SK285453B6 - Alkalický zinkovo-niklový kúpeľ - Google Patents

Alkalický zinkovo-niklový kúpeľ Download PDF

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Publication number
SK285453B6
SK285453B6 SK89-2001A SK892001A SK285453B6 SK 285453 B6 SK285453 B6 SK 285453B6 SK 892001 A SK892001 A SK 892001A SK 285453 B6 SK285453 B6 SK 285453B6
Authority
SK
Slovakia
Prior art keywords
anode
nickel
bath
zinc
alkaline
Prior art date
Application number
SK89-2001A
Other languages
English (en)
Slovak (sk)
Other versions
SK892001A3 (en
Inventor
Ernst-Walter Hillebrand
Original Assignee
Walter Hillebrand Gmbh & Co. Kg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7875843&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=SK285453(B6) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Walter Hillebrand Gmbh & Co. Kg filed Critical Walter Hillebrand Gmbh & Co. Kg
Publication of SK892001A3 publication Critical patent/SK892001A3/sk
Publication of SK285453B6 publication Critical patent/SK285453B6/sk

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electrodes For Compound Or Non-Metal Manufacture (AREA)
SK89-2001A 1998-07-30 1999-07-29 Alkalický zinkovo-niklový kúpeľ SK285453B6 (sk)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19834353A DE19834353C2 (de) 1998-07-30 1998-07-30 Alkalisches Zink-Nickelbad
PCT/EP1999/005443 WO2000006807A2 (fr) 1998-07-30 1999-07-29 Bain alcalin de zinc-nickel

Publications (2)

Publication Number Publication Date
SK892001A3 SK892001A3 (en) 2001-10-08
SK285453B6 true SK285453B6 (sk) 2007-01-04

Family

ID=7875843

Family Applications (1)

Application Number Title Priority Date Filing Date
SK89-2001A SK285453B6 (sk) 1998-07-30 1999-07-29 Alkalický zinkovo-niklový kúpeľ

Country Status (22)

Country Link
US (4) US6602394B1 (fr)
EP (2) EP1344850B1 (fr)
JP (2) JP4716568B2 (fr)
KR (1) KR20010071074A (fr)
CN (1) CN1311830A (fr)
AT (2) ATE242821T1 (fr)
AU (1) AU5415299A (fr)
BG (1) BG105184A (fr)
BR (1) BR9912589A (fr)
CA (1) CA2339144A1 (fr)
CZ (1) CZ298904B6 (fr)
DE (3) DE19834353C2 (fr)
EE (1) EE200100059A (fr)
ES (2) ES2277624T3 (fr)
HR (1) HRP20010044B1 (fr)
HU (1) HUP0103951A3 (fr)
IL (1) IL141086A0 (fr)
MX (1) MXPA01000932A (fr)
PL (1) PL198149B1 (fr)
SK (1) SK285453B6 (fr)
TR (1) TR200100232T2 (fr)
WO (1) WO2000006807A2 (fr)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19834353C2 (de) 1998-07-30 2000-08-17 Hillebrand Walter Gmbh & Co Kg Alkalisches Zink-Nickelbad
US8852417B2 (en) 1999-04-13 2014-10-07 Applied Materials, Inc. Electrolytic process using anion permeable barrier
US8236159B2 (en) * 1999-04-13 2012-08-07 Applied Materials Inc. Electrolytic process using cation permeable barrier
US20060157355A1 (en) * 2000-03-21 2006-07-20 Semitool, Inc. Electrolytic process using anion permeable barrier
US20060189129A1 (en) * 2000-03-21 2006-08-24 Semitool, Inc. Method for applying metal features onto barrier layers using ion permeable barriers
DE10026956A1 (de) * 2000-05-30 2001-12-13 Walter Hillebrand Galvanotechn Zink-Legierungsbad
WO2001096631A1 (fr) 2000-06-15 2001-12-20 Taskem Inc. Electrodeposition zinc-nickel
US6755960B1 (en) 2000-06-15 2004-06-29 Taskem Inc. Zinc-nickel electroplating
US7628898B2 (en) * 2001-03-12 2009-12-08 Semitool, Inc. Method and system for idle state operation
DE10223622B4 (de) * 2002-05-28 2005-12-08 Walter Hillebrand Gmbh & Co. Kg Galvanotechnik Alkalisches Zink-Nickelbad sowie entsprechende Galvanisierungsverfahren mit erhöhter Stromausbeute
US8377283B2 (en) 2002-11-25 2013-02-19 Coventya, Inc. Zinc and zinc-alloy electroplating
DE10261493A1 (de) * 2002-12-23 2004-07-08 METAKEM Gesellschaft für Schichtchemie der Metalle mbH Anode zur Galvanisierung
ES2609080T3 (es) * 2003-06-03 2017-04-18 Coventya, Inc. Revestimiento electrolítico de cinc y aleaciones de cinc
US20050121332A1 (en) * 2003-10-03 2005-06-09 Kochilla John R. Apparatus and method for treatment of metal surfaces by inorganic electrophoretic passivation
US20050133376A1 (en) * 2003-12-19 2005-06-23 Opaskar Vincent C. Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom
FR2864553B1 (fr) * 2003-12-31 2006-09-01 Coventya Installation de depot de zinc ou d'alliages de zinc
US7442286B2 (en) * 2004-02-26 2008-10-28 Atotech Deutschland Gmbh Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys
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ES2574158T3 (es) * 2005-04-26 2016-06-15 Atotech Deutschland Gmbh Baño galvánico alcalino con una membrana de filtración
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US20070043474A1 (en) * 2005-08-17 2007-02-22 Semitool, Inc. Systems and methods for predicting process characteristics of an electrochemical treatment process
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DE102008058086B4 (de) 2008-11-18 2013-05-23 Atotech Deutschland Gmbh Verfahren und Vorrichtung zur Reinigung von galvanischen Bädern zur Abscheidung von Metallen
KR100977068B1 (ko) * 2010-01-25 2010-08-19 한용순 비정질 3가크롬합금도금층을 형성하기 위한 도금장치 및 그 3가크롬합금도금액
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EP2565297A3 (fr) 2011-08-30 2013-04-24 Rohm and Haas Electronic Materials LLC Promotion de l'adhérence de bronze blanc exempt de cyanure
CN103849915B (zh) * 2012-12-06 2016-08-31 北大方正集团有限公司 电镀装置和pcb板导通孔镀铜的方法
CN103911650B (zh) * 2014-04-02 2016-07-06 广东达志环保科技股份有限公司 一种应用于碱性锌镍合金电镀的阳极
DE202015002289U1 (de) 2015-03-25 2015-05-06 Hartmut Trenkner Zweikammer - Elektrodialysezelle mit Anionen- und Kationenaustauschermembran zur Verwendung als Anode in alkalischen Zink- und Zinklegierungselektrolyten zum Zweck der Metallabscheidung in galvanischen Anlagen
US9903038B2 (en) 2015-07-22 2018-02-27 Dipsol Chemicals Co., Ltd. Zinc alloy plating method
EP3042985B1 (fr) 2015-07-22 2019-04-10 Dipsol Chemicals Co., Ltd. Procédé de placage d'un alliage de zinc
WO2017171113A1 (fr) * 2016-03-29 2017-10-05 (주) 테크윈 Bain électrolytique et procédé d'électrolyse
CN106987879A (zh) * 2016-11-23 2017-07-28 瑞尔太阳能投资有限公司 电沉积装置及其电沉积方法
EP3358045A1 (fr) 2017-02-07 2018-08-08 Dr.Ing. Max Schlötter GmbH & Co. KG Procédé de dépôt par placage de revêtements en zinc et en alliage de zinc à partir d'un bain de revêtement alcalin à élimination réduite des additifs de bain organiques
PL3415665T3 (pl) 2017-06-14 2024-03-25 Dr.Ing. Max Schlötter Gmbh & Co. Kg Sposób osadzania galwanicznego powłok ze stopu cynku i niklu z alkalicznej kąpieli stopu cynku i niklu z ograniczoną degradacją dodatków
US20220119978A1 (en) 2019-01-24 2022-04-21 Atotech Deutschland Gmbh Membrane anode system for electrolytic zinc-nickel alloy deposition
CN110462107A (zh) 2019-02-15 2019-11-15 迪普索股份公司 锌或锌合金电镀方法和系统
JP6750186B1 (ja) 2019-11-28 2020-09-02 ユケン工業株式会社 めっき液の亜鉛濃度の上昇を抑制する方法および亜鉛系めっき部材の製造方法
JP2023507479A (ja) 2019-12-20 2023-02-22 アトテック ドイチュラント ゲー・エム・ベー・ハー ウント コー． カー・ゲー 亜鉛ニッケル合金を基材上に堆積するための方法およびシステム
EP4273303A1 (fr) 2022-05-05 2023-11-08 Atotech Deutschland GmbH & Co. KG Procédé de dépôt d'un alliage zinc-nickel sur un substrat, bain de dépôt zinc-nickel aqueux, agent d'éclaircissement et son utilisation

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Also Published As

Publication number Publication date
MXPA01000932A (es) 2002-06-04
DE59905937D1 (de) 2003-07-17
US20080164150A1 (en) 2008-07-10
DE59914011D1 (de) 2007-01-04
EP1102875A2 (fr) 2001-05-30
CZ2001189A3 (cs) 2001-08-15
WO2000006807A3 (fr) 2000-05-04
HUP0103951A3 (en) 2003-05-28
JP2002521572A (ja) 2002-07-16
JP4716568B2 (ja) 2011-07-06
US8486235B2 (en) 2013-07-16
EP1102875B1 (fr) 2003-06-11
PL198149B1 (pl) 2008-05-30
EP1344850A1 (fr) 2003-09-17
HUP0103951A2 (hu) 2002-02-28
CA2339144A1 (fr) 2000-02-10
ATE242821T1 (de) 2003-06-15
BR9912589A (pt) 2001-05-02
EE200100059A (et) 2002-10-15
DE19834353C2 (de) 2000-08-17
SK892001A3 (en) 2001-10-08
ES2277624T3 (es) 2007-07-16
AU5415299A (en) 2000-02-21
CN1311830A (zh) 2001-09-05
US20110031127A1 (en) 2011-02-10
ATE346180T1 (de) 2006-12-15
BG105184A (en) 2001-10-31
EP1344850B1 (fr) 2006-11-22
HRP20010044B1 (en) 2005-06-30
US20040104123A1 (en) 2004-06-03
WO2000006807A2 (fr) 2000-02-10
DE19834353A1 (de) 2000-02-03
PL345970A1 (en) 2002-01-14
IL141086A0 (en) 2002-02-10
TR200100232T2 (tr) 2001-06-21
CZ298904B6 (cs) 2008-03-05
US6602394B1 (en) 2003-08-05
KR20010071074A (ko) 2001-07-28
JP2008150713A (ja) 2008-07-03
US7807035B2 (en) 2010-10-05
ES2201759T3 (es) 2004-03-16
HRP20010044A2 (en) 2001-12-31

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Expiry date: 20190729