MY162000A - Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor - Google Patents
Method for provisional fixing/release of member and adhesive for provisional fixing suitable thereforInfo
- Publication number
- MY162000A MY162000A MYPI2011000279A MYPI2011000279A MY162000A MY 162000 A MY162000 A MY 162000A MY PI2011000279 A MYPI2011000279 A MY PI2011000279A MY PI2011000279 A MYPI2011000279 A MY PI2011000279A MY 162000 A MY162000 A MY 162000A
- Authority
- MY
- Malaysia
- Prior art keywords
- provisional
- fixing
- adhesive
- provisional fixing
- processed
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/67—Unsaturated compounds having active hydrogen
- C08G18/671—Unsaturated compounds having only one group containing active hydrogen
- C08G18/672—Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
- C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2475/00—Presence of polyurethane
Abstract
PROVIDED IS A METHOD FOR PROVISIONAL FIXING, WHICH ENSURES THAT AN EXCELLENT EFFECT CAN BE OBTAINED IN TERMS OF DIMENSIONAL ACCURACY OF A PROCESSED MEMBER.THE METHOD OF PROVISIONAL FIXING INCLUDES A COATING STEP OF COATING A PROVISIONAL-FIXING ADHESIVE ON A FIXING MEMBER, A MOUNTING STEP OF MOUNTING A MEMBER TO BE PROCESSED ON THE PROVISIONAL-FIXING ADHESIVE, AN IRRADIATION STEP OF IRRADIATING THE PROVISIONAL-FIXING ADHESIVE WITH AT LEAST EITHER ONE OF VISIBLE LIGHT AND ULTRAVIOLET LIGHT AFTER THE MOUNTING TO ENHANCE THE ADHESIVE FORCE OF THE PROVISIONAL-FIXING ADHESIVE, AND A PRESSURIZING STEP OF APPLYING A PRESSURE TO EITHER ONE OR BOTH OF THE FIXING MEMBER AND THE MEMBER TO BE PROCESSED, IN WHICH THE PRESSURIZING STEP AND THE IRRADIATION STEP ARE SIMULTANEOUSLY PERFORMED AT LEAST FOR A GIVEN TIME. THE PROVISIONAL-FIXING ADHESIVE IS A COMPOSITION CONTAINING A POLYFUNCTIONAL (METH)ACRYLATE (A), A MORIOFUNCTIONAL (METH)ACRYLATE (B) AND A PHOTOPOLYMERIZATION INITIATOR (C).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008188295 | 2008-07-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
MY162000A true MY162000A (en) | 2017-05-31 |
Family
ID=41570360
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2011000279A MY162000A (en) | 2008-07-22 | 2009-07-22 | Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5675355B2 (en) |
KR (1) | KR101660056B1 (en) |
CN (1) | CN102105546B (en) |
MY (1) | MY162000A (en) |
WO (1) | WO2010010900A1 (en) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5350055B2 (en) * | 2009-04-14 | 2013-11-27 | 電気化学工業株式会社 | (Meth) acrylic resin composition for adhesives |
JP5674332B2 (en) * | 2010-04-14 | 2015-02-25 | 電気化学工業株式会社 | Adhesive composition and method for temporarily fixing member using the same |
KR101696331B1 (en) * | 2010-11-19 | 2017-01-13 | 덴카 주식회사 | Method for processing light-transmitting rigid substrate laminate and method for manufacturing plate shaped product |
KR20130121870A (en) | 2010-11-30 | 2013-11-06 | 덴끼 가가꾸 고교 가부시키가이샤 | Method for processing light-transmissive hard substrate laminate, and process for manufacturing plate-like product employing the method |
US9358763B2 (en) | 2011-07-15 | 2016-06-07 | Denka Company Limited | Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus |
CN103648753B (en) * | 2011-07-15 | 2016-01-27 | 电化株式会社 | The manufacture method of light-transmissive hard substrate laminate and light transmission hard Base Plate Lamination Device |
JPWO2013084953A1 (en) * | 2011-12-05 | 2015-04-27 | 電気化学工業株式会社 | Method for manufacturing translucent hard substrate laminate |
WO2014142085A1 (en) * | 2013-03-11 | 2014-09-18 | リンテック株式会社 | Adhesive sheet, and production method for processed device-related members |
JP6895714B2 (en) * | 2016-03-30 | 2021-06-30 | デンカ株式会社 | Composition for thin substrates and temporary fixing method |
JP7028660B2 (en) * | 2018-01-30 | 2022-03-02 | 日東電工株式会社 | Adhesive sheet and its manufacturing method, as well as adhesive film |
KR102334412B1 (en) * | 2019-12-18 | 2021-12-03 | (주)이녹스첨단소재 | Adhesive composition and method of temporarily fixing member using the same |
KR102334413B1 (en) * | 2019-12-18 | 2021-12-03 | (주)이녹스첨단소재 | Adhesive composition and method of temporarily fixing member using the same |
KR102339285B1 (en) * | 2019-12-18 | 2021-12-15 | 삼성디스플레이 주식회사 | Adhesive composition and method of temporarily fixing member using the same |
CN117242146A (en) * | 2021-04-26 | 2023-12-15 | 电化株式会社 | Composition and method for producing the same |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05318593A (en) * | 1992-03-16 | 1993-12-03 | Toshiba Lighting & Technol Corp | Ultraviolet ray irradiation apparatus |
JPH06116534A (en) | 1992-10-05 | 1994-04-26 | Three Bond Co Ltd | Adhesive composition |
JPH0959571A (en) * | 1995-08-28 | 1997-03-04 | Toshiba Corp | Adhesive setting method of part and device therefor |
JPH10130309A (en) * | 1996-10-25 | 1998-05-19 | Toagosei Co Ltd | Photocurable composition for temporary fixation and production of article |
JPH1171553A (en) | 1997-08-28 | 1999-03-16 | Toagosei Co Ltd | Production of photocurable composition for temporary fixation and article |
JP4601757B2 (en) | 2000-02-17 | 2010-12-22 | 株式会社 アーデル | Adhesive composition for temporary fixing and method of using the same |
JP2003303510A (en) * | 2002-04-11 | 2003-10-24 | Toshiba Lighting & Technology Corp | Illumination device |
JP4326747B2 (en) | 2002-04-23 | 2009-09-09 | 株式会社 アーデル | Processing method using temporary fixing adhesive and peeling method of temporary fixing adhesive |
JP4593328B2 (en) * | 2005-03-18 | 2010-12-08 | 電気化学工業株式会社 | Temporary fixing adhesive composition and temporary fixing method |
SG163531A1 (en) * | 2005-07-04 | 2010-08-30 | Denki Kagaku Kogyo Kk | Curable composition and temporary fixation method of member using it |
JP4916681B2 (en) * | 2005-07-04 | 2012-04-18 | 電気化学工業株式会社 | Photocurable adhesive for temporary fixing method and temporary fixing method of member using the same |
JP5132045B2 (en) * | 2005-09-13 | 2013-01-30 | 電気化学工業株式会社 | Composition and method for temporarily fixing member using the same |
JP5408836B2 (en) * | 2005-09-27 | 2014-02-05 | 電気化学工業株式会社 | Composition and method for temporarily fixing and peeling member using the same |
JP2007169560A (en) * | 2005-12-26 | 2007-07-05 | Denki Kagaku Kogyo Kk | Composition and method for temporarily fixing member using the same |
JP5016224B2 (en) * | 2006-01-16 | 2012-09-05 | 電気化学工業株式会社 | Composition and method for temporarily fixing member using the same |
JP4932300B2 (en) * | 2006-03-28 | 2012-05-16 | 電気化学工業株式会社 | Temporary fixing composition and member temporary fixing method using the same |
CN101472962A (en) * | 2006-06-19 | 2009-07-01 | 电气化学工业株式会社 | Resin composition, and temporary fixation method and surface protection method for member to be processed each using the resin composition |
MY149144A (en) * | 2006-08-10 | 2013-07-15 | Denki Kagaku Kogyo Kk | Adhesive composition and temporary fixing method of member using it |
WO2008078469A1 (en) * | 2006-12-25 | 2008-07-03 | Denki Kagaku Kogyo Kabushiki Kaisha | Composition, and method for temporarily fixing member using the composition |
-
2009
- 2009-07-22 CN CN200980128706.3A patent/CN102105546B/en active Active
- 2009-07-22 KR KR1020117001555A patent/KR101660056B1/en active IP Right Grant
- 2009-07-22 MY MYPI2011000279A patent/MY162000A/en unknown
- 2009-07-22 JP JP2010521718A patent/JP5675355B2/en active Active
- 2009-07-22 WO PCT/JP2009/063119 patent/WO2010010900A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
KR20110031347A (en) | 2011-03-25 |
JP5675355B2 (en) | 2015-02-25 |
KR101660056B1 (en) | 2016-09-30 |
JPWO2010010900A1 (en) | 2012-01-05 |
WO2010010900A1 (en) | 2010-01-28 |
CN102105546A (en) | 2011-06-22 |
CN102105546B (en) | 2016-12-07 |
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