CN101021490B - Automatic detecting system and method for planar substrate - Google Patents
Automatic detecting system and method for planar substrate Download PDFInfo
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- CN101021490B CN101021490B CN2007100876561A CN200710087656A CN101021490B CN 101021490 B CN101021490 B CN 101021490B CN 2007100876561 A CN2007100876561 A CN 2007100876561A CN 200710087656 A CN200710087656 A CN 200710087656A CN 101021490 B CN101021490 B CN 101021490B
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
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- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G01N2021/8812—Diffuse illumination, e.g. "sky"
- G01N2021/8816—Diffuse illumination, e.g. "sky" by using multiple sources, e.g. LEDs
Abstract
The invention discloses an automatic detecting system and method of flat base plate, which contains an optical module. The optical module has illuminating module and lens array leading beam to part of base plate. Lens array contains a Fresnel lens and optical module contains a camera. The camera has time delay integral (TDI) sensor, which receives reflected light producing by illuminating source and base plate. Telecentric imaging lens leads reflected light from base plate to camera. Illuminating module has a controller connected with a source containing multi-group LED (each LED can radiate light with different wavelength) and the controller control each LED independently. The invention can analyze large-scale flat base plate quickly, has high sensitivity and can provide high-resolution picture.
Description
Technical field
The invention belongs to the detection system field, especially for the system and method for the defective of mint-mark figure on the detection plane substrate.
Technical background
The defective monitoring is the committed step of production and processing plane display class large substrate.Flat-panel screens is mainly used in the notebook personal computer, computer plane display, mobile phone and digital instrument display screen, car navigation system, video camera, projection TV and LCD TV, and the big and small display screen on many instruments.The plane shows and is made up of two transparency carriers (generally being glass).Mint-mark has control circuit and optics color filter on the substrate, is full of liquid crystal between two substrates.The process of flat-panel screens product is very complicated, and must under super-clean environment, carry out, otherwise is easy to receive the various defective effects in the process, manufacturer's defective display of might having to repair or scrap.This will reduce yield rate, increase cost, so control and detection to base board defect depended in the success of manufacturer to a great extent.
The defective that many types are arranged in the process of flat-panel screens; Defective includes but not limited to: dust fall (dropping on the foreign matter on the substrate), open circuit and short circuit, chemical residual (staying the chemical substance of substrate surface); Through hole (connect bilevel hole, this hole possibly cause short circuit).These defectives are not worked by some pixel of substrate or the monoblock substrate is not worked.
Carry out the substrate detection in process of production and can help quality control and flow process control, and help to reduce the material unaccounted-for (MUF) that defective causes.Flat-faced screen detects and faces the special technique challenge, and reason is that substrate uses transparent material, and the groove on surface has sandwich construction, and the pattern of mint-mark is intensive, the size of defective very little (in micron dimension), and substrate area is too big, and detection time is very short.Automatic optical detecting system is used for the process of planar transistor liquid crystal display substrate and SIC (semiconductor integrated circuit), and the quality of diagnosable product improves yield rate, reduces production costs.
Traditional automatic optical detecting system uses camera that substrate is taken pictures.The image that analysis is taken pictures can be found the defective on the substrate, and image can provide the coordinate (x, y coordinate, longitude, latitude, zone or the like) of defective, size, kind.Graphical analysis not only provides defective locations and kind, and number of defects purpose trend also is provided.These information help manufacturer to optimize their yield rate management system.
The performance of automatic optical detecting system is mainly by detection speed and sensitivity decision.The continual renovation of process technology improves speed of production greatly, and it is big that substrate also constantly becomes, and the pattern line-width of mint-mark is also more and more littler on the substrate, and all these require automatic optical detecting system to have the sensitivity of higher detection speed and Geng Gao.Be can the large-scale planar substrates of high speed analysis (flat liquid crystal display substrate now to the requirement of automatic optical detecting system and method; Semiconductor crystal wafer or the like); The detector of detection system must have very high sensitivity simultaneously, and high-definition picture can be provided.
Summary of the invention
For addressing the above problem, the present invention provides a kind of planar substrates automatic checkout system and method, can the large-scale planar substrates of high speed analysis, and have high sensitivity, and high-definition picture can be provided.
The objective of the invention is to realize like this: a kind of planar substrates automatic checkout system is characterized in that comprising: a light fixture; A lens combination is used for the specific region of the light beam of guiding illumination assembly to substrate, and lens combination comprises a Fresnel Lenses at least; Be used to receive the reflected light after illumination light and the substrate surface effect with a camera, camera comprises a time delay integration (TDI) sensor.
A kind of planar substrates automatic testing method is characterized in that comprising: produce illumination; Adopt a zone of Fresnel Lenses guiding light to substrate; Adopt the time delay integration (TDI) sensor to receive the reflected light after incident light and substrate effect; With the image of gathering reflected light information generation substrate.
Below said automatic optical detecting system and method be the detection that is used for mint-mark pattern defect on the planar display substrates, judge and classification.Flat-panel screens comprises LCD, Organic Light Emitting Diode substrate, mask plate and semiconductor crystal wafer.Automatic optical detecting system and method are referred to as the AOI system here, and it is made up of optical module.Optical module comprises lighting source and lens arra, is used for projecting substrate surface to the light of light source and gets on.Lens arra comprises at least one Fresnel Lenses among the present invention.Optical module also comprises a camera, is used to receive the reflection of light part, scattered portion or the transmissive part that project substrate.Camera comprises time delay integration sensor or linear scan charge-coupled device (CCD) (CCD).A telecentric lens is the reflected light of substrate, and scattered light or transmitted light project camera and get on.
Illumination section has a controller to control a plurality of light emitting diodes (LED) light source, the light of different LED emission different wave length.Controller can be controlled each led light source separately.Illumination section comprises frontlighting light source and back lighting light source, and each light source comprises light field and dark field.Another automatic optical detecting system instance of here describing comprises the single led light source that the different wave length light wave can take place.A feedback system is connected to the output terminal of camera, the gain of this feedback system control illumination light intensity and camera.Camera is connected with a cable or optical cable with disposal system with IMAQ.
The present invention has high sensitivity and high-definition picture can be provided; Output intensity through adjustment different wave length LED lamp can be optimized Defect detection sensitivity; Thereby through adopting Fresnel Lenses can reduce lens thickness weight reduction and volume; Through adopting the TDI camera in the relatively short sampling time, to gather a large amount of signals, therefore compare with other videoscanning method, a kind of more linear scan of high response speed that has can be provided.
Description of drawings
Fig. 1 is the synoptic diagram of an instance of automatic optical detecting system optical module of the present invention;
Fig. 2 is the synoptic diagram of another instance of automatic optical detecting system optical module of the present invention;
Fig. 3 is the structural drawing of a sample instance of Fresnel Lenses in the automatic optical detecting system optical module of the present invention;
Fig. 4 is the present invention uses the method instance of dark field detection in automatic optical detecting system a synoptic diagram;
Fig. 5 is the synoptic diagram of the instance of used for optical module light field and the dark field detection of the present invention in automatic optical detecting system;
Fig. 6 is with the synoptic diagram of the instance of the optical module of back lighting in the automatic optical detecting system of the present invention;
Fig. 7 is a synoptic diagram of making the optical module instance of back lighting in the automatic optical detecting system of the present invention of catoptron;
Fig. 8 is that optical module uses positive light in the automatic optical detecting system of the present invention, back lighting, the synoptic diagram of the example combinations of light field and dark field detection;
Fig. 9 is the synoptic diagram that automatic optical detecting system of the present invention has the optical module instance of feedback system;
Figure 10 is the synoptic diagram of automatic optical detecting system module instance of the present invention;
Figure 11 is the synoptic diagram of automatic optical detecting system of the present invention, and this system is formed by the different optical module combinations, has different monitoring and top layer measurement function instance;
Figure 12 is the synoptic diagram that the present invention is used to detect the automatic optical detecting system instance of large substrate;
Figure 13 is the synoptic diagram of the high speed examples of actuators of detection system of the present invention.
Embodiment
Following description provides many details to describe and understand the instance of a detection system and method.Lack one or more details even the technician in present technique field can recognize, perhaps use other element, still can realize these instances.In other words, well-known structure is not presented at here with operation, does not perhaps describe in detail.
Fig. 1 is the calcspar instance of automatic optical detecting system optical module 605.Optical module 605 is used for detecting substrate and carries out the judgement and the location of defective, can realize this goal through detection and incident intensity and flaw indication that integral time, product was directly proportional.Optical module 605 comprises a plurality of led light sources, and the light that each led light source sends different wave length incides on the planar substrates to be detected.Though optical module 605 has the light of three wavelength of three led light sources generations in this example, can use the LED or the wavelength of different numbers in the practical application equally.The optical module 605 of multiple light courcess comprises that it is λ that LED 301 produces wavelength
1Light, it is λ that LED 302 produces wavelength
2Light, it is λ that LED 303 produces wavelength
3Light, the output beam of LED is through lens 311,312 and 313 collimations, and merged by dichroic beamsplitter 314 and 315.Dichroic beamsplitter 314 reflection wavelengths are λ
2Light and transmission peak wavelength be λ
1Light.Dichroic beamsplitter 315 transmission peak wavelengths are λ
1And λ
2Light, reflection wavelength is λ
3Light.
The light intensity of 3 wavelength light of control module 330 independent controls.The light intensity I of sample surfaces is provided by formula:
I＝I
1+I
2+I
3
Here I
1, I
2, and I
3Be respectively that wavelength is λ
1, λ
2, λ
3The output intensity of led light source.
The light intensity I of led light source 301-303
1, I
2, and I
3Can from 0 to 100% adjustment separately, like this can be to the sensitivity of different samples surface optimization defects detection.For example, be plated in the optical characteristics of the film on the substrate and the reflection of light rate that thickness all can influence different wave length.So the light of some wavelength can have higher Defect detection sensitivity than the light of other wavelength.The adjustability of the light relative intensity of different wave length can be optimized Defect detection sensitivity, but is very difficult to realize this point with traditional optical fiber source.
In addition because the relative weighting of the light of different wavelengths is adjustable continuously, make optical module 605 can compensation optical system to the unevenness of the optic response of the unevenness of different spectral transmissions and ccd sensor.Therefore, optical module 605 can provide a true smooth illumination spectrum, and this is extremely important for detecting the substrate that produces many noises because of surface coating thickness is irregular.In addition, increase another light source and can also realize illumination and the imaging of details in a play not acted out on stage, but told through dialogues (not diagram), such as with laser with an angle of inclination irradiating surface.
In the optical module 605 lens pillar 202 and a sphere lens 203 are being arranged between colored filter 315 and spectroscope 307 on the illumination path.Lens pillar 202 and sphere lens 203 be through configuration and location, and the light that is used to control each LED output light source is incident upon the shape that forms on the substrate, and the field of illumination that collects in substrate surface in the present invention is a narrow wire zone.The field of illumination also should be optimized, at least with the length breadth ratio of pixel, size, the visual field of imaging sensor on substrate in one or all be complementary.Optical module 605 also comprises the imaging len 205 on the reflection paths that is positioned at spectroscope 307; The beam split minute surface 308 of spectroscope 307 so just can be through spectroscope 307 imagings from the light beam of sample surfaces 204 or substrate towards imaging len 205.Optical module 605 has specifically realized eliminating the aberration that is caused by spectroscope thickness by this method.Light from imaging len 205 is invested the camera 206 that linear sweep charge-coupled device (CCD) (CCD) or time delay integration device (TDI) are housed, and is described below.
Fig. 2 is the another kind of implementation method of calcspar of the optical module 200 of an automatic optical detecting system.The optical module 200 of automatic optical detecting system comprises a plurality of led light sources, and each led light source is through being provided with the light that can export different wave length.Although three led light sources are arranged in the optical module 200 in this example and can export the light of three kinds of wavelength separately respectively, this device can also dispose different led light sources and/or wavelength.It is λ that optical module 200 with a plurality of light sources comprises LED 301 output light source wavelength
1, LED302 output light source wavelength is λ
2, LED303 output light source wavelength is λ
3The light source of output is merged by dichroic beamsplitter 314 and 315 via lens 311,312 and 313 calibrations again.Dichroic beamsplitter 314 reflection wavelengths are λ
2Light with the projection wavelength be λ
1Light.Dichroic beamsplitter 315 transmission peak wavelengths are λ
1And λ
2Light, reflection wavelength is λ
3Light.
The light intensity of the light source of three kinds of wavelength of control module 330 independent controls.The calculating of sample surfaces illumination light intensity such as aforementioned shown in Figure 1.The light intensity I of led light source 301-303
1, I
2, and I
3Can be independently by regulating in 0 to 100% range of light intensity, to optimize the sensitivity of different sample surfaces defects detection.
Between colored filter 315 and spectroscope 307, comprising a lens pillar 202 and a sphere lens 203 on the illumination path in the optical module 200.Lens pillar 202 and sphere lens 203 be through configuration and location, and the light that is used to control the LED output light source is incident upon the shape on the substrate.The field of illumination that collects in substrate surface is a narrow wire zone.The field of illumination should be optimized, at least with the length breadth ratio of pixel, size, the visual field of imaging sensor on substrate in one or all be complementary.Optical module 200 comprises the imaging len 205 on the opticpath between spectroscope 307 and the sample surfaces 204; The spectroscope face of spectroscope 307 is towards camera 206; It directly reflexes to the light of coming on the sample surfaces 204 308 on the camera 206 that linear sweep charge-coupled device (CCD) (CCD) or time delay integration device (TDI) are housed, and the light beam from sample surfaces 204 or substrate just can not pass through spectroscope 307 like this.The optical module 200 of automatic optical detecting system has specifically realized eliminating the aberration that is caused by spectroscope thickness by this method.
Light module 200 is comprising lens 311,312 on the light path, 313,316,202 and 203 between light source and spectroscope 307.Each lens 311,312,313,316,202 and 203 is through configuration, and collection and guiding are from light to the substrate surface 204 of light source 301-303, and each lens 311,312,313,316,202 and 203 all is a Fresnel Lenses.
Shown in Figure 3 is the instance of optical module 200 contained Fresnel Lenses 300.Optical module 200 usefulness acrylic resin Fresnel Lenses 300 substitute conventional lenses.The gossamery plastic sheet that Fresnel Lenses 300 forms with direct press mold has replaced the required lot of materials of traditional fabrication camera lens.Fresnel Lenses 300 can have big aperture and short focal length, but need as other lens, not expend very heavy and material significant volume for this reason.Compare with other type lens, Fresnel Lenses 300 is lighter, and transmittance is higher.Because Fresnel Lenses is very thin, light loss very little or that almost do not cause because of absorption.Fresnel Lenses 300 is made up of one group of concentric annular structure that is called as Fresnel region, has reduced the required lot of materials of traditional spheroidal lens.To each Fresnel region, the integral thickness of lens significantly reduces, and equivalence has same curvature but discontinuous a plurality of surface for the standard lens that has a continuous surface with is cut into a cover.So just can significantly reduce lens thickness (so weight reduction minimizing volume), descend but cost is the lens imaging quality.The configuration of light module 200 can be adopted Fresnel Lenses 300; Be because tdi sensor only reads a pixel on the direction of scanning at every turn; Rather than picture; Therefore the illuminating line of optical module 200 is wider than imaging area far away, thus only utilized from the teeth outwards one very little, uniform linear zone relatively.Therefore, any image quality decline that is produced by Fresnel Lenses can not hinder Fresnel Lenses to be applied in the optical lighting system of automatic optical detecting system of the present invention.
Reflected light 308 from substrate 204 should be vertical with TDI camera 206, because moving of imaging direction is consistent with electric charge moving direction (through the sensor of camera 206).Referring to Fig. 1, the configuration of optical module meets this requirement, and it injects substrate surface 204 with incident light through spectroscope 307.Same spectroscope will import TDI camera 206 by scattered light and/or the transmitted light that substrate 204 reflects.Imaging len 205 is arranged in light path will import TDI camera 206 from the light of substrate surface 204.
Light module 200 has adopted more compact design, is placed on imaging len 205 between spectroscope 307 and the substrate surface 204, and the reflected light from substrate 204 can collected and guide to imaging len 205 just like this.Imaging len 205 in the optical module 200 has less relatively operating distance.When the enlargement ratio of optical module 200 fixedly the time, the distance between imaging len 205 and the TDI camera lens 206 also just shortens.
For these reasons, the imaging len that comprises of optical module 200 205 adopts telecentric lenses.Generally speaking, the configuration of telecentric lens is to make the light spindle parallel of having a few from object or image.Telecentric lens can provide coaxial imaging.It is because last image has fixing enlargement ratio and geometric configuration that automatic optical detecting system of the present invention adopts telecentric lens; Telecentric lens makes the size of object not receive the position influence of subject image in the visual field, even also it doesn't matter when the distance of camera lens has some to change when object.Adopt telecentric lens and led light source can optimize the effect of the heart far away simultaneously, because LED is that it can produce parallel light beam through the telecentric lens illumination.Therefore, incident light with by the reflected light of substrate surface 204 with identical light path through imaging len 205.
Different with conventional lenses, telecentric lens has identical enlargement ratio to the object apart from the camera lens any distance, so telecentric lens all generates equirotal image to the object of any distance, keeps fixing visual angle within sweep of the eye whole.If an object too closely or too far all can cause focusing fuzzy apart from telecentric lens, even but focusing on fuzzy image also all has identical size with the focusing distinct image.
Therefore the telecentric lens that is applied to NI Vision Builder for Automated Inspection can provide the image of fixed size and geometric configuration in the certain distance scope and in the whole visual field scope.Adopt the automatic optical detector device vision system of telecentric lens thereby overcome the common problem of NI Vision Builder for Automated Inspection of many employing conventional lenses; These problems include but not limited to: change the change of the apparent size that causes owing to object distance; Owing to the modification that does not cause (use conventional lenses, the visual angle of object on the edge of time the and object visual angle when central area, the visual field is different) in the central area in the visual field.
Substrate to be detected of generalized case has two surfaces: the substrate of bottom and the graphic structure on upper strata.Telecentric lens can not received the shadow image of reflection from bottom (substrate such as us under the graphic structure of interested upper strata); Because when incident ray normal incidence was to substrate, shadow image was just in time under graphic structure.The image that TDI obtains is the top view of substrate.The shade of all lower floors can be blocked by the figure on them.Shadow image is as background noise in Flame Image Process.Therefore adopt telecentric imaging lens can reduce the ground unrest of the optical module 200 of automatic optical detecting system.
Optical module 200 comprises a TDI camera 206 that is used to catch substrate image, as stated.The TDI camera is that a kind of linear scan camera includes a tdi sensor.Usually the TDI camera can be accumulated multiexposure, multiple exposure to same object, thereby has effectively increased the integral time of collecting incident light.When the object that is forming images was kept in motion, the motion of object and the exposure of TDI should keep synchronously to guarantee picture quality.
The TDI camera can be gathered a large amount of signals in the relatively short sampling time, therefore compare with other videoscanning method, and a kind of more linear scan of high response speed that has can be provided.Under identical incident intensity situation, the velocity sweeping that the TDI camera can be higher, or under low light level situation, with identical velocity sweeping.
Tdi sensor comprises multirow photodetector or sensor (like, photodetectors from 4 row to 96 row).When each photodetector in delegation's photodetector array receives the bump of photon, just produce and the directly proportional electric charge of photon number.Gather the image of mobile object based on the system of TDI camera with the method for time delay multiexposure, multiple exposure,, make it that to gather the maintenance of Line Chart picture synchronous with the TDI camera so automatic optical detecting system moves substrate to be detected.This motion makes substrate with the mode of the each line visual field through the TDI camera lens, and is the same through scanner as file.
When substrate motion process TDI camera, the linear image of collection (part of substrate) is successively by a row detector migration next line detector.Simultaneously, the electric charge of TDI mobile camera moving storage is consistent they and the image of motion.So, when substrate motion process TDI camera, represent the electric charge of substrate image also to flow to photodetector and the constantly accumulation that closes on successively.By this method, tdi sensor gets up the accumulation of the linear image on the several rows sensor (integration), makes image obtain more illumination.The TDI camera transmits the information of linear image to image pick-up card, complete image of the information integrated one-tenth of pixel.
Picture signal through integration has better signal to noise ratio (S/N ratio) and dynamic range.Can realize the faster dynamically collection of image more integral time.Further because the operation of TDI camera can be effectively the light-intensity variation of average DC light source, thereby can replace high power with led light source, the direct current Halogen lamp LED of high flow rate and high temperature, and then reduced the maintenance cost of system.Although automatic optical detecting system is to use a TDI camera 206 here; Other various highly sensitive detectors are contained within the optical module 200 of this automatic optical detecting system; For example: the charge-coupled image sensor of enhancement mode (ICCD); Photomultiplier (PMT), linear sweep charge-coupled image sensor, complementary metal oxide semiconductor (CMOS) (CMOS).
Above-mentioned automatic optical detecting system adopts the bright field detection principle to carry out substrate and detects.The light field method is directly obtained the image of substrate surface by the reflected light of substrate.Some defective (like cut, particle etc.) has very strong details in a play not acted out on stage, but told through dialogues optic response, and some defective has very strong light field optic response.Therefore, for reliable detection goes out various types of defects, a kind of design of automatic optical detecting system has adopted dark field methods to detect substrate as replenishing of light field method in addition.
The synoptic diagram that adopts the dark field detection method for automatic optical detecting system shown in Figure 4.In the dark field detection method incident light 601 by a place or many places oblique incidence to substrate.Produce reflection ray 602 and scattered beam 603 after incident ray 601 and the substrate effect.Lens combination 604 is collected from the scattered light 603 of substrate surface and with detector of it importing.
Fig. 5 is the synoptic diagram of automatic optical detecting system optical module 500, and this system uses light field and dark field detection method.Configuration and function such as preceding Fig. 2 said (optical module 200) of the bright field detection part of this optical module 500.Optical module 500 also comprises a dark field 701 except that containing aforementioned light field led light source 301-303.Dark field 701 comprises one or more LED, bulb, optical fibre illumination and LASER Light Source or the like.Lens 702 will be assembled to substrate surface 204 from the incident light 703 of dark field 701.The dark ground illumination zone should be overlapping with the bright field illumination zone.Incident light 703 generates reflected light 704 and scattered light 705 with substrate surface 204 effects.Imaging len 205 is collected scattered light 705 and imaging on TDI camera 206.
Automatic optical detecting system also uses backlight or dorsal part throws light on obtains substrate image.Backlightly be set to place a light source under the substrate of needs imaging.Some type flaw (like the island defective on the glass substrate) that can make backlight obtains very high contrast.When sample to be detected was glass substrate, backlight can detect glass surface and the inner defective of glass.
Fig. 6 is the synoptic diagram that adopts the automatic optical detecting system of back lighting.Backlightly can strengthen the recall rate that some front light source is difficult to detected defective.Automatic optical detecting system optical module 600 comprises front light source 804 and backlight 803.Front light source 804 can comprise aforementioned all light sources.By light source can be a LED, bulb or optical fiber source.The numerical aperture of backlight 803 should get into the TDI camera to guarantee light as much as possible with front light source 804 couplings.Two kinds of light sources illuminate the same zone of substrate surface.Optical module 600 comprises the air supporting support 603 of two band vacuum, and the zone between the support 603 is a backlight 803.Support comprises a compressed air inlet 801 and a vacuum outlet 802, and wherein vacuum provides and keeps substrate is stablized high-speed motion in air supporting downward suction.
It is to be positioned over the mirror of different reflectivity under the glass substrate that another kind provides the back light method.Fig. 7 contains optical module 700 synoptic diagram of minute surface 903 as the automatic optical detecting system of back lighting.The light of front light source 804 output is injected minute surface 903, from the reflected light of minute surface 903 back light is provided.Minute surface 903 has a triangular prism shaped structure, but is not limited thereto.Each face of triangular prism shaped minute surface 903 is coated with the film of different reflectivity.Select the backlight minute surface of different reflectivity for use to substrate of different nature, through rotation or place suitable triangular prism minute surface and provide the varying strength reflection ray as backlight.Reflected light from substrate surface and minute surface all gets into TDI camera 206.The zone of placing minute surface under the substrate is than placing the regional little many of other light source (like LED, bulb, optical fibre illumination).The film of random geometry and any reflectivity and/or type is adopted in a kind of design of automatic optical detecting system in addition, and dissimilar lighting sources is such as the diffuse scattering light source.
Fig. 8 is the synoptic diagram that adopts the automatic optical detecting system optical module 800 of front light source and backlight and light field and dark field detection method.Automatic optical detecting system optical module 800 includes a front light source 804 and backlight 803 that is used for light field, as previously mentioned.Front light source 804 and/or backlight 803 can be one or more LED, bulb, optical fibre illumination.Automatic optical detecting system 800 includes a front light source 701 and backlight 1001 that is used for dark ground illumination, as previously mentioned.Dark field 1001 comprises one or more LED, bulb, optical fibre illumination, or LASER Light Source.Dark field field of illumination and bright field light source field of illumination overlap.Front lighting source structure and operation in the optical module 800, similar with foregoing optical module 200 (Fig. 2) and optical module 500 (Fig. 5) respectively when being used for light field and dark field detection.Backlight configurations in the optical module 800 and operation, similar with foregoing optical module 600 (Fig. 6) and optical module 700 (Fig. 7).
No matter use which kind of light source type recited above or structure, the led light source light intensity must keep stable in the substrate detecting operation.Although led light source has very long serviceable life relatively, their light intensity can decay with LED or semi-conductive aging effect.A cover feedback system is adopted in the design of automatic optical detecting system, checks and compensate the decay of any LED intensity through a standard model.With the light intensity that standard model comes periodic measurement LED, if light intensity changes (as descending), feedback system will be adjusted the LED working current to provide automatic optical detecting system required light intensity.
Fig. 9 has the synoptic diagram of optical module 900 of the automatic optical detecting system of feedback system.Optical module 900 in this example comprises the optical module 200 described in the prior figures 2, but also can comprise any optical module described in this patent.Optical module 900 comprises a feedback system; This feedback system contains a control module 1102; The gain output of may command TDI camera 206 and the input of LED power supply 1103, the output of power supply 1103 and led light source 301-303 are bound up, so may command is supplied with the electric current of led light source.
In calibration operation, optical module 900 usefulness minute surfaces 1101 are the plane as a reference, and will be used as the standard of calibration automatically from the reflected light of this minute surface 1101.Get into the sensor of TDI camera 206 by the light of minute surface 1101 reflected backs, after measurement, input to control module 1102.If catoptrical reading is less than preset value, control module just produces a signal or order is got back to preset value with the light intensity readings of electric current on TDI camera 206 that driving power 1103 increases led light source.
The standard minute surface also can be used for the calibration of TDI camera, and the output of each tdi sensor pixel is not necessarily identical when using reference mirror 1101.The difference of pixel output possibly come from the unevenness of each pixel optics response, imaging len and light source.The first step of TDI camera calibrated is the output of after it receives the light from reference mirror 1101, measuring each pixel.Next step is the output of duplicate measurements under different light intensity, and this step can realize through the minute surface that reduces the illumination light intensity or use different reflectivity instead.The result who measures is used for confirming the parameter of two calibrations: the slope and the skew of each pixel or one group of pixel.When actual substrate was measured, the output of each pixel at first deducted skew, multiply by the slope of this pixel again, came unevenness between correction pixels with this method.
The another one feedback system is that the gain that is used to control TDI camera 206 sensors makes the dynamic range of sensor reach maximum.The maximum dynamic range of tdi sensor is controlled or adjusted to feedback system in two steps: at first confirm the numeral output 1 when tdi sensor is saturated, the numeral output 2 when confirming the picture signal maximal value then.So feedback system is provided with and keep the value of TDI gain to be substantially equal to numeral output 1 divided by numeral output 2.This yield value can make sensor reach maximum dynamic range.
The automatic optical detecting system that this patent is described is a modular system, can construct again or increase and decrease, to be applicable to substrate to be detected or detecting operation.
Figure 10 is the synoptic diagram of module 1000.Module 1000 comprises the combination of one or more assemblies or assembly, as, module comprises 1201, two lens 1202 of at least one light source and 1203 and is used for lead beam to substrate, and spectroscope 1204 is used to reflect light from substrate to TDI camera 1206.Imaging len 1205 becomes the picture of substrate on TDI camera 1206.A cable or an optical fiber 1209 that links to camera lens is used for image information is transferred to image pick-up card 1207 by TDI camera 1206.Image pick-up card 1207 collections and analysis of image data, and view data is provided to pattern process computer 1208.Each module 1000 all is independently, and its quantity and/or type of being installed in the system all can be adjusted according to specific substrate and testing process.
Such as, Figure 12 has shown that an automatic optical detecting system includes three optical modules 605.
Figure 11 is the synoptic diagram of an automatic optical detecting system 1100, and this system comprises an optical detection module 801 takes pictures with check, repairs, and measures module 802-806.Optical detection module 801 that automatic optical detecting system 1100 contains a plurality of (as 3); Also has an optics check photo module 802 simultaneously; Live width and line degree of registration measurement module 803; A film thickness measures 805, one reparations of the grand defectoscopy module of 804, one numerals of module module 806 and repairs the defective that is similar to short circuit and open circuit with cut and chemical vapor deposition (CVD) (or similar techniques).Live width/alignment (CD/Overlay) measures and requires to reach 50nm or better degree of accuracy.Any very little vibration of substrate all can make measurement result exceed accuracy rating.The air supporting Suction type frame of automatic optical detecting system can guarantee the measuring accuracy of CD/Overlay, because the high-speed motion that it provides downward suction to make that glass can be stable in air supporting.Thereby on automatic optical detecting system 1100, can realize multiple function.Other design can be adopted the different combinations of above-mentioned module.
The raw data that is produced by the TDI camera of automatic optical detecting system is as stated delivered to image pick-up card and is used for Flame Image Process.Traditional automatic optical detecting system adopts a kind of camera lens tie cable to connect the TDI camera and image pick-up card carries out image data transmission.It is that a kind of Data Transport Protocol needs specific cable that camera lens connects.The camera lens tie cable is limited by the twisted-pair feeder degree of tightness, the restriction of the strict demand of shielding and length.Automated optical in reality detects in the application; The TDI camera (as; Be positioned on the slide rail on the platform) and image pick-up card (as being positioned on the pattern process computer) between cable length can meet or exceed 10 meters, like this just need repeater to come the integrality of holding signal.In addition, because the volume of camera lens tie cable very big (diameter is approximately 15 millimeters) is so many cable distribution, all need be in many places around coming can to become very complicated and difficult around going.And these cables are because antenna effect meeting interferes with each other so that destroy data-signal.
Automatic optical detecting system has replaced the camera lens tie cable between TDI camera and the image pick-up card with optical fiber.It is converted into light signal with the electric signal output of TDI camera earlier, then by optical signal transmission fiber.At the image pick-up card end, light signal is changed the telegram in reply signal once more.Very thin, light and submissive of optical fiber need not repeater and still can connect remote assembly, so image pick-up card or other data processors can be away from automatic optical detecting systems.It will be further appreciated that light signal does not receive electromagnetic interference effect, compare with the camera lens tie cable and have wideer bandwidth (so allow higher data traffic).
Figure 12 is the automatic optical detecting system 1200 that is used to detect large-size substrate.Automatic optical detecting system 1200 comprises that a platform 601 contains an air supporting support 602 and an air supporting vacuum preload support 603.Automatic optical detecting system 1200 comprises at least one optical module 605 (like 3 optical modules 605).Automatic optical detecting system 1200 is used to detect large substrate such as LCD (LCD) glass substrate 606, but is not limited thereto.Optical module 605 comprises lighting source and image-forming assembly, and (like optical module among Fig. 2 200, optical module 500 among Fig. 5 specifically as previously mentioned; Like 600 figure of optical module among Fig. 6; Like optical module among Fig. 7 700, like optical module among Fig. 8 800, like optical module among Fig. 9 900)
In detecting operation, line triggers TDI and all can generate a substrate image that pixel is wide each time.The wide regional long limit of linear image of pixel parallels with the driving cephalomotor linear motor axle 604 of optics (x axle).Glass 606 edges and the motion of linear motor axle 607 (y axle) parallel direction, and by air supporting support 602 and 603 supports of vacuum preload air supporting support.Vacuum preload air supporting support 603 provides strict flying height control for the glass that in thin layer air supporting, moves.Linear motor axle 604 drives optical module step by step along the x axle, detects up to whole glass to finish.
After each substrate is loaded on the detection system 1200, must come align substrates according to the coordinate of platform.Therefore, need to adopt at a high speed, high resolving power, the actuator of pinpoint accuracy and long shift length is done the aligning of substrate.The high speed base plate alignment can guarantee high processing speed (or shorter processing time) and higher productive capacity, and long shift length can be adjusted bigger loading error.High resolving power in the automatic optical detecting system, the pinpoint accuracy actuator can be realized meticulous aligning at microscopically, thereby accurate aligning is provided, location and registration.
Figure 13 shows a detection system synoptic diagram that uses the high speed actuator.High speed actuator 1301 includes but not limited to, like pneumatic actuator, and voice coil actuator, linear motor actuator and solenoid.High speed actuator 1301 comprises that one is aimed at bolt 1304, is used for the aligning or the location of substrate 1305.Substrate can be loaded under spring or the action of gravity own on the aligning bolt 1304.Aligning bolt 1304 contacts with substrate 1305 and is driven by high speed actuator 1301.The hard stop position 1302 of aiming at bolt is by 1303 controls of high resolving power actuator.The expulsive force that is produced by high speed actuator 1301 is less than the reverse direction pulling force that is produced by high resolving power actuator 1303.By the hard stop position 1302 of high resolving power actuator 1303 controls, the rearmost position of bolt or the degree of accuracy and the resolution of aligning are aimed in decision.
Detection system described in the invention and method all can be realized by various programmable circuit; Comprise that PLD (PLDs) is like field programmable gate array (FPGAs); Programmable logic array (PAL) device; The device based on battery of electronic programmable logic and memory device and standard, the application of special IC.Also have some possible methods can realize detection system and method in addition, comprise the microprocessor (like electronics erasable programmable read-only memory (EEPROM)) of being with internal memory, embedded microprocessor, firmware, software or the like.Further, this detection system and method can be by the circuit simulations based on software, discrete logic devices (continuous with combination), and self-defining device, fuzzy logic (in neural network), the amalgam of quantum device and above various devices is realized.Certainly just various types of components can be provided at developing device technology; As; Mos field effect transistor (MOSFET) technology is like complementary metal oxide semiconductor (CMOS) (CMOS), and dipole is technological like emitter coupled logic (ECL) device (ECL), polymer technology (like silicon-conjugated polymer and metal-conjugated polymer-metal structure); Analog-and digital-hybrid device, or the like.
It should be noted that the assembly available computers design aids in the various detection systems and method is described among the present invention; And it is expressed by various computer-readable medium: from their behavior with the mode of data and/or instruction; Register shifts, logic module, transistor; Layout, and/or other characteristics.Formative data and/or instruction set that computing machine can be discerned medium comprise; But be not limited to; Like various read-only storage media (like optics; Electromagnetism or semiconductor storage medium) with via wireless, optics or cable or their combination can the formatted data and/or the carrier wave of instruction set.
Example through these formatted datas of carrier-wave transmission and/or instruction set does, but is not limited to, through combining or connect one or more Data Transport Protocols (like HTTP, FTP, SMTP etc.) transmission (upload, download Email etc.).In conjunction with or ways of connecting include, but not limited to wired connection, wireless connections, the mixing of wire/wireless connects.Further, connected mode can include, but not limited to provide the diverse network and/or the networking component (not showing) of Communications service.Mentioned network and corresponding networking component include but not limited to local area network (LANs), regional network (MANs), wide area network (WANs), private network, terminal network and internet.When accepting through one or more computer-readable mediums in a computing machine when these data of said system and method and/or based on the expression formula of instruction, the operation processing unit (like one or more operation processing unit) of the computing machine that is attached thereto through executable program just can be handled them.
Only if clear and definite context is arranged in addition, all descriptions, " comprising " " comprises " and similarly is interpreted as the anti-meaning that the word that comprises is " unique " or " completely ", that is to say the explanation of say so " including but not limited to ".In addition, word " here ", " hereinafter ", " top ", " following " and similar pronoun all are to quote the present invention as a whole rather than refer to particular of the present invention.When with " or " quote one during by two or more multinomial tabulation, following explanation contained in this speech: in the tabulation any one, the combination arbitrarily of all and each item.
If the specific description of said detecting system and method are not intended to exhaustively describe or limit the system and method that is described.To specific realization, for example, detection system and method are described as illustrative purposes herein, and various correction is possible in other the detection system and the scope the inside of method, as should appreciate that in those relevant technologies of being familiar with.The detection system that is provided herein and the teaching of method can be applicable to other disposal systems and method, not only to above-mentioned detection system and method.
Above-mentioned various instance and element and behavior can be combined so that further instance to be provided.Can be based on the inspiration of above-mentioned detailed description, to detection system and method through the various improvement of row.
Claims (32)
1. planar substrates automatic checkout system is characterized in that comprising:
A light fixture;
The lens combination of the specific region of light beam a to substrate that is used for the guiding illumination assembly, this lens combination comprises a Fresnel Lenses at least; With
A catoptrical camera that receives after illumination light and the substrate surface effect, this camera comprises a time delay integration (TDI) sensor;
An imaging len is between lens combination and substrate, and imaging len is a telecentric lens.
2. according to the planar substrates automatic checkout system described in the claim 1, it is characterized in that: described light fixture comprises a plurality of led light sources, and each led light source sends the light of different wavelengths.
3. according to the planar substrates automatic checkout system described in the claim 2, it is characterized in that: also comprise a controller and be linked in a plurality of led light sources, be used for independently controlling each led light source.
4. according to the planar substrates automatic checkout system described in the claim 1, it is characterized in that: also comprise a spectroscope between lens combination and substrate, spectroscope is a dichroic beamsplitter.
5. according to the planar substrates automatic checkout system described in the claim 1, it is characterized in that: described lens combination comprises a plurality of Fresnel Lenses.
6. according to the planar substrates automatic checkout system described in the claim 1, it is characterized in that: described light fixture contains a bright field light source and a dark field.
7. according to the planar substrates automatic checkout system described in the claim 6, it is characterized in that: described bright field light source comprises first side that one first front side light source is positioned at substrate.
8. according to the planar substrates automatic checkout system described in the claim 7, it is characterized in that: described bright field light source comprises second side that a dorsal part light source is positioned at substrate, and second side is the opposite of first side.
9. the planar substrates automatic checkout system described in according to Claim 8, it is characterized in that: described dorsal part light source is a mirror, is used for the light source that the indirect illumination assembly sends.
10. according to the planar substrates automatic checkout system described in the claim 6, it is characterized in that: described dark field comprises first side that one second front side light source is positioned at substrate.
11. the planar substrates automatic checkout system according to described in the claim 10 is characterized in that: described dark field comprises one second dorsal part light source and is positioned at substrate second side, and second side is the opposite of first side.
12. the planar substrates automatic checkout system according to described in the claim 1 is characterized in that: also comprise a feedback system that links to each other with camera output.
13. the planar substrates automatic checkout system according to described in the claim 12 is characterized in that: described feedback system is used to control light fixture.
14. the planar substrates automatic checkout system according to described in the claim 12 is characterized in that: described feedback system is used to control the gain of camera.
15. the planar substrates automatic checkout system according to described in the claim 1 is characterized in that also comprising: an image pick-up card; Link to each other with image pick-up card with camera with an optical fiber.
16. the planar substrates automatic checkout system according to described in the claim 1 is characterized in that also comprising: an air supporting support is used for transmission base plate; Be used to cause the relative motion of substrate with a motion.
17. the planar substrates automatic checkout system according to described in the claim 16 is characterized in that: also comprise a vacuum preload air supporting support and be used for supporting and stabilized baseplate.
18. the planar substrates automatic checkout system according to described in the claim 1 is characterized in that: also comprise a high speed that is used for align substrates, high resolving power, the actuator of pinpoint accuracy and long shift length.
19. according to the planar substrates automatic checkout system described in the claim 1; It is characterized in that: described camera comprises one or more linear sweep CCDs (CCD); Enhancement mode CCD; Photomultiplier (PMT) array, or complementary metal-oxide-semiconductor (CMOS) detector.
20. the planar substrates automatic checkout system according to described in the claim 1 is characterized in that: described light fixture comprises a led light source, and led light source can send multi-wavelength's light.
21. according to the planar substrates automatic checkout system described in the claim 1; It is characterized in that: described substrate comprises one or more LCDs (LCD) panel; A flat-panel screens (FPD); An Organic Light Emitting Diode (OLED) substrate, a mask, or semiconductor crystal wafer.
22. a planar substrates automatic testing method is characterized in that comprising:
Produce illuminating ray;
Adopt a zone of Fresnel Lenses guiding light to substrate;
Adopt reflected light to the time delay integration (TDI) sensor of imaging len guiding after incident light and substrate effect, imaging len is a telecentric lens;
Adopt tdi sensor to receive reflected light;
Gather the image that reflected light information generates substrate.
23. the planar substrates automatic testing method according to described in the claim 22 is characterized in that: produce illuminating ray and comprise light with multi-wavelength.
24. the planar substrates automatic testing method according to described in the claim 22 is characterized in that: also comprise a plurality of light sources that independent control is used to produce multi-wavelength's illuminating ray.
25. the planar substrates automatic testing method according to described in the claim 22 is characterized in that: produce illuminating ray through bright field illumination light source and dark ground illumination light source.
26. the planar substrates automatic testing method according to described in the claim 22 is characterized in that: produce illuminating ray through one or more front side-illuminated light sources and dorsal part lighting source.
27. the planar substrates automatic testing method according to described in the claim 26 is characterized in that: the method through reflection front side-illuminated light source forms the dorsal part lighting source.
28. the planar substrates automatic testing method according to described in the claim 22 is characterized in that also comprising:
Generate the light signal of image by the electric signal of image; And transmitting optical signal.
29., it is characterized in that also comprising the method that adopts view data to detect base board defect according to the planar substrates automatic testing method described in the claim 22.
30. a planar substrates automatic testing method is characterized in that comprising:
Produce illuminating ray;
Adopt Fresnel Lenses guiding light to substrate;
Adopt imaging len that reflection ray is guided to imaging sensor, reflection ray is the result of illuminating ray and substrate surface effect, and imaging len is a telecentric lens; Generate substrate image with the employing reflected light.
31., it is characterized in that also comprising employing image detection base board defect according to the planar substrates automatic testing method described in the claim 30.
32. the planar substrates automatic testing method according to described in the claim 30 is characterized in that: described imaging sensor comprises one or more time delay integration (TDI) sensors, linear sweep CCD, ICCD, PMT array, and cmos detector.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100876561A CN101021490B (en) | 2007-03-12 | 2007-03-12 | Automatic detecting system and method for planar substrate |
| KR1020097020292A KR101174081B1 (en) | 2007-03-12 | 2008-03-05 | Plane substrate auto-test system and the method thereof |
| PCT/CN2008/000439 WO2008110061A1 (en) | 2007-03-12 | 2008-03-05 | Plane substrate auto-test system and the method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100876561A CN101021490B (en) | 2007-03-12 | 2007-03-12 | Automatic detecting system and method for planar substrate |
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| CN101021490A CN101021490A (en) | 2007-08-22 |
| CN101021490B true CN101021490B (en) | 2012-11-14 |
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| KR (1) | KR101174081B1 (en) |
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| KR101174081B1 (en) | 2012-08-14 |
| CN101021490A (en) | 2007-08-22 |
| KR20090122266A (en) | 2009-11-26 |
| WO2008110061A1 (en) | 2008-09-18 |
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