KR101308281B1 - 비닐 에테르 가교제를 사용하는 무반사 코팅 - Google Patents
비닐 에테르 가교제를 사용하는 무반사 코팅 Download PDFInfo
- Publication number
- KR101308281B1 KR101308281B1 KR1020067022125A KR20067022125A KR101308281B1 KR 101308281 B1 KR101308281 B1 KR 101308281B1 KR 1020067022125 A KR1020067022125 A KR 1020067022125A KR 20067022125 A KR20067022125 A KR 20067022125A KR 101308281 B1 KR101308281 B1 KR 101308281B1
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- South Korea
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C43/00—Ethers; Compounds having groups, groups or groups
- C07C43/02—Ethers
- C07C43/03—Ethers having all ether-oxygen atoms bound to acyclic carbon atoms
- C07C43/14—Unsaturated ethers
- C07C43/164—Unsaturated ethers containing six-membered aromatic rings
- C07C43/166—Unsaturated ethers containing six-membered aromatic rings having unsaturation outside the aromatic rings
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/942—Masking
- Y10S438/948—Radiation resist
- Y10S438/952—Utilizing antireflective layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
- Y10T428/31692—Next to addition polymer from unsaturated monomers
- Y10T428/31699—Ester, halide or nitrile of addition polymer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31855—Of addition polymer from unsaturated monomers
- Y10T428/31935—Ester, halide or nitrile of addition polymer
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Structural Engineering (AREA)
- Architecture (AREA)
- Materials For Photolithography (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US56632904P | 2004-04-29 | 2004-04-29 | |
| US60/566,329 | 2004-04-29 | ||
| US11/105,862 US20050255410A1 (en) | 2004-04-29 | 2005-04-14 | Anti-reflective coatings using vinyl ether crosslinkers |
| US11/105,862 | 2005-04-14 | ||
| PCT/US2005/012851 WO2005111719A2 (en) | 2004-04-29 | 2005-04-15 | Anti-reflective coatings using vinyl ether crosslinkers |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117031664A Division KR101308191B1 (ko) | 2004-04-29 | 2005-04-15 | 비닐 에테르 가교제를 사용하는 무반사 코팅 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20070012812A KR20070012812A (ko) | 2007-01-29 |
| KR101308281B1 true KR101308281B1 (ko) | 2013-09-13 |
Family
ID=35309829
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067022125A Expired - Lifetime KR101308281B1 (ko) | 2004-04-29 | 2005-04-15 | 비닐 에테르 가교제를 사용하는 무반사 코팅 |
| KR1020117031664A Expired - Fee Related KR101308191B1 (ko) | 2004-04-29 | 2005-04-15 | 비닐 에테르 가교제를 사용하는 무반사 코팅 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117031664A Expired - Fee Related KR101308191B1 (ko) | 2004-04-29 | 2005-04-15 | 비닐 에테르 가교제를 사용하는 무반사 코팅 |
Country Status (7)
| Country | Link |
|---|---|
| US (4) | US20050255410A1 (enExample) |
| EP (1) | EP1743219B1 (enExample) |
| JP (2) | JP5972510B2 (enExample) |
| KR (2) | KR101308281B1 (enExample) |
| CN (2) | CN1981240B (enExample) |
| TW (1) | TWI387612B (enExample) |
| WO (1) | WO2005111719A2 (enExample) |
Families Citing this family (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050214674A1 (en) * | 2004-03-25 | 2005-09-29 | Yu Sui | Positive-working photoimageable bottom antireflective coating |
| US20050255410A1 (en) | 2004-04-29 | 2005-11-17 | Guerrero Douglas J | Anti-reflective coatings using vinyl ether crosslinkers |
| US20070207406A1 (en) * | 2004-04-29 | 2007-09-06 | Guerrero Douglas J | Anti-reflective coatings using vinyl ether crosslinkers |
| EP2866093A1 (en) * | 2004-05-14 | 2015-04-29 | Nissan Chemical Industries, Limited | Anti-reflective coating forming composition containing vinyl ether compound and polyimide |
| US7816071B2 (en) * | 2005-02-10 | 2010-10-19 | Az Electronic Materials Usa Corp. | Process of imaging a photoresist with multiple antireflective coatings |
| KR100662542B1 (ko) * | 2005-06-17 | 2006-12-28 | 제일모직주식회사 | 반사방지 하드마스크 조성물 및 이를 이용하여 기판 상에패턴화된 재료 형상을 형성시키는 방법 |
| KR100703007B1 (ko) * | 2005-11-17 | 2007-04-06 | 삼성전자주식회사 | 감광성 유기 반사 방지막 형성용 조성물 및 이를 이용한패턴 형성 방법 |
| US20070117041A1 (en) * | 2005-11-22 | 2007-05-24 | Christoph Noelscher | Photosensitive coating for enhancing a contrast of a photolithographic exposure |
| US20070298176A1 (en) * | 2006-06-26 | 2007-12-27 | Dipietro Richard Anthony | Aromatic vinyl ether based reverse-tone step and flash imprint lithography |
| US7914974B2 (en) * | 2006-08-18 | 2011-03-29 | Brewer Science Inc. | Anti-reflective imaging layer for multiple patterning process |
| US9645494B2 (en) | 2006-12-13 | 2017-05-09 | Nissan Chemical Industries, Ltd. | Resist underlayer film forming composition containing low molecular weight dissolution accelerator |
| US20090098490A1 (en) * | 2007-10-16 | 2009-04-16 | Victor Pham | Radiation-Sensitive, Wet Developable Bottom Antireflective Coating Compositions and Their Applications in Semiconductor Manufacturing |
| US8088548B2 (en) * | 2007-10-23 | 2012-01-03 | Az Electronic Materials Usa Corp. | Bottom antireflective coating compositions |
| JP2011502286A (ja) * | 2007-10-30 | 2011-01-20 | ブルーワー サイエンス アイ エヌ シー. | 光像形成性分岐ポリマー |
| US7976894B1 (en) * | 2007-11-13 | 2011-07-12 | Brewer Science Inc. | Materials with thermally reversible curing mechanism |
| KR101647158B1 (ko) | 2008-01-29 | 2016-08-09 | 브레우어 사이언스 인코포레이션 | 다중 다크 필드 노출에 의한, 하드마스크 패턴화를 위한 온-트랙 공정 |
| US9638999B2 (en) * | 2008-02-22 | 2017-05-02 | Brewer Science Inc. | Dual-layer light-sensitive developer-soluble bottom anti-reflective coatings for 193-nm lithography |
| JP5739325B2 (ja) * | 2008-04-23 | 2015-06-24 | ブルーワー サイエンス アイ エヌシー. | マイクロリソグラフィー用の感光性ハードマスク |
| US8257910B1 (en) * | 2008-06-24 | 2012-09-04 | Brewer Science Inc. | Underlayers for EUV lithography |
| US8455176B2 (en) * | 2008-11-12 | 2013-06-04 | Az Electronic Materials Usa Corp. | Coating composition |
| JP5218762B2 (ja) * | 2008-12-12 | 2013-06-26 | 日産化学工業株式会社 | レジストパターンの形成方法 |
| US9640396B2 (en) | 2009-01-07 | 2017-05-02 | Brewer Science Inc. | Spin-on spacer materials for double- and triple-patterning lithography |
| US8383318B2 (en) * | 2009-02-19 | 2013-02-26 | Brewer Science Inc. | Acid-sensitive, developer-soluble bottom anti-reflective coatings |
| US8632948B2 (en) * | 2009-09-30 | 2014-01-21 | Az Electronic Materials Usa Corp. | Positive-working photoimageable bottom antireflective coating |
| US20110086312A1 (en) * | 2009-10-09 | 2011-04-14 | Dammel Ralph R | Positive-Working Photoimageable Bottom Antireflective Coating |
| WO2011074433A1 (ja) * | 2009-12-16 | 2011-06-23 | 日産化学工業株式会社 | 感光性レジスト下層膜形成組成物 |
| KR20120105545A (ko) * | 2010-01-18 | 2012-09-25 | 닛산 가가쿠 고교 가부시키 가이샤 | 감광성 레지스트 하층막 형성 조성물 및 레지스트 패턴의 형성 방법 |
| KR20110112641A (ko) * | 2010-04-07 | 2011-10-13 | 한국과학기술연구원 | 광활성 그룹을 측쇄로 가지는 사다리 구조의 폴리실세스퀴옥산 및 이의 제조방법 |
| US8685615B2 (en) | 2010-06-17 | 2014-04-01 | Nissan Chemical Industries, Ltd. | Photosensitive resist underlayer film forming composition |
| WO2012018983A2 (en) | 2010-08-05 | 2012-02-09 | Brewer Science Inc. | Methods of producing structures using a developer-soluble layer with multilayer technology |
| JP6035017B2 (ja) | 2010-10-04 | 2016-11-30 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 下層組成物および下層を像形成する方法 |
| JP5820676B2 (ja) * | 2010-10-04 | 2015-11-24 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | 下層組成物および下層を像形成する方法 |
| KR101900976B1 (ko) | 2010-12-27 | 2018-09-20 | 브레우어 사이언스 인코포레이션 | 개선된 패터닝 요구를 위해 작은 특징 부분(feature)을 패터닝하는 방법 |
| KR102115442B1 (ko) * | 2012-04-23 | 2020-05-28 | 브레우어 사이언스 인코포레이션 | 감광성의 현상제-가용성 하부 반사-방지 코팅 재료 |
| US9348228B2 (en) * | 2013-01-03 | 2016-05-24 | Globalfoundries Inc. | Acid-strippable silicon-containing antireflective coating |
| JP6119668B2 (ja) | 2013-06-11 | 2017-04-26 | 信越化学工業株式会社 | 下層膜材料及びパターン形成方法 |
| JP6119669B2 (ja) | 2013-06-11 | 2017-04-26 | 信越化学工業株式会社 | 下層膜材料及びパターン形成方法 |
| JP6119667B2 (ja) | 2013-06-11 | 2017-04-26 | 信越化学工業株式会社 | 下層膜材料及びパターン形成方法 |
| JP6135600B2 (ja) | 2013-06-11 | 2017-05-31 | 信越化学工業株式会社 | 下層膜材料及びパターン形成方法 |
| WO2019065476A1 (ja) * | 2017-09-29 | 2019-04-04 | 富士フイルム株式会社 | 着色感光性組成物および光学フィルタの製造方法 |
| KR102285555B1 (ko) * | 2018-06-12 | 2021-08-03 | 주식회사 엘지화학 | 코팅 조성물 및 이를 이용한 마이크로 전자 소자 제조용 포지티브형 패턴의 제조방법 |
| US11656550B2 (en) | 2020-09-01 | 2023-05-23 | Tokyo Electron Limited | Controlling semiconductor film thickness |
Citations (2)
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|---|---|---|---|---|
| US6110653A (en) * | 1999-07-26 | 2000-08-29 | International Business Machines Corporation | Acid sensitive ARC and method of use |
| KR20030068729A (ko) * | 2002-02-16 | 2003-08-25 | 삼성전자주식회사 | 반사 방지용 광흡수막 형성 조성물 및 이를 이용한 반도체소자의 패턴 형성 방법 |
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- 2005-04-15 WO PCT/US2005/012851 patent/WO2005111719A2/en not_active Ceased
- 2005-04-15 CN CN2005800132461A patent/CN1981240B/zh not_active Expired - Lifetime
- 2005-04-15 KR KR1020067022125A patent/KR101308281B1/ko not_active Expired - Lifetime
- 2005-04-15 JP JP2007510782A patent/JP5972510B2/ja not_active Expired - Lifetime
- 2005-04-15 EP EP05771626.8A patent/EP1743219B1/en not_active Expired - Lifetime
- 2005-04-15 KR KR1020117031664A patent/KR101308191B1/ko not_active Expired - Fee Related
- 2005-04-15 CN CN201010110135.5A patent/CN101916051B/zh not_active Expired - Lifetime
- 2005-04-29 TW TW94113835A patent/TWI387612B/zh active
-
2006
- 2006-12-20 US US11/613,704 patent/US7601483B2/en not_active Expired - Lifetime
-
2009
- 2009-08-31 US US12/551,176 patent/US20090317747A1/en not_active Abandoned
-
2010
- 2010-12-20 US US12/973,552 patent/US9110372B2/en not_active Expired - Lifetime
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2012
- 2012-05-08 JP JP2012106641A patent/JP5511887B2/ja not_active Expired - Lifetime
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| US6110653A (en) * | 1999-07-26 | 2000-08-29 | International Business Machines Corporation | Acid sensitive ARC and method of use |
| KR20030068729A (ko) * | 2002-02-16 | 2003-08-25 | 삼성전자주식회사 | 반사 방지용 광흡수막 형성 조성물 및 이를 이용한 반도체소자의 패턴 형성 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20120015360A (ko) | 2012-02-21 |
| KR20070012812A (ko) | 2007-01-29 |
| TWI387612B (zh) | 2013-03-01 |
| US20050255410A1 (en) | 2005-11-17 |
| EP1743219A2 (en) | 2007-01-17 |
| JP2012188671A (ja) | 2012-10-04 |
| JP5511887B2 (ja) | 2014-06-04 |
| WO2005111719A2 (en) | 2005-11-24 |
| EP1743219B1 (en) | 2015-12-09 |
| CN101916051B (zh) | 2014-07-23 |
| WO2005111719A3 (en) | 2006-11-09 |
| KR101308191B1 (ko) | 2013-09-13 |
| US20090317747A1 (en) | 2009-12-24 |
| US20070117049A1 (en) | 2007-05-24 |
| US9110372B2 (en) | 2015-08-18 |
| US7601483B2 (en) | 2009-10-13 |
| JP5972510B2 (ja) | 2016-08-17 |
| CN101916051A (zh) | 2010-12-15 |
| CN1981240A (zh) | 2007-06-13 |
| EP1743219A4 (en) | 2010-04-28 |
| US20120156613A1 (en) | 2012-06-21 |
| JP2007536389A (ja) | 2007-12-13 |
| CN1981240B (zh) | 2012-09-26 |
| TW200615312A (en) | 2006-05-16 |
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