)
*
|
1999-03-30 |
2003-10-21 |
Applied Materials, Inc |
Method for reducing topography dependent charging effects in a plasma enhanced semiconductor wafer processing system
|
|
US6305677B1
(en)
|
1999-03-30 |
2001-10-23 |
Lam Research Corporation |
Perimeter wafer lifting
|
|
JP4236329B2
(ja)
*
|
1999-04-15 |
2009-03-11 |
日本碍子株式会社 |
プラズマ処理装置
|
|
US6490146B2
(en)
|
1999-05-07 |
2002-12-03 |
Applied Materials Inc. |
Electrostatic chuck bonded to base with a bond layer and method
|
|
US6310755B1
(en)
*
|
1999-05-07 |
2001-10-30 |
Applied Materials, Inc. |
Electrostatic chuck having gas cavity and method
|
|
US6462928B1
(en)
|
1999-05-07 |
2002-10-08 |
Applied Materials, Inc. |
Electrostatic chuck having improved electrical connector and method
|
|
US6464795B1
(en)
|
1999-05-21 |
2002-10-15 |
Applied Materials, Inc. |
Substrate support member for a processing chamber
|
|
US6524389B1
(en)
*
|
1999-05-24 |
2003-02-25 |
Tokyo Electron Limited |
Substrate processing apparatus
|
|
JP2001068538A
(ja)
*
|
1999-06-21 |
2001-03-16 |
Tokyo Electron Ltd |
電極構造、載置台構造、プラズマ処理装置及び処理装置
|
|
US6803546B1
(en)
|
1999-07-08 |
2004-10-12 |
Applied Materials, Inc. |
Thermally processing a substrate
|
|
US6673198B1
(en)
*
|
1999-12-22 |
2004-01-06 |
Lam Research Corporation |
Semiconductor processing equipment having improved process drift control
|
|
US6363882B1
(en)
*
|
1999-12-30 |
2002-04-02 |
Lam Research Corporation |
Lower electrode design for higher uniformity
|
|
US6461980B1
(en)
*
|
2000-01-28 |
2002-10-08 |
Applied Materials, Inc. |
Apparatus and process for controlling the temperature of a substrate in a plasma reactor chamber
|
|
JP3492325B2
(ja)
|
2000-03-06 |
2004-02-03 |
キヤノン株式会社 |
画像表示装置の製造方法
|
|
JP4334723B2
(ja)
*
|
2000-03-21 |
2009-09-30 |
新明和工業株式会社 |
イオンプレーティング成膜装置、及びイオンプレーティング成膜方法。
|
|
JP2001338878A
(ja)
*
|
2000-03-21 |
2001-12-07 |
Sharp Corp |
サセプタおよび表面処理方法
|
|
JP4592916B2
(ja)
*
|
2000-04-25 |
2010-12-08 |
東京エレクトロン株式会社 |
被処理体の載置装置
|
|
JP4697833B2
(ja)
*
|
2000-06-14 |
2011-06-08 |
キヤノンアネルバ株式会社 |
静電吸着機構及び表面処理装置
|
|
WO2002005323A2
(en)
*
|
2000-07-06 |
2002-01-17 |
Applied Materials, Inc. |
Thermally processing a substrate
|
|
JP3581303B2
(ja)
*
|
2000-07-31 |
2004-10-27 |
東京エレクトロン株式会社 |
判別方法及び処理装置
|
|
KR100385876B1
(ko)
*
|
2000-12-20 |
2003-06-02 |
한미반도체 주식회사 |
반도체 패키지장치 절단용 핸들러 시스템
|
|
US6709721B2
(en)
|
2001-03-28 |
2004-03-23 |
Applied Materials Inc. |
Purge heater design and process development for the improvement of low k film properties
|
|
JP4549022B2
(ja)
*
|
2001-04-30 |
2010-09-22 |
ラム リサーチ コーポレイション |
ワーク支持体の表面を横切る空間温度分布を制御する方法および装置
|
|
US20050211385A1
(en)
|
2001-04-30 |
2005-09-29 |
Lam Research Corporation, A Delaware Corporation |
Method and apparatus for controlling spatial temperature distribution
|
|
JP4707271B2
(ja)
*
|
2001-06-29 |
2011-06-22 |
三洋電機株式会社 |
エレクトロルミネッセンス素子の製造方法
|
|
TWI234417B
(en)
*
|
2001-07-10 |
2005-06-11 |
Tokyo Electron Ltd |
Plasma procesor and plasma processing method
|
|
DE10134513A1
(de)
*
|
2001-07-16 |
2003-01-30 |
Unaxis Balzers Ag |
Hebe-und Stützvorichtung
|
|
US6538872B1
(en)
|
2001-11-05 |
2003-03-25 |
Applied Materials, Inc. |
Electrostatic chuck having heater and method
|
|
JP3948325B2
(ja)
*
|
2002-04-02 |
2007-07-25 |
松下電器産業株式会社 |
フィルム基板処理方法
|
|
US20040253551A1
(en)
*
|
2003-03-06 |
2004-12-16 |
Tsuyoshi Shibata |
Baking apparatus, substrate heat treatment method and semiconductor device manufacturing method for using baking apparatus, pattern forming method and semiconductor device manufacturing method for using pattern forming method
|
|
CN100390955C
(zh)
*
|
2003-03-19 |
2008-05-28 |
东京毅力科创株式会社 |
使用静电卡盘的基板保持机构及其制造方法
|
|
US7993460B2
(en)
*
|
2003-06-30 |
2011-08-09 |
Lam Research Corporation |
Substrate support having dynamic temperature control
|
|
JP2005063991A
(ja)
*
|
2003-08-08 |
2005-03-10 |
Sumitomo Electric Ind Ltd |
半導体製造装置
|
|
JP4300216B2
(ja)
*
|
2003-09-25 |
2009-07-22 |
株式会社日立国際電気 |
基板処理装置、半導体デバイスの製造方法及び基板の移載方法
|
|
JP3981091B2
(ja)
*
|
2004-03-01 |
2007-09-26 |
株式会社東芝 |
成膜用リングおよび半導体装置の製造装置
|
|
US7697260B2
(en)
*
|
2004-03-31 |
2010-04-13 |
Applied Materials, Inc. |
Detachable electrostatic chuck
|
|
US7595972B2
(en)
*
|
2004-04-09 |
2009-09-29 |
Varian Semiconductor Equipment Associates, Inc. |
Clamp for use in processing semiconductor workpieces
|
|
KR20060037822A
(ko)
*
|
2004-10-28 |
2006-05-03 |
주식회사 하이닉스반도체 |
고밀도플라즈마 화학기상증착 장치 및 그를 이용한반도체소자의 제조 방법
|
|
US20060130764A1
(en)
*
|
2004-12-16 |
2006-06-22 |
Jusung Engineering Co., Ltd. |
Susceptor for apparatus fabricating thin film
|
|
DE202005003014U1
(de)
*
|
2005-02-24 |
2005-04-28 |
Dekema Dental-Keramiköfen GmbH |
Vorrichtung zur Herstellung von Muffeln für die Herstellung von Zahnersatzteilen
|
|
JP4336320B2
(ja)
|
2005-02-25 |
2009-09-30 |
キヤノンアネルバ株式会社 |
ウエハホルダ
|
|
US7789962B2
(en)
*
|
2005-03-31 |
2010-09-07 |
Tokyo Electron Limited |
Device and method for controlling temperature of a mounting table, a program therefor, and a processing apparatus including same
|
|
US8226769B2
(en)
*
|
2006-04-27 |
2012-07-24 |
Applied Materials, Inc. |
Substrate support with electrostatic chuck having dual temperature zones
|
|
JP2007324295A
(ja)
*
|
2006-05-31 |
2007-12-13 |
Dainippon Screen Mfg Co Ltd |
ウエハ薄化装置及びウエハ処理システム
|
|
US9275887B2
(en)
*
|
2006-07-20 |
2016-03-01 |
Applied Materials, Inc. |
Substrate processing with rapid temperature gradient control
|
|
US7560007B2
(en)
*
|
2006-09-11 |
2009-07-14 |
Lam Research Corporation |
In-situ wafer temperature measurement and control
|
|
US20080066683A1
(en)
*
|
2006-09-19 |
2008-03-20 |
General Electric Company |
Assembly with Enhanced Thermal Uniformity and Method For Making Thereof
|
|
US7589950B2
(en)
*
|
2006-10-13 |
2009-09-15 |
Applied Materials, Inc. |
Detachable electrostatic chuck having sealing assembly
|
|
US7972444B2
(en)
*
|
2007-11-07 |
2011-07-05 |
Mattson Technology, Inc. |
Workpiece support with fluid zones for temperature control
|
|
JP5222442B2
(ja)
*
|
2008-02-06 |
2013-06-26 |
東京エレクトロン株式会社 |
基板載置台、基板処理装置及び被処理基板の温度制御方法
|
|
KR101179065B1
(ko)
*
|
2008-03-24 |
2012-09-03 |
도쿄엘렉트론가부시키가이샤 |
샤워 플레이트와 이를 이용한 플라즈마 처리 장치
|
|
TWI425591B
(zh)
*
|
2008-04-02 |
2014-02-01 |
Ap Systems Inc |
基板組合裝置
|
|
JP5036614B2
(ja)
*
|
2008-04-08 |
2012-09-26 |
東京応化工業株式会社 |
基板用ステージ
|
|
US8293016B2
(en)
*
|
2008-10-07 |
2012-10-23 |
Applied Materials, Inc. |
Apparatus for efficient removal of halogen residues from etched substrates
|
|
US9186742B2
(en)
*
|
2009-01-30 |
2015-11-17 |
General Electric Company |
Microwave brazing process and assemblies and materials therefor
|
|
EP2539920A1
(en)
|
2010-02-24 |
2013-01-02 |
Veeco Instruments Inc. |
Processing methods and apparatus with temperature distribution control
|
|
US9096930B2
(en)
*
|
2010-03-29 |
2015-08-04 |
Stion Corporation |
Apparatus for manufacturing thin film photovoltaic devices
|
|
US20120083129A1
(en)
|
2010-10-05 |
2012-04-05 |
Skyworks Solutions, Inc. |
Apparatus and methods for focusing plasma
|
|
US9478428B2
(en)
|
2010-10-05 |
2016-10-25 |
Skyworks Solutions, Inc. |
Apparatus and methods for shielding a plasma etcher electrode
|
|
US9123762B2
(en)
|
2010-10-22 |
2015-09-01 |
Applied Materials, Inc. |
Substrate support with symmetrical feed structure
|
|
JP5787526B2
(ja)
*
|
2011-01-17 |
2015-09-30 |
イビデン株式会社 |
電子部品位置決め用治具
|
|
USD671901S1
(en)
*
|
2011-04-13 |
2012-12-04 |
Novellus Systems, Inc. |
Pedestal cover
|
|
DE112011105215B4
(de)
*
|
2011-05-06 |
2024-09-26 |
OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung |
Bauelementträgerverbund und Verfahren zur Herstellung einer Mehrzahl von Bauelementträgerbereichen
|
|
WO2014083965A1
(ja)
*
|
2012-11-27 |
2014-06-05 |
株式会社クリエイティブ テクノロジー |
静電チャック,ガラス基板処理方法及びそのガラス基板
|
|
CH707480B1
(de)
*
|
2013-01-21 |
2016-08-31 |
Besi Switzerland Ag |
Bondkopf mit einem heiz- und kühlbaren Saugorgan.
|
|
US9273413B2
(en)
|
2013-03-14 |
2016-03-01 |
Veeco Instruments Inc. |
Wafer carrier with temperature distribution control
|
|
JP6114708B2
(ja)
*
|
2013-05-27 |
2017-04-12 |
東京エレクトロン株式会社 |
基板脱離検出装置及び基板脱離検出方法、並びにこれらを用いた基板処理装置及び基板処理方法
|
|
CN103376176B
(zh)
*
|
2013-06-21 |
2015-10-28 |
清华大学 |
测量静电卡盘的静电力的装置
|
|
JP5987966B2
(ja)
*
|
2014-12-10 |
2016-09-07 |
Toto株式会社 |
静電チャックおよびウェーハ処理装置
|
|
US9929121B2
(en)
*
|
2015-08-31 |
2018-03-27 |
Kulicke And Soffa Industries, Inc. |
Bonding machines for bonding semiconductor elements, methods of operating bonding machines, and techniques for improving UPH on such bonding machines
|
|
KR101758347B1
(ko)
*
|
2016-08-01 |
2017-07-18 |
주식회사 엘케이엔지니어링 |
정전 척 및 리페어 방법
|
|
PT3422396T
(pt)
*
|
2017-06-28 |
2021-09-02 |
Meyer Burger Germany Gmbh |
Dispositivo para transporte de um substrato, equipamento de tratamento com uma placa receptora adaptada a um portador de substrato de um tal dispositivo, e procedimento para processamento de um substrato mediante utilização de um tal dispositivo para transporte de um substrato, bem como instalação de tratamento
|
|
KR20190114372A
(ko)
*
|
2018-03-30 |
2019-10-10 |
(주)포인트엔지니어링 |
마이크로 led 전사 시스템
|
|
TWI845682B
(zh)
|
2019-05-22 |
2024-06-21 |
荷蘭商Asm Ip私人控股有限公司 |
工件基座主體
|
|
CN112011778B
(zh)
*
|
2020-08-26 |
2022-08-16 |
北京北方华创微电子装备有限公司 |
一种半导体工艺设备中的卡盘组件及半导体工艺设备
|
|
US20250021022A1
(en)
*
|
2021-08-12 |
2025-01-16 |
Asml Netherlands B.V. |
Electrostatic holder, object table and lithographic apparatus
|
|
EP4134748A1
(en)
*
|
2021-08-12 |
2023-02-15 |
ASML Netherlands B.V. |
Electrostatic holder, object table and lithographic apparatus
|
|
KR102716919B1
(ko)
*
|
2022-06-24 |
2024-10-16 |
주식회사 아바코 |
기판지지장치
|
|
KR20240061128A
(ko)
|
2022-10-31 |
2024-05-08 |
삼성전자주식회사 |
기판 처리 장치
|
|
KR102514491B1
(ko)
*
|
2022-12-21 |
2023-03-27 |
주식회사 디스닉스 |
싱글타입 고온용 서셉터
|