JPS4952973A - - Google Patents

Info

Publication number
JPS4952973A
JPS4952973A JP47095343A JP9534372A JPS4952973A JP S4952973 A JPS4952973 A JP S4952973A JP 47095343 A JP47095343 A JP 47095343A JP 9534372 A JP9534372 A JP 9534372A JP S4952973 A JPS4952973 A JP S4952973A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47095343A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47095343A priority Critical patent/JPS4952973A/ja
Publication of JPS4952973A publication Critical patent/JPS4952973A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
JP47095343A 1972-09-22 1972-09-22 Pending JPS4952973A (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47095343A JPS4952973A (de) 1972-09-22 1972-09-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47095343A JPS4952973A (de) 1972-09-22 1972-09-22

Publications (1)

Publication Number Publication Date
JPS4952973A true JPS4952973A (de) 1974-05-23

Family

ID=14135030

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47095343A Pending JPS4952973A (de) 1972-09-22 1972-09-22

Country Status (1)

Country Link
JP (1) JPS4952973A (de)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5972737A (ja) * 1982-10-20 1984-04-24 Toshiba Corp 半導体装置の外部端子接続方法
JPS60154540A (ja) * 1984-01-24 1985-08-14 Nec Corp バンプ形成装置
JPS62154648A (ja) * 1985-12-26 1987-07-09 Toshiba Corp バンプ形成方法
JPS63275127A (ja) * 1987-05-07 1988-11-11 Matsushita Electric Ind Co Ltd 半導体チップの実装体
JPH02120836U (de) * 1989-03-15 1990-09-28
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US5294038A (en) * 1991-11-12 1994-03-15 Nec Corporation Method of and apparatus for manufacturing semiconductor device
US5306664A (en) * 1991-05-16 1994-04-26 Seiko Epson Corp. Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device
US5350947A (en) * 1991-11-12 1994-09-27 Nec Corporation Film carrier semiconductor device
EP0704895A2 (de) 1994-09-30 1996-04-03 Nec Corporation Verfahren zur Herstellung einer halbleitenden Anordnung und einer Halbleiterscheibe
US5683942A (en) * 1994-05-25 1997-11-04 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
US5726489A (en) * 1994-09-30 1998-03-10 Nec Corporation Film carrier semiconductor device
US5757068A (en) * 1994-09-30 1998-05-26 Nec Corporation Carrier film with peripheral slits
US6603207B2 (en) 1995-07-14 2003-08-05 Matsushita Electric Industrial Co., Ltd. Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0328823B2 (de) * 1982-10-20 1991-04-22 Tokyo Shibaura Electric Co
JPS5972737A (ja) * 1982-10-20 1984-04-24 Toshiba Corp 半導体装置の外部端子接続方法
JPS60154540A (ja) * 1984-01-24 1985-08-14 Nec Corp バンプ形成装置
JPH0695519B2 (ja) * 1985-12-26 1994-11-24 株式会社東芝 バンプ形成方法
JPS62154648A (ja) * 1985-12-26 1987-07-09 Toshiba Corp バンプ形成方法
JPS63275127A (ja) * 1987-05-07 1988-11-11 Matsushita Electric Ind Co Ltd 半導体チップの実装体
JPH0750726B2 (ja) * 1987-05-07 1995-05-31 松下電器産業株式会社 半導体チップの実装体
US5014111A (en) * 1987-12-08 1991-05-07 Matsushita Electric Industrial Co., Ltd. Electrical contact bump and a package provided with the same
US5090119A (en) * 1987-12-08 1992-02-25 Matsushita Electric Industrial Co., Ltd. Method of forming an electrical contact bump
JPH02120836U (de) * 1989-03-15 1990-09-28
US5306664A (en) * 1991-05-16 1994-04-26 Seiko Epson Corp. Semiconductor device, method of forming bump electrode of a semiconductor device, method of packaging a semiconductor device, chip carrier tape, display device and electronic printing device incorporating the semiconductor device
US5350947A (en) * 1991-11-12 1994-09-27 Nec Corporation Film carrier semiconductor device
US5294038A (en) * 1991-11-12 1994-03-15 Nec Corporation Method of and apparatus for manufacturing semiconductor device
US5683942A (en) * 1994-05-25 1997-11-04 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
US5905303A (en) * 1994-05-25 1999-05-18 Nec Corporation Method for manufacturing bump leaded film carrier type semiconductor device
EP0704895A2 (de) 1994-09-30 1996-04-03 Nec Corporation Verfahren zur Herstellung einer halbleitenden Anordnung und einer Halbleiterscheibe
US5726489A (en) * 1994-09-30 1998-03-10 Nec Corporation Film carrier semiconductor device
US5757068A (en) * 1994-09-30 1998-05-26 Nec Corporation Carrier film with peripheral slits
US5844304A (en) * 1994-09-30 1998-12-01 Nec Corporation Process for manufacturing semiconductor device and semiconductor wafer
USRE39603E1 (en) * 1994-09-30 2007-05-01 Nec Corporation Process for manufacturing semiconductor device and semiconductor wafer
US6603207B2 (en) 1995-07-14 2003-08-05 Matsushita Electric Industrial Co., Ltd. Electrode structure for semiconductor device, method for forming the same, mounted body including semiconductor device and semiconductor device

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