MY189073A - Photosensitive element, laminated body, method for forming resist pattern, and method for producing printed circuit board - Google Patents
Photosensitive element, laminated body, method for forming resist pattern, and method for producing printed circuit boardInfo
- Publication number
- MY189073A MY189073A MYPI2018700082A MYPI2018700082A MY189073A MY 189073 A MY189073 A MY 189073A MY PI2018700082 A MYPI2018700082 A MY PI2018700082A MY PI2018700082 A MYPI2018700082 A MY PI2018700082A MY 189073 A MY189073 A MY 189073A
- Authority
- MY
- Malaysia
- Prior art keywords
- photosensitive element
- resist pattern
- circuit board
- printed circuit
- laminated body
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000002245 particle Substances 0.000 abstract 2
- 230000002950 deficient Effects 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
- C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L27/04—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L39/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen; Compositions of derivatives of such polymers
- C08L39/04—Homopolymers or copolymers of monomers containing heterocyclic rings having nitrogen as ring member
- C08L39/06—Homopolymers or copolymers of N-vinyl-pyrrolidones
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
An object of the present disclosure is to provide a photosensitive element (1) which can form a resist pattern (32) having a small amount of minute defective parts, and provides a photosensitive element (1) including a support film (2), an intermediate layer (3, 20), and a photosensitive layer (4, 30) in this order, wherein the thickness of the support film (2) is 20 ?m or more, the number of particles having a diameter of 5 ?m or more contained in the support film (2) is 30 particles/mm2 or less. Figure 1
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015137109 | 2015-07-08 | ||
PCT/JP2016/070163 WO2017007001A1 (en) | 2015-07-08 | 2016-07-07 | Photosensitive element, laminated body, method for forming resist pattern, and method for producing printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
MY189073A true MY189073A (en) | 2022-01-24 |
Family
ID=57685009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MYPI2018700082A MY189073A (en) | 2015-07-08 | 2016-07-07 | Photosensitive element, laminated body, method for forming resist pattern, and method for producing printed circuit board |
Country Status (6)
Country | Link |
---|---|
JP (1) | JP6870611B2 (en) |
KR (2) | KR102611300B1 (en) |
CN (2) | CN107850839A (en) |
MY (1) | MY189073A (en) |
TW (1) | TWI763631B (en) |
WO (1) | WO2017007001A1 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017078836A (en) * | 2015-10-22 | 2017-04-27 | Jsr株式会社 | Method for forming resist pattern and method for manufacturing plated molded article |
JP6985291B2 (en) * | 2016-12-07 | 2021-12-22 | 旭化成株式会社 | Photosensitive resin composition and photosensitive resin laminate |
JP6825580B2 (en) * | 2018-01-12 | 2021-02-03 | 味の素株式会社 | Manufacturing method of printed wiring board |
JP7124409B2 (en) * | 2018-04-18 | 2022-08-24 | 三菱ケミカル株式会社 | Polyester film for dry film resist |
EP3723459A1 (en) | 2019-04-10 | 2020-10-14 | AT & S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier with high passive intermodulation (pim) performance |
KR20230041976A (en) * | 2020-07-20 | 2023-03-27 | 가부시끼가이샤 레조낙 | Photosensitive element, resist pattern formation method, and printed wiring board manufacturing method |
TW202402531A (en) * | 2022-04-28 | 2024-01-16 | 日商富士軟片股份有限公司 | Transfer film, a manufacturing method for laminated body, a manufacturing method for circuit wiring board, circuit wiring board, and semiconductor package |
WO2024116247A1 (en) * | 2022-11-28 | 2024-06-06 | 株式会社レゾナック | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5551255Y2 (en) | 1976-04-12 | 1980-11-28 | ||
JPS5483734U (en) | 1977-11-26 | 1979-06-13 | ||
US20070269738A1 (en) * | 2004-07-30 | 2007-11-22 | Hitachi Chemical Company, Ltd. | Photosensitive Film, Photosensitive Film Laminate and Photosensitive Film Roll |
WO2007125992A1 (en) * | 2006-04-28 | 2007-11-08 | Asahi Kasei Emd Corporation | Photosensitive resin laminate |
JP4979391B2 (en) * | 2007-01-17 | 2012-07-18 | 旭化成イーマテリアルズ株式会社 | Photosensitive resin laminate |
CN101600995B (en) * | 2007-01-31 | 2012-05-09 | 日立化成工业株式会社 | Photosensitive element |
CN101836162B (en) | 2007-10-25 | 2012-11-14 | 可隆工业株式会社 | Film type transfer material |
JP5488866B2 (en) * | 2009-03-16 | 2014-05-14 | 日立化成株式会社 | Photosensitive element, resist pattern forming method using the same, and printed wiring board manufacturing method |
JP5551255B2 (en) | 2009-09-28 | 2014-07-16 | コーロン インダストリーズ インク | Dry film photoresist |
JP5768521B2 (en) * | 2010-07-13 | 2015-08-26 | 日立化成株式会社 | Photosensitive element, resist pattern forming method using the same, and printed wiring board manufacturing method |
CN107367903A (en) * | 2010-12-16 | 2017-11-21 | 日立化成株式会社 | The manufacture method of photosensitive element, the forming method of corrosion-resisting pattern and printed wiring board |
JP5814667B2 (en) | 2011-07-15 | 2015-11-17 | 旭化成イーマテリアルズ株式会社 | Photosensitive element |
-
2016
- 2016-07-07 KR KR1020187003342A patent/KR102611300B1/en active IP Right Grant
- 2016-07-07 JP JP2017527500A patent/JP6870611B2/en active Active
- 2016-07-07 MY MYPI2018700082A patent/MY189073A/en unknown
- 2016-07-07 WO PCT/JP2016/070163 patent/WO2017007001A1/en active Application Filing
- 2016-07-07 CN CN201680039640.0A patent/CN107850839A/en active Pending
- 2016-07-07 KR KR1020237041794A patent/KR102654084B1/en active IP Right Grant
- 2016-07-07 TW TW105121650A patent/TWI763631B/en active
- 2016-07-07 CN CN202410174840.3A patent/CN117835533A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
KR20180027541A (en) | 2018-03-14 |
TWI763631B (en) | 2022-05-11 |
CN107850839A (en) | 2018-03-27 |
TW201710803A (en) | 2017-03-16 |
CN117835533A (en) | 2024-04-05 |
JPWO2017007001A1 (en) | 2018-04-19 |
JP6870611B2 (en) | 2021-05-12 |
WO2017007001A1 (en) | 2017-01-12 |
KR102654084B1 (en) | 2024-04-04 |
KR20230170134A (en) | 2023-12-18 |
KR102611300B1 (en) | 2023-12-08 |
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