KR102755833B1 - 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품 - Google Patents

워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품 Download PDF

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KR102755833B1
KR102755833B1 KR1020237022390A KR20237022390A KR102755833B1 KR 102755833 B1 KR102755833 B1 KR 102755833B1 KR 1020237022390 A KR1020237022390 A KR 1020237022390A KR 20237022390 A KR20237022390 A KR 20237022390A KR 102755833 B1 KR102755833 B1 KR 102755833B1
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semiconductor device
singulated semiconductor
illumination
camera
defects
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KR20230105688A (ko
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톰 마리보에트
칼 트뤼앙스
크리스토프 바우터스
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8822—Dark field detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8835—Adjustable illumination, e.g. software adjustable screen
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8841—Illumination and detection on two sides of object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/104—Mechano-optical scan, i.e. object and beam moving
    • G01N2201/1047—Mechano-optical scan, i.e. object and beam moving with rotating optics and moving stage

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Signal Processing (AREA)
  • General Engineering & Computer Science (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Textile Engineering (AREA)
KR1020237022390A 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품 Active KR102755833B1 (ko)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US201462088284P 2014-12-05 2014-12-05
US62/088,284 2014-12-05
US201562154109P 2015-04-28 2015-04-28
US62/154,109 2015-04-28
KR1020217042849A KR20220003134A (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
PCT/US2015/064100 WO2016090311A1 (en) 2014-12-05 2015-12-04 Apparatus, method and computer program product for defect detection in work pieces

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020217042849A Division KR20220003134A (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품

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Publication Number Publication Date
KR20230105688A KR20230105688A (ko) 2023-07-11
KR102755833B1 true KR102755833B1 (ko) 2025-01-15

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KR1020237022390A Active KR102755833B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020177018489A Active KR102386192B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020227023563A Active KR102715961B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020227023565A Active KR102790723B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020227023564A Active KR102589607B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020227011485A Active KR102741226B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020237034587A Active KR102726006B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020247036384A Pending KR20240159033A (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020217042849A Ceased KR20220003134A (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품

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KR1020177018489A Active KR102386192B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020227023563A Active KR102715961B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020227023565A Active KR102790723B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020227023564A Active KR102589607B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020227011485A Active KR102741226B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020237034587A Active KR102726006B1 (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020247036384A Pending KR20240159033A (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품
KR1020217042849A Ceased KR20220003134A (ko) 2014-12-05 2015-12-04 워크 피스들에서의 결함 검출을 위한 장치, 방법 및 컴퓨터 프로그램 제품

Country Status (10)

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US (6) US10324044B2 (enExample)
EP (3) EP3926330A1 (enExample)
JP (5) JP6929772B2 (enExample)
KR (9) KR102755833B1 (enExample)
CN (3) CN107003254A (enExample)
MY (3) MY188685A (enExample)
PH (3) PH12022551948B1 (enExample)
SG (3) SG10202110739PA (enExample)
TW (2) TWI663394B (enExample)
WO (1) WO2016090311A1 (enExample)

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JP2020146144A (ja) * 2019-03-12 2020-09-17 株式会社三洋物産 遊技機
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JP2021133199A (ja) * 2020-02-28 2021-09-13 株式会社三洋物産 遊技機
JP2021133198A (ja) * 2020-02-28 2021-09-13 株式会社三洋物産 遊技機
JP2021133200A (ja) * 2020-02-28 2021-09-13 株式会社三洋物産 遊技機
JP7437987B2 (ja) * 2020-03-23 2024-02-26 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP2022012088A (ja) * 2020-06-30 2022-01-17 株式会社三洋物産 遊技機
JP2022012089A (ja) * 2020-06-30 2022-01-17 株式会社三洋物産 遊技機
JP2022012090A (ja) * 2020-06-30 2022-01-17 株式会社三洋物産 遊技機
KR102255421B1 (ko) * 2020-08-11 2021-05-24 충남대학교산학협력단 단결정 산화갈륨의 결함 평가방법
JP7579722B2 (ja) * 2021-03-09 2024-11-08 本田技研工業株式会社 表面検査方法及び表面検査装置
JP6906779B1 (ja) * 2021-03-11 2021-07-21 ヴィスコ・テクノロジーズ株式会社 半導体チップの検査方法及び装置
CN112816490A (zh) * 2021-03-16 2021-05-18 上海悦易网络信息技术有限公司 一种电子产品的自动检测设备及自动检测方法
DE112022002435T5 (de) 2021-05-05 2024-05-23 Besi Switzerland Ag Vorrichtung und Verfahren zur optischen Inspektion von drei oder mehr Seiten einer Komponente
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