KR101854948B1 - 수지 조성물, 수지 시트, 수지 시트 경화물, 수지 시트 적층체, 수지 시트 적층체 경화물 및 그 제조 방법, 반도체 장치, 그리고 led 장치 - Google Patents

수지 조성물, 수지 시트, 수지 시트 경화물, 수지 시트 적층체, 수지 시트 적층체 경화물 및 그 제조 방법, 반도체 장치, 그리고 led 장치 Download PDF

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KR101854948B1
KR101854948B1 KR1020137024003A KR20137024003A KR101854948B1 KR 101854948 B1 KR101854948 B1 KR 101854948B1 KR 1020137024003 A KR1020137024003 A KR 1020137024003A KR 20137024003 A KR20137024003 A KR 20137024003A KR 101854948 B1 KR101854948 B1 KR 101854948B1
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resin
resin sheet
filler
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KR20140007894A (ko
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도모오 니시야마
아츠시 구와노
도시아키 시라사카
나오키 하라
겐스케 요시하라
히데유키 가타기
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히타치가세이가부시끼가이샤
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/858Means for heat extraction or cooling
    • H10H20/8581Means for heat extraction or cooling characterised by their material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
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    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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    • B32B15/092Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
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    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/42Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
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    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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    • H01L24/33Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
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EP2692759B1 (en) 2018-10-31
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