KR980006178A - 칩 사이즈 반도체 패키지 및 그 제조 방법 - Google Patents

칩 사이즈 반도체 패키지 및 그 제조 방법 Download PDF

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KR980006178A
KR980006178A KR1019960022507A KR19960022507A KR980006178A KR 980006178 A KR980006178 A KR 980006178A KR 1019960022507 A KR1019960022507 A KR 1019960022507A KR 19960022507 A KR19960022507 A KR 19960022507A KR 980006178 A KR980006178 A KR 980006178A
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South Korea
Prior art keywords
chip
conductive wire
semiconductor chip
molding resin
semiconductor package
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KR1019960022507A
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English (en)
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KR100186333B1 (ko
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유중하
차기본
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문정환
엘지반도체 주식회사
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Priority to KR1019960022507A priority Critical patent/KR100186333B1/ko
Priority to CN97103780A priority patent/CN1092841C/zh
Priority to DE19723203A priority patent/DE19723203B4/de
Priority to JP9147350A priority patent/JP2949426B2/ja
Priority to US08/877,566 priority patent/US5977643A/en
Publication of KR980006178A publication Critical patent/KR980006178A/ko
Application granted granted Critical
Publication of KR100186333B1 publication Critical patent/KR100186333B1/ko

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

본 발명은 칩 사이즈 반도체 패키지 및 그 제조 방법에 관한 것으로, 그 구조는 다수의 칩패드(22)가 형성되어 있는 반도체 칩(21) 위에 그 칩패드(22)를 제외하고서 보호막(27)이 형성되어 있고, 그 보호막위(27)에 피아이큐(PIQ : Polyimide Isoindoro Quinazorindion)막(28)이 형성되어 있으며, 상기 드러나 있는 각 칩패드(22)위에 도선(26)의 일단이 수직으로 접속되어 있고, 그 도선(26)의 다른 일단을 제외한 상기 반도체 칩(21) 전체가 몰딩수지(23)에 의해 몰딩되어 있으며, 상기 몰딩수지(23)의 외부로 돌출된 상기 도선(26)의 단부가 원형의 외부볼(26′)로 형성되어 있는 것을 특징으로 하며; 또한 상기 반도체 칩(21)의 칩패드(22)와 도선(26)간은 초음파 열압착법을 이용하여 접속하도록 하고, 상기 외부볼(24′)의 형성은 상기 도선(26)의 단부를 아크방전법을 이용하여 원형의 볼형태로 형성시키도록 함을 특징으로 하여; 제조공정이 단순해지고 패키지의 크기가 매우 작아지며, 칩패드에서부터 외부리드까지의 전기적 경로가 되는 거리가 매우 짧아져 전기적 특성이 급상승되고, 칩패드의 형성 위치에 관계없이 외부리드를 용이하게 형성할 수 있는 효과가 있다.

Description

칩 사이즈 반도체 패키지 및 그 제조 방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제4도는 본 발명의 일실시례에 따른 칩 사이즈 반도체 패키지의 일부 절단사시도.

Claims (9)

  1. 다수의 칩패드(22)가 형성되어 있는 반도체 칩(21)과; 상기 반도체 칩(21)의 각 칩패드(22)위에 일단이 수직으로 접속되어 있는 도선(26); 및 상기 도선(26)의 다른 일단이 외부로 돌출되도록 상기 반도체 칩(21)의 전체를 둘러 쌓고 있는 몰딩수지(23)를 포함하여 구성된 칩 사이즈 반도체 패키지.
  2. 제1항에 있어서, 상기 칩패드(22)에 접속 부착된 도선(26)의 일단은 불규칙한 타원 형태의 접착볼(25)로 형성된 것을 특징으로 하는 칩 사이즈 반도체 패키지.
  3. 제1항에 있어서, 상기 몰딩수지(23)의 일부로 돌출되어 있는 각 도선(26)의 일단은 반도체 칩(21)의 중앙 부측으로 구부러진 “ㄱ”형상의 외부리드(24)로 형성된 것을 특징으로 하는 칩 사이즈 반도체 패키지.
  4. 제1항에 있어서, 상기 몰딩수지(23)의 외부로 돌출되어 있는 각 도선(26)의 일단은 원형의 볼 형태로 형성된 것을 특징으로 하는 칩 사이즈 반도체 패키지.
  5. 반도체 칩에 형성되어 있는 각 칩패드와 도선의 일단을 접속시키는 제1공정과; 상기 각 도선을 소정길이로 절단하는 제2공정과; 상기 도선의 다른 일단만 남기고 반도체 칩을 밀봉하는 제3공정과; 및 상기 몰딩수지 외부로 돌출된 도선의 다른 일단을 성형하는 제4공정을 구비함을 특징으로 하는 칩 사이즈 반도체 패키지의 제조 방법.
  6. 제5항에 있어서, 상기 제4공정의 수행은 아크방전법을 이용함을 특징으로 하는 칩 사이즈 반도체 패키지의 제조 방법.
  7. 제5항에 있어서, 상기 제4공정의 수행은 돌출 도선의 압착법을 사용함을 특징으로 하는 칩 사이즈 반도체 패키지의 제조 방법.
  8. 제7항에 있어서, 상기 압착법은 본드헤드를 이용함을 특징으로 하는 칩 사이즈 반도체 패키지의 제조 방법.
  9. 제5항에 있어서, 상기 제1공정의 수행은 초음파 열압착법을 사용함을 특징으로 하는 칩 사이즈 반도체 패키지의 제조 방법.
KR1019960022507A 1996-06-20 1996-06-20 칩 사이즈 반도체 패키지 및 그 제조방법 KR100186333B1 (ko)

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KR1019960022507A KR100186333B1 (ko) 1996-06-20 1996-06-20 칩 사이즈 반도체 패키지 및 그 제조방법
CN97103780A CN1092841C (zh) 1996-06-20 1997-04-10 片式半导体封装及其制造方法
DE19723203A DE19723203B4 (de) 1996-06-20 1997-06-03 Verfahren zum Herstellen eines Halbleiterbauteils in Chipgröße
JP9147350A JP2949426B2 (ja) 1996-06-20 1997-06-05 チップサイズ半導体パッケージの製造方法
US08/877,566 US5977643A (en) 1996-06-20 1997-06-17 Chip-size semiconductor package

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KR1019960022507A KR100186333B1 (ko) 1996-06-20 1996-06-20 칩 사이즈 반도체 패키지 및 그 제조방법

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Publication number Publication date
KR100186333B1 (ko) 1999-03-20
CN1092841C (zh) 2002-10-16
CN1174403A (zh) 1998-02-25
JPH1065054A (ja) 1998-03-06
DE19723203A1 (de) 1998-01-02
US5977643A (en) 1999-11-02
JP2949426B2 (ja) 1999-09-13
DE19723203B4 (de) 2005-12-29

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