TW200602645A - Method of manufacturing sheetlike probe and its application - Google Patents

Method of manufacturing sheetlike probe and its application

Info

Publication number
TW200602645A
TW200602645A TW094113273A TW94113273A TW200602645A TW 200602645 A TW200602645 A TW 200602645A TW 094113273 A TW094113273 A TW 094113273A TW 94113273 A TW94113273 A TW 94113273A TW 200602645 A TW200602645 A TW 200602645A
Authority
TW
Taiwan
Prior art keywords
sheetlike
probe
manufacturing
electrodes
circuit device
Prior art date
Application number
TW094113273A
Other languages
English (en)
Inventor
Katsumi Sato
Kazuo Inoue
Hitoshi Fujiyama
Mutsuhiko Yoshioka
Hisao Igarashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200602645A publication Critical patent/TW200602645A/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H29/00—Drive mechanisms for toys in general
    • A63H29/22—Electric drives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H30/00—Remote-control arrangements specially adapted for toys, e.g. for toy vehicles
    • A63H30/02—Electrical arrangements
    • A63H30/04—Electrical arrangements using wireless transmission
    • A—HUMAN NECESSITIES
    • A63—SPORTS; GAMES; AMUSEMENTS
    • A63H—TOYS, e.g. TOPS, DOLLS, HOOPS OR BUILDING BLOCKS
    • A63H31/00—Gearing for toys
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H48/00—Differential gearings
    • F16H48/06—Differential gearings with gears having orbital motion
    • F16H48/08—Differential gearings with gears having orbital motion comprising bevel gears
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
TW094113273A 2004-04-27 2005-04-26 Method of manufacturing sheetlike probe and its application TW200602645A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004132151 2004-04-27

Publications (1)

Publication Number Publication Date
TW200602645A true TW200602645A (en) 2006-01-16

Family

ID=35197107

Family Applications (5)

Application Number Title Priority Date Filing Date
TW094113273A TW200602645A (en) 2004-04-27 2005-04-26 Method of manufacturing sheetlike probe and its application
TW094113274A TW200604533A (en) 2004-04-27 2005-04-26 Sheetlike probe, its manufacturing method and its application
TW094113278A TW200538742A (en) 2004-04-27 2005-04-26 Sheet-like probe, method of producing the probe, and application of the probe
TW094113271A TW200540430A (en) 2004-04-27 2005-04-26 Sheet-like probe, method of producing the probe, and application of the probe
TW094113277A TW200602642A (en) 2004-04-27 2005-04-26 Sheet-like probe, method of producing the same, and application thereof

Family Applications After (4)

Application Number Title Priority Date Filing Date
TW094113274A TW200604533A (en) 2004-04-27 2005-04-26 Sheetlike probe, its manufacturing method and its application
TW094113278A TW200538742A (en) 2004-04-27 2005-04-26 Sheet-like probe, method of producing the probe, and application of the probe
TW094113271A TW200540430A (en) 2004-04-27 2005-04-26 Sheet-like probe, method of producing the probe, and application of the probe
TW094113277A TW200602642A (en) 2004-04-27 2005-04-26 Sheet-like probe, method of producing the same, and application thereof

Country Status (6)

Country Link
US (2) US7671609B2 (zh)
EP (2) EP1744167B1 (zh)
KR (3) KR20070010068A (zh)
CN (2) CN100451659C (zh)
TW (5) TW200602645A (zh)
WO (5) WO2005103732A1 (zh)

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JP4604893B2 (ja) * 2005-07-19 2011-01-05 住友電気工業株式会社 複合多孔質樹脂基材及びその製造方法
JPWO2007043350A1 (ja) * 2005-10-11 2009-04-16 Jsr株式会社 異方導電性コネクター装置および回路装置の検査装置
TWI403723B (zh) * 2005-12-21 2013-08-01 Jsr Corp Manufacturing method of foreign - shaped conductive connector
WO2008015967A1 (fr) * 2006-07-31 2008-02-07 Jsr Corporation Feuille composite conductrice, son procédé de fabrication et son application
KR100767447B1 (ko) * 2006-10-31 2007-10-17 주식회사 아이에스시테크놀러지 반도체 디바이스 운반체
KR100946144B1 (ko) * 2007-12-06 2010-03-10 삼성전기주식회사 세라믹 프로브 기판 제조 방법
CN101946404A (zh) * 2008-02-18 2011-01-12 精工电子有限公司 压电振动器的制造方法、压电振动器、振荡器、电子设备及电波钟
US8378705B2 (en) * 2008-02-29 2013-02-19 Nhk Spring Co., Ltd. Wiring substrate and probe card
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JP4487016B1 (ja) * 2009-09-10 2010-06-23 株式会社アドバンテスト 通電部材、接続部材、試験装置および接続部材を修繕する方法
US8193040B2 (en) * 2010-02-08 2012-06-05 Infineon Technologies Ag Manufacturing of a device including a semiconductor chip
WO2012095997A1 (ja) * 2011-01-16 2012-07-19 日本電子材料株式会社 プローブカード及びその製造方法
JP5859834B2 (ja) * 2011-12-06 2016-02-16 エルフィノート・テクノロジー株式会社 プローブカード用のバンプ付きメンブレンシート、プローブカード及びプローブカード用のバンプ付きメンブレンシートの製造方法
JP5847663B2 (ja) * 2012-08-01 2016-01-27 日本電子材料株式会社 プローブカード用ガイド板の製造方法
KR101359358B1 (ko) * 2012-12-28 2014-02-10 전자부품연구원 액상공정을 이용한 반도체 검사용 콘택트 핑거의 절연 코팅 방법
JP6341634B2 (ja) * 2013-05-28 2018-06-13 新光電気工業株式会社 プローブガイド板及びその製造方法、半導体検査装置
WO2015055899A1 (fr) * 2013-10-18 2015-04-23 Griset Support pour composants électroniques de puissance, module de puissance doté d'un tel support, et procédé de fabrication correspondant
JP6376761B2 (ja) * 2014-01-31 2018-08-22 日本航空電子工業株式会社 中継部材及び中継部材の製造方法
EP3103566B1 (en) 2014-02-04 2018-11-14 Senju Metal Industry Co., Ltd Ni ball, ni core ball, solder joint, solder paste, and solder foam
CN103951438A (zh) * 2014-04-14 2014-07-30 北京盈和工控技术有限公司 一种新型自动叠片机
WO2016044786A1 (en) * 2014-09-19 2016-03-24 Celadon Systems, Inc. Probe card with stress relieving feature
JP6626254B2 (ja) * 2015-02-03 2019-12-25 株式会社テセック 半導体デバイス測定方法
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KR101765079B1 (ko) * 2016-01-12 2017-08-04 서울대학교산학협력단 식물의 수액 흐름 측정용 마이크로 니들 프로브 및 이를 구비한 수액 흐름 측정 장치
JP2017216402A (ja) * 2016-06-01 2017-12-07 ソニー株式会社 金属フレーム、疑似ウエハ、半導体装置、電子機器、及び、半導体装置の製造方法
JP6951897B2 (ja) * 2016-10-06 2021-10-20 日東電工株式会社 異方導電性シート
US20180159239A1 (en) * 2016-12-07 2018-06-07 Wafer Llc Low loss electrical transmission mechanism and antenna using same
WO2018116477A1 (ja) * 2016-12-22 2018-06-28 三井金属鉱業株式会社 多層配線板の製造方法
US11167676B2 (en) * 2017-12-06 2021-11-09 Tesla, Inc. Load-bearing fabric architecture
TWI678596B (zh) * 2018-09-13 2019-12-01 新應材股份有限公司 正型光阻組成物及圖案化聚醯亞胺層之形成方法
CN109275210B (zh) * 2018-10-12 2021-02-09 重庆墨希科技有限公司 一种基于石墨烯的高可靠性的发热膜及其制备方法
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Also Published As

Publication number Publication date
TW200602642A (en) 2006-01-16
US7737707B2 (en) 2010-06-15
TWI357499B (zh) 2012-02-01
CN1957259A (zh) 2007-05-02
TWI361894B (zh) 2012-04-11
US7671609B2 (en) 2010-03-02
WO2005103732A1 (ja) 2005-11-03
WO2005103734A1 (ja) 2005-11-03
EP1744167B1 (en) 2013-10-02
EP1744166A1 (en) 2007-01-17
KR101140505B1 (ko) 2012-04-30
CN1973207A (zh) 2007-05-30
EP1744167A1 (en) 2007-01-17
WO2005103730A1 (ja) 2005-11-03
US20070200574A1 (en) 2007-08-30
TW200538742A (en) 2005-12-01
KR20070010068A (ko) 2007-01-19
KR20070006926A (ko) 2007-01-11
TW200604533A (en) 2006-02-01
EP1744167A4 (en) 2012-02-29
WO2005103733A1 (ja) 2005-11-03
WO2005103731A1 (ja) 2005-11-03
KR20070010187A (ko) 2007-01-22
CN100451659C (zh) 2009-01-14
TW200540430A (en) 2005-12-16
US20070205783A1 (en) 2007-09-06

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