KR101014508B1 - 적층 콘덴서 - Google Patents

적층 콘덴서 Download PDF

Info

Publication number
KR101014508B1
KR101014508B1 KR1020087016699A KR20087016699A KR101014508B1 KR 101014508 B1 KR101014508 B1 KR 101014508B1 KR 1020087016699 A KR1020087016699 A KR 1020087016699A KR 20087016699 A KR20087016699 A KR 20087016699A KR 101014508 B1 KR101014508 B1 KR 101014508B1
Authority
KR
South Korea
Prior art keywords
main surface
laminate
region
effective layer
external electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020087016699A
Other languages
English (en)
Korean (ko)
Other versions
KR20080077273A (ko
Inventor
켄이치 카와사키
노리유키 이노우에
아키라 사이토
마키토 나카노
켄이치 오시우미
Original Assignee
가부시키가이샤 무라타 세이사쿠쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 무라타 세이사쿠쇼 filed Critical 가부시키가이샤 무라타 세이사쿠쇼
Publication of KR20080077273A publication Critical patent/KR20080077273A/ko
Application granted granted Critical
Publication of KR101014508B1 publication Critical patent/KR101014508B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/30Stacked capacitors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/232Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H01G4/2325Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Ceramic Capacitors (AREA)
KR1020087016699A 2006-01-13 2007-01-09 적층 콘덴서 Active KR101014508B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006006132 2006-01-13
JPJP-P-2006-00006132 2006-01-13
JPJP-P-2006-00229570 2006-08-25
JP2006229570 2006-08-25

Publications (2)

Publication Number Publication Date
KR20080077273A KR20080077273A (ko) 2008-08-21
KR101014508B1 true KR101014508B1 (ko) 2011-02-14

Family

ID=38256258

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087016699A Active KR101014508B1 (ko) 2006-01-13 2007-01-09 적층 콘덴서

Country Status (7)

Country Link
US (1) US7715172B2 (enExample)
JP (1) JP4816648B2 (enExample)
KR (1) KR101014508B1 (enExample)
CN (1) CN101401177B (enExample)
DE (1) DE112007000130B4 (enExample)
TW (1) TW200741768A (enExample)
WO (1) WO2007080852A1 (enExample)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8021277B2 (en) 2005-02-02 2011-09-20 Mad Dogg Athletics, Inc. Programmed exercise bicycle with computer aided guidance
DE112008003104B4 (de) * 2007-11-22 2014-09-25 Murata Mfg. Co., Ltd. Keramische Mehrschichtkomponente
JP4539713B2 (ja) * 2007-12-11 2010-09-08 Tdk株式会社 積層コンデンサアレイ
US8072773B2 (en) * 2008-04-04 2011-12-06 John Mruz Ultra-wideband assembly system and method
JP5751080B2 (ja) * 2010-09-28 2015-07-22 株式会社村田製作所 積層セラミック電子部品
JP5201223B2 (ja) * 2011-01-28 2013-06-05 株式会社村田製作所 電子部品及び基板モジュール
KR101823149B1 (ko) * 2011-04-19 2018-01-29 삼성전기주식회사 적층형 세라믹 커패시터
KR101539808B1 (ko) * 2011-06-23 2015-07-28 삼성전기주식회사 적층 세라믹 커패시터
JP5899699B2 (ja) * 2011-08-10 2016-04-06 Tdk株式会社 積層型コンデンサ
KR101548773B1 (ko) * 2011-08-22 2015-08-31 삼성전기주식회사 적층 세라믹 커패시터의 회로 기판 실장 구조
WO2013148567A1 (en) * 2012-03-26 2013-10-03 Kemet Electronics Corporation Asymmetric high voltage capacitor
KR101309326B1 (ko) 2012-05-30 2013-09-16 삼성전기주식회사 적층 칩 전자부품, 그 실장 기판 및 포장체
US8934215B2 (en) * 2012-07-20 2015-01-13 Samsung Electro-Mechanics Co., Ltd Laminated chip electronic component, board for mounting the same, and packing unit thereof
KR101771730B1 (ko) * 2012-08-07 2017-08-25 삼성전기주식회사 적층 세라믹 전자부품 및 이의 제조방법
KR101474065B1 (ko) * 2012-09-27 2014-12-17 삼성전기주식회사 적층 칩 전자부품, 그 실장 기판 및 포장체
JP5811152B2 (ja) * 2012-11-05 2015-11-11 株式会社村田製作所 積層セラミック電子部品、その製造方法、テーピング電子部品連、その製造方法、および積層セラミック電子部品の方向識別方法
KR101452048B1 (ko) 2012-11-09 2014-10-22 삼성전기주식회사 적층 세라믹 커패시터, 적층 세라믹 커패시터의 회로 기판 실장 구조 및 적층 세라믹 커패시터의 포장체
KR101444540B1 (ko) * 2012-11-20 2014-09-24 삼성전기주식회사 적층 세라믹 커패시터, 적층 세라믹 커패시터의 회로 기판 실장 구조 및 적층 세라믹 커패시터의 포장체
KR101452074B1 (ko) 2012-12-27 2014-10-16 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
JP5987812B2 (ja) 2013-01-25 2016-09-07 株式会社村田製作所 積層コンデンサ、テーピング積層コンデンサ連及び積層コンデンサの実装構造
KR101462757B1 (ko) * 2013-01-29 2014-11-17 삼성전기주식회사 적층 세라믹 커패시터, 그 제조방법 및 적층 세라믹 커패시터가 내장된 인쇄회로기판
WO2014121100A1 (en) * 2013-02-01 2014-08-07 The Trustees Of Dartmouth College Multilayer conductors with integrated capacitors and associated systems and methods
KR101823174B1 (ko) * 2013-06-14 2018-01-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
KR101477405B1 (ko) * 2013-07-05 2014-12-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
JP6377957B2 (ja) * 2014-05-29 2018-08-22 太陽誘電株式会社 積層セラミックコンデンサ
JP2016001695A (ja) * 2014-06-12 2016-01-07 株式会社村田製作所 積層コンデンサ、これを含む積層コンデンサ連および積層コンデンサ実装体
WO2016013339A1 (ja) * 2014-07-23 2016-01-28 株式会社 村田製作所 積層コイル部品
JP6312633B2 (ja) * 2014-08-01 2018-04-18 太陽誘電株式会社 積層セラミックコンデンサ
KR102048094B1 (ko) * 2014-10-08 2019-11-22 삼성전기주식회사 전자 부품 및 이의 제조 방법
CA2919466C (en) * 2015-02-10 2023-06-27 Nova Chemicals Corporation Stand up pouch
KR101808794B1 (ko) * 2015-05-07 2018-01-18 주식회사 모다이노칩 적층체 소자
JP6690176B2 (ja) * 2015-10-06 2020-04-28 Tdk株式会社 電子部品
JP6522549B2 (ja) 2016-06-07 2019-05-29 太陽誘電株式会社 積層セラミックコンデンサ
JP2018006627A (ja) * 2016-07-05 2018-01-11 太陽誘電株式会社 積層セラミックコンデンサ
JP6527612B2 (ja) * 2018-02-15 2019-06-05 太陽誘電株式会社 積層セラミックコンデンサ
JP6616929B2 (ja) * 2018-02-15 2019-12-04 太陽誘電株式会社 積層セラミックコンデンサ
JP7547694B2 (ja) * 2018-03-09 2024-09-10 サムソン エレクトロ-メカニックス カンパニーリミテッド. 積層型キャパシタ
KR102185055B1 (ko) * 2018-10-02 2020-12-01 삼성전기주식회사 적층 세라믹 전자부품
KR102470407B1 (ko) * 2020-05-27 2022-11-24 주식회사 아모텍 광대역 커패시터
WO2024075402A1 (ja) * 2022-10-03 2024-04-11 株式会社村田製作所 積層セラミック電子部品
WO2024161743A1 (ja) * 2023-01-30 2024-08-08 株式会社村田製作所 積層セラミックコンデンサ
US11806577B1 (en) 2023-02-17 2023-11-07 Mad Dogg Athletics, Inc. Programmed exercise bicycle with computer aided guidance

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163311A (ja) * 1992-11-26 1994-06-10 Matsushita Electric Ind Co Ltd 積層セラミックコンデンサ
JPH0732936U (ja) * 1993-11-29 1995-06-16 太陽誘電株式会社 積層セラミック電子部品

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4241378A (en) * 1978-06-12 1980-12-23 Erie Technological Products, Inc. Base metal electrode capacitor and method of making the same
JP2853523B2 (ja) 1993-07-14 1999-02-03 トヨタ自動車株式会社 ヘッドランプ照射範囲制御装置
JPH07211132A (ja) * 1994-01-10 1995-08-11 Murata Mfg Co Ltd 導電性ペーストおよびこれを用いた積層セラミックコンデンサの製造方法
JPH0869939A (ja) 1994-06-23 1996-03-12 Murata Mfg Co Ltd 積層セラミックコンデンサおよびその製造方法
US5600533A (en) 1994-06-23 1997-02-04 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor having an anti-reducing agent
JPH08181033A (ja) 1994-12-22 1996-07-12 Tokin Corp 積層セラミックコンデンサ
JPH08180731A (ja) * 1994-12-26 1996-07-12 Murata Mfg Co Ltd 導電性厚膜組成物、厚膜電極、セラミック電子部品、および積層セラミックコンデンサ
US5805409A (en) * 1995-08-18 1998-09-08 Tdk Corporation Multi-layer electronic part having external electrodes that have a thermosetting resin and metal particles
JPH10261546A (ja) * 1997-03-19 1998-09-29 Murata Mfg Co Ltd 積層コンデンサ
JPH10312933A (ja) * 1997-05-09 1998-11-24 Murata Mfg Co Ltd 積層セラミック電子部品
JPH11150037A (ja) 1997-11-19 1999-06-02 Tdk Corp 積層セラミックコンデンサ
JPH11186092A (ja) * 1997-12-25 1999-07-09 Tdk Corp チップ状電子部品
JP2000124057A (ja) * 1998-10-12 2000-04-28 Tdk Corp 積層型セラミックコンデンサ
JP2000269066A (ja) * 1999-03-19 2000-09-29 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
JP2001035738A (ja) * 1999-07-15 2001-02-09 Murata Mfg Co Ltd 積層セラミック電子部品
JP2001185437A (ja) * 1999-12-24 2001-07-06 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
JP2003022929A (ja) * 2001-07-09 2003-01-24 Taiyo Yuden Co Ltd 積層セラミックコンデンサ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163311A (ja) * 1992-11-26 1994-06-10 Matsushita Electric Ind Co Ltd 積層セラミックコンデンサ
JPH0732936U (ja) * 1993-11-29 1995-06-16 太陽誘電株式会社 積層セラミック電子部品

Also Published As

Publication number Publication date
DE112007000130T5 (de) 2008-12-18
JPWO2007080852A1 (ja) 2009-06-11
DE112007000130B4 (de) 2016-06-09
WO2007080852A1 (ja) 2007-07-19
CN101401177B (zh) 2011-03-30
US20090002918A1 (en) 2009-01-01
CN101401177A (zh) 2009-04-01
JP4816648B2 (ja) 2011-11-16
TWI325597B (enExample) 2010-06-01
US7715172B2 (en) 2010-05-11
KR20080077273A (ko) 2008-08-21
TW200741768A (en) 2007-11-01

Similar Documents

Publication Publication Date Title
KR101014508B1 (ko) 적층 콘덴서
KR101102184B1 (ko) 적층 세라믹 전자부품
JP4905498B2 (ja) 積層型セラミック電子部品
KR100884902B1 (ko) 적층 커패시터 및 그 실장구조
KR101379874B1 (ko) 적층형 세라믹 전자부품
JP5810706B2 (ja) 電子部品
KR101059247B1 (ko) 적층콘덴서
KR100898672B1 (ko) 적층 세라믹 콘덴서
KR100883524B1 (ko) 적층 세라믹 콘덴서
CN113140405B (zh) 层叠陶瓷电容器
JP2005347509A (ja) 積層コンデンサおよびその製造方法
KR100976347B1 (ko) 적층 커패시터
US11289274B2 (en) Multilayer ceramic capacitor
KR20130091270A (ko) 적층 세라믹 전자부품의 제조방법
KR101950715B1 (ko) 적층 세라믹 콘덴서
JP2022073617A (ja) 積層セラミックコンデンサ
KR101872529B1 (ko) 적층 칩 전자부품
JP2009059888A (ja) 積層セラミックコンデンサ
KR102483617B1 (ko) 적층형 전자 부품
JP4925779B2 (ja) 積層コンデンサ
US11972900B2 (en) Multilayer ceramic capacitor
CN115410824B (zh) 层叠电容器
JP6527612B2 (ja) 積層セラミックコンデンサ
KR20250054103A (ko) 적층 세라믹 전자부품
KR20250084171A (ko) 적층 세라믹 전자부품

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

Patent event date: 20080709

Patent event code: PA01051R01D

Comment text: International Patent Application

PA0201 Request for examination
PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20100322

Patent event code: PE09021S01D

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20100806

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20110112

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20110207

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20110207

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
FPAY Annual fee payment

Payment date: 20140120

Year of fee payment: 4

PR1001 Payment of annual fee

Payment date: 20140120

Start annual number: 4

End annual number: 4

FPAY Annual fee payment

Payment date: 20150120

Year of fee payment: 5

PR1001 Payment of annual fee

Payment date: 20150120

Start annual number: 5

End annual number: 5

FPAY Annual fee payment

Payment date: 20160205

Year of fee payment: 6

PR1001 Payment of annual fee

Payment date: 20160205

Start annual number: 6

End annual number: 6

FPAY Annual fee payment

Payment date: 20180126

Year of fee payment: 8

PR1001 Payment of annual fee

Payment date: 20180126

Start annual number: 8

End annual number: 8

PR1001 Payment of annual fee

Payment date: 20210128

Start annual number: 11

End annual number: 11

PR1001 Payment of annual fee

Payment date: 20220127

Start annual number: 12

End annual number: 12

PR1001 Payment of annual fee

Payment date: 20240125

Start annual number: 14

End annual number: 14