DE69628018D1 - Halbleiterpackung mit mechanisch und elektrisch verbundenen Trägerelementen - Google Patents

Halbleiterpackung mit mechanisch und elektrisch verbundenen Trägerelementen

Info

Publication number
DE69628018D1
DE69628018D1 DE69628018T DE69628018T DE69628018D1 DE 69628018 D1 DE69628018 D1 DE 69628018D1 DE 69628018 T DE69628018 T DE 69628018T DE 69628018 T DE69628018 T DE 69628018T DE 69628018 D1 DE69628018 D1 DE 69628018D1
Authority
DE
Germany
Prior art keywords
mechanically
electrically connected
semiconductor package
carrier elements
connected carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69628018T
Other languages
English (en)
Inventor
Luc Petit
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SA
Original Assignee
STMicroelectronics SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SA filed Critical STMicroelectronics SA
Application granted granted Critical
Publication of DE69628018D1 publication Critical patent/DE69628018D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13011—Shape comprising apertures or cavities, e.g. hollow bump
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13016—Shape in side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10242—Metallic cylinders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
DE69628018T 1996-10-30 1996-10-30 Halbleiterpackung mit mechanisch und elektrisch verbundenen Trägerelementen Expired - Lifetime DE69628018D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP96410112A EP0840374B1 (de) 1996-10-30 1996-10-30 Halbleiterpackung mit mechanisch und elektrisch verbundenen Trägerelementen

Publications (1)

Publication Number Publication Date
DE69628018D1 true DE69628018D1 (de) 2003-06-12

Family

ID=8225381

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69628018T Expired - Lifetime DE69628018D1 (de) 1996-10-30 1996-10-30 Halbleiterpackung mit mechanisch und elektrisch verbundenen Trägerelementen

Country Status (3)

Country Link
US (1) US5959355A (de)
EP (1) EP0840374B1 (de)
DE (1) DE69628018D1 (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6638638B2 (en) * 2001-09-18 2003-10-28 Samsung Electronics Co., Ltd. Hollow solder structure having improved reliability and method of manufacturing same
WO2005119850A1 (en) * 2004-05-28 2005-12-15 Molex Incorporated Electro-formed ring interconnection system
US20080142964A1 (en) * 2006-12-13 2008-06-19 Haixiao Sun Tubular-shaped bumps for integrated circuit devices and methods of fabrication
US7985672B2 (en) * 2007-11-28 2011-07-26 Freescale Semiconductor, Inc. Solder ball attachment ring and method of use
US20090174069A1 (en) * 2008-01-04 2009-07-09 National Semiconductor Corporation I/o pad structure for enhancing solder joint reliability in integrated circuit devices
US8193768B2 (en) * 2008-02-28 2012-06-05 Jason S. Hallett Contactless charging system for musical instruments
US10833033B2 (en) * 2011-07-27 2020-11-10 Taiwan Semiconductor Manufacturing Co., Ltd. Bump structure having a side recess and semiconductor structure including the same
US10224294B2 (en) * 2015-08-18 2019-03-05 Mitsubishi Electric Corporation Semiconductor device
JP6686876B2 (ja) * 2016-12-28 2020-04-22 豊田合成株式会社 半導体構造体および半導体素子

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5958843A (ja) * 1982-09-28 1984-04-04 Sharp Corp フリツプチツプ用バンプ製造方法
FR2618254B1 (fr) * 1987-07-16 1990-01-05 Thomson Semiconducteurs Procede et structure de prise de contact sur des plots de circuit integre.
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US5241133A (en) 1990-12-21 1993-08-31 Motorola, Inc. Leadless pad array chip carrier
US5767580A (en) * 1993-04-30 1998-06-16 Lsi Logic Corporation Systems having shaped, self-aligning micro-bump structures
FR2722916A1 (fr) * 1994-02-22 1996-01-26 Nec Corp Element de connexion et procede de connexion mettant en oeuvre cet element
US5466635A (en) * 1994-06-02 1995-11-14 Lsi Logic Corporation Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating
US5468995A (en) * 1994-07-05 1995-11-21 Motorola, Inc. Semiconductor device having compliant columnar electrical connections
US5497938A (en) * 1994-09-01 1996-03-12 Intel Corporation Tape with solder forms and methods for transferring solder to chip assemblies
US5542174A (en) * 1994-09-15 1996-08-06 Intel Corporation Method and apparatus for forming solder balls and solder columns
US5525834A (en) * 1994-10-17 1996-06-11 W. L. Gore & Associates, Inc. Integrated circuit package
KR0181615B1 (ko) * 1995-01-30 1999-04-15 모리시다 요이치 반도체 장치의 실장체, 그 실장방법 및 실장용 밀봉재
US5714803A (en) * 1995-07-28 1998-02-03 Sgs-Thomson Microelectronics, Inc. Low-profile removable ball-grid-array integrated circuit package
US5796169A (en) * 1996-11-19 1998-08-18 International Business Machines Corporation Structurally reinforced ball grid array semiconductor package and systems

Also Published As

Publication number Publication date
EP0840374A1 (de) 1998-05-06
EP0840374B1 (de) 2003-05-07
US5959355A (en) 1999-09-28

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Legal Events

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