KR100402507B1 - 복합 플렉시블 배선 기판 및 그 제조 방법, 전기 광학장치, 전자 기기 - Google Patents
복합 플렉시블 배선 기판 및 그 제조 방법, 전기 광학장치, 전자 기기 Download PDFInfo
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- KR100402507B1 KR100402507B1 KR10-2000-0053742A KR20000053742A KR100402507B1 KR 100402507 B1 KR100402507 B1 KR 100402507B1 KR 20000053742 A KR20000053742 A KR 20000053742A KR 100402507 B1 KR100402507 B1 KR 100402507B1
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- flexible wiring
- wiring board
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Combinations Of Printed Boards (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
Claims (17)
- 제 1 플렉시블 배선 기판과, 실장 부품이 탑재된 제 2 플렉시블 배선 기판을 포함하고,상기 제 2 플렉시블 배선 기판은 상기 제 1 플렉시블 배선 기판 상의 소정 영역에 설치되며,상기 제 1 및 제 2 플렉시블 배선 기판의 각각에는 컨택트부가 설치되어 있고,상기 제 1 및 제 2 플렉시블 배선 기판은 상기 컨택트부를 개재시켜 전기적으로 접속되어 이루어지는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 2 플렉시블 배선 기판은 상기 제 1 플렉시블 배선 기판 상의 일부분에 배치되어 이루어지는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 1 플렉시블 배선 기판은 IC 칩을 탑재하여 이루어지는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 1 플렉시블 배선 기판은 입력 측 단자 영역과, 출력 측 단자 영역을 갖는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 2 플렉시블 배선 기판은, 플랫 패키지형 LSI, 저항, 콘덴서, 인덕턴스, 다이오드, 트랜지스터, 수정 진동자 및 커넥터로부터 선택되는 적어도 1종의 실장 부품이 탑재되어 이루어지는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 제 3 항에 있어서,상기 제 1 플렉시블 배선 기판에서, 상기 IC 칩은 이방성 도전층을 개재시켜 상기 제 1 플렉시블 배선 기판 상에 형성된 도전층에 접속되어 이루어지는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 2 플렉시블 배선 기판에서, 상기 실장 부품은 땜납층을 개재시켜 상기 제 2 플렉시블 배선 기판상에 형성된 도전층에 접속되어 이루어지는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 컨택트부는 이방성 도전층 혹은 땜납층으로 구성되는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 1 플렉시블 배선 기판과 접속된 제 3 플렉시블 배선 기판을 더 가지며,상기 제 3 플렉시블 배선 기판은 출력 측 단자 영역을 갖는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 2 플렉시블 배선 기판은 양면 플렉시블 배선 기판으로 구성되는 것을 특징으로 하는 복합 플렉시블 배선 기판.
- 복합 플렉시블 배선 기판의 제조 방법에 있어서,제 1 및 제 2 플렉시블 배선 기판을 각각 형성하는 공정,상기 제 1 및 제 2 플렉시블 배선 기판의 각각에 컨택트부를 형성하는 공정, 및상기 제 1 및 제 2 플렉시블 배선 기판을 상기 컨택트부를 개재시켜 전기적으로 접속하는 공정을 포함하는 것을 특징으로 하는 복합 플렉시블 배선 기판의 제조 방법.
- 제 11 항에 있어서,상기 컨택트부는 이방성 도전층을 개재시켜 상기 제 1 플렉시블 배선 기판과 상기 제 2 플렉시블 배선 기판을 열 압착시킴으로써 형성되는 것을 특징으로 하는 복합 플렉시블 배선 기판의 제조 방법.
- 적어도 하나의 기판을 갖는 전기 광학 패널을 포함하는 전기 광학 장치에 있어서,상기 기판은 배선 접합 영역을 갖고,상기 배선 접합 영역은 제 1 항 내지 제 10 항중 어느 한 항에 기재된 복합 플렉시블 배선 기판과 접속되는 것을 특징으로 하는 전기 광학 장치.
- 제 13 항에 있어서,상기 전기 광학 패널은 서로 대향하는 제 1 기판과 제 2 기판을 포함하며,상기 제 1 기판은 상기 제 2 기판에 대해 겹치지 않는 배선 접합 영역을 갖는 것을 특징으로 하는 전기 광학 장치.
- 제 14 항에 있어서,상기 제 1 기판과 상기 제 2 기판 사이에 전기 광학 재료층으로서 액정층을 갖는 것을 특징으로 하는 전기 광학 장치.
- 제 13 항에 있어서,상기 전기 광학 패널은 상기 기판 상에 전기 광학 재료층으로서 전계 발광 구조체를 갖는 EL 표시 패널인 것을 특징으로 하는 전기 광학 장치.
- 제 13 항 내지 제 16 항중 어느 한 항에 기재된 전기 광학 장치를 포함하는 전자 기기.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26053699 | 1999-09-14 | ||
JP99-260536 | 1999-09-14 | ||
JP2000272684A JP3952125B2 (ja) | 1999-09-14 | 2000-09-08 | 複合フレキシブル配線基板、電気光学装置、電子機器 |
JP2000-272684 | 2000-09-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010039881A KR20010039881A (ko) | 2001-05-15 |
KR100402507B1 true KR100402507B1 (ko) | 2003-10-22 |
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ID=26544649
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2000-0053742A KR100402507B1 (ko) | 1999-09-14 | 2000-09-09 | 복합 플렉시블 배선 기판 및 그 제조 방법, 전기 광학장치, 전자 기기 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6972966B1 (ko) |
EP (1) | EP1085788A3 (ko) |
JP (1) | JP3952125B2 (ko) |
KR (1) | KR100402507B1 (ko) |
CN (1) | CN1132054C (ko) |
TW (1) | TW548455B (ko) |
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KR100705869B1 (ko) * | 2004-02-10 | 2007-04-10 | 세이코 엡슨 가부시키가이샤 | 실장 구조체, 전기 광학 장치 및 전자 기기 |
KR101065931B1 (ko) | 2009-07-30 | 2011-09-19 | 삼성에스디아이 주식회사 | 플라즈마 표시 장치 |
US8085379B2 (en) | 2005-03-29 | 2011-12-27 | Samsung Electronics Co., Ltd. | Circuit board and display device having the same |
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Also Published As
Publication number | Publication date |
---|---|
TW548455B (en) | 2003-08-21 |
JP2001156418A (ja) | 2001-06-08 |
KR20010039881A (ko) | 2001-05-15 |
JP3952125B2 (ja) | 2007-08-01 |
US6972966B1 (en) | 2005-12-06 |
CN1132054C (zh) | 2003-12-24 |
EP1085788A2 (en) | 2001-03-21 |
EP1085788A3 (en) | 2003-01-02 |
CN1288171A (zh) | 2001-03-21 |
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