MY187337A - Photosensitive resin composition and photosensitive resin laminate - Google Patents

Photosensitive resin composition and photosensitive resin laminate

Info

Publication number
MY187337A
MY187337A MYUI2018700686A MYUI2018700686A MY187337A MY 187337 A MY187337 A MY 187337A MY UI2018700686 A MYUI2018700686 A MY UI2018700686A MY UI2018700686 A MYUI2018700686 A MY UI2018700686A MY 187337 A MY187337 A MY 187337A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
alkali
resin composition
weight
soluble polymer
Prior art date
Application number
MYUI2018700686A
Inventor
Fujiwara Akira
Matsuda Takayuki
Nishimoto Hideaki
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY187337A publication Critical patent/MY187337A/en

Links

Abstract

[Problem] To provide a photosensitive resin composition exhibiting excellent adhesion or resolution even under severe development conditions such as over-development, over-washing and developer at a high temperature, and a resist pattern forming method and a wiring board production method each using the same. [Solution] A photosensitive resin composition including (A) an alkali-soluble polymer; (B) a compound having an ethylenically unsaturated bond; (C) a photopolymerization initiator; and (D) an inhibitor, wherein the (A) alkali-soluble polymer contains (A-1) an alkali-soluble polymer having an I/O value of 0.200 to 0.560 in an amount of 5 weight% or more relative to the weight of non-volatiles in the photosensitive resin composition, the (D) inhibitor contains a phenol derivative, and when a substance other than the (A) alkali-soluble polymer and the (B) compound having an ethylenically unsaturated bond contained in the non- volatiles is designated as a component other than (A) and (B), the ratio of the weight of the component other than (A) and (B) to the weight of the (B) compound having an ethylenically unsaturated bond is 0.190 or less.
MYUI2018700686A 2017-02-23 2018-02-22 Photosensitive resin composition and photosensitive resin laminate MY187337A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017032102 2017-02-23
JP2018012025A JP7308014B2 (en) 2017-02-23 2018-01-26 Photosensitive resin composition and photosensitive resin laminate

Publications (1)

Publication Number Publication Date
MY187337A true MY187337A (en) 2021-09-22

Family

ID=63365528

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2018700686A MY187337A (en) 2017-02-23 2018-02-22 Photosensitive resin composition and photosensitive resin laminate

Country Status (3)

Country Link
JP (2) JP7308014B2 (en)
MY (1) MY187337A (en)
TW (1) TWI664498B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7339111B2 (en) * 2018-10-01 2023-09-05 旭化成株式会社 Photosensitive resin laminate for microfluidic devices
CN113632005A (en) * 2019-03-26 2021-11-09 富士胶片株式会社 Photosensitive resin composition, transfer film, cured film, laminate, and method for producing touch panel
CN114901454A (en) * 2020-01-28 2022-08-12 昭和电工材料株式会社 Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080268374A1 (en) * 2004-07-14 2008-10-30 Fujifilm Corporation Photosensitive Composition, Pattern Forming Material, Photosensitive Laminate, Pattern Forming Apparatus, and Pattern Forming Process
TW200622491A (en) * 2004-09-28 2006-07-01 Fuji Photo Film Co Ltd Pattern-forming material, pattern-forming device and pattern-forming method
JP4500657B2 (en) * 2004-11-30 2010-07-14 旭化成イーマテリアルズ株式会社 Pattern forming material, pattern forming apparatus and pattern forming method
JP2009217040A (en) * 2008-03-11 2009-09-24 Fujifilm Corp Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method and printed circuit board
JP6284913B2 (en) * 2014-08-29 2018-02-28 富士フイルム株式会社 Composition for forming touch panel electrode protective film, transfer film, laminate, protective film for touch panel electrode and method for forming the same, capacitive input device, and image display device
WO2017018053A1 (en) * 2015-07-29 2017-02-02 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board
TW201707283A (en) * 2015-08-13 2017-02-16 凡甲科技股份有限公司 Electrical connector
JP6240288B2 (en) * 2016-10-06 2017-11-29 東芝テック株式会社 Payment processing apparatus and control program therefor
JP2018124436A (en) 2017-02-01 2018-08-09 日立化成株式会社 Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for manufacturing printed wiring board

Also Published As

Publication number Publication date
JP2018136531A (en) 2018-08-30
TWI664498B (en) 2019-07-01
JP7340643B2 (en) 2023-09-07
JP7308014B2 (en) 2023-07-13
JP2022082614A (en) 2022-06-02
TW201835681A (en) 2018-10-01

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