KR960039436A - 박막트랜지스터 및 그것을 사용한 액정표시장치 - Google Patents
박막트랜지스터 및 그것을 사용한 액정표시장치 Download PDFInfo
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- KR960039436A KR960039436A KR1019960010707A KR19960010707A KR960039436A KR 960039436 A KR960039436 A KR 960039436A KR 1019960010707 A KR1019960010707 A KR 1019960010707A KR 19960010707 A KR19960010707 A KR 19960010707A KR 960039436 A KR960039436 A KR 960039436A
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- 239000010409 thin film Substances 0.000 title claims abstract 16
- 239000004973 liquid crystal related substance Substances 0.000 title claims abstract 4
- 239000012535 impurity Substances 0.000 claims abstract 16
- 239000000758 substrate Substances 0.000 claims abstract 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract 3
- 239000010408 film Substances 0.000 claims abstract 3
- 229910052710 silicon Inorganic materials 0.000 claims abstract 3
- 239000010703 silicon Substances 0.000 claims abstract 3
- 239000011159 matrix material Substances 0.000 claims abstract 2
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
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- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
- H01L29/78606—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
- H01L29/78618—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
- H01L29/78621—Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
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- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/10—Materials and properties semiconductor
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Abstract
본 발명의 박막트랜지스터는 절연기판상의 박막실리콘영역내에 형성된 소스영역, 드레인영역 및 채널영역과 상기 채널영역상의 게이트절연막을 통해 형성된 게이트 전극을 구비하고; 상기 소스영역과, 상기 드레인영역중 적어도 하나는 고농도 불순물영역과, 저농도 불순물영역을 지니고; 상기 채널영역은 상기 저농도불순물영역과, 접촉하고, 있으며; 상기 저농도불순물영역은 상기 채널영역과, 두께가 거의 동일한 박막으로 구서된 제1영역과; 상기 제1영역보다도 두꺼운 상기 고농도불순물영역과 두께가 거의 동일한 박막으로 구성된 제2영역을 적어도 구비한다.
액정표시장치는 상기 박막트랜지스터가 매트릭스형태로 배치된 TFT기판을 지닌다. 액정표시장치는 상기 소스영역의 전극이나 상기 드레인영역의 전극이 투명전극에 접속된 복수의 박막 트랜지스터를 구비하고, 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명에 의한 TET의 일실시예의 단면도
Claims (6)
- 절연기판상의 박막실리콘영역내에 형성된 소스영역, 드레인영역 및 채널영역과, 상기 채널영역상의 게이트절연막을 통해 형성된 게이트전극을 구비하고; 상기 소스영역과, 상기 드레인영역중 적어도 하나는 고농도 불순물영역과 저농도불순물영역을 지니고; 상기 채널영역은 상기 저농도불순물영역과, 접촉하고 있으며; 상기 저농도불순물영역이 상기 채널영역과 두께가 거의 동일한 박막으로 구성된 제1영역과; 상기 제1영역보다도 두께가 상기 고농도불순물영역과 두께가 박막으로 구성된 제2영역을 적어도 구비한 것을 특징으로 하는 박막트랜지스터.
- 제1항에 있어서, 상기 게이트전극은 소스 · 드레인전류의 흐름방향으로 복수의 부분으로 분할되고, 분할된 게이트전극 모두는 등전위로 접속된 것을 특징으로 하는 박막트랜지스터.
- 제1항에 있어서, 상기 게이트전극의 일부는 상기 제2영역의 적어도 일부를 커버하는 것을 특징으로 하는 박막트랜지스터.
- 제1항에 있어서, 상기 게이트전극은 소스 · 드래인전류의 흐름방향으로 복수의 부분으로 분할되고 분할된 게이트전극 하부의 채널영역은 상기 저농도불순물영역을 통해 서로 접속되어 있는 것을 특징으로 하는 박막트랜지스터.
- 제1항내지 제3항 중 어느한 항에 기재된 박막트랜지스터가 매트릭스형태로 배열된 것을 특징으로 하는 TFT기판을 지닌 액정표시장치.
- 절연기판상의 박막실리콘영역내에 형성된 소스영역, 드레인영역 및 채널영역과 상기 채널영역상의 게이트절연막을 통해 형성된 게이트전극을 구비하고; 상기 소스영역과, 상기 드레인영역중 적어도 하나는 고농도불순물영역과, 저농도불순물영역을 지니고; 상기 채널 영역은 상기 저농도불순물영역과, 접촉하고 있으며: 상기 저농도불순물영역이 상기 채널영역과 두께가 거의 동일한 박막으로 구성된 제1영역과; 상기 제1영역보다 두꺼운 상기 고농도 불순물영역과 두께가 거의 동일한 박막으로 구성된 제2영역을 적어도 구비하고; 상기 소스영역의 전극 또는 상기 드레인영역의 전극이 투명전극에 접속되어 있는 것을 특징으로 하는 복수의 박막트랜지스터를 구비한 액정표시장치.※참고사항: 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
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JP95-84106 | 1995-04-10 | ||
JP8410695 | 1995-04-10 | ||
JP96-81485 | 1996-04-03 | ||
JP8148596A JP3292657B2 (ja) | 1995-04-10 | 1996-04-03 | 薄膜トランジスタ及びそれを用いた液晶表示装置の製造法 |
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Publication Number | Publication Date |
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KR960039436A true KR960039436A (ko) | 1996-11-25 |
KR100261983B1 KR100261983B1 (ko) | 2000-07-15 |
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Application Number | Title | Priority Date | Filing Date |
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KR1019960010707A KR100261983B1 (ko) | 1995-04-10 | 1996-04-10 | 박막트랜지스터 및 그것을 사용한 액정표시장치 |
Country Status (5)
Country | Link |
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US (1) | US5693959A (ko) |
EP (1) | EP0738012B1 (ko) |
JP (1) | JP3292657B2 (ko) |
KR (1) | KR100261983B1 (ko) |
DE (1) | DE69618697D1 (ko) |
Cited By (3)
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KR100532082B1 (ko) * | 2001-12-28 | 2005-11-30 | 엘지.필립스 엘시디 주식회사 | 다결정 박막트랜지스터 및 그 제조방법 |
KR100793278B1 (ko) * | 2005-02-25 | 2008-01-10 | 재단법인서울대학교산학협력재단 | 다결정 실리콘 박막트랜지스터의 제조 방법 |
KR100848338B1 (ko) * | 2007-01-09 | 2008-07-25 | 삼성에스디아이 주식회사 | 박막트랜지스터, 그의 제조방법 및 이를 포함하는평판표시장치 |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3645380B2 (ja) * | 1996-01-19 | 2005-05-11 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法、情報端末、ヘッドマウントディスプレイ、ナビゲーションシステム、携帯電話、ビデオカメラ、投射型表示装置 |
US6478263B1 (en) | 1997-01-17 | 2002-11-12 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and its manufacturing method |
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US5888858A (en) | 1996-01-20 | 1999-03-30 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method thereof |
US6465287B1 (en) | 1996-01-27 | 2002-10-15 | Semiconductor Energy Laboratory Co., Ltd. | Method for fabricating a semiconductor device using a metal catalyst and high temperature crystallization |
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JPH09281508A (ja) * | 1996-04-12 | 1997-10-31 | Semiconductor Energy Lab Co Ltd | 液晶表示装置およびその作製方法 |
US6288764B1 (en) | 1996-06-25 | 2001-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device or electronic device having liquid crystal display panel |
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JP3274081B2 (ja) * | 1997-04-08 | 2002-04-15 | 松下電器産業株式会社 | 薄膜トランジスタの製造方法および液晶表示装置の製造方法 |
KR100248119B1 (ko) * | 1997-05-01 | 2000-03-15 | 구자홍 | 박막트랜지스터 및 그 제조방법 |
US6686623B2 (en) | 1997-11-18 | 2004-02-03 | Semiconductor Energy Laboratory Co., Ltd. | Nonvolatile memory and electronic apparatus |
US7202497B2 (en) | 1997-11-27 | 2007-04-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
JP3934236B2 (ja) * | 1998-01-14 | 2007-06-20 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
JP4014710B2 (ja) | 1997-11-28 | 2007-11-28 | 株式会社半導体エネルギー研究所 | 液晶表示装置 |
US5811855A (en) * | 1997-12-29 | 1998-09-22 | United Technologies Corporation | SOI combination body tie |
US6288413B1 (en) * | 1998-04-03 | 2001-09-11 | Kabushiki Kaisha Toshiba | Thin film transistor and method for producing same |
US6060749A (en) * | 1998-04-23 | 2000-05-09 | Texas Instruments - Acer Incorporated | Ultra-short channel elevated S/D MOSFETS formed on an ultra-thin SOI substrate |
JP2000012864A (ja) | 1998-06-22 | 2000-01-14 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
US6271101B1 (en) | 1998-07-29 | 2001-08-07 | Semiconductor Energy Laboratory Co., Ltd. | Process for production of SOI substrate and process for production of semiconductor device |
JP4476390B2 (ja) | 1998-09-04 | 2010-06-09 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US6617644B1 (en) | 1998-11-09 | 2003-09-09 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
US7141821B1 (en) * | 1998-11-10 | 2006-11-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having an impurity gradient in the impurity regions and method of manufacture |
US6518594B1 (en) * | 1998-11-16 | 2003-02-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor devices |
US6909114B1 (en) | 1998-11-17 | 2005-06-21 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device having LDD regions |
US6277679B1 (en) | 1998-11-25 | 2001-08-21 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing thin film transistor |
US6365917B1 (en) * | 1998-11-25 | 2002-04-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
US6501098B2 (en) | 1998-11-25 | 2002-12-31 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device |
US6469317B1 (en) | 1998-12-18 | 2002-10-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
TW404070B (en) * | 1999-02-02 | 2000-09-01 | Nat Science Council | Poly-silicon thin film transistor process |
JP4372943B2 (ja) * | 1999-02-23 | 2009-11-25 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
TW469484B (en) * | 1999-03-26 | 2001-12-21 | Semiconductor Energy Lab | A method for manufacturing an electrooptical device |
US6346730B1 (en) * | 1999-04-06 | 2002-02-12 | Semiconductor Energy Laboratory Co., Ltd. | Liquid crystal display device having a pixel TFT formed in a display region and a drive circuit formed in the periphery of the display region on the same substrate |
TW480554B (en) | 1999-07-22 | 2002-03-21 | Semiconductor Energy Lab | Semiconductor device and manufacturing method thereof |
US6967633B1 (en) | 1999-10-08 | 2005-11-22 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
US6384427B1 (en) * | 1999-10-29 | 2002-05-07 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device |
JP4727029B2 (ja) * | 1999-11-29 | 2011-07-20 | 株式会社半導体エネルギー研究所 | El表示装置、電気器具及びel表示装置用の半導体素子基板 |
GB2358082B (en) * | 2000-01-07 | 2003-11-12 | Seiko Epson Corp | Semiconductor transistor |
GB2358083B (en) * | 2000-01-07 | 2004-02-18 | Seiko Epson Corp | Thin-film transistor and its manufacturing method |
US6515310B2 (en) * | 2000-05-06 | 2003-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and electric apparatus |
TW538246B (en) * | 2000-06-05 | 2003-06-21 | Semiconductor Energy Lab | Display panel, display panel inspection method, and display panel manufacturing method |
JP3522216B2 (ja) * | 2000-12-19 | 2004-04-26 | シャープ株式会社 | 薄膜トランジスタおよびその製造方法ならびに液晶表示装置 |
SG103846A1 (en) | 2001-02-28 | 2004-05-26 | Semiconductor Energy Lab | A method of manufacturing a semiconductor device |
JP2002334994A (ja) * | 2001-03-07 | 2002-11-22 | Seiko Epson Corp | 電気光学装置および電気光学装置の製造方法、電気光学装置用基板、投射型表示装置並びに電子機器 |
JP3904512B2 (ja) * | 2002-12-24 | 2007-04-11 | シャープ株式会社 | 半導体装置およびその製造方法、並びに半導体装置を備えた電子機器 |
US6960794B2 (en) * | 2002-12-31 | 2005-11-01 | Matrix Semiconductor, Inc. | Formation of thin channels for TFT devices to ensure low variability of threshold voltages |
US6713371B1 (en) * | 2003-03-17 | 2004-03-30 | Matrix Semiconductor, Inc. | Large grain size polysilicon films formed by nuclei-induced solid phase crystallization |
TWI231996B (en) * | 2003-03-28 | 2005-05-01 | Au Optronics Corp | Dual gate layout for thin film transistor |
KR100849292B1 (ko) * | 2003-03-31 | 2008-07-29 | 샤프 가부시키가이샤 | 액정 표시 장치 및 그 제조 방법 |
US7323731B2 (en) * | 2003-12-12 | 2008-01-29 | Canon Kabushiki Kaisha | Photoelectric conversion device, method of manufacturing photoelectric conversion device, and image pickup system |
JP2005223027A (ja) * | 2004-02-04 | 2005-08-18 | Sony Corp | 表示装置およびその製造方法 |
WO2005109512A1 (en) * | 2004-05-06 | 2005-11-17 | Canon Kabushiki Kaisha | Photoelectric conversion device and manufacturing method thereof |
WO2005124306A1 (en) * | 2004-06-15 | 2005-12-29 | Canon Kabushiki Kaisha | Semiconductor device |
KR100763913B1 (ko) * | 2006-04-27 | 2007-10-05 | 삼성전자주식회사 | 박막 트랜지스터의 제조방법 |
EP2259294B1 (en) * | 2006-04-28 | 2017-10-18 | Semiconductor Energy Laboratory Co, Ltd. | Semiconductor device and manufacturing method thereof |
US7863612B2 (en) | 2006-07-21 | 2011-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Display device and semiconductor device |
JP4332545B2 (ja) * | 2006-09-15 | 2009-09-16 | キヤノン株式会社 | 電界効果型トランジスタ及びその製造方法 |
US7659579B2 (en) | 2006-10-06 | 2010-02-09 | International Business Machines Corporation | FETS with self-aligned bodies and backgate holes |
DE102008000128B4 (de) * | 2007-01-30 | 2013-01-03 | Denso Corporation | Halbleitersensorvorrichtung und deren Herstellungsverfahren |
US8119463B2 (en) * | 2008-12-05 | 2012-02-21 | Electronics And Telecommunications Research Institute | Method of manufacturing thin film transistor and thin film transistor substrate |
JP5451098B2 (ja) * | 2009-02-06 | 2014-03-26 | キヤノン株式会社 | 半導体装置の製造方法 |
JP2010206174A (ja) | 2009-02-06 | 2010-09-16 | Canon Inc | 光電変換装置およびその製造方法ならびにカメラ |
JP2010206173A (ja) | 2009-02-06 | 2010-09-16 | Canon Inc | 光電変換装置およびカメラ |
JP2010206172A (ja) | 2009-02-06 | 2010-09-16 | Canon Inc | 撮像装置およびカメラ |
US8680617B2 (en) * | 2009-10-06 | 2014-03-25 | International Business Machines Corporation | Split level shallow trench isolation for area efficient body contacts in SOI MOSFETS |
KR101117739B1 (ko) * | 2010-03-15 | 2012-02-24 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터 및 그 제조방법 |
JP2011002855A (ja) * | 2010-09-22 | 2011-01-06 | Semiconductor Energy Lab Co Ltd | 液晶表示装置 |
JP2011158923A (ja) * | 2011-05-11 | 2011-08-18 | Semiconductor Energy Lab Co Ltd | 表示装置 |
JP2015161701A (ja) * | 2014-02-26 | 2015-09-07 | 国立大学法人 琉球大学 | ディスプレイ |
CN104779171A (zh) * | 2015-05-05 | 2015-07-15 | 京东方科技集团股份有限公司 | 低温多晶硅薄膜晶体管及制作方法、阵列基板、显示装置 |
CN105070764A (zh) * | 2015-08-31 | 2015-11-18 | 深圳市华星光电技术有限公司 | Tft、阵列基板、显示装置及tft的制备方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2737406A1 (de) * | 1977-08-19 | 1979-02-22 | Bayer Ag | Strahlenhaertbare bindemittel |
JPH0828507B2 (ja) * | 1982-03-16 | 1996-03-21 | セイコーエプソン株式会社 | 半導体装置 |
JPH0669094B2 (ja) * | 1983-12-23 | 1994-08-31 | ソニー株式会社 | 電界効果型トランジスタ |
US5242844A (en) * | 1983-12-23 | 1993-09-07 | Sony Corporation | Semiconductor device with polycrystalline silicon active region and method of fabrication thereof |
US4859618A (en) * | 1986-11-20 | 1989-08-22 | Sumitomo Electric Industries, Ltd. | Method of producing the gate electrode of a field effect transistor |
JPH0338755A (ja) * | 1989-07-05 | 1991-02-19 | Nec Corp | ファイル転送システム |
JPH03220774A (ja) * | 1990-01-25 | 1991-09-27 | Sanyo Electric Co Ltd | Mos電界効果トランジスタ |
JP2895166B2 (ja) * | 1990-05-31 | 1999-05-24 | キヤノン株式会社 | 半導体装置の製造方法 |
JPH04241466A (ja) * | 1991-01-16 | 1992-08-28 | Casio Comput Co Ltd | 電界効果型トランジスタ |
EP0510604A3 (en) * | 1991-04-23 | 2001-05-09 | Canon Kabushiki Kaisha | Semiconductor device and method of manufacturing the same |
JP2731056B2 (ja) * | 1991-10-09 | 1998-03-25 | シャープ株式会社 | 薄膜トランジスタの製造方法 |
JPH05259457A (ja) * | 1992-03-16 | 1993-10-08 | Sharp Corp | 薄膜トランジスタ |
JPH05267327A (ja) * | 1992-03-18 | 1993-10-15 | Fujitsu Ltd | Misfet及びその製造方法 |
DE69326123T2 (de) * | 1992-06-24 | 1999-12-23 | Seiko Epson Corp | Dünnfilmtransistor und verfahren zur herstellung eines dünnfilmtransistors |
US5412493A (en) * | 1992-09-25 | 1995-05-02 | Sony Corporation | Liquid crystal display device having LDD structure type thin film transistors connected in series |
DE69434235T2 (de) * | 1993-02-10 | 2005-12-08 | Seiko Epson Corp. | Aktivmatrixschaltkreisplatine und deren Herstellungsverfahren |
-
1996
- 1996-04-03 JP JP8148596A patent/JP3292657B2/ja not_active Expired - Fee Related
- 1996-04-10 US US08/629,466 patent/US5693959A/en not_active Expired - Lifetime
- 1996-04-10 EP EP96302525A patent/EP0738012B1/en not_active Expired - Lifetime
- 1996-04-10 DE DE69618697T patent/DE69618697D1/de not_active Expired - Lifetime
- 1996-04-10 KR KR1019960010707A patent/KR100261983B1/ko not_active IP Right Cessation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100532082B1 (ko) * | 2001-12-28 | 2005-11-30 | 엘지.필립스 엘시디 주식회사 | 다결정 박막트랜지스터 및 그 제조방법 |
KR100793278B1 (ko) * | 2005-02-25 | 2008-01-10 | 재단법인서울대학교산학협력재단 | 다결정 실리콘 박막트랜지스터의 제조 방법 |
KR100848338B1 (ko) * | 2007-01-09 | 2008-07-25 | 삼성에스디아이 주식회사 | 박막트랜지스터, 그의 제조방법 및 이를 포함하는평판표시장치 |
US7821007B2 (en) | 2007-01-09 | 2010-10-26 | Samsung Mobile Display Co., Ltd. | Thin film transistor and flat panel display device |
Also Published As
Publication number | Publication date |
---|---|
EP0738012A2 (en) | 1996-10-16 |
JP3292657B2 (ja) | 2002-06-17 |
KR100261983B1 (ko) | 2000-07-15 |
EP0738012B1 (en) | 2002-01-23 |
US5693959A (en) | 1997-12-02 |
DE69618697D1 (de) | 2002-03-14 |
JPH08340120A (ja) | 1996-12-24 |
EP0738012A3 (en) | 1997-08-13 |
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