PH12022551948B1 - Apparatus, method and computer program product for defect detection in work pieces - Google Patents

Apparatus, method and computer program product for defect detection in work pieces

Info

Publication number
PH12022551948B1
PH12022551948B1 PH1/2022/551948A PH12022551948A PH12022551948B1 PH 12022551948 B1 PH12022551948 B1 PH 12022551948B1 PH 12022551948 A PH12022551948 A PH 12022551948A PH 12022551948 B1 PH12022551948 B1 PH 12022551948B1
Authority
PH
Philippines
Prior art keywords
program product
computer program
defect detection
work pieces
work piece
Prior art date
Application number
PH1/2022/551948A
Other languages
English (en)
Other versions
PH12022551948A1 (en
Inventor
Tom Marivoet
Carl Truyens
Christophe Wouters
Original Assignee
Kla Tencor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kla Tencor Corp filed Critical Kla Tencor Corp
Publication of PH12022551948A1 publication Critical patent/PH12022551948A1/en
Publication of PH12022551948B1 publication Critical patent/PH12022551948B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8841—Illumination and detection on two sides of object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1047—Mechano-optical scan, i.e. object and beam moving with rotating optics and moving stage

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Textile Engineering (AREA)
PH1/2022/551948A 2014-12-05 2015-12-04 Apparatus, method and computer program product for defect detection in work pieces PH12022551948B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462088284P 2014-12-05 2014-12-05
US201562154109P 2015-04-28 2015-04-28
PCT/US2015/064100 WO2016090311A1 (en) 2014-12-05 2015-12-04 Apparatus, method and computer program product for defect detection in work pieces

Publications (2)

Publication Number Publication Date
PH12022551948A1 PH12022551948A1 (en) 2023-02-20
PH12022551948B1 true PH12022551948B1 (en) 2024-04-17

Family

ID=56092564

Family Applications (3)

Application Number Title Priority Date Filing Date
PH1/2022/551948A PH12022551948B1 (en) 2014-12-05 2015-12-04 Apparatus, method and computer program product for defect detection in work pieces
PH12017501024A PH12017501024A1 (en) 2014-12-05 2017-06-02 Apparatus, method and computer program product for defect detection in work pieces
PH12020551338A PH12020551338A1 (en) 2014-12-05 2020-08-26 Apparatus, method and computer program product for defect detection in work pieces

Family Applications After (2)

Application Number Title Priority Date Filing Date
PH12017501024A PH12017501024A1 (en) 2014-12-05 2017-06-02 Apparatus, method and computer program product for defect detection in work pieces
PH12020551338A PH12020551338A1 (en) 2014-12-05 2020-08-26 Apparatus, method and computer program product for defect detection in work pieces

Country Status (10)

Country Link
US (6) US10324044B2 (enExample)
EP (3) EP3926330A1 (enExample)
JP (5) JP6929772B2 (enExample)
KR (9) KR102755833B1 (enExample)
CN (3) CN107003254A (enExample)
MY (3) MY188685A (enExample)
PH (3) PH12022551948B1 (enExample)
SG (3) SG10202110739PA (enExample)
TW (2) TWI663394B (enExample)
WO (1) WO2016090311A1 (enExample)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3926330A1 (en) * 2014-12-05 2021-12-22 Kla-Tencor Corporation Apparatus and method for defect detection in work pieces
US10670531B2 (en) 2016-01-04 2020-06-02 Laser & Plasma Technologies, LLC Infrared detection camera
CN107843991A (zh) * 2017-09-05 2018-03-27 努比亚技术有限公司 屏幕漏光的检测方法、系统、终端及计算机可读存储介质
WO2019157271A2 (en) * 2018-02-09 2019-08-15 Massachusetts Institute Of Technology Systems and methods for crack detection
US20190257876A1 (en) * 2018-02-21 2019-08-22 Asm Technology Singapore Pte Ltd System and method for detecting defects in an electronic device
CN108872246A (zh) * 2018-05-29 2018-11-23 湖南科创信息技术股份有限公司 板面材料全视面缺陷检测系统
CN109100366A (zh) * 2018-08-10 2018-12-28 武汉盛为芯科技有限公司 半导体激光器芯片端面外观的检测系统及方法
JP2020054531A (ja) * 2018-09-29 2020-04-09 株式会社三洋物産 遊技機
US10481097B1 (en) * 2018-10-01 2019-11-19 Guardian Glass, LLC Method and system for detecting inclusions in float glass based on spectral reflectance analysis
US10746667B2 (en) * 2018-11-27 2020-08-18 General Electric Company Fluorescent penetrant inspection system and method
JP2020103414A (ja) * 2018-12-26 2020-07-09 株式会社三洋物産 遊技機
JP2020103417A (ja) * 2018-12-26 2020-07-09 株式会社三洋物産 遊技機
JP2020146144A (ja) * 2019-03-12 2020-09-17 株式会社三洋物産 遊技機
US11650164B2 (en) * 2019-05-15 2023-05-16 Getac Technology Corporation Artificial neural network-based method for selecting surface type of object
US11543363B2 (en) 2019-05-24 2023-01-03 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for wafer bond monitoring
US12085518B2 (en) 2020-03-02 2024-09-10 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for wafer bond monitoring
US11340284B2 (en) * 2019-07-23 2022-05-24 Kla Corporation Combined transmitted and reflected light imaging of internal cracks in semiconductor devices
JP6755603B1 (ja) * 2019-12-25 2020-09-16 上野精機株式会社 電子部品の処理装置
JP2021133199A (ja) * 2020-02-28 2021-09-13 株式会社三洋物産 遊技機
JP2021133198A (ja) * 2020-02-28 2021-09-13 株式会社三洋物産 遊技機
JP2021133200A (ja) * 2020-02-28 2021-09-13 株式会社三洋物産 遊技機
JP7437987B2 (ja) * 2020-03-23 2024-02-26 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP2022012088A (ja) * 2020-06-30 2022-01-17 株式会社三洋物産 遊技機
JP2022012089A (ja) * 2020-06-30 2022-01-17 株式会社三洋物産 遊技機
JP2022012090A (ja) * 2020-06-30 2022-01-17 株式会社三洋物産 遊技機
KR102255421B1 (ko) * 2020-08-11 2021-05-24 충남대학교산학협력단 단결정 산화갈륨의 결함 평가방법
JP7579722B2 (ja) * 2021-03-09 2024-11-08 本田技研工業株式会社 表面検査方法及び表面検査装置
JP6906779B1 (ja) * 2021-03-11 2021-07-21 ヴィスコ・テクノロジーズ株式会社 半導体チップの検査方法及び装置
CN112816490A (zh) * 2021-03-16 2021-05-18 上海悦易网络信息技术有限公司 一种电子产品的自动检测设备及自动检测方法
DE112022002435T5 (de) 2021-05-05 2024-05-23 Besi Switzerland Ag Vorrichtung und Verfahren zur optischen Inspektion von drei oder mehr Seiten einer Komponente
CN115372361B (zh) * 2021-05-21 2025-11-25 泰科电子(上海)有限公司 工件多表面检测设备及检测方法
TWI797689B (zh) * 2021-05-24 2023-04-01 馬來西亞商正齊科技有限公司 檢查電子元件內部缺陷的裝置及方法
CN115078392B (zh) * 2022-07-29 2025-03-04 深圳市泽信智能装备有限公司 一种半导体芯片缺陷检测设备及方法
CN116757973B (zh) * 2023-08-23 2023-12-01 成都数之联科技股份有限公司 一种面板产品自动修补方法、系统、设备及存储介质
CN119322062A (zh) * 2024-08-30 2025-01-17 中科慧远视觉技术（洛阳）有限公司 一种手机盖板打光成像结构和方法

Family Cites Families (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1623425C2 (de) 1967-10-26 1972-06-08 Eltro Gmbh Optoelektronisches Verfahren und System zur Durchfuehrung dieses Verfahrens
US4689491A (en) * 1985-04-19 1987-08-25 Datasonics Corp. Semiconductor wafer scanning system
US4891530A (en) * 1986-02-22 1990-01-02 Helmut K. Pinsch Gmbh & Co. Testing or inspecting apparatus and method for detecting differently shaped surfaces of objects
JP2591751B2 (ja) 1987-06-29 1997-03-19 日本電気株式会社 オブジェクト間の類似度判定方式
JPH02281132A (ja) * 1989-04-21 1990-11-16 Matsushita Electric Ind Co Ltd 汚れ検出器
JP2975476B2 (ja) * 1992-03-30 1999-11-10 三井金属鉱業株式会社 結晶内のフォトルミネッセンス計測方法及び装置
JP2847458B2 (ja) * 1993-03-26 1999-01-20 三井金属鉱業株式会社 欠陥評価装置
JP3366067B2 (ja) * 1993-09-03 2003-01-14 ラトックシステムエンジニアリング株式会社 結晶欠陥検出方法
JP3348168B2 (ja) * 1993-09-03 2002-11-20 ラトックシステムエンジニアリング株式会社 結晶欠陥検出方法およびその装置
US5790247A (en) * 1995-10-06 1998-08-04 Photon Dynamics, Inc. Technique for determining defect positions in three dimensions in a transparent structure
WO1998037404A1 (en) * 1997-02-21 1998-08-27 Sidney Braginsky Method of scanning semiconductor wafers to inspect for defects
JP2897754B2 (ja) 1997-03-27 1999-05-31 日本電気株式会社 半導体装置の検査方法
JPH11352072A (ja) * 1998-06-04 1999-12-24 Advantest Corp 表面検査装置および方法
US6529018B1 (en) 1998-08-28 2003-03-04 International Business Machines Corporation Method for monitoring defects in polysilicon gates in semiconductor devices responsive to illumination by incident light
DE69800756T2 (de) 1998-10-15 2001-08-09 Wacker Siltronic Gesellschaft Fuer Halbleitermaterialien Ag Verfahren und Vorrichtung zum Detektieren, Überwachung und Charakterisierung von Kantendefekten in Halbleiterscheiben
US6384415B1 (en) 2000-06-20 2002-05-07 Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) Method of evaluating quality of silicon wafer and method of reclaiming the water
US6512239B1 (en) * 2000-06-27 2003-01-28 Photon Dynamics Canada Inc. Stereo vision inspection system for transparent media
JP2002310929A (ja) * 2001-04-13 2002-10-23 Mitsubishi Electric Corp 欠陥検査装置
JP3709426B2 (ja) 2001-11-02 2005-10-26 日本エレクトロセンサリデバイス株式会社 表面欠陥検出方法および表面欠陥検出装置
JP3762952B2 (ja) * 2002-09-04 2006-04-05 レーザーテック株式会社 光学装置並びにそれを用いた画像測定装置及び検査装置
US20040207836A1 (en) * 2002-09-27 2004-10-21 Rajeshwar Chhibber High dynamic range optical inspection system and method
EP1546691A1 (en) * 2002-09-30 2005-06-29 Applied Materials Israel Ltd. Inspection system with oblique viewing angle
WO2004072629A1 (en) 2003-02-17 2004-08-26 Nanyang Technological University System and method for inspection of silicon wafers
JP2005257671A (ja) 2004-02-10 2005-09-22 Sharp Corp 光学部品の欠陥検出方法および欠陥検出装置
DE102004029212B4 (de) 2004-06-16 2006-07-13 Leica Microsystems Semiconductor Gmbh Vorrichtung und Verfahren zur optischen Auf- und/oder Durchlichtinspektion von Mikrostrukturen im IR
JP4626982B2 (ja) 2005-02-10 2011-02-09 セントラル硝子株式会社 ガラス板の端面の欠陥検出装置および検出方法
JP2007086050A (ja) * 2005-02-18 2007-04-05 Hoya Corp 透光性材料からなる透光性物品の検査方法、ガラス基板の欠陥検査方法及び装置、マスクブランク用ガラス基板の製造方法、マスクブランクの製造方法、及び露光用マスクの製造方法、並びに、マスクブランク用ガラス基板、マスクブランク、露光用マスク、及び半導体装置の製造方法
US7898650B2 (en) * 2005-02-18 2011-03-01 Hoya Corporation Inspection method for transparent article
CN2791639Y (zh) 2005-03-02 2006-06-28 昆明物理研究所 检测半导体材料内部缺陷的红外装置
JP2006351669A (ja) * 2005-06-14 2006-12-28 Mitsubishi Electric Corp 赤外検査装置および赤外検査方法ならびに半導体ウェハの製造方法
JP4847128B2 (ja) 2005-12-21 2011-12-28 日本エレクトロセンサリデバイス株式会社 表面欠陥検査装置
JP4878907B2 (ja) 2006-05-08 2012-02-15 三菱電機株式会社 画像検査装置およびこの画像検査装置を用いた画像検査方法
KR20080015363A (ko) 2006-08-14 2008-02-19 야마하 가부시키가이샤 웨이퍼 및 반도체 소자의 검사 방법 및 장치
JP4973062B2 (ja) 2006-08-14 2012-07-11 ヤマハ株式会社 半導体チップの検査方法及びウェハのクラック検査装置
KR100768038B1 (ko) * 2006-10-24 2007-10-17 한국전기연구원 균일한 내부 전반사 조명에 의한 바이오칩 측정 장치 및방법
US8274727B1 (en) 2006-11-13 2012-09-25 Hrl Laboratories, Llc Programmable optical label
CN101021490B (zh) * 2007-03-12 2012-11-14 3i系统公司 平面基板自动检测系统及方法
JP5191484B2 (ja) * 2007-04-27 2013-05-08 芝浦メカトロニクス株式会社 表面検査装置
WO2008143228A1 (ja) 2007-05-21 2008-11-27 Nikon Corporation ウエハ端面検査装置
WO2009021207A2 (en) 2007-08-09 2009-02-12 Accretech Usa, Inc. Apparatus and method for wafer edge exclusion measurement
JP4600476B2 (ja) * 2007-12-28 2010-12-15 日本電気株式会社 微細構造物の欠陥検査方法及び欠陥検査装置
JP2009192358A (ja) * 2008-02-14 2009-08-27 Fuji Electric Systems Co Ltd 欠陥検査装置
JP2009236493A (ja) * 2008-03-25 2009-10-15 Mitsubishi Rayon Co Ltd 透明板の欠陥検査方法および装置
JP5240771B2 (ja) * 2008-04-14 2013-07-17 上野精機株式会社 外観検査装置
JP2010025713A (ja) * 2008-07-18 2010-02-04 Hitachi High-Technologies Corp 欠陥検査方法及び欠陥検査装置
TWI512865B (zh) 2008-09-08 2015-12-11 Rudolph Technologies Inc 晶圓邊緣檢查技術
US8532364B2 (en) 2009-02-18 2013-09-10 Texas Instruments Deutschland Gmbh Apparatus and method for detecting defects in wafer manufacturing
CN101819165B (zh) 2009-02-27 2013-08-07 圣戈本玻璃法国公司 用于检测图案化基板的缺陷的方法及系统
KR101114362B1 (ko) * 2009-03-09 2012-02-14 주식회사 쓰리비 시스템 결점검사를 위한 검사장치
DE102009017786B3 (de) * 2009-04-20 2010-10-14 Intego Gmbh Verfahren zur Detektion von Fehlstellen in einer dünnen Waferscheibe für ein Solarelement sowie Vorrichtung zur Durchführung des Verfahrens
WO2010137431A1 (ja) 2009-05-29 2010-12-02 株式会社ロゼフテクノロジー 多結晶ウエハの検査方法
JP2011033449A (ja) 2009-07-31 2011-02-17 Sumco Corp ウェーハの欠陥検査方法及び欠陥検査装置
DE102009050711A1 (de) * 2009-10-26 2011-05-05 Schott Ag Verfahren und Vorrichtung zur Detektion von Rissen in Halbleitersubstraten
KR20110055788A (ko) * 2009-11-20 2011-05-26 재단법인 서울테크노파크 레이저를 이용한 접합웨이퍼 검사방법
KR101519476B1 (ko) 2010-02-17 2015-05-14 한미반도체 주식회사 잉곳 검사 장치 및 방법
KR101214806B1 (ko) 2010-05-11 2012-12-24 가부시키가이샤 사무코 웨이퍼 결함 검사 장치 및 웨이퍼 결함 검사 방법
TWI422814B (zh) * 2010-08-23 2014-01-11 Delta Electronics Inc 基板內部缺陷檢查裝置及方法
JP2012083125A (ja) 2010-10-07 2012-04-26 Nikon Corp 端面検査装置
US9001029B2 (en) 2011-02-15 2015-04-07 Basf Se Detector for optically detecting at least one object
WO2012153718A1 (ja) 2011-05-12 2012-11-15 コニカミノルタホールディングス株式会社 ガラスシートの端面検査方法、及びガラスシートの端面検査装置
KR101813315B1 (ko) * 2011-06-24 2017-12-28 케이엘에이-텐코 코포레이션 포토루미네선스 이미징을 이용한 발광 반도체 소자의 검사 방법 및 장치
JP2013015428A (ja) 2011-07-05 2013-01-24 Lasertec Corp 検査装置、検査方法及び半導体装置の製造方法
JP5594254B2 (ja) 2011-08-09 2014-09-24 三菱電機株式会社 シリコン基板の検査装置、および検査方法
CN103376259A (zh) 2012-04-11 2013-10-30 百励科技股份有限公司 元件内部缺陷的检测装置及方法
PL222470B1 (pl) 2012-08-14 2016-07-29 Włodarczyk Władysław Igloo Moduł głowicy do pobierania oraz umieszczania komponentów dedykowanych w technologii SMT
US9664625B2 (en) * 2012-09-28 2017-05-30 Rudolph Technologies, Inc. Inspection of substrates using calibration and imaging
CN203011849U (zh) 2012-11-13 2013-06-19 上海太阳能工程技术研究中心有限公司 硅片缺陷检测装置
KR20140060946A (ko) * 2012-11-13 2014-05-21 에이티아이 주식회사 전자재료 가공부위 측정용 조명장치 및 이를 적용한 검사 장치
KR101385219B1 (ko) 2012-12-27 2014-04-16 한국생산기술연구원 반도체 패키지의 결함 검출 시스템 및 결함 검출 방법
US9041919B2 (en) 2013-02-18 2015-05-26 Globalfoundries Inc. Infrared-based metrology for detection of stress and defects around through silicon vias
DE102013108308A1 (de) * 2013-08-01 2015-02-19 Schott Ag Verfahren und Vorrichtung zur Detektion in Bandrollen aus sprödhartem oder sprödbrechendem, zumindest teiltransparentem Material, sowie deren Verwendung
EP3926330A1 (en) 2014-12-05 2021-12-22 Kla-Tencor Corporation Apparatus and method for defect detection in work pieces
KR102093450B1 (ko) 2018-12-31 2020-03-25 주식회사 디쓰리디 원단의 물성 측정 시스템 및 방법

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