KR950021448A - 반도체 장치 및 그 제조방법 - Google Patents

반도체 장치 및 그 제조방법 Download PDF

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Publication number
KR950021448A
KR950021448A KR1019940028898A KR19940028898A KR950021448A KR 950021448 A KR950021448 A KR 950021448A KR 1019940028898 A KR1019940028898 A KR 1019940028898A KR 19940028898 A KR19940028898 A KR 19940028898A KR 950021448 A KR950021448 A KR 950021448A
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South Korea
Prior art keywords
semiconductor chip
fixing
lead
semiconductor device
leads
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KR1019940028898A
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English (en)
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KR0140675B1 (ko
Inventor
다까오 오찌
히사시 후나꼬시
겐죠우 히타다
다까시 와까바야시
Original Assignee
모리시다 요이치
마쯔시다 덴기 산교 가부시끼가이샤
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Publication of KR950021448A publication Critical patent/KR950021448A/ko
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Publication of KR0140675B1 publication Critical patent/KR0140675B1/ko

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Abstract

본 발명은 내부리드와 외부리드로 되는 복수의 접속용리드는, 리드프레임 본체에서 내측으로 연장되도록 설치된 후에 리드프레임 본체에서 잘라내어져 있고, 반도체칩의 a1 전극과 전기적으로 접속되어 있으며, 굴곡한 선단부를 가지는 복수의 고정용리드는, 리드프레임 본체에서 내측으로 연장되도록 설치된 후에 리드프레임 본체에서 잘려내어져 있고, 상기 선단부에 의해 반도체칩을 협지하고 있으며, 반도체칩, 복수의 접속용리드 및 복수의 고정용리드는 수지제의 패키지에 의해 밀봉되어 있는 것을 특징으로 한다.

Description

반도체 장치 및 그 제조방법
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1 실시예에 관한 반도체 장치의 단면도.
제2도 (a)는 제1 실시예에 관한 반도체 장치의 평면도,
(b)는 제2도에서의 B-B'선의 단면도.
제3도 (a)∼(e)는 제1 실시예에 관한 반도체 장치의 제조방법의 각 공정을 표시하는 단면도.
제4도 (a)∼(c)는 제1 실시예에 관한 반도체 장치에서의 고정용리드의 선단부의 리드프레임에 대한 각도를 설명하는 단면도.
제5도 (a)∼(c)는 제1 실시예에 관한 반도체 장치에서의 고정용리드의 선단부에 의한 반도체칩의 협지방법을 설명하는 단면도.
제6도 (a)∼(f)는 제1 실시예에 관한 반도체 장치에서의 고정용리드의 선단부와 반도체칩과의 높이 관계를 설명하는 단면도.
제7도 (a)∼(c)는 제1 실시예에 관한 반도체 장치에서의 고정용리드의 선단부의 하단위치와 반도체칩의 이면위치와의 관계를 설명하는 단면도.

Claims (27)

  1. 반도체칩과,
    리드프레임 본체에서 내측으로 연장되도록 설치된 후에 상기 리드프레임 본체에서 잘라내어, 상기 반도체칩의 전극과 전기적으로 접속되어 있는 복수의 접속용리드와,
    상기 리드프레임 본체에서 내측으로 연장되도록 설치된 후에 상기 리드프레임 본체에서 잘라내어, 상기 반도체칩측으로 굴곡한 선단부를 가지고 이 선단부에 의해 상기 반도체칩을 유지하는 고정용리드와,
    상기 반도체칩, 복수의 접속용리드 및 복수의 고정용리드를 밀봉하고 있는 수지제의 패키지를 구비하고 있는 것을 특징으로 하는 반도체 장치.
  2. 제1항에 있어서, 상기 접속용리드의 내부리드는 상기 반도체칩 상측으로 연장되어 이 반도체칩의 전극과 전기적으로 접속되어 있는 것을 특징으로 하는 반도체 장치.
  3. 제1항에 있어서, 상기 고정용리드의 선단부는 상기 반도체칩의 측면을 유지하고 있는 것을 특징으로 하는 반도체 장치.
  4. 제3항에 있어서, 상기 고정용리드의 선단부는 상기 반도체칩의 측면에 면접촉하고 있는 것을 특징으로 하는 반도체 장치.
  5. 제3항에 있어서, 상기 고정용리드의 선단부는 상기 반도체칩의 측면사이에 연금속 또는 탄성체가 개재하고 있는 것을 특징으로 하는 반도체 장치.
  6. 제3항에 있어서, 상기 고정용리드의 선단부는 상기 반도체칩의 측면은 수지 또는 저융점금속에 의해 서로 접합하고 있는 것을 특징으로 하는 반도체 장치.
  7. 제3항에 있어서, 상기 고정용리드의 선단부는 상기 반도체칩의 측면은 접착성을 가지는 절연성 필름에 의해 서로 접합하고 있는 것을 특징으로 하는 반도체 장치.
  8. 제3항에 있어서, 상기 고정용리드는 접속용리드인 것을 특징으로 하는 반도체 장치.
  9. 제1항에 있어서, 상기 고정용리드의 선단부는 상기 반도체칩의 각부를 유지하고 있는 것을 특징으로 하는 반도체 장치.
  10. 제9항에 있어서, 상기 고정용리드의 선단부에 상기 반도체칩의 각부를 유지하는 평면시 L자상의 유지부가 설치되어 있는 것을 특징으로 하는 반도체 장치.
  11. 제9항에 있어서, 상기 고정용리드의 선단부와 상기 반도체칩의 사이에 연금속 또는 탄성체가 개재하고 있는 것을 특징으로 하는 반도체 장치.
  12. 제9항에 있어서, 상기 고정용리드의 선단부와 상기 반도체칩의 각부는 수지 또는 저융점금속에 의해 서로 접합하고 있는 것을 특징으로 하는 반도체 장치.
  13. 제9항에 있어서, 상기 고정용리드는 접속용리드인 것을 특징으로 하는 반도체 장치.
  14. 리드프레임 본체와, 이 리드프레임 본체에서 내측으로 연장되어 전기적 접속을 하기 위한 복수의 접속용리드와, 상기 리드프레임 본체에서 내측으로 연장되고 또한 굴곡한 선단부를 가지는 복수의 고정용리드를 가지는 리드프레임을 설치하는 제1의 공정과,
    상기 복수의 고정용리드의 선단부에 의해 상기 반도체칩을 유지하는 제2의 공정과,
    상기 반도체칩, 복수의 접속용리드 및 복수의 고정용리드를 수지에 의해 밀봉하여 수지제의 패키지를 형성하는 제3의 공정과,
    상기 복수의 접속용리드 및 고정용리드를 상기 리드프레임 본체에서 잘라내는 제4의 공정을 구비하고 있는 것을 특징으로 하는 반도체장치의 제조 방법.
  15. 제14항에 있어서, 상기 제2의 공정과 상기 제3의 공정과의 사이에, 상기 반도체칩의 전극과 접속용리드의 내부리드를 본딩와이어에 의해 전기적으로 접속하는 공정을 더 구비하고 있는 것을 특징으로 하는 반도체장치의 제조 방법.
  16. 제14항에 있어서, 상기 제1의 공정은, 복수의 고정용리드를 그 선단부끼리의 간격이 상기 반도체칩의 치수보다도 약간 작아지도록 설치하는 공정을 가지고,
    상기 제2의 공정은, 복수의 고정용리드의 선단부를 이 선단부끼리의 간격이 상기 반도체칩의 치수보다도 크게되도록 외측으로 넓히는 선단부 확개공정과, 상기 반도체칩을 상기 리드프레임에 세트하는 반도체칩 세트공정과, 상기 복수의 고정용리드의 선단부를 내측으로 되돌려서 이 선단부에 상기 반도체칩을 협지시키는 반도체칩 유지공정을 가지고 있는 것을 특징으로 하는 반도체장치의 제조 방법.
  17. 제16항에 있어서, 상기 제1의 공정은, 상기 복수의 고정용리드를 각 고정용리드가 상기 리드프레임 본체에 대하여 탄성력을 가지도록 설치하는 공정을 가지고,
    상기 제2의 공정에서의 상기 반도체칩 유지공정은, 상기 복수의 고정용리드가 상기 리드프레임에 대하여 가지는 탄성력에 의해 상기 선단부에 상기 반도체칩을 협지시키는 공정을 가지는 것을 특징으로 하는 반도체장치의 제조 방법.
  18. 제16항에 있어서, 상기 제1의 공정은, 상기 복수의 고정용리드를 그 선단부가 고정용리드 본체에 대하여 탄성력을 가지도록 설치하는 공정을 가지고,
    상기 제2의 공정에서의 상기 반도체칩 유지공정은, 상기 선단부가 상기 고정용리드 본체에 대하여 가지는 탄성력에 의해서 상기 선단부에 상기 반도체칩을 협지시키는 공정을 가지는 것을 특징으로 하는 반도체장치의 제조 방법.
  19. 제16항에 있어서, 상기 제2의 공정에서의, 상기 선단부 확개공정은 리드프레임을 가열하는것에 의해 상기 복수의 고정용리드의 선단부를 외측으로 넓히는 공정을 것을 특징으로 하는 반도체장치의 제조 방법.
  20. 제16항에 있어서, 상기 제2의 공정에서의 상기 반도체칩 유지공정은, 상기 고정용리드의 선단부와 상기 반도체칩 사이에 설치되어 상기 반도체칩보다도 부드러운 물체를 통하여 상기 산단부에 상기 반도체칩을 선단부확개공정은, 상기 협지시키는 공정을 가지는 것을 특징으로 하는 반도체장치의 제조 방법.
  21. 제20항에 있어서, 상기 반도체칩보다도 부드러운 물체는 탄성체인 것을 특징으로 하는 반도체장치의 제조 방법.
  22. 제14항에 있어서, 상기 제1의 공정은, 상기 복수의 고정용리드를 그 선단부끼리의 간격이 상기 반도체칩의 치수보다도 약간 크게되도록 설치하는 공정을 가지고,
    상기 제2의 공정은, 상기 반도체칩을 상기 리드프레임에 세트하는 반도체칩 세트공정과,
    상기 고정용리드의 선단부와 상기 반도체칩을 접합하여 상기 선단부에 상기 반도체칩을 유지시키는 반도체칩 유지공정을 가지는 것을 특징으로 하는 반도체장치의 제조 방법.
  23. 제22항에 있어서, 상기 제2의 공정에서의 상기 반도체칩 유지공정은, 상기 고정용리드의 선단부와 상기 반도체칩을 저융점금속에 의해 접합하는 공정을 가지는 것을 특징으로 하는 반도체장치의 제조 방법.
  24. 제22항에 있어서, 상기 제2의 공정에서의 상기 반도체칩 유지공정은, 상기 고정용리드의 선단부와 상기 반도체칩을 절연성수지에 의해 접합하는 공정을 가지고 있는 것을 특징으로 하는 반도체장치의 제조 방법.
  25. 제22항에 있어서, 상기 제2의 공정에서의 상기 반도체칩 유지공정은, 상기 고정용리드의 선단부와 상기 반도체칩을 접착성을 가지는 절연성 필름에 의해 접합하는 공정을 가지는 것을 특징으로 하는 반도체장치의 제조 방법.
  26. 제14항에 있어서, 상기 제2의 공정은, 상기 고정용리드의 선단부에 상기 반도체칩의 측면을 유지시키는 공정을 가지는 것을 특징으로 하는 반도체장치의 제조 방법.
  27. 제14항에 있어서, 상기 제2의 공정은, 상기 복수의 고정용리드의 선단부에 상기 반도체칩의 측면을 유지시키는 공정을 가지고 있는 것을 특징으로 하는 반도체장치의 제조 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019940028898A 1993-12-08 1994-11-04 반도체 장치 및 그 제조방법 KR0140675B1 (ko)

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KR0140675B1 (ko) 1998-06-01
US5998866A (en) 1999-12-07
EP0657931B1 (en) 1999-11-10
DE69421592T2 (de) 2000-04-06
US5776802A (en) 1998-07-07
EP0657931A1 (en) 1995-06-14
DE69421592D1 (de) 1999-12-16
TW270213B (ko) 1996-02-11

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