DE69839714D1 - Kunststoffpackung und Halbleiteranordnung - Google Patents
Kunststoffpackung und HalbleiteranordnungInfo
- Publication number
- DE69839714D1 DE69839714D1 DE69839714T DE69839714T DE69839714D1 DE 69839714 D1 DE69839714 D1 DE 69839714D1 DE 69839714 T DE69839714 T DE 69839714T DE 69839714 T DE69839714 T DE 69839714T DE 69839714 D1 DE69839714 D1 DE 69839714D1
- Authority
- DE
- Germany
- Prior art keywords
- semiconductor device
- plastic package
- package
- plastic
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
- H01L23/49548—Cross section geometry
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
- H01L23/49586—Insulating layers on lead frames
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01012—Magnesium [Mg]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7183797 | 1997-03-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
DE69839714D1 true DE69839714D1 (de) | 2008-08-28 |
Family
ID=13472064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE69839714T Expired - Lifetime DE69839714D1 (de) | 1997-03-25 | 1998-03-25 | Kunststoffpackung und Halbleiteranordnung |
Country Status (7)
Country | Link |
---|---|
US (1) | US6087713A (de) |
EP (1) | EP0867935B1 (de) |
KR (1) | KR19980080551A (de) |
CN (1) | CN1134062C (de) |
CA (1) | CA2232843C (de) |
DE (1) | DE69839714D1 (de) |
TW (1) | TW368739B (de) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999043032A2 (de) * | 1998-02-20 | 1999-08-26 | Siemens Aktiengesellschaft | Halbleiterbauelement mit strukturiertem leadframe und verfahren zu dessen herstellung |
EP0987747A1 (de) * | 1998-09-17 | 2000-03-22 | STMicroelectronics S.r.l. | Verfahren zur Verbesserung der Adhäsion zwischen Metal und Kunststoff in Packungsstrukturen für elektronische Halbleiteranordnungen |
WO2000028589A1 (en) * | 1998-11-06 | 2000-05-18 | Festec Co., Ltd. | A plastic package having an air cavity and manufacturing method thereof |
DE19958229B4 (de) * | 1998-12-09 | 2007-05-31 | Fuji Electric Co., Ltd., Kawasaki | Optisches Halbleiter-Sensorbauelement |
US6246107B1 (en) * | 1999-07-07 | 2001-06-12 | Philips Semiconductors, Inc. | Semiconductor device arrangement having configuration via adjacent bond pad coding |
US6765275B1 (en) * | 2000-05-09 | 2004-07-20 | National Semiconductor Corporation | Two-layer electrical substrate for optical devices |
JP2002076831A (ja) * | 2000-08-28 | 2002-03-15 | Nec Corp | リードフレームおよびそれを使用するsawフィルタ |
US7786565B2 (en) | 2003-09-04 | 2010-08-31 | Panasonic Corporation | Semiconductor apparatus including power semiconductor device constructed by using wide band gap semiconductor |
JP2006049691A (ja) * | 2004-08-06 | 2006-02-16 | Matsushita Electric Ind Co Ltd | 半導体パッケージ,その製造方法及び半導体デバイス |
KR101509760B1 (ko) * | 2008-10-16 | 2015-04-08 | 엘지이노텍 주식회사 | 발광 다이오드 패키지 및 그 제조방법, 이를 구비한 발광 장치 |
JP5983700B2 (ja) | 2013-12-09 | 2016-09-06 | 株式会社デンソー | 半導体装置およびその製造方法、複合成形体 |
EP2765410B1 (de) * | 2014-06-06 | 2023-02-22 | Sensirion AG | Sensorbaustein |
JP6902394B2 (ja) * | 2017-05-15 | 2021-07-14 | ポリプラスチックス株式会社 | シール性を有する複合成形品 |
CN110155934A (zh) | 2019-04-22 | 2019-08-23 | 武汉衍熙微器件有限公司 | 一种mems器件及其制作方法 |
CN111739844B (zh) * | 2020-08-06 | 2021-01-29 | 深圳市汇顶科技股份有限公司 | 一种芯片及芯片封装方法、电子设备 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59219949A (ja) * | 1983-05-30 | 1984-12-11 | Sumitomo Electric Ind Ltd | プラスチツク封止型半導体装置用リ−ドフレ−ム |
JPS6060742A (ja) * | 1983-09-14 | 1985-04-08 | Matsushita Electronics Corp | リ−ドフレ−ム |
JPS60231349A (ja) * | 1984-05-01 | 1985-11-16 | Toshiba Corp | リ−ドフレ−ム |
JPS6139556A (ja) * | 1984-07-31 | 1986-02-25 | Toshiba Corp | リ−ドフレ−ム |
JPS61152053A (ja) * | 1984-12-26 | 1986-07-10 | Hitachi Ltd | リ−ドフレ−ム、それを用いた半導体装置およびその製造方法 |
US4767049A (en) * | 1986-05-19 | 1988-08-30 | Olin Corporation | Special surfaces for wire bonding |
JPS63169747A (ja) * | 1987-01-08 | 1988-07-13 | Mitsubishi Electric Corp | 樹脂封止形半導体装置 |
JPH0821662B2 (ja) * | 1987-01-19 | 1996-03-04 | 日本電気株式会社 | 半導体装置用リ−ドフレ−ム |
JPS63310146A (ja) * | 1987-06-12 | 1988-12-19 | Toshiba Corp | リ−ドフレ−ムの製造方法 |
EP0478241A3 (en) * | 1990-09-24 | 1993-04-28 | Texas Instruments Incorporated | Insulated lead frame for integrated circuits and method of manufacture thereof |
KR940006083B1 (ko) * | 1991-09-11 | 1994-07-06 | 금성일렉트론 주식회사 | Loc 패키지 및 그 제조방법 |
JPH0828396B2 (ja) * | 1992-01-31 | 1996-03-21 | 株式会社東芝 | 半導体装置 |
JPH06148951A (ja) * | 1992-11-09 | 1994-05-27 | Mitsubishi Kasei Corp | 電子写真用2成分現像剤 |
US5859471A (en) * | 1992-11-17 | 1999-01-12 | Shinko Electric Industries Co., Ltd. | Semiconductor device having tab tape lead frame with reinforced outer leads |
JPH06244355A (ja) * | 1993-02-15 | 1994-09-02 | Tetsuya Hojo | リードフレームのピン保持固定部の形成方法、樹脂モールド時の樹脂漏れ防止部の形成方法、およびic等の放熱板固定部の形成方法 |
JPH07326699A (ja) * | 1994-05-31 | 1995-12-12 | Daido Steel Co Ltd | Icリードフレーム材の製造方法 |
JPH0855927A (ja) * | 1994-08-12 | 1996-02-27 | Mitsui Petrochem Ind Ltd | 中空パッケージ |
KR0179925B1 (ko) * | 1996-06-14 | 1999-03-20 | 문정환 | 리드프레임 및 그를 이용한 버텀 리드 반도체 패키지 |
-
1998
- 1998-03-23 CA CA002232843A patent/CA2232843C/en not_active Expired - Fee Related
- 1998-03-23 KR KR1019980009927A patent/KR19980080551A/ko active Search and Examination
- 1998-03-24 CN CNB981097405A patent/CN1134062C/zh not_active Expired - Lifetime
- 1998-03-25 TW TW087104479A patent/TW368739B/zh not_active IP Right Cessation
- 1998-03-25 US US09/047,413 patent/US6087713A/en not_active Expired - Lifetime
- 1998-03-25 DE DE69839714T patent/DE69839714D1/de not_active Expired - Lifetime
- 1998-03-25 EP EP98302290A patent/EP0867935B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
EP0867935A3 (de) | 2000-03-15 |
KR19980080551A (ko) | 1998-11-25 |
TW368739B (en) | 1999-09-01 |
CA2232843A1 (en) | 1998-09-25 |
CN1134062C (zh) | 2004-01-07 |
CN1202731A (zh) | 1998-12-23 |
US6087713A (en) | 2000-07-11 |
EP0867935B1 (de) | 2008-07-16 |
CA2232843C (en) | 2002-03-12 |
EP0867935A2 (de) | 1998-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69637488D1 (de) | Halbleiter und Halbleitermodul | |
DE69419469T2 (de) | Halbleiterbauelement und Halbleiterspeichervorrichtung | |
DE69832359D1 (de) | Halbleitervorrichtung -anordnung und -schaltungen | |
DE69737588D1 (de) | Halbleiteranordnung und Herstellungsverfahren dafür | |
DE19823069B8 (de) | Halbleiterbauelement | |
DE69628902D1 (de) | Halbleitervorrichtung und Halbleitermodul | |
DE69534483D1 (de) | Leiterrahmen und Halbleiterbauelement | |
DE69841416D1 (de) | Integrierte Halbleiterschaltungsanordnung und Packungstruktur dafür | |
DE69839714D1 (de) | Kunststoffpackung und Halbleiteranordnung | |
DE69737320D1 (de) | Halbleitervorrichtung | |
KR960012451A (ko) | 반도체 장치 및 리드프레임 | |
DE69820240D1 (de) | Kunststoffolien und daraus hergestellte verpackungen | |
DE69531121D1 (de) | Integrierte Halbleiteranordnung | |
KR980005485U (ko) | 반도체 패키지 디바이스 | |
DE69839205D1 (de) | Halbleiterelementmodul und Halbleiter | |
KR970059871U (ko) | 반도체 패키지 | |
KR980005467U (ko) | 반도체 패키지 | |
KR970056088U (ko) | 반도체 패키지 | |
KR970019770U (ko) | 반도체 디바이스 패키지 | |
KR970011218U (ko) | 반도체 패키지장치 | |
KR960035630U (ko) | 반도체 디바이스 패키지 장치 | |
KR970025853U (ko) | 반도체 디바이스 패키지 | |
KR970046920U (ko) | 반도체 패키지 소자 | |
KR950028723U (ko) | 반도체 패키지 마킹장치 | |
DE59509897D1 (de) | Integrierte Halbleitervorrichtung |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
R082 | Change of representative |
Ref document number: 867935 Country of ref document: EP Representative=s name: WUESTHOFF & WUESTHOFF PATENT- UND RECHTSANWAELTE, |