MY174577A - Photosensitive resin composition and photosensitive resin laminate - Google Patents
Photosensitive resin composition and photosensitive resin laminateInfo
- Publication number
- MY174577A MY174577A MYUI2016701970A MYUI2016701970A MY174577A MY 174577 A MY174577 A MY 174577A MY UI2016701970 A MYUI2016701970 A MY UI2016701970A MY UI2016701970 A MYUI2016701970 A MY UI2016701970A MY 174577 A MY174577 A MY 174577A
- Authority
- MY
- Malaysia
- Prior art keywords
- photosensitive resin
- resin composition
- substrate
- pattern
- focal point
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title abstract 3
- 239000011347 resin Substances 0.000 title abstract 2
- 229920005989 resin Polymers 0.000 title abstract 2
- 239000000758 substrate Substances 0.000 abstract 4
- 150000001875 compounds Chemical class 0.000 abstract 1
- 239000003999 initiator Substances 0.000 abstract 1
- 229920000642 polymer Polymers 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C39/00—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
- C07C39/12—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
- C07C39/15—Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings with all hydroxy groups on non-condensed rings, e.g. phenylphenol
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F265/00—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00
- C08F265/02—Macromolecular compounds obtained by polymerising monomers on to polymers of unsaturated monocarboxylic acids or derivatives thereof as defined in group C08F20/00 on to polymers of acids, salts or anhydrides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Engineering & Computer Science (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
A photosensitive resin composition including an alkali-soluble polymer (A), a compound (B) having an ethylenic unsaturated double bond, and a photopolymerization initiator (C). In a resist pattern obtained by forming a photosensitive resin layer, comprising the photosensitive resin composition, upon a substrate surface and exposing and developing the same, the difference is less than 15 ?m between: a pattern resolution (a) when the focal point is positioned on the substrate surface and the pattern is exposed, and a pattern resolution (b) obtained when the focal point position is displaced from the substrate by 300 ?m in the thickness direction of the substrate.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013270370 | 2013-12-26 | ||
PCT/JP2014/084557 WO2015099137A1 (en) | 2013-12-26 | 2014-12-26 | Photosensitive resin composition and photosensitive resin laminate |
Publications (1)
Publication Number | Publication Date |
---|---|
MY174577A true MY174577A (en) | 2020-04-28 |
Family
ID=53478976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYUI2016701970A MY174577A (en) | 2013-12-26 | 2014-12-26 | Photosensitive resin composition and photosensitive resin laminate |
Country Status (6)
Country | Link |
---|---|
JP (2) | JP6320425B2 (en) |
KR (3) | KR102248976B1 (en) |
CN (2) | CN105793778B (en) |
MY (1) | MY174577A (en) |
TW (4) | TWI721371B (en) |
WO (1) | WO2015099137A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105793778B (en) * | 2013-12-26 | 2021-02-09 | 旭化成株式会社 | Photosensitive resin composition and photosensitive resin laminate |
JP6716883B2 (en) * | 2015-10-13 | 2020-07-01 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element, cured product, resist pattern forming method, and printed wiring board manufacturing method |
JP6755109B2 (en) * | 2016-03-29 | 2020-09-16 | 旭化成株式会社 | Photosensitive resin composition, photosensitive resin laminate, resist pattern forming method and conductor pattern manufacturing method |
JP6985291B2 (en) * | 2016-12-07 | 2021-12-22 | 旭化成株式会社 | Photosensitive resin composition and photosensitive resin laminate |
TWI664497B (en) * | 2017-01-30 | 2019-07-01 | 日商旭化成股份有限公司 | Photosensitive resin composition, photosensitive resin laminated body, substrate on which photoresist pattern is formed, and method for manufacturing circuit board |
KR102522749B1 (en) * | 2017-11-06 | 2023-04-17 | 아사히 가세이 가부시키가이샤 | Photosensitive resin laminate and method for producing resist pattern |
CN108663867A (en) * | 2018-04-11 | 2018-10-16 | 华南师范大学 | A kind of laser protective film of dyestuff doping |
JP7422664B2 (en) * | 2018-08-09 | 2024-01-26 | 旭化成株式会社 | Photosensitive resin composition and resist pattern formation method |
TW202205012A (en) * | 2020-03-19 | 2022-02-01 | 日商富士軟片股份有限公司 | Transfer film, photosensitive material, method for forming pattern, method for manufacturing circuit board, and method for manufacturing touch panel |
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JP6132505B2 (en) * | 2012-10-05 | 2017-05-24 | 旭化成株式会社 | Photosensitive resin composition and photosensitive resin laminate |
CN105793778B (en) * | 2013-12-26 | 2021-02-09 | 旭化成株式会社 | Photosensitive resin composition and photosensitive resin laminate |
-
2014
- 2014-12-26 CN CN201480064426.1A patent/CN105793778B/en active Active
- 2014-12-26 TW TW108103816A patent/TWI721371B/en active
- 2014-12-26 CN CN202010498797.8A patent/CN111596526B/en active Active
- 2014-12-26 JP JP2015555052A patent/JP6320425B2/en active Active
- 2014-12-26 TW TW105101582A patent/TWI592748B/en active
- 2014-12-26 MY MYUI2016701970A patent/MY174577A/en unknown
- 2014-12-26 KR KR1020187004734A patent/KR102248976B1/en active IP Right Grant
- 2014-12-26 WO PCT/JP2014/084557 patent/WO2015099137A1/en active Application Filing
- 2014-12-26 KR KR1020167012407A patent/KR20160070801A/en not_active Application Discontinuation
- 2014-12-26 TW TW106116007A patent/TWI674478B/en active
- 2014-12-26 TW TW103145839A patent/TWI541596B/en active
- 2014-12-26 KR KR1020217013116A patent/KR102437195B1/en active IP Right Grant
-
2018
- 2018-04-03 JP JP2018071677A patent/JP6666944B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN105793778A (en) | 2016-07-20 |
TWI592748B (en) | 2017-07-21 |
TW201616234A (en) | 2016-05-01 |
KR20160070801A (en) | 2016-06-20 |
WO2015099137A1 (en) | 2015-07-02 |
KR102248976B1 (en) | 2021-05-06 |
TWI674478B (en) | 2019-10-11 |
JP2018120242A (en) | 2018-08-02 |
TW201533526A (en) | 2015-09-01 |
CN105793778B (en) | 2021-02-09 |
KR20210049995A (en) | 2021-05-06 |
JP6666944B2 (en) | 2020-03-18 |
KR20180021226A (en) | 2018-02-28 |
TW201727369A (en) | 2017-08-01 |
TW201922805A (en) | 2019-06-16 |
KR102437195B1 (en) | 2022-08-26 |
TWI721371B (en) | 2021-03-11 |
JPWO2015099137A1 (en) | 2017-03-23 |
TWI541596B (en) | 2016-07-11 |
CN111596526A (en) | 2020-08-28 |
JP6320425B2 (en) | 2018-05-09 |
CN111596526B (en) | 2023-07-25 |
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