MY187337A - Photosensitive resin composition and photosensitive resin laminate - Google Patents
Photosensitive resin composition and photosensitive resin laminateInfo
- Publication number
- MY187337A MY187337A MYUI2018700686A MYUI2018700686A MY187337A MY 187337 A MY187337 A MY 187337A MY UI2018700686 A MYUI2018700686 A MY UI2018700686A MY UI2018700686 A MYUI2018700686 A MY UI2018700686A MY 187337 A MY187337 A MY 187337A
- Authority
- MY
- Malaysia
- Prior art keywords
- photosensitive resin
- alkali
- resin composition
- weight
- soluble polymer
- Prior art date
Links
Landscapes
- Materials For Photolithography (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Polymerisation Methods In General (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
[Problem] To provide a photosensitive resin composition exhibiting excellent adhesion or resolution even under severe development conditions such as over-development, over-washing and developer at a high temperature, and a resist pattern forming method and a wiring board production method each using the same. [Solution] A photosensitive resin composition including (A) an alkali-soluble polymer; (B) a compound having an ethylenically unsaturated bond; (C) a photopolymerization initiator; and (D) an inhibitor, wherein the (A) alkali-soluble polymer contains (A-1) an alkali-soluble polymer having an I/O value of 0.200 to 0.560 in an amount of 5 weight% or more relative to the weight of non-volatiles in the photosensitive resin composition, the (D) inhibitor contains a phenol derivative, and when a substance other than the (A) alkali-soluble polymer and the (B) compound having an ethylenically unsaturated bond contained in the non- volatiles is designated as a component other than (A) and (B), the ratio of the weight of the component other than (A) and (B) to the weight of the (B) compound having an ethylenically unsaturated bond is 0.190 or less.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017032102 | 2017-02-23 | ||
| JP2018012025A JP7308014B2 (en) | 2017-02-23 | 2018-01-26 | Photosensitive resin composition and photosensitive resin laminate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY187337A true MY187337A (en) | 2021-09-22 |
Family
ID=63365528
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYUI2018700686A MY187337A (en) | 2017-02-23 | 2018-02-22 | Photosensitive resin composition and photosensitive resin laminate |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP7308014B2 (en) |
| MY (1) | MY187337A (en) |
| TW (1) | TWI664498B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7339111B2 (en) * | 2018-10-01 | 2023-09-05 | 旭化成株式会社 | Photosensitive resin laminate for microfluidic devices |
| WO2020195558A1 (en) * | 2019-03-26 | 2020-10-01 | 富士フイルム株式会社 | Photosensitive resin composition, transfer film, cured film, layered product, and method for producing touch panel |
| WO2021152709A1 (en) * | 2020-01-28 | 2021-08-05 | 昭和電工マテリアルズ株式会社 | Photosensitive element, resist pattern forming method and printed circuit board production method |
| TWI830425B (en) | 2021-10-25 | 2024-01-21 | 日商旭化成股份有限公司 | Photosensitive element and method for forming photoresist pattern |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101411346B1 (en) * | 2004-07-14 | 2014-06-25 | 아사히 가세이 이-매터리얼즈 가부시키가이샤 | Photosensitive composition, pattern forming material, photosensitive laminate, pattern forming apparatus and method of pattern formation |
| TW200622491A (en) * | 2004-09-28 | 2006-07-01 | Fuji Photo Film Co Ltd | Pattern-forming material, pattern-forming device and pattern-forming method |
| JP4500657B2 (en) * | 2004-11-30 | 2010-07-14 | 旭化成イーマテリアルズ株式会社 | Pattern forming material, pattern forming apparatus and pattern forming method |
| JP2009217040A (en) * | 2008-03-11 | 2009-09-24 | Fujifilm Corp | Photosensitive composition, photosensitive film, photosensitive laminate, permanent pattern forming method and printed circuit board |
| JP6284913B2 (en) * | 2014-08-29 | 2018-02-28 | 富士フイルム株式会社 | Composition for forming touch panel electrode protective film, transfer film, laminate, protective film for touch panel electrode and method for forming the same, capacitive input device, and image display device |
| WO2017018053A1 (en) * | 2015-07-29 | 2017-02-02 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board |
| TW201707283A (en) * | 2015-08-13 | 2017-02-16 | 凡甲科技股份有限公司 | Electrical connector |
| JP6240288B2 (en) * | 2016-10-06 | 2017-11-29 | 東芝テック株式会社 | Payment processing apparatus and control program therefor |
| JP2018124436A (en) | 2017-02-01 | 2018-08-09 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for manufacturing printed wiring board |
-
2018
- 2018-01-26 JP JP2018012025A patent/JP7308014B2/en active Active
- 2018-02-13 TW TW107105177A patent/TWI664498B/en active
- 2018-02-22 MY MYUI2018700686A patent/MY187337A/en unknown
-
2022
- 2022-03-22 JP JP2022045839A patent/JP7340643B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI664498B (en) | 2019-07-01 |
| JP2018136531A (en) | 2018-08-30 |
| JP2022082614A (en) | 2022-06-02 |
| TW201835681A (en) | 2018-10-01 |
| JP7308014B2 (en) | 2023-07-13 |
| JP7340643B2 (en) | 2023-09-07 |
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