DE3888476D1 - Elektrische Kontaktstellen und damit versehene Gehäuse. - Google Patents
Elektrische Kontaktstellen und damit versehene Gehäuse.Info
- Publication number
- DE3888476D1 DE3888476D1 DE88311598T DE3888476T DE3888476D1 DE 3888476 D1 DE3888476 D1 DE 3888476D1 DE 88311598 T DE88311598 T DE 88311598T DE 3888476 T DE3888476 T DE 3888476T DE 3888476 D1 DE3888476 D1 DE 3888476D1
- Authority
- DE
- Germany
- Prior art keywords
- electrical contact
- contact points
- housings provided
- housings
- points
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
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- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62309805A JP2506861B2 (ja) | 1987-12-08 | 1987-12-08 | 電気的接続接点の形成方法 |
JP18493688A JPH063820B2 (ja) | 1988-07-25 | 1988-07-25 | 半導体装置の実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3888476D1 true DE3888476D1 (de) | 1994-04-21 |
DE3888476T2 DE3888476T2 (de) | 1994-09-29 |
Family
ID=26502799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE3888476T Expired - Lifetime DE3888476T2 (de) | 1987-12-08 | 1988-12-07 | Elektrische Kontaktstellen und damit versehene Gehäuse. |
Country Status (5)
Country | Link |
---|---|
US (2) | US5014111A (de) |
EP (1) | EP0320244B1 (de) |
KR (1) | KR910009780B1 (de) |
DE (1) | DE3888476T2 (de) |
HK (1) | HK89096A (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004059389B4 (de) * | 2004-12-09 | 2012-02-23 | Infineon Technologies Ag | Halbleiterbauelement mit Ausgleichsmetallisierung |
Families Citing this family (138)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5917707A (en) | 1993-11-16 | 1999-06-29 | Formfactor, Inc. | Flexible contact structure with an electrically conductive shell |
US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
US5074947A (en) * | 1989-12-18 | 1991-12-24 | Epoxy Technology, Inc. | Flip chip technology using electrically conductive polymers and dielectrics |
US5611140A (en) * | 1989-12-18 | 1997-03-18 | Epoxy Technology, Inc. | Method of forming electrically conductive polymer interconnects on electrical substrates |
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Also Published As
Publication number | Publication date |
---|---|
KR890011037A (ko) | 1989-08-12 |
KR910009780B1 (ko) | 1991-11-30 |
US5090119A (en) | 1992-02-25 |
DE3888476T2 (de) | 1994-09-29 |
HK89096A (en) | 1996-05-31 |
EP0320244A2 (de) | 1989-06-14 |
US5014111A (en) | 1991-05-07 |
EP0320244B1 (de) | 1994-03-16 |
EP0320244A3 (en) | 1990-10-10 |
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