KR101035465B1 - 현상방법 및 현상장치 - Google Patents

현상방법 및 현상장치 Download PDF

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Publication number
KR101035465B1
KR101035465B1 KR1020030080297A KR20030080297A KR101035465B1 KR 101035465 B1 KR101035465 B1 KR 101035465B1 KR 1020030080297 A KR1020030080297 A KR 1020030080297A KR 20030080297 A KR20030080297 A KR 20030080297A KR 101035465 B1 KR101035465 B1 KR 101035465B1
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South Korea
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developer
concentration
unit
developing
resist
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KR1020030080297A
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English (en)
Korean (ko)
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KR20040042875A (ko
Inventor
타테야마키요히사
노무라마사푸미
시노기타케토라
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도쿄엘렉트론가부시키가이샤
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Publication of KR20040042875A publication Critical patent/KR20040042875A/ko
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
    • G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
    • G03D3/02—Details of liquid circulation
    • G03D3/06—Liquid supply; Liquid circulation outside tanks
    • G03D3/065—Liquid supply; Liquid circulation outside tanks replenishment or recovery apparatus
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03D—APPARATUS FOR PROCESSING EXPOSED PHOTOGRAPHIC MATERIALS; ACCESSORIES THEREFOR
    • G03D3/00—Liquid processing apparatus involving immersion; Washing apparatus involving immersion
    • G03D3/02—Details of liquid circulation
    • G03D3/06—Liquid supply; Liquid circulation outside tanks
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3071—Process control means, e.g. for replenishing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020030080297A 2002-11-15 2003-11-13 현상방법 및 현상장치 Expired - Fee Related KR101035465B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002332578A JP3894104B2 (ja) 2002-11-15 2002-11-15 現像方法及び現像装置及び現像液再生装置
JPJP-P-2002-00332578 2002-11-15

Publications (2)

Publication Number Publication Date
KR20040042875A KR20040042875A (ko) 2004-05-20
KR101035465B1 true KR101035465B1 (ko) 2011-05-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030080297A Expired - Fee Related KR101035465B1 (ko) 2002-11-15 2003-11-13 현상방법 및 현상장치

Country Status (5)

Country Link
US (3) US6969572B2 (https=)
JP (1) JP3894104B2 (https=)
KR (1) KR101035465B1 (https=)
CN (1) CN1311303C (https=)
TW (1) TWI284922B (https=)

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JP3894104B2 (ja) * 2002-11-15 2007-03-14 東京エレクトロン株式会社 現像方法及び現像装置及び現像液再生装置
JP2005136364A (ja) * 2003-10-08 2005-05-26 Zao Nikon Co Ltd 基板搬送装置、露光装置、並びにデバイス製造方法
JP4391387B2 (ja) * 2004-10-27 2009-12-24 大日本スクリーン製造株式会社 基板処理装置および基板処理方法
JP4634822B2 (ja) * 2005-02-24 2011-02-16 株式会社東芝 レジストパターン形成方法および半導体装置の製造方法
JP2006278765A (ja) * 2005-03-29 2006-10-12 Fujitsu Ltd 貼合せ基板製造装置の洗浄方法、貼合せ基板製造装置の洗浄用治具及び貼合せ基板製造装置の洗浄装置
JP2006344310A (ja) * 2005-06-09 2006-12-21 Sony Corp 現像方法および現像装置
US7766566B2 (en) * 2005-08-03 2010-08-03 Tokyo Electron Limited Developing treatment apparatus and developing treatment method
CN100471541C (zh) * 2005-09-30 2009-03-25 日本瑞环株式会社 溶剂的回收装置及溶剂的回收方法
CN100555084C (zh) * 2005-11-21 2009-10-28 友达光电股份有限公司 显影液成分调整方法及其显影系统
JP4839820B2 (ja) * 2005-12-19 2011-12-21 三菱化学エンジニアリング株式会社 現像液の供給装置
KR100734659B1 (ko) * 2005-12-28 2007-07-02 동부일렉트로닉스 주식회사 현상 공정 제어 장치 및 방법
US8448804B2 (en) * 2006-10-04 2013-05-28 Ropak Corporation Pivoting cover with a fastening device
JP5604770B2 (ja) * 2006-11-30 2014-10-15 三菱化学エンジニアリング株式会社 現像液の濃度調節方法および調製装置
JP2009099721A (ja) * 2007-10-16 2009-05-07 Dainippon Screen Mfg Co Ltd 基板冷却方法および基板冷却装置
TWI413156B (zh) * 2008-01-28 2013-10-21 東京應化工業股份有限公司 光阻液供給回收系統及光阻液回收方法
CN101634816B (zh) * 2008-07-24 2012-05-30 北京京东方光电科技有限公司 显影液控制系统
US7854558B2 (en) * 2009-02-16 2010-12-21 Eastman Kodak Company Developer waste reuse
CN102830595B (zh) * 2012-08-24 2014-08-13 京东方科技集团股份有限公司 一种显影液监控方法及设备
CN103887151B (zh) * 2014-03-07 2017-02-01 京东方科技集团股份有限公司 一种构图装置和构图方法
CN109791374B (zh) * 2017-08-23 2022-05-17 深圳市柔宇科技股份有限公司 显影液回收系统
US11061333B2 (en) * 2017-11-13 2021-07-13 Taiwan Semiconductor Manufacturing Company, Ltd. Manufacturing method of semiconductor device and semiconductor processing system
CN109806658B (zh) * 2017-11-20 2021-10-12 台湾积体电路制造股份有限公司 显影液过滤系统及显影液的过滤方法
TWI668528B (zh) * 2017-11-20 2019-08-11 台灣積體電路製造股份有限公司 顯影液過濾系統及顯影液的過濾方法
JP7060415B2 (ja) * 2018-03-12 2022-04-26 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
CN109802643B (zh) * 2018-11-30 2020-09-08 无锡市好达电子股份有限公司 一种辅助显影版图制作方法
JP7731730B2 (ja) * 2021-08-18 2025-09-01 旭化成株式会社 データ処理装置、現像装置、データ処理方法、および、データ処理プログラム
JP7738447B2 (ja) * 2021-10-08 2025-09-12 東京エレクトロン株式会社 分析装置
JP7369227B2 (ja) * 2022-03-22 2023-10-25 株式会社Ｓｃｒｅｅｎホールディングス 現像装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07110580A (ja) * 1993-10-13 1995-04-25 Dainippon Screen Mfg Co Ltd 基板現像装置
JPH09269320A (ja) * 1996-04-02 1997-10-14 Kubota Corp 水質計
KR20040001788A (ko) * 2002-06-28 2004-01-07 주식회사 하이닉스반도체 현상액 재활용장치

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JP2561578B2 (ja) * 1991-08-07 1996-12-11 株式会社平間理化研究所 現像液管理装置
JP3116297B2 (ja) 1994-08-03 2000-12-11 東京エレクトロン株式会社 処理方法及び処理装置
JPH08278635A (ja) * 1995-04-07 1996-10-22 Tokyo Ohka Kogyo Co Ltd 現像液の調整方法及び調整装置
JP3964475B2 (ja) 1995-04-19 2007-08-22 東京エレクトロン株式会社 基板の処理方法と装置
US5853961A (en) * 1995-04-19 1998-12-29 Tokyo Electron Limited Method of processing substrate and apparatus for processing substrate
JPH09258457A (ja) * 1996-03-18 1997-10-03 Fujitsu Ltd 薬液の回収方法および回収装置
KR20000062334A (ko) * 1996-12-25 2000-10-25 나카노 가츠히코 패턴 가공용 약액 집중 관리 장치
JP3362767B2 (ja) 1997-05-20 2003-01-07 東京エレクトロン株式会社 処理方法及び処理装置
TW357389B (en) * 1996-12-27 1999-05-01 Tokyo Electric Ltd Apparatus and method for supplying process solution to surface of substrate to be processed
JPH10207082A (ja) * 1997-01-21 1998-08-07 Japan Organo Co Ltd フォトレジスト用アルカリ現像液又はその現像廃液又はその処理液の分析管理方法及び装置
JP3795627B2 (ja) * 1997-05-15 2006-07-12 東芝電子エンジニアリング株式会社 レジストの現像方法
JP3728945B2 (ja) * 1998-10-30 2005-12-21 オルガノ株式会社 フォトレジスト現像廃液からの現像液の回収再利用方法及び装置
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TWI298423B (en) * 2001-02-06 2008-07-01 Nagase & Co Ltd Developer producing equipment and method
TWI298826B (en) * 2001-02-06 2008-07-11 Hirama Lab Co Ltd Purified developer producing equipment and method
US6752545B2 (en) * 2001-08-16 2004-06-22 Nagase & Co., Ltd. Alkali-based treating liquid, treating liquid adjusting method and equipment, treating liquid supplying method and equipment
JP3894104B2 (ja) * 2002-11-15 2007-03-14 東京エレクトロン株式会社 現像方法及び現像装置及び現像液再生装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07110580A (ja) * 1993-10-13 1995-04-25 Dainippon Screen Mfg Co Ltd 基板現像装置
JPH09269320A (ja) * 1996-04-02 1997-10-14 Kubota Corp 水質計
KR20040001788A (ko) * 2002-06-28 2004-01-07 주식회사 하이닉스반도체 현상액 재활용장치

Also Published As

Publication number Publication date
US20060246384A1 (en) 2006-11-02
US7182531B2 (en) 2007-02-27
US7101646B2 (en) 2006-09-05
US6969572B2 (en) 2005-11-29
TWI284922B (en) 2007-08-01
US20040096760A1 (en) 2004-05-20
JP2004170451A (ja) 2004-06-17
US20060024622A1 (en) 2006-02-02
CN1501177A (zh) 2004-06-02
TW200415705A (en) 2004-08-16
KR20040042875A (ko) 2004-05-20
JP3894104B2 (ja) 2007-03-14
CN1311303C (zh) 2007-04-18

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