SG11201704388YA - Apparatus, method and computer program product for defect detection in work pieces - Google Patents
Apparatus, method and computer program product for defect detection in work piecesInfo
- Publication number
- SG11201704388YA SG11201704388YA SG11201704388YA SG11201704388YA SG11201704388YA SG 11201704388Y A SG11201704388Y A SG 11201704388YA SG 11201704388Y A SG11201704388Y A SG 11201704388YA SG 11201704388Y A SG11201704388Y A SG 11201704388YA SG 11201704388Y A SG11201704388Y A SG 11201704388YA
- Authority
- SG
- Singapore
- Prior art keywords
- computer program
- program product
- defect detection
- work pieces
- pieces
- Prior art date
Links
- 238000004590 computer program Methods 0.000 title 1
- 230000007547 defect Effects 0.000 title 1
- 238000001514 detection method Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8841—Illumination and detection on two sides of object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/104—Mechano-optical scan, i.e. object and beam moving
- G01N2201/1047—Mechano-optical scan, i.e. object and beam moving with rotating optics and moving stage
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Textile Engineering (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462088284P | 2014-12-05 | 2014-12-05 | |
| US201562154109P | 2015-04-28 | 2015-04-28 | |
| PCT/US2015/064100 WO2016090311A1 (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG11201704388YA true SG11201704388YA (en) | 2017-06-29 |
Family
ID=56092564
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201704388YA SG11201704388YA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
| SG10202110739PA SG10202110739PA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
| SG10201913246TA SG10201913246TA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10202110739PA SG10202110739PA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
| SG10201913246TA SG10201913246TA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
Country Status (10)
| Country | Link |
|---|---|
| US (6) | US10324044B2 (en) |
| EP (3) | EP3164723B1 (en) |
| JP (5) | JP6929772B2 (en) |
| KR (8) | KR20220047684A (en) |
| CN (3) | CN107003254A (en) |
| MY (3) | MY181846A (en) |
| PH (2) | PH12017501024A1 (en) |
| SG (3) | SG11201704388YA (en) |
| TW (2) | TWI702390B (en) |
| WO (1) | WO2016090311A1 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20220047684A (en) | 2014-12-05 | 2022-04-18 | 케이엘에이 코포레이션 | Apparatus, method and computer program product for defect detection in work pieces |
| US10670531B2 (en) | 2016-01-04 | 2020-06-02 | Laser & Plasma Technologies, LLC | Infrared detection camera |
| CN107843991A (en) * | 2017-09-05 | 2018-03-27 | 努比亚技术有限公司 | Detection method, system, terminal and the computer-readable recording medium of screen light leak |
| US10724965B2 (en) | 2018-02-09 | 2020-07-28 | Massachusetts Institute Of Technology | Systems and methods for crack detection |
| US20190257876A1 (en) * | 2018-02-21 | 2019-08-22 | Asm Technology Singapore Pte Ltd | System and method for detecting defects in an electronic device |
| CN108872246A (en) * | 2018-05-29 | 2018-11-23 | 湖南科创信息技术股份有限公司 | Face sheet material regards planar defect detection system entirely |
| CN109100366A (en) * | 2018-08-10 | 2018-12-28 | 武汉盛为芯科技有限公司 | The detection system and method for semiconductor laser chip end face appearance |
| US10481097B1 (en) * | 2018-10-01 | 2019-11-19 | Guardian Glass, LLC | Method and system for detecting inclusions in float glass based on spectral reflectance analysis |
| US10746667B2 (en) * | 2018-11-27 | 2020-08-18 | General Electric Company | Fluorescent penetrant inspection system and method |
| US11650164B2 (en) * | 2019-05-15 | 2023-05-16 | Getac Technology Corporation | Artificial neural network-based method for selecting surface type of object |
| US11543363B2 (en) | 2019-05-24 | 2023-01-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for wafer bond monitoring |
| US11340284B2 (en) * | 2019-07-23 | 2022-05-24 | Kla Corporation | Combined transmitted and reflected light imaging of internal cracks in semiconductor devices |
| JP6755603B1 (en) * | 2019-12-25 | 2020-09-16 | 上野精機株式会社 | Electronic component processing equipment |
| JP7437987B2 (en) * | 2020-03-23 | 2024-02-26 | ファスフォードテクノロジ株式会社 | Die bonding equipment and semiconductor device manufacturing method |
| KR102255421B1 (en) * | 2020-08-11 | 2021-05-24 | 충남대학교산학협력단 | Method for Evaluating Defect in Monoclinic Gallium Oxide |
| JP2022137904A (en) * | 2021-03-09 | 2022-09-22 | 本田技研工業株式会社 | Method and device for inspecting surface |
| JP6906779B1 (en) * | 2021-03-11 | 2021-07-21 | ヴィスコ・テクノロジーズ株式会社 | Semiconductor chip inspection method and equipment |
| CN112816490A (en) * | 2021-03-16 | 2021-05-18 | 上海悦易网络信息技术有限公司 | Automatic detection equipment and automatic detection method for electronic product |
| JP2024516858A (en) | 2021-05-05 | 2024-04-17 | ベシ スウィツァランド エージー | Apparatus and method for optically inspecting three or more sides of a component - Patents.com |
| TWI797689B (en) * | 2021-05-24 | 2023-04-01 | 馬來西亞商正齊科技有限公司 | Apparatus and method for performing internal defects inspection of an electronic component |
| CN116757973B (en) * | 2023-08-23 | 2023-12-01 | 成都数之联科技股份有限公司 | Automatic repair method, system, equipment and storage medium for panel products |
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-
2015
- 2015-12-04 KR KR1020227011485A patent/KR20220047684A/en active Application Filing
- 2015-12-04 EP EP15865251.1A patent/EP3164723B1/en active Active
- 2015-12-04 TW TW108116788A patent/TWI702390B/en active
- 2015-12-04 CN CN201580065271.8A patent/CN107003254A/en active Pending
- 2015-12-04 TW TW104140838A patent/TWI663394B/en active
- 2015-12-04 KR KR1020227023563A patent/KR20220103199A/en not_active Application Discontinuation
- 2015-12-04 WO PCT/US2015/064100 patent/WO2016090311A1/en active Application Filing
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