MX9602406A - Mecanismo semiconductor que comprende un elemento de memoria ferroelectrica con un electrodo inferior provisto de una barrera de oxigeno. - Google Patents
Mecanismo semiconductor que comprende un elemento de memoria ferroelectrica con un electrodo inferior provisto de una barrera de oxigeno.Info
- Publication number
- MX9602406A MX9602406A MX9602406A MX9602406A MX9602406A MX 9602406 A MX9602406 A MX 9602406A MX 9602406 A MX9602406 A MX 9602406A MX 9602406 A MX9602406 A MX 9602406A MX 9602406 A MX9602406 A MX 9602406A
- Authority
- MX
- Mexico
- Prior art keywords
- layer
- lower electrode
- metal oxide
- memory element
- oxygen barrier
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 title abstract 2
- 230000004888 barrier function Effects 0.000 title abstract 2
- 229910052760 oxygen Inorganic materials 0.000 title abstract 2
- 239000001301 oxygen Substances 0.000 title abstract 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 abstract 7
- 150000004706 metal oxides Chemical class 0.000 abstract 6
- 229910044991 metal oxide Inorganic materials 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 abstract 3
- 229910052697 platinum Inorganic materials 0.000 abstract 3
- 239000003990 capacitor Substances 0.000 abstract 1
- 239000004020 conductor Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
Landscapes
- Semiconductor Memories (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
La invencion se refiere a un mecanismo semiconductor que comprende un cuerpo semiconductor (3) con un elemento semiconductor (1) con una region de conduccion eléctrica (5) sobre la cual un capacitor (2) que forma un elemento de memoria está presente con un electrodo inferior (11), un dieléctrico ferroeléctrico de oxido (12), y un electrodo superior (13), cuyo electrodo inferior (11) hace contacto eléctrico con la region de conduccion (5) y comprende una capa con un oxido de metal conductor (112) y una capa (111) que comprende platino. La capa con el oxido de metal conductor (112) actua como una barrera de oxígeno durante la fabricacion. La invencion también se refiere a un método de fabricacion de tal mecanismo semiconductor. De acuerdo con la invencion, el mecanismo se caracteriza porque dicha capa que comprende platino (111) contiene más de 15% atom de un metal capaz de formar un oxido de metal conductor, y en que la capa (112) con el oxido de metal conductor está presente entre la capa (111) que comprende platino y el dieléctrico ferroeléctrico (12). Así se logra un buen contacto eléctrico entre el electrodo inferior (11) y la region de conduccion (5) después de la fabricacion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP94202867 | 1994-10-04 | ||
| PCT/IB1995/000799 WO1996010845A2 (en) | 1994-10-04 | 1995-09-26 | Semiconductor device comprising a ferroelectric memory element with a lower electrode provided with an oxygen barrier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MX9602406A true MX9602406A (es) | 1997-03-29 |
Family
ID=8217255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MX9602406A MX9602406A (es) | 1994-10-04 | 1995-09-26 | Mecanismo semiconductor que comprende un elemento de memoria ferroelectrica con un electrodo inferior provisto de una barrera de oxigeno. |
Country Status (9)
| Country | Link |
|---|---|
| US (2) | US5744832A (es) |
| EP (1) | EP0737364B1 (es) |
| JP (1) | JP3804972B2 (es) |
| KR (1) | KR100342296B1 (es) |
| CA (1) | CA2178091A1 (es) |
| DE (1) | DE69508737T2 (es) |
| MX (1) | MX9602406A (es) |
| TW (1) | TW286401B (es) |
| WO (1) | WO1996010845A2 (es) |
Families Citing this family (57)
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|---|---|---|---|---|
| KR100200299B1 (ko) * | 1995-11-30 | 1999-06-15 | 김영환 | 반도체 소자 캐패시터 형성방법 |
| JP2830845B2 (ja) * | 1996-06-26 | 1998-12-02 | 日本電気株式会社 | 半導体記憶装置 |
| DE19640243A1 (de) * | 1996-09-30 | 1998-04-09 | Siemens Ag | Kondensator mit einer Sauerstoff-Barriereschicht und einer ersten Elektrode aus einem Nichtedelmetall |
| US5790366A (en) * | 1996-12-06 | 1998-08-04 | Sharp Kabushiki Kaisha | High temperature electrode-barriers for ferroelectric and other capacitor structures |
| JP3385889B2 (ja) * | 1996-12-25 | 2003-03-10 | 株式会社日立製作所 | 強誘電体メモリ素子及びその製造方法 |
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| JP3201468B2 (ja) * | 1997-05-26 | 2001-08-20 | 日本電気株式会社 | 容量素子及びその製造方法 |
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| KR100533991B1 (ko) | 1997-12-27 | 2006-05-16 | 주식회사 하이닉스반도체 | 반도체 장치의 고유전체 캐패시터 제조방법 |
| US6303952B1 (en) * | 1998-01-14 | 2001-10-16 | Texas Instruments Incorporated | Contact structure with an oxide silicidation barrier |
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| DE19901210A1 (de) * | 1999-01-14 | 2000-07-27 | Siemens Ag | Halbleiterbauelement und Verfahren zu dessen Herstellung |
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| US6329286B1 (en) | 1999-04-27 | 2001-12-11 | Micron Technology, Inc. | Methods for forming conformal iridium layers on substrates |
| US6465828B2 (en) | 1999-07-30 | 2002-10-15 | Micron Technology, Inc. | Semiconductor container structure with diffusion barrier |
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| US6660631B1 (en) * | 2000-08-31 | 2003-12-09 | Micron Technology, Inc. | Devices containing platinum-iridium films and methods of preparing such films and devices |
| US6787833B1 (en) * | 2000-08-31 | 2004-09-07 | Micron Technology, Inc. | Integrated circuit having a barrier structure |
| JP3681632B2 (ja) * | 2000-11-06 | 2005-08-10 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
| DE10061580A1 (de) * | 2000-12-11 | 2002-06-27 | Infineon Technologies Ag | Speichereinrichtung und Verfahren zu deren Betrieb |
| US7378719B2 (en) * | 2000-12-20 | 2008-05-27 | Micron Technology, Inc. | Low leakage MIM capacitor |
| KR100410716B1 (ko) * | 2001-03-07 | 2003-12-18 | 주식회사 하이닉스반도체 | 캐패시터의 하부전극을 스토리지노드와 연결할 수 있는강유전체 메모리 소자 및 그 제조 방법 |
| KR20030025671A (ko) * | 2001-09-22 | 2003-03-29 | 주식회사 하이닉스반도체 | 커패시터의 제조방법 |
| KR100431294B1 (ko) * | 2001-10-06 | 2004-05-12 | 주식회사 하이닉스반도체 | 반도체소자 제조방법 |
| KR100432882B1 (ko) * | 2001-10-12 | 2004-05-22 | 삼성전자주식회사 | 강유전성 메모리 장치 형성 방법 |
| DE60140757D1 (de) | 2001-12-28 | 2010-01-21 | St Microelectronics Srl | Kondensator für integrierte Halbleiterbauelemente |
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| KR100474072B1 (ko) | 2002-09-17 | 2005-03-10 | 주식회사 하이닉스반도체 | 귀금속 박막의 형성 방법 |
| DE10303316A1 (de) * | 2003-01-28 | 2004-08-12 | Forschungszentrum Jülich GmbH | Schneller remanenter Speicher |
| US7297602B2 (en) * | 2003-09-09 | 2007-11-20 | Sharp Laboratories Of America, Inc. | Conductive metal oxide gate ferroelectric memory transistor |
| US7378286B2 (en) * | 2004-08-20 | 2008-05-27 | Sharp Laboratories Of America, Inc. | Semiconductive metal oxide thin film ferroelectric memory transistor |
| US7109079B2 (en) * | 2005-01-26 | 2006-09-19 | Freescale Semiconductor, Inc. | Metal gate transistor CMOS process and method for making |
| KR100707783B1 (ko) * | 2005-10-10 | 2007-04-17 | 삼성전기주식회사 | 컬러 휠 유니트 및 그 제작 방법 |
| US9299643B2 (en) * | 2008-09-29 | 2016-03-29 | Cypress Semiconductor Corporation | Ruthenium interconnect with high aspect ratio and method of fabrication thereof |
| US8723654B2 (en) | 2010-07-09 | 2014-05-13 | Cypress Semiconductor Corporation | Interrupt generation and acknowledgment for RFID |
| US9092582B2 (en) | 2010-07-09 | 2015-07-28 | Cypress Semiconductor Corporation | Low power, low pin count interface for an RFID transponder |
| US9846664B2 (en) | 2010-07-09 | 2017-12-19 | Cypress Semiconductor Corporation | RFID interface and interrupt |
| US9548348B2 (en) * | 2013-06-27 | 2017-01-17 | Cypress Semiconductor Corporation | Methods of fabricating an F-RAM |
| CN104600073B (zh) * | 2013-10-30 | 2017-06-06 | 上海华虹宏力半导体制造有限公司 | Otp器件及制造方法 |
| CN104576648B (zh) * | 2014-08-19 | 2017-03-29 | 上海华虹宏力半导体制造有限公司 | Otp器件及其制造方法 |
| JP6805674B2 (ja) * | 2016-09-21 | 2020-12-23 | 豊田合成株式会社 | 発光素子及びその製造方法 |
| KR20190008047A (ko) | 2017-07-14 | 2019-01-23 | 에스케이하이닉스 주식회사 | 강유전성 메모리 소자 |
| US10411017B2 (en) * | 2017-08-31 | 2019-09-10 | Micron Technology, Inc. | Multi-component conductive structures for semiconductor devices |
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| US5003428A (en) * | 1989-07-17 | 1991-03-26 | National Semiconductor Corporation | Electrodes for ceramic oxide capacitors |
| JPH03256691A (ja) * | 1990-03-08 | 1991-11-15 | Fanuc Ltd | 産業用ロボットに於ける旋回軸のケーブル処理構造 |
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| JP3207227B2 (ja) * | 1991-11-08 | 2001-09-10 | ローム株式会社 | 不揮発性半導体記憶装置 |
| US5382817A (en) * | 1992-02-20 | 1995-01-17 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device having a ferroelectric capacitor with a planarized lower electrode |
| US5216572A (en) * | 1992-03-19 | 1993-06-01 | Ramtron International Corporation | Structure and method for increasing the dielectric constant of integrated ferroelectric capacitors |
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| EP0618597B1 (en) * | 1993-03-31 | 1997-07-16 | Texas Instruments Incorporated | Lightly donor doped electrodes for high-dielectric-constant materials |
| JPH0793969A (ja) * | 1993-09-22 | 1995-04-07 | Olympus Optical Co Ltd | 強誘電体容量素子 |
| JPH07312365A (ja) * | 1994-05-17 | 1995-11-28 | Hitachi Ltd | 半導体装置の製造方法 |
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| US5504041A (en) * | 1994-08-01 | 1996-04-02 | Texas Instruments Incorporated | Conductive exotic-nitride barrier layer for high-dielectric-constant materials |
| JPH0864767A (ja) * | 1994-08-23 | 1996-03-08 | Olympus Optical Co Ltd | 半導体装置 |
| JP3322031B2 (ja) * | 1994-10-11 | 2002-09-09 | 三菱電機株式会社 | 半導体装置 |
| US5555486A (en) * | 1994-12-29 | 1996-09-10 | North Carolina State University | Hybrid metal/metal oxide electrodes for ferroelectric capacitors |
-
1995
- 1995-09-26 MX MX9602406A patent/MX9602406A/es unknown
- 1995-09-26 JP JP51156396A patent/JP3804972B2/ja not_active Expired - Fee Related
- 1995-09-26 CA CA002178091A patent/CA2178091A1/en not_active Abandoned
- 1995-09-26 DE DE69508737T patent/DE69508737T2/de not_active Expired - Fee Related
- 1995-09-26 EP EP95930695A patent/EP0737364B1/en not_active Expired - Lifetime
- 1995-09-26 KR KR1019960702917A patent/KR100342296B1/ko not_active Expired - Fee Related
- 1995-09-26 WO PCT/IB1995/000799 patent/WO1996010845A2/en not_active Ceased
- 1995-10-03 US US08/538,515 patent/US5744832A/en not_active Expired - Fee Related
- 1995-11-01 TW TW084111506A patent/TW286401B/zh active
-
1998
- 1998-02-18 US US09/025,372 patent/US6140173A/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR100342296B1 (ko) | 2002-11-29 |
| KR970702585A (ko) | 1997-05-13 |
| JPH09507342A (ja) | 1997-07-22 |
| US5744832A (en) | 1998-04-28 |
| EP0737364A1 (en) | 1996-10-16 |
| US6140173A (en) | 2000-10-31 |
| WO1996010845A3 (en) | 1996-06-06 |
| DE69508737D1 (de) | 1999-05-06 |
| JP3804972B2 (ja) | 2006-08-02 |
| EP0737364B1 (en) | 1999-03-31 |
| CA2178091A1 (en) | 1996-04-11 |
| TW286401B (es) | 1996-09-21 |
| WO1996010845A2 (en) | 1996-04-11 |
| DE69508737T2 (de) | 1999-10-07 |
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