MY162000A - Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor - Google Patents

Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor

Info

Publication number
MY162000A
MY162000A MYPI2011000279A MYPI2011000279A MY162000A MY 162000 A MY162000 A MY 162000A MY PI2011000279 A MYPI2011000279 A MY PI2011000279A MY PI2011000279 A MYPI2011000279 A MY PI2011000279A MY 162000 A MY162000 A MY 162000A
Authority
MY
Malaysia
Prior art keywords
provisional
fixing
adhesive
provisional fixing
processed
Prior art date
Application number
MYPI2011000279A
Inventor
Hiroyuki Kurimura
Tomoyuki Kanai
Kazuhiro Oshima
Original Assignee
Denka Company Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Company Ltd filed Critical Denka Company Ltd
Publication of MY162000A publication Critical patent/MY162000A/en

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67Unsaturated compounds having active hydrogen
    • C08G18/671Unsaturated compounds having only one group containing active hydrogen
    • C08G18/672Esters of acrylic or alkyl acrylic acid having only one group containing active hydrogen
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D133/00Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
    • C09D133/04Homopolymers or copolymers of esters
    • C09D133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09D133/08Homopolymers or copolymers of acrylic acid esters
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • C09J175/14Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00Presence of (meth)acrylic polymer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00Presence of polyurethane

Abstract

PROVIDED IS A METHOD FOR PROVISIONAL FIXING, WHICH ENSURES THAT AN EXCELLENT EFFECT CAN BE OBTAINED IN TERMS OF DIMENSIONAL ACCURACY OF A PROCESSED MEMBER.THE METHOD OF PROVISIONAL FIXING INCLUDES A COATING STEP OF COATING A PROVISIONAL-FIXING ADHESIVE ON A FIXING MEMBER, A MOUNTING STEP OF MOUNTING A MEMBER TO BE PROCESSED ON THE PROVISIONAL-FIXING ADHESIVE, AN IRRADIATION STEP OF IRRADIATING THE PROVISIONAL-FIXING ADHESIVE WITH AT LEAST EITHER ONE OF VISIBLE LIGHT AND ULTRAVIOLET LIGHT AFTER THE MOUNTING TO ENHANCE THE ADHESIVE FORCE OF THE PROVISIONAL-FIXING ADHESIVE, AND A PRESSURIZING STEP OF APPLYING A PRESSURE TO EITHER ONE OR BOTH OF THE FIXING MEMBER AND THE MEMBER TO BE PROCESSED, IN WHICH THE PRESSURIZING STEP AND THE IRRADIATION STEP ARE SIMULTANEOUSLY PERFORMED AT LEAST FOR A GIVEN TIME. THE PROVISIONAL-FIXING ADHESIVE IS A COMPOSITION CONTAINING A POLYFUNCTIONAL (METH)ACRYLATE (A), A MORIOFUNCTIONAL (METH)ACRYLATE (B) AND A PHOTOPOLYMERIZATION INITIATOR (C).
MYPI2011000279A 2008-07-22 2009-07-22 Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor MY162000A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008188295 2008-07-22

Publications (1)

Publication Number Publication Date
MY162000A true MY162000A (en) 2017-05-31

Family

ID=41570360

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2011000279A MY162000A (en) 2008-07-22 2009-07-22 Method for provisional fixing/release of member and adhesive for provisional fixing suitable therefor

Country Status (5)

Country Link
JP (1) JP5675355B2 (en)
KR (1) KR101660056B1 (en)
CN (1) CN102105546B (en)
MY (1) MY162000A (en)
WO (1) WO2010010900A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5350055B2 (en) * 2009-04-14 2013-11-27 電気化学工業株式会社 (Meth) acrylic resin composition for adhesives
JP5674332B2 (en) * 2010-04-14 2015-02-25 電気化学工業株式会社 Adhesive composition and method for temporarily fixing member using the same
KR101696331B1 (en) * 2010-11-19 2017-01-13 덴카 주식회사 Method for processing light-transmitting rigid substrate laminate and method for manufacturing plate shaped product
KR20130121870A (en) 2010-11-30 2013-11-06 덴끼 가가꾸 고교 가부시키가이샤 Method for processing light-transmissive hard substrate laminate, and process for manufacturing plate-like product employing the method
US9358763B2 (en) 2011-07-15 2016-06-07 Denka Company Limited Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
CN103648753B (en) * 2011-07-15 2016-01-27 电化株式会社 The manufacture method of light-transmissive hard substrate laminate and light transmission hard Base Plate Lamination Device
JPWO2013084953A1 (en) * 2011-12-05 2015-04-27 電気化学工業株式会社 Method for manufacturing translucent hard substrate laminate
WO2014142085A1 (en) * 2013-03-11 2014-09-18 リンテック株式会社 Adhesive sheet, and production method for processed device-related members
JP6895714B2 (en) * 2016-03-30 2021-06-30 デンカ株式会社 Composition for thin substrates and temporary fixing method
JP7028660B2 (en) * 2018-01-30 2022-03-02 日東電工株式会社 Adhesive sheet and its manufacturing method, as well as adhesive film
KR102334412B1 (en) * 2019-12-18 2021-12-03 (주)이녹스첨단소재 Adhesive composition and method of temporarily fixing member using the same
KR102334413B1 (en) * 2019-12-18 2021-12-03 (주)이녹스첨단소재 Adhesive composition and method of temporarily fixing member using the same
KR102339285B1 (en) * 2019-12-18 2021-12-15 삼성디스플레이 주식회사 Adhesive composition and method of temporarily fixing member using the same
CN117242146A (en) * 2021-04-26 2023-12-15 电化株式会社 Composition and method for producing the same

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05318593A (en) * 1992-03-16 1993-12-03 Toshiba Lighting & Technol Corp Ultraviolet ray irradiation apparatus
JPH06116534A (en) 1992-10-05 1994-04-26 Three Bond Co Ltd Adhesive composition
JPH0959571A (en) * 1995-08-28 1997-03-04 Toshiba Corp Adhesive setting method of part and device therefor
JPH10130309A (en) * 1996-10-25 1998-05-19 Toagosei Co Ltd Photocurable composition for temporary fixation and production of article
JPH1171553A (en) 1997-08-28 1999-03-16 Toagosei Co Ltd Production of photocurable composition for temporary fixation and article
JP4601757B2 (en) 2000-02-17 2010-12-22 株式会社 アーデル Adhesive composition for temporary fixing and method of using the same
JP2003303510A (en) * 2002-04-11 2003-10-24 Toshiba Lighting & Technology Corp Illumination device
JP4326747B2 (en) 2002-04-23 2009-09-09 株式会社 アーデル Processing method using temporary fixing adhesive and peeling method of temporary fixing adhesive
JP4593328B2 (en) * 2005-03-18 2010-12-08 電気化学工業株式会社 Temporary fixing adhesive composition and temporary fixing method
SG163531A1 (en) * 2005-07-04 2010-08-30 Denki Kagaku Kogyo Kk Curable composition and temporary fixation method of member using it
JP4916681B2 (en) * 2005-07-04 2012-04-18 電気化学工業株式会社 Photocurable adhesive for temporary fixing method and temporary fixing method of member using the same
JP5132045B2 (en) * 2005-09-13 2013-01-30 電気化学工業株式会社 Composition and method for temporarily fixing member using the same
JP5408836B2 (en) * 2005-09-27 2014-02-05 電気化学工業株式会社 Composition and method for temporarily fixing and peeling member using the same
JP2007169560A (en) * 2005-12-26 2007-07-05 Denki Kagaku Kogyo Kk Composition and method for temporarily fixing member using the same
JP5016224B2 (en) * 2006-01-16 2012-09-05 電気化学工業株式会社 Composition and method for temporarily fixing member using the same
JP4932300B2 (en) * 2006-03-28 2012-05-16 電気化学工業株式会社 Temporary fixing composition and member temporary fixing method using the same
CN101472962A (en) * 2006-06-19 2009-07-01 电气化学工业株式会社 Resin composition, and temporary fixation method and surface protection method for member to be processed each using the resin composition
MY149144A (en) * 2006-08-10 2013-07-15 Denki Kagaku Kogyo Kk Adhesive composition and temporary fixing method of member using it
WO2008078469A1 (en) * 2006-12-25 2008-07-03 Denki Kagaku Kogyo Kabushiki Kaisha Composition, and method for temporarily fixing member using the composition

Also Published As

Publication number Publication date
KR20110031347A (en) 2011-03-25
JP5675355B2 (en) 2015-02-25
KR101660056B1 (en) 2016-09-30
JPWO2010010900A1 (en) 2012-01-05
WO2010010900A1 (en) 2010-01-28
CN102105546A (en) 2011-06-22
CN102105546B (en) 2016-12-07

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