SG10202110739PA - Apparatus, method and computer program product for defect detection in work pieces - Google Patents
Apparatus, method and computer program product for defect detection in work piecesInfo
- Publication number
- SG10202110739PA SG10202110739PA SG10202110739PA SG10202110739PA SG10202110739PA SG 10202110739P A SG10202110739P A SG 10202110739PA SG 10202110739P A SG10202110739P A SG 10202110739PA SG 10202110739P A SG10202110739P A SG 10202110739PA SG 10202110739P A SG10202110739P A SG 10202110739PA
- Authority
- SG
- Singapore
- Prior art keywords
- computer program
- program product
- defect detection
- work pieces
- pieces
- Prior art date
Links
- 238000004590 computer program Methods 0.000 title 1
- 230000007547 defect Effects 0.000 title 1
- 238000001514 detection method Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
- G01N21/9505—Wafer internal defects, e.g. microcracks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
- G01N2021/8841—Illumination and detection on two sides of object
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/104—Mechano-optical scan, i.e. object and beam moving
- G01N2201/1047—Mechano-optical scan, i.e. object and beam moving with rotating optics and moving stage
Landscapes
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Textile Engineering (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201462088284P | 2014-12-05 | 2014-12-05 | |
| US201562154109P | 2015-04-28 | 2015-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SG10202110739PA true SG10202110739PA (en) | 2021-11-29 |
Family
ID=56092564
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG10202110739PA SG10202110739PA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
| SG11201704388YA SG11201704388YA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
| SG10201913246TA SG10201913246TA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SG11201704388YA SG11201704388YA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
| SG10201913246TA SG10201913246TA (en) | 2014-12-05 | 2015-12-04 | Apparatus, method and computer program product for defect detection in work pieces |
Country Status (10)
| Country | Link |
|---|---|
| US (6) | US10324044B2 (en) |
| EP (3) | EP3926330A1 (en) |
| JP (5) | JP6929772B2 (en) |
| KR (8) | KR20230146671A (en) |
| CN (3) | CN112858319A (en) |
| MY (3) | MY181846A (en) |
| PH (2) | PH12017501024A1 (en) |
| SG (3) | SG10202110739PA (en) |
| TW (2) | TWI702390B (en) |
| WO (1) | WO2016090311A1 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG10202110739PA (en) | 2014-12-05 | 2021-11-29 | Kla Tencor Corp | Apparatus, method and computer program product for defect detection in work pieces |
| US10670531B2 (en) | 2016-01-04 | 2020-06-02 | Laser & Plasma Technologies, LLC | Infrared detection camera |
| CN107843991A (en) * | 2017-09-05 | 2018-03-27 | 努比亚技术有限公司 | Detection method, system, terminal and the computer-readable recording medium of screen light leak |
| WO2019157271A2 (en) * | 2018-02-09 | 2019-08-15 | Massachusetts Institute Of Technology | Systems and methods for crack detection |
| US20190257876A1 (en) * | 2018-02-21 | 2019-08-22 | Asm Technology Singapore Pte Ltd | System and method for detecting defects in an electronic device |
| CN108872246A (en) * | 2018-05-29 | 2018-11-23 | 湖南科创信息技术股份有限公司 | Face sheet material regards planar defect detection system entirely |
| CN109100366A (en) * | 2018-08-10 | 2018-12-28 | 武汉盛为芯科技有限公司 | The detection system and method for semiconductor laser chip end face appearance |
| US10481097B1 (en) | 2018-10-01 | 2019-11-19 | Guardian Glass, LLC | Method and system for detecting inclusions in float glass based on spectral reflectance analysis |
| US10746667B2 (en) * | 2018-11-27 | 2020-08-18 | General Electric Company | Fluorescent penetrant inspection system and method |
| US20200364442A1 (en) * | 2019-05-15 | 2020-11-19 | Getac Technology Corporation | System for detecting surface pattern of object and artificial neural network-based method for detecting surface pattern of object |
| US11543363B2 (en) | 2019-05-24 | 2023-01-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for wafer bond monitoring |
| US11340284B2 (en) * | 2019-07-23 | 2022-05-24 | Kla Corporation | Combined transmitted and reflected light imaging of internal cracks in semiconductor devices |
| JP6755603B1 (en) * | 2019-12-25 | 2020-09-16 | 上野精機株式会社 | Electronic component processing equipment |
| JP7437987B2 (en) * | 2020-03-23 | 2024-02-26 | ファスフォードテクノロジ株式会社 | Die bonding equipment and semiconductor device manufacturing method |
| KR102255421B1 (en) * | 2020-08-11 | 2021-05-24 | 충남대학교산학협력단 | Method for Evaluating Defect in Monoclinic Gallium Oxide |
| JP2022137904A (en) * | 2021-03-09 | 2022-09-22 | 本田技研工業株式会社 | Method and device for inspecting surface |
| JP6906779B1 (en) * | 2021-03-11 | 2021-07-21 | ヴィスコ・テクノロジーズ株式会社 | Semiconductor chip inspection method and equipment |
| CN112816490A (en) * | 2021-03-16 | 2021-05-18 | 上海悦易网络信息技术有限公司 | Automatic detection equipment and automatic detection method for electronic product |
| KR20240004770A (en) | 2021-05-05 | 2024-01-11 | 베시 스위처랜드 아게 | Apparatus and method for optically inspecting three or more aspects of a component |
| TWI797689B (en) * | 2021-05-24 | 2023-04-01 | 馬來西亞商正齊科技有限公司 | Apparatus and method for performing internal defects inspection of an electronic component |
| CN116757973B (en) * | 2023-08-23 | 2023-12-01 | 成都数之联科技股份有限公司 | Automatic repair method, system, equipment and storage medium for panel products |
Family Cites Families (73)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1623425C2 (en) | 1967-10-26 | 1972-06-08 | Eltro Gmbh | Optoelectronic process and system for carrying out this process |
| US4689491A (en) * | 1985-04-19 | 1987-08-25 | Datasonics Corp. | Semiconductor wafer scanning system |
| US4891530A (en) * | 1986-02-22 | 1990-01-02 | Helmut K. Pinsch Gmbh & Co. | Testing or inspecting apparatus and method for detecting differently shaped surfaces of objects |
| JP2591751B2 (en) | 1987-06-29 | 1997-03-19 | 日本電気株式会社 | Similarity judgment method between objects |
| JPH02281132A (en) * | 1989-04-21 | 1990-11-16 | Matsushita Electric Ind Co Ltd | Contamination detector |
| JP2975476B2 (en) * | 1992-03-30 | 1999-11-10 | 三井金属鉱業株式会社 | Method and apparatus for measuring photoluminescence in crystal |
| JP2847458B2 (en) * | 1993-03-26 | 1999-01-20 | 三井金属鉱業株式会社 | Defect evaluation device |
| JP3348168B2 (en) * | 1993-09-03 | 2002-11-20 | ラトックシステムエンジニアリング株式会社 | Crystal defect detection method and apparatus |
| JP3366067B2 (en) * | 1993-09-03 | 2003-01-14 | ラトックシステムエンジニアリング株式会社 | Crystal defect detection method |
| US5790247A (en) * | 1995-10-06 | 1998-08-04 | Photon Dynamics, Inc. | Technique for determining defect positions in three dimensions in a transparent structure |
| EP0961928A4 (en) * | 1997-02-21 | 2000-04-26 | Sidney Braginsky | Method of scanning semiconductor wafers to inspect for defects |
| JP2897754B2 (en) | 1997-03-27 | 1999-05-31 | 日本電気株式会社 | Inspection method for semiconductor device |
| JPH11352072A (en) * | 1998-06-04 | 1999-12-24 | Advantest Corp | Surface inspection apparatus and method therefor |
| US6529018B1 (en) | 1998-08-28 | 2003-03-04 | International Business Machines Corporation | Method for monitoring defects in polysilicon gates in semiconductor devices responsive to illumination by incident light |
| DE69800756T2 (en) | 1998-10-15 | 2001-08-09 | Wacker Siltronic Halbleitermat | Method and device for detecting, monitoring and characterizing edge defects in semiconductor wafers |
| US6384415B1 (en) | 2000-06-20 | 2002-05-07 | Kabushiki Kaisha Kobe Seiko Sho (Kobe Steel, Ltd.) | Method of evaluating quality of silicon wafer and method of reclaiming the water |
| US6512239B1 (en) * | 2000-06-27 | 2003-01-28 | Photon Dynamics Canada Inc. | Stereo vision inspection system for transparent media |
| JP2002310929A (en) * | 2001-04-13 | 2002-10-23 | Mitsubishi Electric Corp | Defect inspecting device |
| JP3709426B2 (en) | 2001-11-02 | 2005-10-26 | 日本エレクトロセンサリデバイス株式会社 | Surface defect detection method and surface defect detection apparatus |
| JP3762952B2 (en) * | 2002-09-04 | 2006-04-05 | レーザーテック株式会社 | Optical apparatus and image measuring apparatus and inspection apparatus using the same |
| US20040207836A1 (en) * | 2002-09-27 | 2004-10-21 | Rajeshwar Chhibber | High dynamic range optical inspection system and method |
| AU2003263109A1 (en) * | 2002-09-30 | 2004-04-23 | Applied Materials Israel, Ltd. | Dark field inspection system |
| WO2004072629A1 (en) | 2003-02-17 | 2004-08-26 | Nanyang Technological University | System and method for inspection of silicon wafers |
| JP2005257671A (en) | 2004-02-10 | 2005-09-22 | Sharp Corp | Defect detection method and defect-detecting apparatus of optical component |
| DE102004029212B4 (en) | 2004-06-16 | 2006-07-13 | Leica Microsystems Semiconductor Gmbh | Apparatus and method for optical inspection and / or transmitted light inspection of microstructures in the IR |
| JP4626982B2 (en) | 2005-02-10 | 2011-02-09 | セントラル硝子株式会社 | Defect detection device and detection method for end face of glass plate |
| KR101117826B1 (en) * | 2005-02-18 | 2012-06-05 | 호야 가부시키가이샤 | Light-transmitting object examining method, manufacturing method for light-transmitting substrate of mask blank, manufacturing method for mask blank, manufacturing method for light-expososure mask, manufacturing method for semiconductor device and manufacturing method for phase shift mask |
| JP2007086050A (en) * | 2005-02-18 | 2007-04-05 | Hoya Corp | Method for inspecting translucent article made of translucent material, method and apparatus for inspecting defect of glass substrate, glass substrate for mask blank, and manufacturing method therefor, mask bland and manufacturing method therefor, mask for exposure and manufacturing method therefor, and manufacturing method of semiconductor device |
| CN2791639Y (en) | 2005-03-02 | 2006-06-28 | 昆明物理研究所 | Infrared device for detecting internal defect of semiconductor material |
| JP2006351669A (en) * | 2005-06-14 | 2006-12-28 | Mitsubishi Electric Corp | Infrared inspection device and infrared inspection method, and method of manufacturing semiconductor wafer |
| JP4847128B2 (en) | 2005-12-21 | 2011-12-28 | 日本エレクトロセンサリデバイス株式会社 | Surface defect inspection equipment |
| JP4878907B2 (en) | 2006-05-08 | 2012-02-15 | 三菱電機株式会社 | Image inspection apparatus and image inspection method using the image inspection apparatus |
| KR20080015363A (en) | 2006-08-14 | 2008-02-19 | 야마하 가부시키가이샤 | Method and apparatus for inspection of wafer and semiconductor device |
| JP4973062B2 (en) | 2006-08-14 | 2012-07-11 | ヤマハ株式会社 | Semiconductor chip inspection method and wafer crack inspection apparatus |
| KR100768038B1 (en) * | 2006-10-24 | 2007-10-17 | 한국전기연구원 | Apparatus and method for measuring bio chips with uniform illumination of total internal reflection |
| US8274727B1 (en) | 2006-11-13 | 2012-09-25 | Hrl Laboratories, Llc | Programmable optical label |
| CN101021490B (en) * | 2007-03-12 | 2012-11-14 | 3i系统公司 | Automatic detecting system and method for planar substrate |
| KR101120226B1 (en) * | 2007-04-27 | 2012-03-20 | 시바우라 메카트로닉스 가부시키가이샤 | Surface inspecting apparatus |
| WO2008143228A1 (en) | 2007-05-21 | 2008-11-27 | Nikon Corporation | Wafer end surface inspecting apparatus |
| WO2009021207A2 (en) | 2007-08-09 | 2009-02-12 | Accretech Usa, Inc. | Apparatus and method for wafer edge exclusion measurement |
| JP4600476B2 (en) * | 2007-12-28 | 2010-12-15 | 日本電気株式会社 | Defect inspection method and defect inspection apparatus for fine structure |
| JP2009192358A (en) * | 2008-02-14 | 2009-08-27 | Fuji Electric Systems Co Ltd | Defect inspection device |
| JP2009236493A (en) * | 2008-03-25 | 2009-10-15 | Mitsubishi Rayon Co Ltd | Flaw inspecting method of transparent plate and flaw inspection device |
| JP5240771B2 (en) * | 2008-04-14 | 2013-07-17 | 上野精機株式会社 | Appearance inspection device |
| JP2010025713A (en) * | 2008-07-18 | 2010-02-04 | Hitachi High-Technologies Corp | Flaw inspection method and flaw inspection device |
| TWI512865B (en) | 2008-09-08 | 2015-12-11 | Rudolph Technologies Inc | Wafer edge inspection |
| US8532364B2 (en) | 2009-02-18 | 2013-09-10 | Texas Instruments Deutschland Gmbh | Apparatus and method for detecting defects in wafer manufacturing |
| CN101819165B (en) | 2009-02-27 | 2013-08-07 | 圣戈本玻璃法国公司 | Method and system for detecting defect of patterned substrate |
| KR101114362B1 (en) * | 2009-03-09 | 2012-02-14 | 주식회사 쓰리비 시스템 | optical apparatus for inspection |
| DE102009017786B3 (en) * | 2009-04-20 | 2010-10-14 | Intego Gmbh | Method for detecting defects in a thin wafer wafer for a solar element and device for carrying out the method |
| JP5559163B2 (en) | 2009-05-29 | 2014-07-23 | 株式会社ロゼフテクノロジー | Inspection method for polycrystalline wafer |
| JP2011033449A (en) | 2009-07-31 | 2011-02-17 | Sumco Corp | Method and apparatus for defect inspection of wafer |
| DE102009050711A1 (en) * | 2009-10-26 | 2011-05-05 | Schott Ag | Method and device for detecting cracks in semiconductor substrates |
| KR20110055788A (en) * | 2009-11-20 | 2011-05-26 | 재단법인 서울테크노파크 | Inspection method for bonded wafer using laser |
| KR101519476B1 (en) | 2010-02-17 | 2015-05-14 | 한미반도체 주식회사 | Ingot Inspection Apparatus and Method for Inspecting an Ingot |
| KR101214806B1 (en) * | 2010-05-11 | 2012-12-24 | 가부시키가이샤 사무코 | Apparatus and method for defect inspection of wafer |
| TWI422814B (en) * | 2010-08-23 | 2014-01-11 | Delta Electronics Inc | An apparatus and method for inspecting inner defect of substrate |
| JP2012083125A (en) | 2010-10-07 | 2012-04-26 | Nikon Corp | End face inspection device |
| US9001029B2 (en) | 2011-02-15 | 2015-04-07 | Basf Se | Detector for optically detecting at least one object |
| WO2012153718A1 (en) | 2011-05-12 | 2012-11-15 | コニカミノルタホールディングス株式会社 | Method for testing end face of glass sheet and device for testing end face of glass sheet |
| DE112012002619T5 (en) * | 2011-06-24 | 2014-04-17 | Kla-Tencor Corp. | Method and device for inspecting semiconductor light-emitting elements by means of photoluminescence imaging |
| JP2013015428A (en) | 2011-07-05 | 2013-01-24 | Lasertec Corp | Inspection device, inspection method and manufacturing method of semiconductor device |
| JP5594254B2 (en) | 2011-08-09 | 2014-09-24 | 三菱電機株式会社 | Silicon substrate inspection apparatus and inspection method |
| CN103376259A (en) | 2012-04-11 | 2013-10-30 | 百励科技股份有限公司 | Device and method for detecting internal defects of element |
| PL222470B1 (en) | 2012-08-14 | 2016-07-29 | Włodarczyk Władysław Igloo | Head module for collection and placement of components dedicated in SMT technology |
| SG11201502436SA (en) * | 2012-09-28 | 2015-04-29 | Rudolph Technologies Inc | Inspection of substrates using calibration and imaging |
| KR20140060946A (en) * | 2012-11-13 | 2014-05-21 | 에이티아이 주식회사 | Electronic materials processing area measurement for illumination device and applying the inspection equipment |
| CN203011849U (en) | 2012-11-13 | 2013-06-19 | 上海太阳能工程技术研究中心有限公司 | Silicon wafer defect detecting device |
| KR101385219B1 (en) | 2012-12-27 | 2014-04-16 | 한국생산기술연구원 | System for detecting defects of semiconductor package and detecting method using the same |
| US9041919B2 (en) | 2013-02-18 | 2015-05-26 | Globalfoundries Inc. | Infrared-based metrology for detection of stress and defects around through silicon vias |
| DE102013108308A1 (en) * | 2013-08-01 | 2015-02-19 | Schott Ag | Method and device for detecting tape rolls made of brittle-hard or brittle-breaking, at least partially transparent material, and their use |
| SG10202110739PA (en) | 2014-12-05 | 2021-11-29 | Kla Tencor Corp | Apparatus, method and computer program product for defect detection in work pieces |
| KR102093450B1 (en) | 2018-12-31 | 2020-03-25 | 주식회사 디쓰리디 | System for measuring property of matter for fabric and method of the same |
-
2015
- 2015-12-04 SG SG10202110739PA patent/SG10202110739PA/en unknown
- 2015-12-04 MY MYPI2017000150A patent/MY181846A/en unknown
- 2015-12-04 EP EP21190120.2A patent/EP3926330A1/en active Pending
- 2015-12-04 JP JP2017529614A patent/JP6929772B2/en active Active
- 2015-12-04 CN CN202110040476.8A patent/CN112858319A/en active Pending
- 2015-12-04 KR KR1020237034587A patent/KR20230146671A/en not_active Application Discontinuation
- 2015-12-04 SG SG11201704388YA patent/SG11201704388YA/en unknown
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