TWI706222B - 感光性樹脂組合物 - Google Patents
感光性樹脂組合物 Download PDFInfo
- Publication number
- TWI706222B TWI706222B TW108122448A TW108122448A TWI706222B TW I706222 B TWI706222 B TW I706222B TW 108122448 A TW108122448 A TW 108122448A TW 108122448 A TW108122448 A TW 108122448A TW I706222 B TWI706222 B TW I706222B
- Authority
- TW
- Taiwan
- Prior art keywords
- photosensitive resin
- compound
- resin composition
- mass
- meth
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 124
- 150000001875 compounds Chemical class 0.000 claims abstract description 118
- 229920005989 resin Polymers 0.000 claims abstract description 77
- 239000011347 resin Substances 0.000 claims abstract description 77
- 239000000758 substrate Substances 0.000 claims abstract description 60
- 229920000642 polymer Polymers 0.000 claims abstract description 46
- 238000011161 development Methods 0.000 claims abstract description 39
- 239000003999 initiator Substances 0.000 claims abstract description 16
- -1 acrylate compound Chemical class 0.000 claims description 67
- 238000000034 method Methods 0.000 claims description 45
- 230000018109 developmental process Effects 0.000 claims description 38
- 125000002947 alkylene group Chemical group 0.000 claims description 27
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical group C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 claims description 25
- 125000003118 aryl group Chemical group 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 25
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical group OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims description 22
- 239000004020 conductor Substances 0.000 claims description 18
- 230000009477 glass transition Effects 0.000 claims description 17
- 125000005395 methacrylic acid group Chemical group 0.000 claims description 17
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical group C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 11
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 10
- 239000000654 additive Substances 0.000 claims description 8
- 238000005530 etching Methods 0.000 claims description 8
- 239000007787 solid Substances 0.000 claims description 8
- 125000000217 alkyl group Chemical group 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical class C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 238000003384 imaging method Methods 0.000 claims description 4
- 239000004305 biphenyl Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 125000005641 methacryl group Chemical group 0.000 claims description 2
- 230000007261 regionalization Effects 0.000 claims description 2
- 229920006395 saturated elastomer Polymers 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 33
- 206010059866 Drug resistance Diseases 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 67
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 33
- 238000011156 evaluation Methods 0.000 description 24
- 239000000178 monomer Substances 0.000 description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 16
- 230000035945 sensitivity Effects 0.000 description 16
- 229920001577 copolymer Polymers 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 13
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 13
- 239000007864 aqueous solution Substances 0.000 description 12
- 239000007788 liquid Substances 0.000 description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 11
- 239000011241 protective layer Substances 0.000 description 11
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 10
- 239000010949 copper Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 9
- 230000000740 bleeding effect Effects 0.000 description 8
- 238000003475 lamination Methods 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 7
- 125000001424 substituent group Chemical group 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 6
- 239000004793 Polystyrene Substances 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 6
- 125000003710 aryl alkyl group Chemical group 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000007334 copolymerization reaction Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 6
- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229920002223 polystyrene Polymers 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 5
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000005488 sandblasting Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 4
- 239000002202 Polyethylene glycol Substances 0.000 description 4
- 239000000975 dye Substances 0.000 description 4
- 150000002148 esters Chemical class 0.000 description 4
- 125000005842 heteroatom Chemical group 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- 229920000573 polyethylene Polymers 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 150000008365 aromatic ketones Chemical class 0.000 description 3
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 3
- 239000000470 constituent Substances 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- CDOSHBSSFJOMGT-UHFFFAOYSA-N linalool Chemical compound CC(C)=CCCC(C)(O)C=C CDOSHBSSFJOMGT-UHFFFAOYSA-N 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- KJUGUADJHNHALS-UHFFFAOYSA-N 1H-tetrazole Chemical compound C=1N=NNN=1 KJUGUADJHNHALS-UHFFFAOYSA-N 0.000 description 2
- KFJDQPJLANOOOB-UHFFFAOYSA-N 2h-benzotriazole-4-carboxylic acid Chemical class OC(=O)C1=CC=CC2=NNN=C12 KFJDQPJLANOOOB-UHFFFAOYSA-N 0.000 description 2
- GUOVBFFLXKJFEE-UHFFFAOYSA-N 2h-benzotriazole-5-carboxylic acid Chemical compound C1=C(C(=O)O)C=CC2=NNN=C21 GUOVBFFLXKJFEE-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- IRQWEODKXLDORP-UHFFFAOYSA-N 4-ethenylbenzoic acid Chemical group OC(=O)C1=CC=C(C=C)C=C1 IRQWEODKXLDORP-UHFFFAOYSA-N 0.000 description 2
- RBCUMFMSGIXKMI-UHFFFAOYSA-N C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C1CO1 Chemical compound C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C(C(=C)C)(=O)O.C1CO1 RBCUMFMSGIXKMI-UHFFFAOYSA-N 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- OAZWDJGLIYNYMU-UHFFFAOYSA-N Leucocrystal Violet Chemical compound C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)N(C)C)C1=CC=C(N(C)C)C=C1 OAZWDJGLIYNYMU-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 2
- 244000028419 Styrax benzoin Species 0.000 description 2
- 235000000126 Styrax benzoin Nutrition 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 description 2
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 2
- 235000005811 Viola adunca Nutrition 0.000 description 2
- 240000009038 Viola odorata Species 0.000 description 2
- 235000013487 Viola odorata Nutrition 0.000 description 2
- 235000002254 Viola papilionacea Nutrition 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000005529 alkyleneoxy group Chemical group 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 229960002130 benzoin Drugs 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 2
- NNBFNNNWANBMTI-UHFFFAOYSA-M brilliant green Chemical compound OS([O-])(=O)=O.C1=CC(N(CC)CC)=CC=C1C(C=1C=CC=CC=1)=C1C=CC(=[N+](CC)CC)C=C1 NNBFNNNWANBMTI-UHFFFAOYSA-M 0.000 description 2
- 238000011088 calibration curve Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 235000019382 gum benzoic Nutrition 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000003884 phenylalkyl group Chemical group 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 150000003219 pyrazolines Chemical class 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- 230000001629 suppression Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000003021 water soluble solvent Substances 0.000 description 2
- 150000007934 α,β-unsaturated carboxylic acids Chemical class 0.000 description 2
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- SLBOQBILGNEPEB-UHFFFAOYSA-N 1-chloroprop-2-enylbenzene Chemical compound C=CC(Cl)C1=CC=CC=C1 SLBOQBILGNEPEB-UHFFFAOYSA-N 0.000 description 1
- XOHZHMUQBFJTNH-UHFFFAOYSA-N 1-methyl-2h-tetrazole-5-thione Chemical compound CN1N=NN=C1S XOHZHMUQBFJTNH-UHFFFAOYSA-N 0.000 description 1
- MHHJQVRGRPHIMR-UHFFFAOYSA-N 1-phenylprop-2-en-1-ol Chemical compound C=CC(O)C1=CC=CC=C1 MHHJQVRGRPHIMR-UHFFFAOYSA-N 0.000 description 1
- MACMNSLOLFMQKL-UHFFFAOYSA-N 1-sulfanyltriazole Chemical compound SN1C=CN=N1 MACMNSLOLFMQKL-UHFFFAOYSA-N 0.000 description 1
- AFBBKYQYNPNMAT-UHFFFAOYSA-N 1h-1,2,4-triazol-1-ium-3-thiolate Chemical compound SC=1N=CNN=1 AFBBKYQYNPNMAT-UHFFFAOYSA-N 0.000 description 1
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 1
- NEBBLNDVSSWJLL-UHFFFAOYSA-N 2,3-bis(2-methylprop-2-enoyloxy)propyl 2-methylprop-2-enoate Chemical class CC(=C)C(=O)OCC(OC(=O)C(C)=C)COC(=O)C(C)=C NEBBLNDVSSWJLL-UHFFFAOYSA-N 0.000 description 1
- JFWOLMRNYJBCCJ-UHFFFAOYSA-N 2,4-bis(2-chlorophenyl)-2-[2-(2-chlorophenyl)-4,5-diphenylimidazol-2-yl]-5-(3,4-dimethoxyphenyl)imidazole Chemical compound C1=C(OC)C(OC)=CC=C1C1=NC(C2(N=C(C(=N2)C=2C=CC=CC=2)C=2C=CC=CC=2)C=2C(=CC=CC=2)Cl)(C=2C(=CC=CC=2)Cl)N=C1C1=CC=CC=C1Cl JFWOLMRNYJBCCJ-UHFFFAOYSA-N 0.000 description 1
- RKFITYIZOSRLCV-UHFFFAOYSA-N 2-(2,4-difluorophenyl)-2-[2-(2,4-difluorophenyl)-4,5-bis(3-methoxyphenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=CC(F)=CC=2)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=CC(F)=CC=2)F)C=2C=C(OC)C=CC=2)=C1 RKFITYIZOSRLCV-UHFFFAOYSA-N 0.000 description 1
- JCYHWKVBYDDNKD-UHFFFAOYSA-N 2-(2,5-difluorophenyl)-2-[2-(2,5-difluorophenyl)-4,5-bis(3-methoxyphenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=CC=C(F)C=2)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=CC=C(F)C=2)F)C=2C=C(OC)C=CC=2)=C1 JCYHWKVBYDDNKD-UHFFFAOYSA-N 0.000 description 1
- LVXWJQRVXVFARN-UHFFFAOYSA-N 2-(2,6-difluorophenyl)-2-[2-(2,6-difluorophenyl)-4,5-bis(3-methoxyphenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=CC=CC=2F)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=CC=CC=2F)F)C=2C=C(OC)C=CC=2)=C1 LVXWJQRVXVFARN-UHFFFAOYSA-N 0.000 description 1
- NSWNXQGJAPQOID-UHFFFAOYSA-N 2-(2-chlorophenyl)-4,5-diphenyl-1h-imidazole Chemical class ClC1=CC=CC=C1C1=NC(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)N1 NSWNXQGJAPQOID-UHFFFAOYSA-N 0.000 description 1
- TVIPVNDJQQUGOQ-UHFFFAOYSA-N 2-(2-fluorophenyl)-2-[2-(2-fluorophenyl)-4,5-bis(3-methoxyphenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=CC=CC=2)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=CC=CC=2)F)C=2C=C(OC)C=CC=2)=C1 TVIPVNDJQQUGOQ-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- LESMLVDJJCWZAJ-UHFFFAOYSA-N 2-(diphenylphosphorylmethyl)-1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1CP(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 LESMLVDJJCWZAJ-UHFFFAOYSA-N 0.000 description 1
- JQMPYPZEZKHJTJ-UHFFFAOYSA-N 2-[2,3-bis(fluoromethyl)phenyl]-2-[2-[2,3-bis(fluoromethyl)phenyl]-4,5-bis(3-methoxyphenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)imidazole Chemical compound FCC1=C(C=CC=C1CF)C1(N=C(C(=N1)C1=CC(=CC=C1)OC)C1=CC(=CC=C1)OC)C1(N=C(C(=N1)C1=CC(=CC=C1)OC)C1=CC(=CC=C1)OC)C1=C(C(=CC=C1)CF)CF JQMPYPZEZKHJTJ-UHFFFAOYSA-N 0.000 description 1
- XOLNSMTWLSOUQY-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-(2-hydroxyethoxy)ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]-1-(4-nonylphenoxy)ethanol;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCCCCCCC1=CC=C(OC(O)COCCOCCOCCOCCOCCOCCOCCO)C=C1 XOLNSMTWLSOUQY-UHFFFAOYSA-N 0.000 description 1
- AIYITDGPHANYCA-UHFFFAOYSA-N 2-[4,5-bis(3-methoxyphenyl)-2-(2,3,4,5,6-pentafluorophenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)-2-(2,3,4,5,6-pentafluorophenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=C(F)C(F)=C(F)C=2F)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=C(F)C(F)=C(F)C=2F)F)C=2C=C(OC)C=CC=2)=C1 AIYITDGPHANYCA-UHFFFAOYSA-N 0.000 description 1
- QIBDXULXPMPHQJ-UHFFFAOYSA-N 2-[4,5-bis(3-methoxyphenyl)-2-(2,3,4,5-tetrafluorophenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)-2-(2,3,4,5-tetrafluorophenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=C(F)C(F)=C(F)C=2)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=C(F)C(F)=C(F)C=2)F)C=2C=C(OC)C=CC=2)=C1 QIBDXULXPMPHQJ-UHFFFAOYSA-N 0.000 description 1
- CURWTGUJTJSIHH-UHFFFAOYSA-N 2-[4,5-bis(3-methoxyphenyl)-2-(2,3,4,6-tetrafluorophenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)-2-(2,3,4,6-tetrafluorophenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=C(F)C(F)=CC=2F)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=C(F)C(F)=CC=2F)F)C=2C=C(OC)C=CC=2)=C1 CURWTGUJTJSIHH-UHFFFAOYSA-N 0.000 description 1
- SBFRPEDNHKKDLM-UHFFFAOYSA-N 2-[4,5-bis(3-methoxyphenyl)-2-(2,3,4-trifluorophenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)-2-(2,3,4-trifluorophenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=C(F)C(F)=CC=2)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=C(F)C(F)=CC=2)F)C=2C=C(OC)C=CC=2)=C1 SBFRPEDNHKKDLM-UHFFFAOYSA-N 0.000 description 1
- UEXKPAUCRZATAJ-UHFFFAOYSA-N 2-[4,5-bis(3-methoxyphenyl)-2-(2,3,5-trifluorophenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)-2-(2,3,5-trifluorophenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=C(F)C=C(F)C=2)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=C(F)C=C(F)C=2)F)C=2C=C(OC)C=CC=2)=C1 UEXKPAUCRZATAJ-UHFFFAOYSA-N 0.000 description 1
- FSJIFAIDISSFSN-UHFFFAOYSA-N 2-[4,5-bis(3-methoxyphenyl)-2-(2,4,5-trifluorophenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)-2-(2,4,5-trifluorophenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=CC(F)=C(F)C=2)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=CC(F)=C(F)C=2)F)C=2C=C(OC)C=CC=2)=C1 FSJIFAIDISSFSN-UHFFFAOYSA-N 0.000 description 1
- KCMZYSGKVTYPII-UHFFFAOYSA-N 2-[4,5-bis(3-methoxyphenyl)-2-(2,4,6-trifluorophenyl)imidazol-2-yl]-4,5-bis(3-methoxyphenyl)-2-(2,4,6-trifluorophenyl)imidazole Chemical compound COC1=CC=CC(C=2C(=NC(N=2)(C=2C(=CC(F)=CC=2F)F)C2(N=C(C(=N2)C=2C=C(OC)C=CC=2)C=2C=C(OC)C=CC=2)C=2C(=CC(F)=CC=2F)F)C=2C=C(OC)C=CC=2)=C1 KCMZYSGKVTYPII-UHFFFAOYSA-N 0.000 description 1
- KUAUJXBLDYVELT-UHFFFAOYSA-N 2-[[2,2-dimethyl-3-(oxiran-2-ylmethoxy)propoxy]methyl]oxirane Chemical compound C1OC1COCC(C)(C)COCC1CO1 KUAUJXBLDYVELT-UHFFFAOYSA-N 0.000 description 1
- HXLLCROMVONRRO-UHFFFAOYSA-N 2-butoxyethenylbenzene Chemical group CCCCOC=CC1=CC=CC=C1 HXLLCROMVONRRO-UHFFFAOYSA-N 0.000 description 1
- QWRSIYJPSWSLTL-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol 2-methylprop-2-enoic acid Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(=C)C(O)=O.CCC(CO)(CO)CO.CCC(CO)(CO)CO QWRSIYJPSWSLTL-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- TWKGRZHFOJJWGP-UHFFFAOYSA-N 2-phenyl-3-(4-propan-2-ylphenyl)-5-[2-(4-propan-2-ylphenyl)ethenyl]-1,3-dihydropyrazole Chemical compound C1=CC(C(C)C)=CC=C1C=CC1=CC(C=2C=CC(=CC=2)C(C)C)N(C=2C=CC=CC=2)N1 TWKGRZHFOJJWGP-UHFFFAOYSA-N 0.000 description 1
- FMFHUEMLVAIBFI-UHFFFAOYSA-N 2-phenylethenyl acetate Chemical group CC(=O)OC=CC1=CC=CC=C1 FMFHUEMLVAIBFI-UHFFFAOYSA-N 0.000 description 1
- LZHCVNIARUXHAL-UHFFFAOYSA-N 2-tert-butyl-4-ethylphenol Chemical compound CCC1=CC=C(O)C(C(C)(C)C)=C1 LZHCVNIARUXHAL-UHFFFAOYSA-N 0.000 description 1
- ULRPISSMEBPJLN-UHFFFAOYSA-N 2h-tetrazol-5-amine Chemical compound NC1=NN=NN1 ULRPISSMEBPJLN-UHFFFAOYSA-N 0.000 description 1
- YCVSNZBGCXUYAK-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)-5-[2-(2,3-dimethoxyphenyl)ethenyl]-2-phenyl-1,3-dihydropyrazole Chemical compound COC1=CC=CC(C=CC=2NN(C(C=2)C=2C(=C(OC)C=CC=2)OC)C=2C=CC=CC=2)=C1OC YCVSNZBGCXUYAK-UHFFFAOYSA-N 0.000 description 1
- KCVVTXFNIHFLGX-UHFFFAOYSA-N 3-(2,4-dimethoxyphenyl)-5-[2-(2,4-dimethoxyphenyl)ethenyl]-2-phenyl-1,3-dihydropyrazole Chemical compound COC1=CC(OC)=CC=C1C=CC1=CC(C=2C(=CC(OC)=CC=2)OC)N(C=2C=CC=CC=2)N1 KCVVTXFNIHFLGX-UHFFFAOYSA-N 0.000 description 1
- QSOSDSRECCIDKA-UHFFFAOYSA-N 3-(2,6-dimethoxyphenyl)-5-[2-(2,6-dimethoxyphenyl)ethenyl]-2-phenyl-1,3-dihydropyrazole Chemical compound COC1=CC=CC(OC)=C1C=CC1=CC(C=2C(=CC=CC=2OC)OC)N(C=2C=CC=CC=2)N1 QSOSDSRECCIDKA-UHFFFAOYSA-N 0.000 description 1
- ONZXDAZFTRWYQU-UHFFFAOYSA-N 3-(3,5-dimethoxyphenyl)-5-[2-(3,5-dimethoxyphenyl)ethenyl]-2-phenyl-1,3-dihydropyrazole Chemical compound COC1=CC(OC)=CC(C=CC=2NN(C(C=2)C=2C=C(OC)C=C(OC)C=2)C=2C=CC=CC=2)=C1 ONZXDAZFTRWYQU-UHFFFAOYSA-N 0.000 description 1
- ZMESCNYFNZEIFB-UHFFFAOYSA-N 3-(4-methoxyphenyl)-5-[2-(4-methoxyphenyl)ethenyl]-2-phenyl-1,3-dihydropyrazole Chemical compound C1=CC(OC)=CC=C1C=CC1=CC(C=2C=CC(OC)=CC=2)N(C=2C=CC=CC=2)N1 ZMESCNYFNZEIFB-UHFFFAOYSA-N 0.000 description 1
- ZEABUURVUDRWCF-UHFFFAOYSA-N 3-(4-tert-butylphenyl)-5-[2-(4-tert-butylphenyl)ethenyl]-2-phenyl-1,3-dihydropyrazole Chemical compound C1=CC(C(C)(C)C)=CC=C1C=CC1=CC(C=2C=CC(=CC=2)C(C)(C)C)N(C=2C=CC=CC=2)N1 ZEABUURVUDRWCF-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- XESZUVZBAMCAEJ-UHFFFAOYSA-N 4-tert-butylcatechol Chemical compound CC(C)(C)C1=CC=C(O)C(O)=C1 XESZUVZBAMCAEJ-UHFFFAOYSA-N 0.000 description 1
- WZUUZPAYWFIBDF-UHFFFAOYSA-N 5-amino-1,2-dihydro-1,2,4-triazole-3-thione Chemical compound NC1=NNC(S)=N1 WZUUZPAYWFIBDF-UHFFFAOYSA-N 0.000 description 1
- GDGIVSREGUOIJZ-UHFFFAOYSA-N 5-amino-3h-1,3,4-thiadiazole-2-thione Chemical compound NC1=NN=C(S)S1 GDGIVSREGUOIJZ-UHFFFAOYSA-N 0.000 description 1
- HOSGXJWQVBHGLT-UHFFFAOYSA-N 6-hydroxy-3,4-dihydro-1h-quinolin-2-one Chemical group N1C(=O)CCC2=CC(O)=CC=C21 HOSGXJWQVBHGLT-UHFFFAOYSA-N 0.000 description 1
- KSMGAOMUPSQGTB-UHFFFAOYSA-N 9,10-dibutoxyanthracene Chemical compound C1=CC=C2C(OCCCC)=C(C=CC=C3)C3=C(OCCCC)C2=C1 KSMGAOMUPSQGTB-UHFFFAOYSA-N 0.000 description 1
- GJNKQJAJXSUJBO-UHFFFAOYSA-N 9,10-diethoxyanthracene Chemical compound C1=CC=C2C(OCC)=C(C=CC=C3)C3=C(OCC)C2=C1 GJNKQJAJXSUJBO-UHFFFAOYSA-N 0.000 description 1
- FCNCGHJSNVOIKE-UHFFFAOYSA-N 9,10-diphenylanthracene Chemical compound C1=CC=CC=C1C(C1=CC=CC=C11)=C(C=CC=C2)C2=C1C1=CC=CC=C1 FCNCGHJSNVOIKE-UHFFFAOYSA-N 0.000 description 1
- DOGGTYYFTFGYQM-UHFFFAOYSA-N 9-(3-methylphenyl)acridine Chemical compound CC1=CC=CC(C=2C3=CC=CC=C3N=C3C=CC=CC3=2)=C1 DOGGTYYFTFGYQM-UHFFFAOYSA-N 0.000 description 1
- KORJZGKNZUDLII-UHFFFAOYSA-N 9-(4-methylphenyl)acridine Chemical compound C1=CC(C)=CC=C1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 KORJZGKNZUDLII-UHFFFAOYSA-N 0.000 description 1
- MTRFEWTWIPAXLG-UHFFFAOYSA-N 9-phenylacridine Chemical compound C1=CC=CC=C1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 MTRFEWTWIPAXLG-UHFFFAOYSA-N 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- IYPRQDJDFFCBHV-UHFFFAOYSA-N C(C=C)(=O)O.C(CCCCCCCC)C1=CC=C(OC(COCCOCCOCCO)O)C=C1 Chemical compound C(C=C)(=O)O.C(CCCCCCCC)C1=CC=C(OC(COCCOCCOCCO)O)C=C1 IYPRQDJDFFCBHV-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical class OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 101001134276 Homo sapiens S-methyl-5'-thioadenosine phosphorylase Proteins 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- NPKSPKHJBVJUKB-UHFFFAOYSA-N N-phenylglycine Chemical compound OC(=O)CNC1=CC=CC=C1 NPKSPKHJBVJUKB-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- 102100022050 Protein canopy homolog 2 Human genes 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- OKKRPWIIYQTPQF-UHFFFAOYSA-N Trimethylolpropane trimethacrylate Chemical compound CC(=C)C(=O)OCC(CC)(COC(=O)C(C)=C)COC(=O)C(C)=C OKKRPWIIYQTPQF-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- JUDXBRVLWDGRBC-UHFFFAOYSA-N [2-(hydroxymethyl)-3-(2-methylprop-2-enoyloxy)-2-(2-methylprop-2-enoyloxymethyl)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CO)(COC(=O)C(C)=C)COC(=O)C(C)=C JUDXBRVLWDGRBC-UHFFFAOYSA-N 0.000 description 1
- ARNIZPSLPHFDED-UHFFFAOYSA-N [4-(dimethylamino)phenyl]-(4-methoxyphenyl)methanone Chemical compound C1=CC(OC)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 ARNIZPSLPHFDED-UHFFFAOYSA-N 0.000 description 1
- 238000002835 absorbance Methods 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 150000001251 acridines Chemical class 0.000 description 1
- 125000002252 acyl group Chemical group 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- 125000003342 alkenyl group Chemical group 0.000 description 1
- 125000004453 alkoxycarbonyl group Chemical group 0.000 description 1
- 125000003282 alkyl amino group Chemical group 0.000 description 1
- 125000004448 alkyl carbonyl group Chemical group 0.000 description 1
- 125000004414 alkyl thio group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 150000001454 anthracenes Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N benzene Substances C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- ZYGHJZDHTFUPRJ-UHFFFAOYSA-N benzo-alpha-pyrone Natural products C1=CC=C2OC(=O)C=CC2=C1 ZYGHJZDHTFUPRJ-UHFFFAOYSA-N 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- VYHBFRJRBHMIQZ-UHFFFAOYSA-N bis[4-(diethylamino)phenyl]methanone Chemical compound C1=CC(N(CC)CC)=CC=C1C(=O)C1=CC=C(N(CC)CC)C=C1 VYHBFRJRBHMIQZ-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004181 carboxyalkyl group Chemical group 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 125000004803 chlorobenzyl group Chemical group 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 235000001671 coumarin Nutrition 0.000 description 1
- 229960000956 coumarin Drugs 0.000 description 1
- AFYCEAFSNDLKSX-UHFFFAOYSA-N coumarin 460 Chemical compound CC1=CC(=O)OC2=CC(N(CC)CC)=CC=C21 AFYCEAFSNDLKSX-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 125000004663 dialkyl amino group Chemical group 0.000 description 1
- HPNMFZURTQLUMO-UHFFFAOYSA-N diethylamine Chemical compound CCNCC HPNMFZURTQLUMO-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- MPQXHAGKBWFSNV-UHFFFAOYSA-N oxidophosphanium Chemical class [PH3]=O MPQXHAGKBWFSNV-UHFFFAOYSA-N 0.000 description 1
- 125000000466 oxiranyl group Chemical group 0.000 description 1
- 125000001820 oxy group Chemical group [*:1]O[*:2] 0.000 description 1
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 125000000286 phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000003918 potentiometric titration Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- UFUASNAHBMBJIX-UHFFFAOYSA-N propan-1-one Chemical compound CC[C]=O UFUASNAHBMBJIX-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000004448 titration Methods 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- ZMKFCSOFJFHVQJ-UHFFFAOYSA-N tribromomethylsulfanylbenzene Chemical compound BrC(Br)(Br)SC1=CC=CC=C1 ZMKFCSOFJFHVQJ-UHFFFAOYSA-N 0.000 description 1
- 239000013638 trimer Substances 0.000 description 1
- FIQMHBFVRAXMOP-UHFFFAOYSA-N triphenylphosphane oxide Chemical compound C=1C=CC=CC=1P(C=1C=CC=CC=1)(=O)C1=CC=CC=C1 FIQMHBFVRAXMOP-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/10—Esters
- C08F20/26—Esters containing oxygen in addition to the carboxy oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/04—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of esters
- C08F265/06—Polymerisation of acrylate or methacrylate esters on to polymers thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/42—Stripping or agents therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015-079381 | 2015-04-08 | ||
JP2015079381 | 2015-04-08 | ||
JP2015-166570 | 2015-08-26 | ||
JP2015166570 | 2015-08-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201947323A TW201947323A (zh) | 2019-12-16 |
TWI706222B true TWI706222B (zh) | 2020-10-01 |
Family
ID=57073148
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108122448A TWI706222B (zh) | 2015-04-08 | 2016-04-08 | 感光性樹脂組合物 |
TW106146049A TWI667539B (zh) | 2015-04-08 | 2016-04-08 | Photosensitive resin composition |
TW105111187A TWI620017B (zh) | 2015-04-08 | 2016-04-08 | Photosensitive resin composition |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW106146049A TWI667539B (zh) | 2015-04-08 | 2016-04-08 | Photosensitive resin composition |
TW105111187A TWI620017B (zh) | 2015-04-08 | 2016-04-08 | Photosensitive resin composition |
Country Status (6)
Country | Link |
---|---|
JP (3) | JPWO2016163540A1 (ja) |
KR (2) | KR101990230B1 (ja) |
CN (2) | CN107407880B (ja) |
MY (1) | MY187481A (ja) |
TW (3) | TWI706222B (ja) |
WO (1) | WO2016163540A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI666518B (zh) * | 2016-12-30 | 2019-07-21 | 奇美實業股份有限公司 | 感光性樹脂組成物及其應用 |
JP6981864B2 (ja) * | 2017-01-30 | 2021-12-17 | 旭化成株式会社 | 感光性樹脂組成物、感光性樹脂積層体、レジストパターンが形成された基板および回路基板の製造方法 |
CN116300314A (zh) * | 2017-03-01 | 2023-06-23 | 旭化成株式会社 | 感光性树脂组合物 |
CN115524922A (zh) * | 2017-03-29 | 2022-12-27 | 旭化成株式会社 | 感光性树脂组合物 |
CN109976092B (zh) * | 2017-12-27 | 2022-04-01 | 太阳油墨(苏州)有限公司 | 固化性树脂组合物、干膜、固化物、及印刷电路板 |
KR102605003B1 (ko) * | 2018-06-22 | 2023-11-22 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 레지스트 패턴의 형성 방법 |
WO2019244724A1 (ja) * | 2018-06-22 | 2019-12-26 | 旭化成株式会社 | 感光性樹脂組成物およびレジストパターンの形成方法 |
KR102519818B1 (ko) * | 2018-07-11 | 2023-04-10 | 후지필름 가부시키가이샤 | 약액, 약액 수용체 |
KR102509152B1 (ko) * | 2018-08-09 | 2023-03-10 | 아사히 가세이 가부시키가이샤 | 감광성 수지 조성물 및 레지스트 패턴의 형성 방법 |
US20220362110A1 (en) * | 2019-09-19 | 2022-11-17 | Kuraray Noritake Dental Inc. | Dental curable composition |
CN114667487A (zh) * | 2019-11-11 | 2022-06-24 | 旭化成株式会社 | 感光性树脂组合物和感光性树脂层叠体 |
US20230273518A1 (en) * | 2020-08-07 | 2023-08-31 | Showa Denko Materials Co., Ltd. | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board |
JPWO2022181485A1 (ja) * | 2021-02-26 | 2022-09-01 | ||
WO2022181764A1 (ja) * | 2021-02-26 | 2022-09-01 | 太陽インキ製造株式会社 | 積層構造体およびフレキシブルプリント配線板 |
KR20240031514A (ko) * | 2022-08-30 | 2024-03-08 | 삼성에스디아이 주식회사 | 감광성 수지 조성물, 이를 이용하여 제조된 감광성 수지막 및 컬러 필터 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006145844A (ja) * | 2004-11-19 | 2006-06-08 | Asahi Kasei Electronics Co Ltd | 光重合性樹脂組成物 |
US20070269738A1 (en) * | 2004-07-30 | 2007-11-22 | Hitachi Chemical Company, Ltd. | Photosensitive Film, Photosensitive Film Laminate and Photosensitive Film Roll |
JP2008094803A (ja) * | 2006-10-16 | 2008-04-24 | Asahi Kasei Electronics Co Ltd | 感光性樹脂組成物およびその積層体 |
TW200846824A (en) * | 2007-01-23 | 2008-12-01 | Fujifilm Corp | Curing composition for photonano-imprinting lithography and pattern forming method by using the same |
EP2096493A1 (en) * | 2006-12-19 | 2009-09-02 | Hitachi Chemical Company, Ltd. | Photosensitive element |
TW200947116A (en) * | 2007-12-18 | 2009-11-16 | Asahi Kasei Emd Corp | Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate |
CN101627339A (zh) * | 2007-06-18 | 2010-01-13 | 旭化成电子材料株式会社 | 感光性树脂组合物、柔性印刷版、以及柔性印刷版的制造方法 |
TW201120572A (en) * | 2009-09-25 | 2011-06-16 | Asahi Kasei E Materials Corp | Photosensitive resin composition for resist material, and photosensitive resin laminate |
WO2015178462A1 (ja) * | 2014-05-21 | 2015-11-26 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び回路パターンの形成方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3619852B2 (ja) * | 1999-06-08 | 2005-02-16 | ニチゴー・モートン株式会社 | 感光性樹脂組成物及びこれを用いたドライフィルムレジスト |
CN1273867C (zh) * | 2001-11-12 | 2006-09-06 | 旭化成电子材料元件株式会社 | 感光性树脂组合物及其用途 |
JP4646759B2 (ja) | 2005-09-20 | 2011-03-09 | 旭化成イーマテリアルズ株式会社 | パターン形成材料、並びにパターン形成装置及びパターン形成方法 |
JP2007133349A (ja) * | 2005-10-14 | 2007-05-31 | Hitachi Chem Co Ltd | 感光性フィルムロール |
TWI536094B (zh) * | 2007-12-25 | 2016-06-01 | Asahi Kasei Emd Corp | Photosensitive resin laminate |
JP5396833B2 (ja) * | 2008-11-28 | 2014-01-22 | Jsr株式会社 | 感放射線性樹脂組成物、液晶表示素子のスペーサーおよび保護膜ならびにそれらの形成方法 |
WO2011013664A1 (ja) * | 2009-07-29 | 2011-02-03 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法 |
JP5526868B2 (ja) * | 2010-03-03 | 2014-06-18 | Jsr株式会社 | 感放射線性樹脂組成物、表示素子のスペーサーおよび保護膜ならびにそれらの形成方法 |
JP5570275B2 (ja) * | 2010-03-31 | 2014-08-13 | 旭化成イーマテリアルズ株式会社 | ドライフィルムレジストロール |
KR20120002864A (ko) * | 2010-07-01 | 2012-01-09 | 동우 화인켐 주식회사 | 흑색 감광성 수지 조성물, 컬러 필터 및 이를 구비한 액정 표시 장치 |
CN106918991A (zh) * | 2010-07-13 | 2017-07-04 | 日立化成工业株式会社 | 感光性元件、抗蚀图案的形成方法、印刷电路布线板的制造方法及印刷电路布线板 |
JP6022749B2 (ja) * | 2010-07-30 | 2016-11-09 | 日立化成株式会社 | 感光性樹脂組成物、感光性エレメント、レジストパターンの製造方法、リードフレームの製造方法及びプリント配線板の製造方法 |
JP5771944B2 (ja) * | 2010-10-18 | 2015-09-02 | Jsr株式会社 | カラーフィルタの製造方法 |
CN103282829B (zh) * | 2010-12-24 | 2016-08-17 | 旭化成株式会社 | 感光性树脂组合物 |
JP5835014B2 (ja) * | 2011-03-31 | 2015-12-24 | Jsr株式会社 | 画素パターンの形成方法及びカラーフィルタの製造方法 |
KR20130047656A (ko) * | 2011-10-31 | 2013-05-08 | 히타치가세이가부시끼가이샤 | 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법 |
JP6229256B2 (ja) | 2011-10-31 | 2017-11-15 | 日立化成株式会社 | 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP5948539B2 (ja) | 2012-01-27 | 2016-07-06 | 旭化成株式会社 | 感光性樹脂組成物 |
JP2013195681A (ja) * | 2012-03-19 | 2013-09-30 | Mitsubishi Chemicals Corp | 感光性樹脂組成物、カラーフィルタ、液晶表示装置、及び有機elディスプレイ |
JP5853806B2 (ja) * | 2012-03-23 | 2016-02-09 | Jsr株式会社 | 感放射線性樹脂組成物、硬化膜及び硬化膜の形成方法 |
JP6019791B2 (ja) * | 2012-06-19 | 2016-11-02 | 日立化成株式会社 | 隔壁形成材料、これを用いた感光性エレメント、隔壁の形成方法及び画像表示装置の製造方法 |
JP5826135B2 (ja) * | 2012-08-23 | 2015-12-02 | 富士フイルム株式会社 | 着色感放射線性組成物、これを用いたカラーフィルタ |
JP6063200B2 (ja) * | 2012-10-15 | 2017-01-18 | 旭化成株式会社 | 感光性樹脂組成物 |
JP6120560B2 (ja) * | 2012-12-26 | 2017-04-26 | 第一工業製薬株式会社 | カラーフィルター、ブラックマトリックス、又は回路形成用の硬化性樹脂組成物 |
JP6135314B2 (ja) * | 2012-12-26 | 2017-05-31 | Jsr株式会社 | 着色組成物、カラーフィルタ及び表示素子 |
JP6257164B2 (ja) | 2013-03-28 | 2018-01-10 | 旭化成株式会社 | レジストパターンの形成方法 |
WO2014192716A1 (ja) * | 2013-05-27 | 2014-12-04 | 富士フイルム株式会社 | カラーフィルタの製造方法、下地層形成用組成物、有機el表示装置 |
JP6432511B2 (ja) | 2013-07-23 | 2018-12-05 | 日立化成株式会社 | 投影露光用感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法及びリードフレームの製造方法 |
-
2016
- 2016-04-08 TW TW108122448A patent/TWI706222B/zh active
- 2016-04-08 TW TW106146049A patent/TWI667539B/zh active
- 2016-04-08 WO PCT/JP2016/061610 patent/WO2016163540A1/ja active Application Filing
- 2016-04-08 CN CN201680019911.6A patent/CN107407880B/zh active Active
- 2016-04-08 TW TW105111187A patent/TWI620017B/zh active
- 2016-04-08 KR KR1020177020557A patent/KR101990230B1/ko active IP Right Grant
- 2016-04-08 KR KR1020197012465A patent/KR102286107B1/ko active IP Right Grant
- 2016-04-08 MY MYUI2017703393A patent/MY187481A/en unknown
- 2016-04-08 CN CN202210104954.1A patent/CN114437251B/zh active Active
- 2016-04-08 JP JP2017511104A patent/JPWO2016163540A1/ja active Pending
-
2020
- 2020-03-31 JP JP2020064645A patent/JP7162030B2/ja active Active
-
2021
- 2021-04-30 JP JP2021077956A patent/JP7242748B2/ja active Active
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070269738A1 (en) * | 2004-07-30 | 2007-11-22 | Hitachi Chemical Company, Ltd. | Photosensitive Film, Photosensitive Film Laminate and Photosensitive Film Roll |
JP2006145844A (ja) * | 2004-11-19 | 2006-06-08 | Asahi Kasei Electronics Co Ltd | 光重合性樹脂組成物 |
JP2008094803A (ja) * | 2006-10-16 | 2008-04-24 | Asahi Kasei Electronics Co Ltd | 感光性樹脂組成物およびその積層体 |
EP2096493A1 (en) * | 2006-12-19 | 2009-09-02 | Hitachi Chemical Company, Ltd. | Photosensitive element |
TW200846824A (en) * | 2007-01-23 | 2008-12-01 | Fujifilm Corp | Curing composition for photonano-imprinting lithography and pattern forming method by using the same |
CN101627339A (zh) * | 2007-06-18 | 2010-01-13 | 旭化成电子材料株式会社 | 感光性树脂组合物、柔性印刷版、以及柔性印刷版的制造方法 |
TW200947116A (en) * | 2007-12-18 | 2009-11-16 | Asahi Kasei Emd Corp | Method for producing cured resist using negative photosensitive resin laminate, negative photosensitive resin laminate, and use of negative photosensitive resin laminate |
TW201120572A (en) * | 2009-09-25 | 2011-06-16 | Asahi Kasei E Materials Corp | Photosensitive resin composition for resist material, and photosensitive resin laminate |
WO2015178462A1 (ja) * | 2014-05-21 | 2015-11-26 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物及び回路パターンの形成方法 |
Also Published As
Publication number | Publication date |
---|---|
CN114437251A (zh) | 2022-05-06 |
KR101990230B1 (ko) | 2019-06-17 |
TW201947323A (zh) | 2019-12-16 |
WO2016163540A1 (ja) | 2016-10-13 |
JPWO2016163540A1 (ja) | 2017-11-02 |
KR20170101263A (ko) | 2017-09-05 |
CN107407880A (zh) | 2017-11-28 |
CN114437251B (zh) | 2024-02-20 |
JP2020126251A (ja) | 2020-08-20 |
TW201701070A (zh) | 2017-01-01 |
TWI667539B (zh) | 2019-08-01 |
KR102286107B1 (ko) | 2021-08-04 |
CN107407880B (zh) | 2022-02-08 |
TWI620017B (zh) | 2018-04-01 |
MY187481A (en) | 2021-09-23 |
JP7242748B2 (ja) | 2023-03-20 |
JP7162030B2 (ja) | 2022-10-27 |
JP2021131556A (ja) | 2021-09-09 |
TW201812454A (zh) | 2018-04-01 |
KR20190047146A (ko) | 2019-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI706222B (zh) | 感光性樹脂組合物 | |
TWI570513B (zh) | And a method for forming a photosensitive resin composition and a circuit pattern | |
JP6865811B2 (ja) | 感光性樹脂組成物 | |
JP7340643B2 (ja) | 感光性樹脂組成物及び感光性樹脂積層体 | |
JP4749305B2 (ja) | 感光性樹脂組成物及び積層体 | |
JP5205464B2 (ja) | 感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法並びに導体パターン、プリント配線板、リードフレーム、基材及び半導体パッケージの製造方法 | |
TWI700183B (zh) | 感光性樹脂積層體 | |
JP6630088B2 (ja) | 感光性樹脂組成物 | |
JP2015148642A (ja) | 感光性樹脂組成物、感光性樹脂積層体及びレジストパターン形成方法 | |
JP2011075706A (ja) | 感光性樹脂組成物、感光性樹脂積層体、レジストパターン形成方法、並びに導体パターン、プリント配線板、リードフレーム、凹凸パターンを有する基板及び半導体パッケージの製造方法 |