MY191860A - Photosensitive resin composition, photosensitive resin laminate, production method of substrate having resist pattern, and production method of circuit board - Google Patents

Photosensitive resin composition, photosensitive resin laminate, production method of substrate having resist pattern, and production method of circuit board

Info

Publication number
MY191860A
MY191860A MYUI2018700390A MYUI2018700390A MY191860A MY 191860 A MY191860 A MY 191860A MY UI2018700390 A MYUI2018700390 A MY UI2018700390A MY UI2018700390 A MYUI2018700390 A MY UI2018700390A MY 191860 A MY191860 A MY 191860A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
compound
production method
resin composition
resist pattern
Prior art date
Application number
MYUI2018700390A
Inventor
Naito Kazuya
Kotani Yuzo
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017239646A external-priority patent/JP6981864B2/en
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY191860A publication Critical patent/MY191860A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/24—All layers being polymeric
    • B32B2250/246—All polymers belonging to those covered by groups B32B27/32 and B32B27/30
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/10—Coating on the layer surface on synthetic resin layer or on natural or synthetic rubber layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2255/00—Coating on the layer surface
    • B32B2255/26—Polymeric coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/544—Torsion strength; Torsion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

[Problem] To provide a photosensitive resin composition capable of forming a resist pattern ensuring that the foamability is suppressed, good sensitivity, resolution and adhesiveness are achieved, the stripping time can be shortened, and the flexibility is excellent. [Solution] A photosensitive resin composition comprising (A) an alkali-soluble polymer, (B) a compound having an ethylenically unsaturated double bond, (C) a photopolymerization initiator, and (D) a sensitizer, wherein a compound represented by following formula (1) is contained in the photosensitive resin composition, as compound (B) having an ethylenically unsaturated double bond, and the sensitizer (D) contains at least one selected from the group consisting of a pyrazoline compound, an anthracene compound, a triarylamine compound, and an oxazole compound.
MYUI2018700390A 2017-01-30 2018-01-30 Photosensitive resin composition, photosensitive resin laminate, production method of substrate having resist pattern, and production method of circuit board MY191860A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017014338 2017-01-30
JP2017164301 2017-08-29
JP2017239646A JP6981864B2 (en) 2017-01-30 2017-12-14 A method for manufacturing a photosensitive resin composition, a photosensitive resin laminate, a substrate on which a resist pattern is formed, and a circuit board.

Publications (1)

Publication Number Publication Date
MY191860A true MY191860A (en) 2022-07-18

Family

ID=63016989

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2018700390A MY191860A (en) 2017-01-30 2018-01-30 Photosensitive resin composition, photosensitive resin laminate, production method of substrate having resist pattern, and production method of circuit board

Country Status (3)

Country Link
CN (1) CN108375874B (en)
MY (1) MY191860A (en)
TW (1) TWI664497B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109195344B (en) * 2018-09-25 2021-11-16 深圳崇达多层线路板有限公司 Method for enhancing dry film adhesion of fine circuit printed board
JP2022000683A (en) * 2019-12-13 2022-01-04 旭化成株式会社 Photosensitive resin composition and transfer film using photosensitive resin composition
CN113666879B (en) * 2021-08-06 2023-04-07 东莞理工学院 Dendritic exciplex thermal activation delayed fluorescent material and application thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2812774B2 (en) * 1989-12-12 1998-10-22 住友ベークライト株式会社 Photosensitive resin composition
KR20130098406A (en) * 2010-12-24 2013-09-04 아사히 가세이 이-매터리얼즈 가부시키가이샤 Photosensitive resin composition
WO2012101908A1 (en) * 2011-01-25 2012-08-02 日立化成工業株式会社 Photosensitive resin composition, photosensitive element, method for producing resist pattern, and method for manufacturing printed wiring board
KR102394595B1 (en) * 2013-07-23 2022-05-04 쇼와덴코머티리얼즈가부시끼가이샤 Photosensitive resin composition for projection exposure, photosensitive element, method for forming resist pattern, process for producing printed wiring board and process for producing lead frame
JP2015087429A (en) * 2013-10-28 2015-05-07 日立化成株式会社 Photosensitive resin composition, photosensitive element, and method for forming resist pattern
TWI674478B (en) * 2013-12-26 2019-10-11 日商旭化成電子材料股份有限公司 Photosensitive resin composition and photosensitive resin laminate
JP2015152676A (en) * 2014-02-12 2015-08-24 日立化成株式会社 Material and method for forming viewing angle expansion pattern, and photosensitive element used therefor

Also Published As

Publication number Publication date
CN108375874A (en) 2018-08-07
TW201832002A (en) 2018-09-01
TWI664497B (en) 2019-07-01
CN108375874B (en) 2021-10-22

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