TW200506950A - Nonvolatile semiconductor memory device, and programming method and erasing method thereof - Google Patents

Nonvolatile semiconductor memory device, and programming method and erasing method thereof

Info

Publication number
TW200506950A
TW200506950A TW093117351A TW93117351A TW200506950A TW 200506950 A TW200506950 A TW 200506950A TW 093117351 A TW093117351 A TW 093117351A TW 93117351 A TW93117351 A TW 93117351A TW 200506950 A TW200506950 A TW 200506950A
Authority
TW
Taiwan
Prior art keywords
line voltage
voltage
bit line
word line
resistive element
Prior art date
Application number
TW093117351A
Other languages
English (en)
Other versions
TWI248616B (en
Inventor
Yukio Tamai
Kohji Inoue
Teruaki Morita
Original Assignee
Sharp Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Kk filed Critical Sharp Kk
Publication of TW200506950A publication Critical patent/TW200506950A/zh
Application granted granted Critical
Publication of TWI248616B publication Critical patent/TWI248616B/zh

Links

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0007Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements comprising metal oxide memory material, e.g. perovskites
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0026Bit-line or column circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0023Address circuits or decoders
    • G11C13/0028Word-line or row circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/10Programming or data input circuits
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C16/00Erasable programmable read-only memories
    • G11C16/02Erasable programmable read-only memories electrically programmable
    • G11C16/06Auxiliary circuits, e.g. for writing into memory
    • G11C16/34Determination of programming status, e.g. threshold voltage, overprogramming or underprogramming, retention
    • G11C16/3418Disturbance prevention or evaluation; Refreshing of disturbed memory data
    • G11C16/3427Circuits or methods to prevent or reduce disturbance of the state of a memory cell when neighbouring cells are read or written
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C13/00Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0021Auxiliary circuits
    • G11C13/0069Writing or programming circuits or methods
    • G11C2013/009Write using potential difference applied between cell electrodes
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/30Resistive cell, memory material aspects
    • G11C2213/31Material having complex metal oxide, e.g. perovskite structure
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C2213/00Indexing scheme relating to G11C13/00 for features not covered by this group
    • G11C2213/70Resistive array aspects
    • G11C2213/77Array wherein the memory element being directly connected to the bit lines and word lines without any access device being used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Semiconductor Memories (AREA)
TW093117351A 2003-06-17 2004-06-16 Nonvolatile semiconductor memory device, and programming method and erasing method thereof TWI248616B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003171489 2003-06-17
JP2003327026A JP2005032401A (ja) 2003-06-17 2003-09-19 不揮発性半導体記憶装置及びその書き込み方法と消去方法

Publications (2)

Publication Number Publication Date
TW200506950A true TW200506950A (en) 2005-02-16
TWI248616B TWI248616B (en) 2006-02-01

Family

ID=33422160

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093117351A TWI248616B (en) 2003-06-17 2004-06-16 Nonvolatile semiconductor memory device, and programming method and erasing method thereof

Country Status (7)

Country Link
US (1) US6992920B2 (zh)
EP (1) EP1489620B1 (zh)
JP (1) JP2005032401A (zh)
KR (1) KR100687016B1 (zh)
CN (1) CN100565702C (zh)
DE (1) DE602004004566T2 (zh)
TW (1) TWI248616B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596610B (zh) * 2013-10-04 2017-08-21 財團法人工業技術研究院 電阻式非揮發性記憶體及其操作方法

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6962648B2 (en) * 2003-09-15 2005-11-08 Global Silicon Net Corp. Back-biased face target sputtering
JP4189395B2 (ja) * 2004-07-28 2008-12-03 シャープ株式会社 不揮発性半導体記憶装置及び読み出し方法
JP2006114087A (ja) * 2004-10-13 2006-04-27 Sony Corp 記憶装置及び半導体装置
US7425504B2 (en) * 2004-10-15 2008-09-16 4D-S Pty Ltd. Systems and methods for plasma etching
US20060081466A1 (en) * 2004-10-15 2006-04-20 Makoto Nagashima High uniformity 1-D multiple magnet magnetron source
US20060081467A1 (en) * 2004-10-15 2006-04-20 Makoto Nagashima Systems and methods for magnetron deposition
JP2006203098A (ja) * 2005-01-24 2006-08-03 Sharp Corp 不揮発性半導体記憶装置
JP4427464B2 (ja) * 2005-02-02 2010-03-10 シャープ株式会社 不揮発性半導体記憶装置及びその動作方法
JP4313372B2 (ja) 2005-05-11 2009-08-12 シャープ株式会社 不揮発性半導体記憶装置
JP4469319B2 (ja) 2005-06-17 2010-05-26 シャープ株式会社 半導体記憶装置
JP2007026492A (ja) * 2005-07-13 2007-02-01 Sony Corp 記憶装置及び半導体装置
JP4309877B2 (ja) * 2005-08-17 2009-08-05 シャープ株式会社 半導体記憶装置
US20070084716A1 (en) * 2005-10-16 2007-04-19 Makoto Nagashima Back-biased face target sputtering based high density non-volatile data storage
US20070084717A1 (en) * 2005-10-16 2007-04-19 Makoto Nagashima Back-biased face target sputtering based high density non-volatile caching data storage
JP4054347B2 (ja) 2005-12-16 2008-02-27 シャープ株式会社 不揮発性半導体記憶装置
JP4203506B2 (ja) * 2006-01-13 2009-01-07 シャープ株式会社 不揮発性半導体記憶装置及びその書き換え方法
JP4594878B2 (ja) * 2006-02-23 2010-12-08 シャープ株式会社 可変抵抗素子の抵抗制御方法及び不揮発性半導体記憶装置
US8395199B2 (en) 2006-03-25 2013-03-12 4D-S Pty Ltd. Systems and methods for fabricating self-aligned memory cell
JP4460552B2 (ja) * 2006-07-04 2010-05-12 シャープ株式会社 半導体記憶装置
US20080011603A1 (en) * 2006-07-14 2008-01-17 Makoto Nagashima Ultra high vacuum deposition of PCMO material
US7932548B2 (en) 2006-07-14 2011-04-26 4D-S Pty Ltd. Systems and methods for fabricating self-aligned memory cell
US8454810B2 (en) 2006-07-14 2013-06-04 4D-S Pty Ltd. Dual hexagonal shaped plasma source
JP4251576B2 (ja) * 2006-07-28 2009-04-08 シャープ株式会社 不揮発性半導体記憶装置
US8308915B2 (en) 2006-09-14 2012-11-13 4D-S Pty Ltd. Systems and methods for magnetron deposition
US7379364B2 (en) * 2006-10-19 2008-05-27 Unity Semiconductor Corporation Sensing a signal in a two-terminal memory array having leakage current
US7372753B1 (en) * 2006-10-19 2008-05-13 Unity Semiconductor Corporation Two-cycle sensing in a two-terminal memory array having leakage current
JP4427560B2 (ja) * 2007-05-21 2010-03-10 株式会社東芝 不揮発性メモリ装置のデータ書き込み方法
JP4252624B2 (ja) 2007-06-01 2009-04-08 パナソニック株式会社 抵抗変化型記憶装置
KR100914267B1 (ko) * 2007-06-20 2009-08-27 삼성전자주식회사 가변저항 메모리 장치 및 그것의 형성방법
JP4607252B2 (ja) * 2008-02-25 2011-01-05 パナソニック株式会社 抵抗変化素子の駆動方法およびそれを用いた抵抗変化型記憶装置
US7920407B2 (en) * 2008-10-06 2011-04-05 Sandisk 3D, Llc Set and reset detection circuits for reversible resistance switching memory material
KR101523677B1 (ko) * 2009-02-26 2015-05-28 삼성전자주식회사 플래시 메모리 장치 및 그것의 프로그램 방법 그리고 그것을 포함하는 메모리 시스템
US8325508B2 (en) * 2009-06-08 2012-12-04 Panasonic Corporation Writing method for variable resistance nonvolatile memory element, and variable resistance nonvolatile memory device
TWI428929B (zh) * 2009-11-24 2014-03-01 Ind Tech Res Inst 控制方法
US8817521B2 (en) 2009-11-24 2014-08-26 Industrial Technology Research Institute Control method for memory cell
JP5598338B2 (ja) * 2011-01-13 2014-10-01 ソニー株式会社 記憶装置およびその動作方法
JP5404683B2 (ja) * 2011-03-23 2014-02-05 株式会社東芝 抵抗変化メモリ
WO2012153488A1 (ja) 2011-05-11 2012-11-15 パナソニック株式会社 クロスポイント型抵抗変化不揮発性記憶装置およびその読み出し方法
JP5542742B2 (ja) * 2011-05-26 2014-07-09 株式会社東芝 半導体記憶装置
TWI506627B (zh) 2011-08-30 2015-11-01 Ind Tech Res Inst 電阻式記憶體及其寫入驗證方法
JP2013089662A (ja) 2011-10-14 2013-05-13 Renesas Electronics Corp 半導体装置
JP5630742B2 (ja) * 2011-12-05 2014-11-26 株式会社東芝 半導体記憶装置
JP5479657B1 (ja) 2012-04-09 2014-04-23 パナソニック株式会社 不揮発性記憶装置、およびそのフォーミング方法
KR102015637B1 (ko) 2012-08-31 2019-08-28 삼성전자주식회사 가변 저항 메모리 장치 및 그 소거 검증 방법
US9047945B2 (en) * 2012-10-15 2015-06-02 Marvell World Trade Ltd. Systems and methods for reading resistive random access memory (RRAM) cells
CN104700891B (zh) * 2013-12-09 2019-01-08 华邦电子股份有限公司 电阻式存储器装置及其写入方法
CN105895152B (zh) * 2016-04-01 2019-05-21 北京大学 一种基于单相导通存储单元的存储阵列读取方法
US11594271B2 (en) * 2019-05-08 2023-02-28 Ferroelectric Memory Gmbh Memory cell driver, memory cell arrangement, and methods thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US81489A (en) * 1868-08-25 fuller
JPH0677434A (ja) * 1992-08-27 1994-03-18 Hitachi Ltd 半導体記憶装置
US5463586A (en) * 1993-05-28 1995-10-31 Macronix International Co., Ltd. Erase and program verification circuit for non-volatile memory
US6204139B1 (en) * 1998-08-25 2001-03-20 University Of Houston Method for switching the properties of perovskite materials used in thin film resistors
US6366497B1 (en) * 2000-03-30 2002-04-02 Intel Corporation Method and apparatus for low voltage sensing in flash memories
US20020036291A1 (en) * 2000-06-20 2002-03-28 Parker Ian D. Multilayer structures as stable hole-injecting electrodes for use in high efficiency organic electronic devices
US20020024835A1 (en) * 2000-07-07 2002-02-28 Thompson Michael O. Non-volatile passive matrix device and method for readout of the same
NO312699B1 (no) * 2000-07-07 2002-06-17 Thin Film Electronics Asa Adressering av minnematrise
US6661730B1 (en) * 2000-12-22 2003-12-09 Matrix Semiconductor, Inc. Partial selection of passive element memory cell sub-arrays for write operation
KR100432510B1 (ko) * 2001-02-02 2004-05-20 주식회사 쓰리비 시스템 부착형 비접촉식 전자카드
US6426907B1 (en) * 2001-01-24 2002-07-30 Infineon Technologies North America Corp. Reference for MRAM cell
KR20030001178A (ko) * 2001-06-28 2003-01-06 주식회사 하이닉스반도체 반도체 소자의 플러그 형성 방법
US6693821B2 (en) * 2001-06-28 2004-02-17 Sharp Laboratories Of America, Inc. Low cross-talk electrically programmable resistance cross point memory
US7044911B2 (en) * 2001-06-29 2006-05-16 Philometron, Inc. Gateway platform for biological monitoring and delivery of therapeutic compounds
US6787013B2 (en) * 2001-09-10 2004-09-07 Eumed Biotechnology Co., Ltd. Biosensor
JP4205938B2 (ja) * 2002-12-05 2009-01-07 シャープ株式会社 不揮発性メモリ装置
JP3804612B2 (ja) * 2003-01-07 2006-08-02 セイコーエプソン株式会社 強誘電体記憶装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI596610B (zh) * 2013-10-04 2017-08-21 財團法人工業技術研究院 電阻式非揮發性記憶體及其操作方法

Also Published As

Publication number Publication date
EP1489620B1 (en) 2007-01-31
KR20040111205A (ko) 2004-12-31
US6992920B2 (en) 2006-01-31
EP1489620A2 (en) 2004-12-22
KR100687016B1 (ko) 2007-02-27
DE602004004566T2 (de) 2007-10-25
JP2005032401A (ja) 2005-02-03
DE602004004566D1 (de) 2007-03-22
CN1574077A (zh) 2005-02-02
EP1489620A3 (en) 2005-02-09
US20040257864A1 (en) 2004-12-23
TWI248616B (en) 2006-02-01
CN100565702C (zh) 2009-12-02

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