CN113702389A - 用于工件中的缺陷检测的设备及方法 - Google Patents

用于工件中的缺陷检测的设备及方法 Download PDF

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Publication number
CN113702389A
CN113702389A CN202111010485.9A CN202111010485A CN113702389A CN 113702389 A CN113702389 A CN 113702389A CN 202111010485 A CN202111010485 A CN 202111010485A CN 113702389 A CN113702389 A CN 113702389A
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China
Prior art keywords
workpiece
illumination
top surface
camera
defects
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CN202111010485.9A
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Chinese (zh)
Inventor
汤姆·马里富特
卡尔·特鲁叶恩斯
克里斯托夫·沃特斯
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KLA Corp
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KLA Tencor Corp
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • G01N21/9505Wafer internal defects, e.g. microcracks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95684Patterns showing highly reflecting parts, e.g. metallic elements
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26Testing of individual semiconductor devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8835Adjustable illumination, e.g. software adjustable screen
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8841Illumination and detection on two sides of object
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/10Scanning
    • G01N2201/104Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1047Mechano-optical scan, i.e. object and beam moving with rotating optics and moving stage

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Textile Engineering (AREA)
CN202111010485.9A 2014-12-05 2015-12-04 用于工件中的缺陷检测的设备及方法 Pending CN113702389A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201462088284P 2014-12-05 2014-12-05
US62/088,284 2014-12-05
US201562154109P 2015-04-28 2015-04-28
US62/154,109 2015-04-28
CN201580065271.8A CN107003254A (zh) 2014-12-05 2015-12-04 用于工件中的缺陷检测的设备、方法及计算机程序产品

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CN202110040476.8A Pending CN112858319A (zh) 2014-12-05 2015-12-04 用于工件中的缺陷检测的设备及方法
CN202111010485.9A Pending CN113702389A (zh) 2014-12-05 2015-12-04 用于工件中的缺陷检测的设备及方法
CN201580065271.8A Pending CN107003254A (zh) 2014-12-05 2015-12-04 用于工件中的缺陷检测的设备、方法及计算机程序产品

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US (6) US10324044B2 (enExample)
EP (3) EP3926330A1 (enExample)
JP (5) JP6929772B2 (enExample)
KR (9) KR102715961B1 (enExample)
CN (3) CN112858319A (enExample)
MY (3) MY181846A (enExample)
PH (3) PH12022551948B1 (enExample)
SG (3) SG10202110739PA (enExample)
TW (2) TWI702390B (enExample)
WO (1) WO2016090311A1 (enExample)

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JP2021133200A (ja) * 2020-02-28 2021-09-13 株式会社三洋物産 遊技機
JP2021133199A (ja) * 2020-02-28 2021-09-13 株式会社三洋物産 遊技機
JP7437987B2 (ja) * 2020-03-23 2024-02-26 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP2022012088A (ja) * 2020-06-30 2022-01-17 株式会社三洋物産 遊技機
JP2022012089A (ja) * 2020-06-30 2022-01-17 株式会社三洋物産 遊技機
JP2022012090A (ja) * 2020-06-30 2022-01-17 株式会社三洋物産 遊技機
KR102255421B1 (ko) * 2020-08-11 2021-05-24 충남대학교산학협력단 단결정 산화갈륨의 결함 평가방법
JP7579722B2 (ja) * 2021-03-09 2024-11-08 本田技研工業株式会社 表面検査方法及び表面検査装置
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CN112816490A (zh) * 2021-03-16 2021-05-18 上海悦易网络信息技术有限公司 一种电子产品的自动检测设备及自动检测方法
CN117321411A (zh) 2021-05-05 2023-12-29 贝思瑞士股份公司 用于光学式检查构件的三侧或更多的侧的设备及方法
CN115372361B (zh) * 2021-05-21 2025-11-25 泰科电子(上海)有限公司 工件多表面检测设备及检测方法
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