MY196431A - Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board - Google Patents
Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring BoardInfo
- Publication number
- MY196431A MY196431A MYPI2018700383A MYPI2018700383A MY196431A MY 196431 A MY196431 A MY 196431A MY PI2018700383 A MYPI2018700383 A MY PI2018700383A MY PI2018700383 A MYPI2018700383 A MY PI2018700383A MY 196431 A MY196431 A MY 196431A
- Authority
- MY
- Malaysia
- Prior art keywords
- barrier layer
- forming
- photosensitive element
- resin composition
- wiring board
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
An object is to provide a photosensitive element capable of improving the releasability between a barrier layer and a support film without using a release accelerator, and provided is a photosensitive element comprising a support film, a barrier layer, and a photosensitive layer in this order, wherein the barrier layer contains a water-soluble resin, and a C3 or higher alcohol.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015150530 | 2015-07-30 | ||
PCT/JP2016/071311 WO2017018299A1 (en) | 2015-07-30 | 2016-07-20 | Photosensitive element, resin composition for forming barrier layer, method for forming resist pattern, and method for producing printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
MY196431A true MY196431A (en) | 2023-04-10 |
Family
ID=57885609
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018700383A MY196431A (en) | 2015-07-30 | 2016-07-20 | Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6870612B2 (en) |
KR (2) | KR20230129587A (en) |
CN (3) | CN107924130B (en) |
MY (1) | MY196431A (en) |
TW (1) | TWI705307B (en) |
WO (1) | WO2017018299A1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018180168A (en) * | 2017-04-07 | 2018-11-15 | ホヤ レンズ タイランド リミテッドHOYA Lens Thailand Ltd | Method for manufacturing optical member with processed pattern formed thereon |
JP2019179135A (en) | 2018-03-30 | 2019-10-17 | ホヤ レンズ タイランド リミテッドHOYA Lens Thailand Ltd | Spectacle lens, spectacles, and method of fabricating spectacle lens |
WO2019215848A1 (en) * | 2018-05-09 | 2019-11-14 | 日立化成株式会社 | Photosensitive element, barrier layer forming resin composition, resist pattern forming method, and printed wiring board manufacturing method |
EP3723459A1 (en) | 2019-04-10 | 2020-10-14 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with high passive intermodulation (pim) performance |
WO2020261523A1 (en) * | 2019-06-27 | 2020-12-30 | 昭和電工マテリアルズ株式会社 | Transfer-type photosensitive film, method for forming resin cured film and method for producing substrate with resin cured film |
KR102693253B1 (en) * | 2021-03-31 | 2024-08-07 | 코오롱인더스트리 주식회사 | Photosensitive laminate, and method of manufacturing a circuit board using the same |
KR102687653B1 (en) * | 2021-03-31 | 2024-07-22 | 코오롱인더스트리 주식회사 | Photosensitive laminate, and method of manufacturing a circuit board using the same |
KR102687652B1 (en) * | 2021-03-31 | 2024-07-22 | 코오롱인더스트리 주식회사 | Photosensitive laminate, method of manufacturing a photosensitive laminate, and method of manufacturing a circuit board using the same |
KR102686422B1 (en) * | 2021-03-31 | 2024-07-17 | 코오롱인더스트리 주식회사 | Photosensitive laminate, and method of manufacturing a circuit board using the same |
WO2024009432A1 (en) * | 2022-07-06 | 2024-01-11 | 株式会社レゾナック | Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing semiconductor package substate or printed wiring board |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS5551255Y2 (en) | 1976-04-12 | 1980-11-28 | ||
JPS5483734U (en) | 1977-11-26 | 1979-06-13 | ||
US4374190A (en) * | 1978-09-28 | 1983-02-15 | Am International, Inc. | Erasable intermediate diazo-type paper |
JPS59137948A (en) * | 1983-01-27 | 1984-08-08 | Mitsubishi Chem Ind Ltd | Photoresist material like dry film |
JPS59137948U (en) * | 1983-03-07 | 1984-09-14 | コ−リツエンジニアリング株式会社 | coke oven lid |
US4835086A (en) * | 1988-02-12 | 1989-05-30 | Hoechst Celanese Corporation | Polysulfone barrier layer for bi-level photoresists |
JP2687187B2 (en) * | 1990-12-01 | 1997-12-08 | 富士写真フイルム株式会社 | Image forming method and transfer material |
JPH11288095A (en) * | 1998-03-31 | 1999-10-19 | Nippon Paper Industries Co Ltd | Oxygen intercepting film forming material and oxygen intercepting film |
WO2003050620A1 (en) * | 2001-12-13 | 2003-06-19 | Fuji Photo Film Co., Ltd. | Image forming material |
KR20050017596A (en) * | 2003-08-15 | 2005-02-22 | 후지 샤신 필름 가부시기가이샤 | Photosensitive transfer sheet, photosensitive laminate, image pattern forming method, and wiring pattern forming method |
JP2005202066A (en) * | 2004-01-14 | 2005-07-28 | Fuji Photo Film Co Ltd | Light-sensitive transfer sheet, light-sensitive laminate, image pattern forming method, and wiring pattern forming method |
JP5155853B2 (en) * | 2006-04-28 | 2013-03-06 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin laminate |
US7799504B2 (en) * | 2007-06-05 | 2010-09-21 | Eastman Kodak Company | Mask film to form relief images and method of use |
JP2010085552A (en) * | 2008-09-30 | 2010-04-15 | Fujifilm Corp | Photomask blanks and photomask |
JP5481339B2 (en) * | 2009-09-30 | 2014-04-23 | 富士フイルム株式会社 | Planographic printing plate precursor and plate making method |
JP5814667B2 (en) | 2011-07-15 | 2015-11-17 | 旭化成イーマテリアルズ株式会社 | Photosensitive element |
JP5743783B2 (en) * | 2011-07-27 | 2015-07-01 | 富士フイルム株式会社 | Photosensitive composition, planographic printing plate precursor, and polyurethane |
WO2014091997A1 (en) * | 2012-12-12 | 2014-06-19 | 日立化成株式会社 | Photosensitive resin composition and photosensitive film using same |
JP6205925B2 (en) * | 2013-07-12 | 2017-10-04 | 日立化成株式会社 | Photosensitive conductive film, conductive pattern forming method using the same, and conductive pattern substrate |
JP6284849B2 (en) * | 2013-08-23 | 2018-02-28 | 富士フイルム株式会社 | Laminate |
-
2016
- 2016-07-20 CN CN201680044650.3A patent/CN107924130B/en active Active
- 2016-07-20 CN CN201910501676.1A patent/CN110225665B/en active Active
- 2016-07-20 JP JP2017530810A patent/JP6870612B2/en active Active
- 2016-07-20 WO PCT/JP2016/071311 patent/WO2017018299A1/en active Application Filing
- 2016-07-20 CN CN201910501662.XA patent/CN110161802B/en active Active
- 2016-07-20 KR KR1020237028959A patent/KR20230129587A/en active IP Right Grant
- 2016-07-20 MY MYPI2018700383A patent/MY196431A/en unknown
- 2016-07-20 KR KR1020187003341A patent/KR102572426B1/en active IP Right Grant
- 2016-07-26 TW TW105123500A patent/TWI705307B/en active
Also Published As
Publication number | Publication date |
---|---|
CN110161802A (en) | 2019-08-23 |
CN110225665B (en) | 2021-04-06 |
KR102572426B1 (en) | 2023-08-30 |
JP6870612B2 (en) | 2021-05-12 |
TW201710796A (en) | 2017-03-16 |
TWI705307B (en) | 2020-09-21 |
CN110161802B (en) | 2022-08-23 |
KR20180035827A (en) | 2018-04-06 |
WO2017018299A1 (en) | 2017-02-02 |
KR20230129587A (en) | 2023-09-08 |
CN110225665A (en) | 2019-09-10 |
CN107924130A (en) | 2018-04-17 |
JPWO2017018299A1 (en) | 2018-05-17 |
CN107924130B (en) | 2022-01-14 |
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