TW200714686A - Curable composition and method for temporal fixation of structural member using the same - Google Patents

Curable composition and method for temporal fixation of structural member using the same

Info

Publication number
TW200714686A
TW200714686A TW095124376A TW95124376A TW200714686A TW 200714686 A TW200714686 A TW 200714686A TW 095124376 A TW095124376 A TW 095124376A TW 95124376 A TW95124376 A TW 95124376A TW 200714686 A TW200714686 A TW 200714686A
Authority
TW
Taiwan
Prior art keywords
structural member
curable composition
temporal fixation
same
meth
Prior art date
Application number
TW095124376A
Other languages
English (en)
Other versions
TWI383031B (zh
Inventor
Kazuhiro Oshima
Tomoyuki Kanai
Original Assignee
Denki Kagaku Kogyo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2005194752A external-priority patent/JP4916681B2/ja
Priority claimed from JP2005224101A external-priority patent/JP5164316B2/ja
Priority claimed from JP2005239987A external-priority patent/JP5002139B2/ja
Application filed by Denki Kagaku Kogyo Kk filed Critical Denki Kagaku Kogyo Kk
Publication of TW200714686A publication Critical patent/TW200714686A/zh
Application granted granted Critical
Publication of TWI383031B publication Critical patent/TWI383031B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/671—Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/14—Peroxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur, or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/14—Homopolymers or copolymers of esters of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/22—Mixtures comprising a continuous polymer matrix in which are dispersed crosslinked particles of another polymer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/10—Homopolymers or copolymers of methacrylic acid esters
    • C08L33/12—Homopolymers or copolymers of methyl methacrylate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
TW095124376A 2005-07-04 2006-07-04 Hardened composition and temporary component method using the component TWI383031B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005194752A JP4916681B2 (ja) 2005-07-04 2005-07-04 仮固定方法用光硬化性接着剤及びそれを用いる部材の仮固定方法
JP2005224101A JP5164316B2 (ja) 2005-08-02 2005-08-02 接着剤及びそれを用いる部材の仮固定方法
JP2005239987A JP5002139B2 (ja) 2005-08-22 2005-08-22 組成物及びそれを用いる部材の仮固定方法
JP2005278984 2005-09-27

Publications (2)

Publication Number Publication Date
TW200714686A true TW200714686A (en) 2007-04-16
TWI383031B TWI383031B (zh) 2013-01-21

Family

ID=37604481

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095124376A TWI383031B (zh) 2005-07-04 2006-07-04 Hardened composition and temporary component method using the component

Country Status (7)

Country Link
US (1) US8313604B2 (zh)
EP (2) EP2383303A1 (zh)
KR (1) KR100995257B1 (zh)
MY (1) MY154745A (zh)
SG (1) SG163531A1 (zh)
TW (1) TWI383031B (zh)
WO (1) WO2007004620A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI492979B (zh) * 2009-10-14 2015-07-21 Denki Kagaku Kogyo Kk Resin composition and adhesive
TWI588225B (zh) * 2012-09-28 2017-06-21 富士軟片股份有限公司 半導體裝置製造用暫時接著劑、以及使用其的接著性支持體及半導體裝置的製造方法

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JP4480641B2 (ja) * 2005-07-08 2010-06-16 電気化学工業株式会社 組成物及びそれを用いる部材の仮固定方法
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SG174041A1 (en) * 2006-08-10 2011-09-29 Denki Kagaku Kogyo Kk Adhesive composition and temporary fixing method of member using it
JP5085162B2 (ja) * 2007-03-07 2012-11-28 電気化学工業株式会社 樹脂組成物及びそれを用いる被加工部材の仮固定方法と表面保護方法
CN102105546B (zh) * 2008-07-22 2016-12-07 电化株式会社 构件的临时固定/剥离方法及适于其的临时固定用胶粘剂
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TW201504179A (zh) * 2013-05-30 2015-02-01 Denki Kagaku Kogyo Kk 硬質基板積層體及硬質基板積層體之製造方法
CN105555899B (zh) 2013-08-26 2019-07-16 国立研究开发法人科学技术振兴机构 一种粘合剂
KR101891729B1 (ko) * 2015-01-20 2018-08-24 주식회사 엘지화학 경화성 조성물
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KR102494902B1 (ko) * 2017-02-02 2023-02-01 쇼와덴코머티리얼즈가부시끼가이샤 전자 부품의 제조 방법, 가보호용 수지 조성물 및 가보호용 수지 필름
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TWI492979B (zh) * 2009-10-14 2015-07-21 Denki Kagaku Kogyo Kk Resin composition and adhesive
TWI588225B (zh) * 2012-09-28 2017-06-21 富士軟片股份有限公司 半導體裝置製造用暫時接著劑、以及使用其的接著性支持體及半導體裝置的製造方法

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EP1900761A4 (en) 2009-07-15
KR100995257B1 (ko) 2010-11-19
TWI383031B (zh) 2013-01-21
EP2383303A1 (en) 2011-11-02
WO2007004620A1 (ja) 2007-01-11
US20100012263A1 (en) 2010-01-21
EP1900761B1 (en) 2012-06-13
SG163531A1 (en) 2010-08-30
EP1900761A1 (en) 2008-03-19
US8313604B2 (en) 2012-11-20
KR20080031721A (ko) 2008-04-10
MY154745A (en) 2015-07-15

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