JP6929772B2 - ワークピース欠陥検出用の装置及び方法 - Google Patents

ワークピース欠陥検出用の装置及び方法 Download PDF

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JP6929772B2
JP6929772B2 JP2017529614A JP2017529614A JP6929772B2 JP 6929772 B2 JP6929772 B2 JP 6929772B2 JP 2017529614 A JP2017529614 A JP 2017529614A JP 2017529614 A JP2017529614 A JP 2017529614A JP 6929772 B2 JP6929772 B2 JP 6929772B2
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workpiece
light
camera
illumination
semiconductor device
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JP2017538117A5 (enExample
JP2017538117A (ja
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トム マリフォート
トム マリフォート
カール トルエンス
カール トルエンス
クリストフ ウッターズ
クリストフ ウッターズ
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KLA Corp
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Priority to JP2021131177A priority patent/JP7373527B2/ja
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Priority to JP2023181884A priority patent/JP2023174984A/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8841—Illumination and detection on two sides of object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1047—Mechano-optical scan, i.e. object and beam moving with rotating optics and moving stage

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Textile Engineering (AREA)
JP2017529614A 2014-12-05 2015-12-04 ワークピース欠陥検出用の装置及び方法 Active JP6929772B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021131178A JP2021175987A (ja) 2014-12-05 2021-08-11 個片化半導体デバイスの欠陥検出装置
JP2021131177A JP7373527B2 (ja) 2014-12-05 2021-08-11 ワークピースの欠陥検出装置及び方法
JP2023181884A JP2023174984A (ja) 2014-12-05 2023-10-23 半導体デバイスの欠陥検出装置及び方法
JP2024004513A JP7755668B2 (ja) 2014-12-05 2024-01-16 個片化半導体デバイスの欠陥検出装置

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462088284P 2014-12-05 2014-12-05
US62/088,284 2014-12-05
US201562154109P 2015-04-28 2015-04-28
US62/154,109 2015-04-28
PCT/US2015/064100 WO2016090311A1 (en) 2014-12-05 2015-12-04 Apparatus, method and computer program product for defect detection in work pieces

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JP2021131177A Division JP7373527B2 (ja) 2014-12-05 2021-08-11 ワークピースの欠陥検出装置及び方法
JP2021131178A Division JP2021175987A (ja) 2014-12-05 2021-08-11 個片化半導体デバイスの欠陥検出装置

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JP2017538117A JP2017538117A (ja) 2017-12-21
JP2017538117A5 JP2017538117A5 (enExample) 2019-01-17
JP6929772B2 true JP6929772B2 (ja) 2021-09-01

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JP2017529614A Active JP6929772B2 (ja) 2014-12-05 2015-12-04 ワークピース欠陥検出用の装置及び方法
JP2021131177A Active JP7373527B2 (ja) 2014-12-05 2021-08-11 ワークピースの欠陥検出装置及び方法
JP2021131178A Pending JP2021175987A (ja) 2014-12-05 2021-08-11 個片化半導体デバイスの欠陥検出装置
JP2023181884A Pending JP2023174984A (ja) 2014-12-05 2023-10-23 半導体デバイスの欠陥検出装置及び方法
JP2024004513A Active JP7755668B2 (ja) 2014-12-05 2024-01-16 個片化半導体デバイスの欠陥検出装置

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JP2021131177A Active JP7373527B2 (ja) 2014-12-05 2021-08-11 ワークピースの欠陥検出装置及び方法
JP2021131178A Pending JP2021175987A (ja) 2014-12-05 2021-08-11 個片化半導体デバイスの欠陥検出装置
JP2023181884A Pending JP2023174984A (ja) 2014-12-05 2023-10-23 半導体デバイスの欠陥検出装置及び方法
JP2024004513A Active JP7755668B2 (ja) 2014-12-05 2024-01-16 個片化半導体デバイスの欠陥検出装置

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US (6) US10324044B2 (enExample)
EP (3) EP4354162A3 (enExample)
JP (5) JP6929772B2 (enExample)
KR (9) KR102741226B1 (enExample)
CN (3) CN107003254A (enExample)
MY (3) MY185911A (enExample)
PH (3) PH12022551948B1 (enExample)
SG (3) SG10201913246TA (enExample)
TW (2) TWI663394B (enExample)
WO (1) WO2016090311A1 (enExample)

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CN112816490A (zh) * 2021-03-16 2021-05-18 上海悦易网络信息技术有限公司 一种电子产品的自动检测设备及自动检测方法
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