MY187481A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
MY187481A
MY187481A MYUI2017703393A MYUI2017703393A MY187481A MY 187481 A MY187481 A MY 187481A MY UI2017703393 A MYUI2017703393 A MY UI2017703393A MY UI2017703393 A MYUI2017703393 A MY UI2017703393A MY 187481 A MY187481 A MY 187481A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin composition
chemical solution
alkali
exposure
Prior art date
Application number
MYUI2017703393A
Other languages
English (en)
Inventor
Shinichi Kunimatsu
Takayuki Matsuda
Yuri Yamada
Yamato Tsutsui
Akira Fujiwara
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY187481A publication Critical patent/MY187481A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
    • C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
    • C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Polymerisation Methods In General (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Graft Or Block Polymers (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
MYUI2017703393A 2015-04-08 2016-04-08 Photosensitive resin composition MY187481A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015079381 2015-04-08
JP2015166570 2015-08-26
PCT/JP2016/061610 WO2016163540A1 (ja) 2015-04-08 2016-04-08 感光性樹脂組成物

Publications (1)

Publication Number Publication Date
MY187481A true MY187481A (en) 2021-09-23

Family

ID=57073148

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2017703393A MY187481A (en) 2015-04-08 2016-04-08 Photosensitive resin composition

Country Status (6)

Country Link
JP (3) JPWO2016163540A1 (ja)
KR (2) KR102286107B1 (ja)
CN (2) CN114437251B (ja)
MY (1) MY187481A (ja)
TW (3) TWI706222B (ja)
WO (1) WO2016163540A1 (ja)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI666518B (zh) * 2016-12-30 2019-07-21 奇美實業股份有限公司 感光性樹脂組成物及其應用
JP6981864B2 (ja) * 2017-01-30 2021-12-17 旭化成株式会社 感光性樹脂組成物、感光性樹脂積層体、レジストパターンが形成された基板および回路基板の製造方法
KR102500912B1 (ko) * 2017-03-01 2023-02-16 아사히 가세이 가부시키가이샤 감광성 수지 조성물
CN110325913B (zh) * 2017-03-29 2022-11-01 旭化成株式会社 感光性树脂组合物
CN109976092B (zh) * 2017-12-27 2022-04-01 太阳油墨（苏州）有限公司 固化性树脂组合物、干膜、固化物、及印刷电路板
CN112352197A (zh) * 2018-06-22 2021-02-09 旭化成株式会社 感光性树脂组合物和抗蚀图案的形成方法
CN112368642A (zh) * 2018-06-22 2021-02-12 旭化成株式会社 感光性树脂组合物和抗蚀图案的形成方法
CN118311829A (zh) * 2018-07-11 2024-07-09 富士胶片株式会社 药液、药液收容体
CN112534351A (zh) * 2018-08-09 2021-03-19 旭化成株式会社 感光性树脂组合物及抗蚀图案的形成方法
JP7300619B2 (ja) * 2019-01-11 2023-06-30 太陽ホールディングス株式会社 積層構造体、ドライフィルム、その硬化物および電子部品
WO2021054457A1 (ja) * 2019-09-19 2021-03-25 クラレノリタケデンタル株式会社 歯科用硬化性組成物
WO2021095784A1 (ja) * 2019-11-11 2021-05-20 旭化成株式会社 感光性樹脂組成物及び感光性樹脂積層体
JPWO2022030053A1 (ja) * 2020-08-07 2022-02-10
KR20230151977A (ko) * 2021-02-26 2023-11-02 다이요 홀딩스 가부시키가이샤 적층 구조체 및 플렉시블 프린트 배선판
JPWO2022181485A1 (ja) * 2021-02-26 2022-09-01
KR20240031514A (ko) * 2022-08-30 2024-03-08 삼성에스디아이 주식회사 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 컬러 필터

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3619852B2 (ja) * 1999-06-08 2005-02-16 ニチゴー・モートン株式会社 感光性樹脂組成物及びこれを用いたドライフィルムレジスト
CN1273867C (zh) * 2001-11-12 2006-09-06 旭化成电子材料元件株式会社 感光性树脂组合物及其用途
CN1989456A (zh) * 2004-07-30 2007-06-27 日立化成工业株式会社 感光性薄膜、感光性薄膜层积体及感光性薄膜卷
JP4535851B2 (ja) * 2004-11-19 2010-09-01 旭化成イーマテリアルズ株式会社 光重合性樹脂組成物
JP4646759B2 (ja) * 2005-09-20 2011-03-09 旭化成イーマテリアルズ株式会社 パターン形成材料、並びにパターン形成装置及びパターン形成方法
JP2007133349A (ja) * 2005-10-14 2007-05-31 Hitachi Chem Co Ltd 感光性フィルムロール
JP4936848B2 (ja) * 2006-10-16 2012-05-23 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその積層体
JPWO2008075575A1 (ja) * 2006-12-19 2010-04-08 日立化成工業株式会社 感光性エレメント
JP2008202022A (ja) * 2007-01-23 2008-09-04 Fujifilm Corp 光ナノインプリントリソグラフィ用硬化性組成物およびそれを用いたパターン形成方法
CN101627339A (zh) * 2007-06-18 2010-01-13 旭化成电子材料株式会社 感光性树脂组合物、柔性印刷版、以及柔性印刷版的制造方法
KR101175079B1 (ko) * 2007-12-18 2012-08-21 아사히 가세이 이-매터리얼즈 가부시키가이샤 네거티브형 감광성 수지 적층체를 사용한 레지스트 경화물의 제조 방법, 네거티브형 감광성 수지 적층체, 및 네거티브형 감광성 수지 적층체의 사용 방법
TWI536094B (zh) * 2007-12-25 2016-06-01 Asahi Kasei Emd Corp Photosensitive resin laminate
JP5396833B2 (ja) * 2008-11-28 2014-01-22 Ｊｓｒ株式会社 感放射線性樹脂組成物、液晶表示素子のスペーサーおよび保護膜ならびにそれらの形成方法
KR101505716B1 (ko) * 2009-07-29 2015-03-24 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물, 감광성 수지 적층체 및 레지스트 패턴 형성 방법
TWI413859B (zh) * 2009-09-25 2013-11-01 Asahi Kasei E Materials Corp A photosensitive resin composition for a resist material, and a photosensitive resin laminate
JP5526868B2 (ja) * 2010-03-03 2014-06-18 Ｊｓｒ株式会社 感放射線性樹脂組成物、表示素子のスペーサーおよび保護膜ならびにそれらの形成方法
JP5570275B2 (ja) * 2010-03-31 2014-08-13 旭化成イーマテリアルズ株式会社 ドライフィルムレジストロール
KR20120002864A (ko) * 2010-07-01 2012-01-09 동우 화인켐 주식회사 흑색 감광성 수지 조성물, 컬러 필터 및 이를 구비한 액정 표시 장치
CN106918991A (zh) * 2010-07-13 2017-07-04 日立化成工业株式会社 感光性元件、抗蚀图案的形成方法、印刷电路布线板的制造方法及印刷电路布线板
JP6022749B2 (ja) 2010-07-30 2016-11-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、リードフレームの製造方法及びプリント配線板の製造方法
JP5771944B2 (ja) * 2010-10-18 2015-09-02 Jsr株式会社 カラーフィルタの製造方法
KR20130098406A (ko) * 2010-12-24 2013-09-04 아사히 가세이 이-매터리얼즈 가부시키가이샤 감광성 수지 조성물
JP5835014B2 (ja) * 2011-03-31 2015-12-24 Jsr株式会社 画素パターンの形成方法及びカラーフィルタの製造方法
JP6229256B2 (ja) 2011-10-31 2017-11-15 日立化成株式会社 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
KR20130047656A (ko) * 2011-10-31 2013-05-08 히타치가세이가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법
JP5948539B2 (ja) * 2012-01-27 2016-07-06 旭化成株式会社 感光性樹脂組成物
JP2013195681A (ja) * 2012-03-19 2013-09-30 Mitsubishi Chemicals Corp 感光性樹脂組成物、カラーフィルタ、液晶表示装置、及び有機ｅｌディスプレイ
JP5853806B2 (ja) * 2012-03-23 2016-02-09 Jsr株式会社 感放射線性樹脂組成物、硬化膜及び硬化膜の形成方法
JP6019791B2 (ja) * 2012-06-19 2016-11-02 日立化成株式会社 隔壁形成材料、これを用いた感光性エレメント、隔壁の形成方法及び画像表示装置の製造方法
JP5826135B2 (ja) * 2012-08-23 2015-12-02 富士フイルム株式会社 着色感放射線性組成物、これを用いたカラーフィルタ
JP6063200B2 (ja) 2012-10-15 2017-01-18 旭化成株式会社 感光性樹脂組成物
JP6120560B2 (ja) * 2012-12-26 2017-04-26 第一工業製薬株式会社 カラーフィルター、ブラックマトリックス、又は回路形成用の硬化性樹脂組成物
JP6135314B2 (ja) * 2012-12-26 2017-05-31 Jsr株式会社 着色組成物、カラーフィルタ及び表示素子
JP6257164B2 (ja) 2013-03-28 2018-01-10 旭化成株式会社 レジストパターンの形成方法
TW201512709A (zh) * 2013-05-27 2015-04-01 Fujifilm Corp 彩色濾光片的製造方法、底層形成用組成物、有機ｅｌ顯示元件
CN105393171B (zh) 2013-07-23 2019-11-26 日立化成株式会社 投影曝光用感光性树脂组合物、感光性元件、抗蚀图案的形成方法、印刷配线板的制造方法和引线框的制造方法
KR20160131084A (ko) * 2014-05-21 2016-11-15 아사히 가세이 가부시키가이샤 감광성 수지 조성물 및 회로 패턴의 형성 방법

Also Published As

Publication number Publication date
TWI667539B (zh) 2019-08-01
JP7162030B2 (ja) 2022-10-27
TW201812454A (zh) 2018-04-01
CN107407880B (zh) 2022-02-08
KR20170101263A (ko) 2017-09-05
KR102286107B1 (ko) 2021-08-04
TWI706222B (zh) 2020-10-01
JPWO2016163540A1 (ja) 2017-11-02
WO2016163540A1 (ja) 2016-10-13
TWI620017B (zh) 2018-04-01
CN114437251A (zh) 2022-05-06
CN114437251B (zh) 2024-02-20
CN107407880A (zh) 2017-11-28
TW201947323A (zh) 2019-12-16
JP7242748B2 (ja) 2023-03-20
TW201701070A (zh) 2017-01-01
KR20190047146A (ko) 2019-05-07
JP2020126251A (ja) 2020-08-20
KR101990230B1 (ko) 2019-06-17
JP2021131556A (ja) 2021-09-09

Similar Documents

Publication Publication Date Title
MY187481A (en) Photosensitive resin composition
EP4023636A4 (en) ACTINIC-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, RESIST FILM AND METHOD FOR PRODUCING AN ELECTRONIC DEVICE
MY174577A (en) Photosensitive resin composition and photosensitive resin laminate
EP3919528A4 (en) ACTINIC RADIATION SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD OF MAKING A PATTERN, AND METHOD OF MAKING AN ELECTRONIC DEVICE
IL284859A (en) A radiation-sensitive or actinic beam-sensitive resin composition, a resistant layer, a method for creating a pattern and a method for producing an electronic device
MY186932A (en) Photosensitive resin composition
TW200710580A (en) Resist underlayer coating forming composition for forming photocrosslinking curable resist underlayer coating
EP3088955A3 (en) Resist composition and patterning process
IL287442A (en) A radiation-sensitive or actinic beam-sensitive resin composition, a resistant layer, a method for creating a pattern and a method for producing an electronic device
IL265647B (en) Actinic beam-sensitive or radiation-sensitive resin composition, method for creating a template and method for manufacturing an electronic device
EP3885378A4 (en) ACTINIC RAY OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD AND PRODUCTION METHOD FOR ELECTRONIC DEVICE
EP3257835A4 (en) Compound, resin, lithography underlayer film forming material, lithography underlayer film forming composition, lithography underlayer film, method for forming resist pattern, method for forming circuit pattern, and method for purifying compound or resin
EP3327005A4 (en) COMPOUND, RESIN, LITHOGRAPHY-BASED UNDERLAYER FILM FORMING MATERIAL, COMPOSITION FOR FORMING LITHOGRAPHY-BASED UNDERLAYER FILM, LITHOGRAPHY-BASED FILM FORMING, PHOTOSENSITIVE RESIN PATTERN FORMING METHOD, PATTERN FORMING METHOD CIRCUIT, AND PURIFICATION METHOD
MY196431A (en) Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board
EP3279179A4 (en) Compound, resin, and method for purifying same, underlayer film formation material for lithography, underlayer film forming composition, and underlayer film, and method for forming resist pattern and method for forming circuit pattern
EP3761114A4 (en) ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND RESIN
JP2017092411A5 (ja)
EP4129975A4 (en) ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN FORMATION METHOD, RESIST FILM, AND PRODUCTION METHOD FOR ELECTRONIC DEVICE
EP3605226A4 (en) ACTINIC OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND METHOD FOR PRODUCING ELECTRONIC DEVICE
EP4166582A4 (en) ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD AND METHOD FOR MANUFACTURING ELECTRONIC DEVICES
MY187337A (en) Photosensitive resin composition and photosensitive resin laminate
TWI800675B (zh) 感光化射線性或感放射線性樹脂組成物、抗蝕劑膜、圖案形成方法、電子器件之製造方法
EP3893054A4 (en) PATTERN MAKING METHOD, LIGHT SENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE AND DEVICE
TW201612633A (en) Photosensitive composition, manufacturing method of cured film, cured film and application therefor
EP4293055A4 (en) ACTIVE RADIATION-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD FOR FORMING A POSITIVE-WORKING PATTERN AND METHOD FOR MANUFACTURING AN ELECTRONIC DEVICE