KR890011037A - 전기적 접속접점과 그 형성방법 및 그것을 사용한 실장기판 - Google Patents

전기적 접속접점과 그 형성방법 및 그것을 사용한 실장기판 Download PDF

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Publication number
KR890011037A
KR890011037A KR1019880016318A KR880016318A KR890011037A KR 890011037 A KR890011037 A KR 890011037A KR 1019880016318 A KR1019880016318 A KR 1019880016318A KR 880016318 A KR880016318 A KR 880016318A KR 890011037 A KR890011037 A KR 890011037A
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South Korea
Prior art keywords
protrusion
primary
substrate
electrode pad
gold
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KR1019880016318A
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English (en)
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KR910009780B1 (ko
Inventor
도시오 쯔다
야스히꼬 호리오
요시히로 벳쇼
도우루 이시다
Original Assignee
다니이 아끼오
마쯔시다덴기산교 가부시기가이샤
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Priority claimed from JP62309805A external-priority patent/JP2506861B2/ja
Priority claimed from JP18493688A external-priority patent/JPH063820B2/ja
Application filed by 다니이 아끼오, 마쯔시다덴기산교 가부시기가이샤 filed Critical 다니이 아끼오
Publication of KR890011037A publication Critical patent/KR890011037A/ko
Application granted granted Critical
Publication of KR910009780B1 publication Critical patent/KR910009780B1/ko

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Abstract

내용 없음

Description

전기적 접속접점과 그 형성방법 및 그것을 사용한 실장기판
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 제1실시예의 전기적 접속접점의 측면도.
제2도는 본 발명의 제2실시예의 전기적 접속접점의 단면도.
제3도는 본 발명의 바람직한 실시예에 의한 실장기판의 단면도.
* 도면의 주요부분에 대한 부호의 설명
1 : 기판 2 : 전극패드
3 : 캐필러리 4 : 구멍
5 : 금선 6 : 보올
7 : 1차 돌출부분 8 : 2차 돌출부분
9 : 금접점 10 : 칩서포트 프레임
11 : 전도성 터미널 12 : 전도성 접착제
13 : 열블럭 14 : 판
15 : 반도체 회로패턴

Claims (22)

  1. 기판위에 착설된 전극 패드위에서 형성된 전기적 접속접점에 있어서, 전극패드에 접착된 1차 돌출부분과 1차 돌출부분으로 형성되고 전극패드에 평행한 평면에서의 1차 돌출부분의 단면보다 더 작은 전극패드의 표면에 평행한 평면에서 단면을 가지고 있는 2차 돌출부분으로 구성되는 전기적 접속접점.
  2. 제1항에 있어서, 1차 돌출부분의 단면과 2차 돌출부분의 단면비율이 3/2 내지 5/1의 범위에 속하고 1차 돌출부분의 높이와 2차 돌출부분의 높이에 비율이 1/2 내지 2/1의 범위에 속하는 전기적 접속접점.
  3. 제1항에 있어서, 1차 돌출부분의 폭이 60 내지 120㎛의 범위에 속하는 전기적 접속접점.
  4. 제1항에 있어서, 1차 2차 돌출부분의 높이의 합이 30 내지 90㎛의 범위에 속하는 전기적 접속접점.
  5. 제1항에 있어서, 1차 2차 돌출부분이 금, 구리, 알루미늄 혹은 금, 구리, 알루미늄의 1종을 주성분으로 함유하는 합금으로 이루어진 전기적 접속접점.
  6. 기판의 전극패드위에서 형성된 전기적 접속접점에 있어서, 전극패드에 부착된 1차 돌출부분과 1차 돌출부분위에 형성되고 루우프형태로 굽혀진 전도성 와이어로 형성된 2차 돌출부분으로 구성되는 전기적 접속접점.
  7. 제6항에 있어서, 1차 2차 돌출부분은 금, 구리, 알루미늄 또는 하나의 주성분으로 금, 구리 알루미늄의 1종을 주성분으로 함유하는 합금으로 이루어진 전기적 접속접점.
  8. 다수의 전도성 터미널이 설치된 1차 기판과 1차 기판의 전도성 터미널이 일치하는 위치에서 각각 다수의 전극패드가 설치된 2차 기판과 다수의 전극패드위에 각각 형성되고 같은 전극패드에 부착된 1차 돌출부분 및 2차 돌출부분의 단면에 평행한 1차 돌출부분의 단면보다 전극패드에 평행한 평면에서의 2차 돌출부분의 단면이 더 적은 단면을 가지고 1차 돌출부분위에서 형성된 2차 돌출부분으로 구성되는 전기적 접속접점과 전기적 접속접점을 1차 기판의 해당 전도성 터미널에 각각 접착하는 전도성 접착제 방울들로 구성되는 실장기판.
  9. 제8항에 있어서, 상기 전도성 접착제의 각 방울은 실제적으로 2차 돌출부분이 형성되는 1차 돌출부분의 표면에만 접촉하는 실장기판.
  10. 제8항에 있어서, 상기 전도성 접착제가 유연한 실장기판.
  11. 제8항에 있어서, 상기 전극패드의 표면에 평행한 1차 돌출부분의 단면적대 1차 돌출부분의 단면에 평행한 2차 돌출부분의 단면적의 비율은 3/2 내지 5/1의 범위에 속하고 1차 돌출부분의 높이와 2차 돌출부분의 높이의 비율은 1/2 내지 2/1의 범위에 속하는 실장기판.
  12. 제8항에 있어서, 상기 1차 돌출부분의 폭은 60 내지 120㎛의 범위에 속하는 실장기판.
  13. 제8항에 있어서, 상기 1차 돌출부분과 2차 돌출부분의 높이에 합은 30 내지 90㎛의 범위에 속하는 실장기판.
  14. 제8항에 있어서, 상기 전기적 접속접점이 금, 구리, 알루미늄이나 또는 금, 구리, 알루미늄의 1종을 주성분으로 포함하는 합금으로 이루어진 실장기판.
  15. 다수의 전도성 터미널이 설치된 1차 기판과 1차 기판의 전도성 터미널에 부합하는 위치에 있는 다수의 전극패드가 설치된 2차 기판과 2차 기판의 전극패드위에서 각각 형성하고 전극패드에 부착된 1차 돌출부분과 1차 돌출부분위에 형성되고 루우프형태로 굽혀진 전도성 와이어로 형성된 2차 돌출부분으로 구성되는 다수의 전기적 접속접점과 전기적 접속접점을 1차 기판의 해당 전도성 터미널에 접착하는 전도성 접착제의 방울들로 구성되는 실장기판.
  16. 제15항에 있어서, 상기 전도성 접착제의 방울은 2차 돌출부분이 형성되는 1차 돌출부분의 표면에만 실제적으로 접촉하는 실장기판.
  17. 제15항에 있어서, 상기 전도성 접착제는 유연성이 있는 실장기판.
  18. 제15항에 있어서, 상기 전기적 접속접점은 금, 구리, 알루미늄 또 금, 구리, 알루미늄의 1종을 주성분으로 포함하는 합금으로 이루어진 실장기판.
  19. 1차 돌출부분과 루우프형태의 2차 돌출부분으로 구성되는 전기적 접속접점을 형성하는 방법에 있어서, 1차 돌출부분을 형성하기 위하여 캐필레리로 기판위에 형성된 전극패드에 전도성 와이어의 자유끝단에서 형성된 보올을 고착하기 위한 첫째단계와 캐필레리로 2차 돌출부분을 형성하기 위해 1차 돌출부분위에서 루우프형태로 전도성 와이어를 루우핑하고 루우프의 자유끝단에서 전도성와이어를 절단하는 둘째단계로 구성되는 전기적 접속접점을 형성하기 위한 방법.
  20. 제19항에 있어서, 상기 전도성 와이어는 금, 구리, 알루미늄 또는 금, 구리, 알루미늄의 1종을 주성분으로 함유하는 합금으로 이루어진 전기적 접속접점을 형성하기 위한 방법.
  21. 제19항에 있어서, 상기 2차 공정에서 전도성 와이어를 루우핑하여 형성된 전도성 와이어의 루우프 끝단이 1차 돌출부분에 고정되고 전도성 와이어가 루우프의 자유끝단에서 절단되는 전기적 접속접점을 형성하기 위한 방법.
  22. 제19항에 있어서, 상기 제2차 공정에서 전도성 와이어의 루우핑으로 형성된 전도성 와이어 루우프의 자유끝단이 1차 돌출부분이 형성된 전극패드의 1차 돌출부위에 고정된 후에 전도성 와이어가 루우프로부터 절단되는 전기적 접속접점을 형성하기 위한 방법.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019880016318A 1987-12-08 1988-12-08 전기적 접속접점과 그 형성방법 및 그것을 사용한 실장기판 KR910009780B1 (ko)

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JP62309805A JP2506861B2 (ja) 1987-12-08 1987-12-08 電気的接続接点の形成方法
JP62-309805 1987-12-08
JP18493688A JPH063820B2 (ja) 1988-07-25 1988-07-25 半導体装置の実装方法
JP63-184936 1988-07-25

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KR910009780B1 KR910009780B1 (ko) 1991-11-30

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EP0320244A2 (en) 1989-06-14
DE3888476T2 (de) 1994-09-29
EP0320244A3 (en) 1990-10-10
US5090119A (en) 1992-02-25
HK89096A (en) 1996-05-31
KR910009780B1 (ko) 1991-11-30
EP0320244B1 (en) 1994-03-16
DE3888476D1 (de) 1994-04-21

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