SG11201502436SA - Inspection of substrates using calibration and imaging - Google Patents

Inspection of substrates using calibration and imaging

Info

Publication number
SG11201502436SA
SG11201502436SA SG11201502436SA SG11201502436SA SG11201502436SA SG 11201502436S A SG11201502436S A SG 11201502436SA SG 11201502436S A SG11201502436S A SG 11201502436SA SG 11201502436S A SG11201502436S A SG 11201502436SA SG 11201502436S A SG11201502436S A SG 11201502436SA
Authority
SG
Singapore
Prior art keywords
calibration
substrates
inspection
imaging
Prior art date
Application number
SG11201502436SA
Inventor
Wei Zhou
Original Assignee
Rudolph Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rudolph Technologies Inc filed Critical Rudolph Technologies Inc
Publication of SG11201502436SA publication Critical patent/SG11201502436SA/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/02—Mechanical
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/062—LED's
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
SG11201502436SA 2012-09-28 2013-09-27 Inspection of substrates using calibration and imaging SG11201502436SA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261707662P 2012-09-28 2012-09-28
PCT/US2013/062272 WO2014052811A1 (en) 2012-09-28 2013-09-27 Inspection of substrates using calibration and imaging

Publications (1)

Publication Number Publication Date
SG11201502436SA true SG11201502436SA (en) 2015-04-29

Family

ID=50389006

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201502436SA SG11201502436SA (en) 2012-09-28 2013-09-27 Inspection of substrates using calibration and imaging

Country Status (4)

Country Link
US (1) US9664625B2 (en)
SG (1) SG11201502436SA (en)
TW (1) TWI597491B (en)
WO (1) WO2014052811A1 (en)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6196119B2 (en) * 2013-10-11 2017-09-13 大塚電子株式会社 Shape measuring apparatus and shape measuring method
US9488595B2 (en) * 2014-03-28 2016-11-08 Intel Corporation Inspection of microelectronic devices using near-infrared light
GB2524836A (en) * 2014-04-04 2015-10-07 Servomex Group Ltd Attachment and alignment device for optical sources, detectors and analysers, and modular analysis system
CN111338187A (en) 2014-08-29 2020-06-26 Asml荷兰有限公司 Metrology method, target and substrate
KR20220003134A (en) * 2014-12-05 2022-01-07 케이엘에이 코포레이션 Apparatus, method and computer program product for defect detection in work pieces
US9859139B2 (en) 2015-07-14 2018-01-02 Taiwan Semiconductor Manufacturing Co., Ltd. 3D IC bump height metrology APC
US20180209918A1 (en) * 2015-07-14 2018-07-26 Synergx Technologies Inc. Optical inspection system for transparent material
TWI596318B (en) * 2016-01-13 2017-08-21 德律科技股份有限公司 Optical inspection system and optical imaging system
EP3222964B1 (en) * 2016-03-25 2020-01-15 Fogale Nanotech Chromatic confocal device and method for 2d/3d inspection of an object such as a wafer
US10563973B2 (en) * 2016-03-28 2020-02-18 Kla-Tencor Corporation All surface film metrology system
EP3487687B1 (en) * 2016-07-20 2019-12-25 Wacker Chemie AG 3d printing method for producing objects
DE102016011497B4 (en) * 2016-09-21 2019-01-24 Mühlbauer Gmbh & Co. Kg Optical inspection device and optical inspection method with visible and infrared light for semiconductor devices
KR101937187B1 (en) * 2017-05-11 2019-01-14 주식회사 에이치비테크놀러지 Apparatus for detecting error of surface
JP6919458B2 (en) * 2017-09-26 2021-08-18 オムロン株式会社 Displacement measuring device, measuring system, and displacement measuring method
US10345373B2 (en) * 2017-09-29 2019-07-09 Taiwan Semiconductor Manufacturing Co., Ltd. Method for inspecting semiconductor device structure
JP6664367B2 (en) * 2017-11-27 2020-03-13 シャープ株式会社 Detector, and method of correcting, calibrating, and detecting the detector
US20190257876A1 (en) * 2018-02-21 2019-08-22 Asm Technology Singapore Pte Ltd System and method for detecting defects in an electronic device
TWI708041B (en) * 2018-10-17 2020-10-21 所羅門股份有限公司 Method of detecting and marking defect
TWI714395B (en) * 2019-12-17 2020-12-21 晟格科技股份有限公司 Surface defect detection apparatus for wafer
DE102021111707B3 (en) 2021-05-05 2022-06-02 Sioptica Gmbh Method and arrangement for non-destructive testing of a surface structure
JP2023027927A (en) * 2021-08-18 2023-03-03 株式会社オキサイド Pattern inspection apparatus and pattern inspection method
US20230114624A1 (en) * 2021-10-07 2023-04-13 Applied Materials Israel Ltd. Defect examination on a semiconductor specimen

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6836324B2 (en) 1998-03-18 2004-12-28 Nova Measuring Instruments Ltd. Method and apparatus for measurements of patterned structures
IL125964A (en) 1998-08-27 2003-10-31 Tevet Process Control Technolo Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate
JP4725822B2 (en) * 2000-07-10 2011-07-13 株式会社ニコン Optical displacement detector
JP4613357B2 (en) * 2000-11-22 2011-01-19 株式会社ニコン Apparatus and method for adjusting optical misregistration measuring apparatus
US6900892B2 (en) * 2000-12-19 2005-05-31 Kla-Tencor Technologies Corporation Parametric profiling using optical spectroscopic systems
US6975410B1 (en) * 2002-04-15 2005-12-13 Sturgill Dennis T Measuring device
US7306696B2 (en) 2002-11-01 2007-12-11 Applied Materials, Inc. Interferometric endpoint determination in a substrate etching process
JP2006123375A (en) * 2004-10-29 2006-05-18 Pentel Corp Ball-point pen
JP4635711B2 (en) * 2005-05-13 2011-02-23 株式会社ニコン Overlay measuring device
JP2007234685A (en) 2006-02-28 2007-09-13 Canon Inc Measuring device, exposure device therewith and method of manufacturing the same
JP2010002328A (en) 2008-06-20 2010-01-07 Otsuka Denshi Co Ltd Film thickness measuring instrument
JP5332632B2 (en) * 2009-01-16 2013-11-06 株式会社日立製作所 Spectroscopic detection method and apparatus, and defect inspection method and apparatus using the same
JP2013024747A (en) * 2011-07-21 2013-02-04 Canon Inc Measurement instrument, exposure apparatus, and device manufacturing method

Also Published As

Publication number Publication date
US20150253256A1 (en) 2015-09-10
TWI597491B (en) 2017-09-01
TW201428274A (en) 2014-07-16
WO2014052811A1 (en) 2014-04-03
US9664625B2 (en) 2017-05-30

Similar Documents

Publication Publication Date Title
SG11201502436SA (en) Inspection of substrates using calibration and imaging
IL223042A0 (en) Inspection of region of interest
HK1216780A1 (en) Systems and methods for performing measurements of one or more materials
HK1206817A1 (en) Calibration of multiple aperture ultrasound probes
TWI563825B (en) Object of interest based image processing
GB2518548B (en) Imaging or measurement methods and systems
GB2525260B (en) Method of material handling using one or more imaging devices
EP2817585A4 (en) Automatic calibration systems and methods of use
EP2616959A4 (en) Determination and display of relevant websites
EP2819566A4 (en) Calibration apparatus
SG11201401016YA (en) Web inspection calibration system and related methods
GB201216332D0 (en) Multiple paths measuring and imaging apparatus and method
SG11201404939QA (en) Method and device for measuring the colour of an object
EP2936120A4 (en) Manual calibration of imaging system
EP2850385A4 (en) Substrate inspection
GB2507690B (en) Combination of narrow and wide view images
EP2726849A4 (en) Measurement of critical dimension
EP2932234A4 (en) Calibration process and system
EP2652515A4 (en) Iddq testing of cmos devices
HK1188486A1 (en) Framework of dust-prevention film component
EP2880432A4 (en) Placeable sensor and method of using same
EP2802848A4 (en) Liquid transfer systems and methods of calibration thereof
EP2919643A4 (en) Methods and systems for quantitative measurement of mental states
EP2810072A4 (en) Compositions and methods for detection of methodone metabolite
GB201102171D0 (en) Inspection of holes