MY176799A - Photosensitive resin element - Google Patents

Photosensitive resin element

Info

Publication number
MY176799A
MY176799A MYUI2016701738A MYUI2016701738A MY176799A MY 176799 A MY176799 A MY 176799A MY UI2016701738 A MYUI2016701738 A MY UI2016701738A MY UI2016701738 A MYUI2016701738 A MY UI2016701738A MY 176799 A MY176799 A MY 176799A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin layer
layer contains
solvent
mass
Prior art date
Application number
MYUI2016701738A
Inventor
Tsutomu Igarashi
Tomohiro Kino
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY176799A publication Critical patent/MY176799A/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Structural Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Laminated Bodies (AREA)

Abstract

To provide a photosensitive resin element ensuring that the outer appearance is good, the product life is long and at the time of manufacture of a printed circuit board, a defect due to a resist chip in a lamination step is decreased. The present disclosure is a photosensitive resin element including a support layer and a photosensitive resin layer on the support layer, wherein the photosensitive resin layer contains (a) a binder resin having a carboxyl group content of 100 to 600 in terms of acid equivalent and a weight average molecular weight of 5,000 to 500,000, (b) a photopolymerizable unsaturated compound, (c) a photopolymerization initiator, and (d) a solvent; the photosensitive resin layer contains the solvent (d) in an amount of 0.001 to 1 mass% based on the mass of the photosensitive resin layer; and the photosensitive resin layer contains, as the photopolymerizable unsaturated compound (b), one or more compounds selected from formulae (I) to (III).
MYUI2016701738A 2013-11-29 2014-11-28 Photosensitive resin element MY176799A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013248365 2013-11-29
PCT/JP2014/081599 WO2015080257A1 (en) 2013-11-29 2014-11-28 Photosensitive resin element

Publications (1)

Publication Number Publication Date
MY176799A true MY176799A (en) 2020-08-21

Family

ID=53199192

Family Applications (1)

Application Number Title Priority Date Filing Date
MYUI2016701738A MY176799A (en) 2013-11-29 2014-11-28 Photosensitive resin element

Country Status (6)

Country Link
JP (2) JPWO2015080257A1 (en)
KR (2) KR102139035B1 (en)
CN (1) CN105474094B (en)
MY (1) MY176799A (en)
TW (5) TWI633388B (en)
WO (1) WO2015080257A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102494967B1 (en) * 2017-02-01 2023-02-02 동우 화인켐 주식회사 Colored photosensitive resin composition, color filter and image display device produced using the same
CN108490737B (en) * 2018-03-14 2021-11-02 杭州福斯特电子材料有限公司 Photosensitive resin composition and application thereof
JP7376712B2 (en) * 2019-12-31 2023-11-08 コーロン インダストリーズ インク Photosensitive resin composition and dry film photoresist, photosensitive element, circuit board, and display device using the same
CN114761874A (en) * 2019-12-31 2022-07-15 可隆工业株式会社 Photosensitive resin layer, dry film photoresist using the same, and photosensitive element
CN114830033A (en) * 2019-12-31 2022-07-29 可隆工业株式会社 Photosensitive resin layer, dry film photoresist using the same, and photosensitive element
JP7376723B2 (en) * 2019-12-31 2023-11-08 コーロン インダストリーズ インク Photosensitive resin composition and dry film photoresist, photosensitive element, circuit board, and display device using the same
JP7509885B2 (en) * 2019-12-31 2024-07-02 コーロン インダストリーズ インク Photosensitive resin layer, dry film photoresist using same, and photosensitive element
CN118355324A (en) * 2022-03-29 2024-07-16 株式会社力森诺科 Photosensitive resin composition, photosensitive element, method for producing cured product pattern, and method for producing circuit board

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11143069A (en) 1997-11-10 1999-05-28 Fuji Photo Film Co Ltd Master plate for printed wiring
SG85613A1 (en) * 1998-02-06 2002-01-15 Morton Int Inc Photoimageable compositions having hydrophilic binder polymers and hydrophilic monomers
JP2001312056A (en) * 2000-04-27 2001-11-09 Nichigo Morton Co Ltd Photosensitive resin composition and photosensitive film using the same
JP3824508B2 (en) * 2001-08-10 2006-09-20 旭化成エレクトロニクス株式会社 Dry film resist and manufacturing method thereof
JP2006106287A (en) * 2004-10-04 2006-04-20 Hitachi Chem Co Ltd Photosensitive resin composition, photosensitive element and method for manufacturing photosensitive element
JP4966528B2 (en) * 2005-09-14 2012-07-04 旭化成イーマテリアルズ株式会社 Pattern forming material, pattern forming apparatus and pattern forming method
JP2007310201A (en) * 2006-05-19 2007-11-29 Kaneka Corp Photosensitive dry film resist and printed wiring board using the same
JP2008239743A (en) * 2007-03-27 2008-10-09 Toray Ind Inc Polyester film for dry film resist carrier
JP2011048270A (en) * 2009-08-28 2011-03-10 Hitachi Chem Co Ltd Photosensitive element, method for forming resist pattern using the same, and method for manufacturing printed wiring board
KR20110041925A (en) * 2009-10-16 2011-04-22 삼성전자주식회사 Double layered patternable adhesive film, method of preparing the same, and method for forming patternable adhesive layer using the same
JP2011257632A (en) * 2010-06-10 2011-12-22 Hitachi Chem Co Ltd Photosensitive element, method for forming resist pattern using the same, and method for producing lead frame and printed wiring board
JP5688116B2 (en) * 2013-05-13 2015-03-25 太陽ホールディングス株式会社 Photo-curable thermosetting resin composition, dry film and cured product thereof, and printed wiring board using them

Also Published As

Publication number Publication date
JP2018013799A (en) 2018-01-25
TWI630459B (en) 2018-07-21
KR20180040739A (en) 2018-04-20
KR102139035B1 (en) 2020-07-29
CN105474094A (en) 2016-04-06
WO2015080257A1 (en) 2015-06-04
TW201631391A (en) 2016-09-01
JPWO2015080257A1 (en) 2017-03-16
TW201525615A (en) 2015-07-01
TWI633388B (en) 2018-08-21
TW201631392A (en) 2016-09-01
TW201631394A (en) 2016-09-01
TWI592753B (en) 2017-07-21
TW201631393A (en) 2016-09-01
KR20160020567A (en) 2016-02-23
JP6518304B2 (en) 2019-05-22
CN105474094B (en) 2020-09-22

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