KR100393948B1 - 플렉시블 배선 기판, 전기 광학 장치 및 전자기기 - Google Patents
플렉시블 배선 기판, 전기 광학 장치 및 전자기기 Download PDFInfo
- Publication number
- KR100393948B1 KR100393948B1 KR10-2000-0051028A KR20000051028A KR100393948B1 KR 100393948 B1 KR100393948 B1 KR 100393948B1 KR 20000051028 A KR20000051028 A KR 20000051028A KR 100393948 B1 KR100393948 B1 KR 100393948B1
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- South Korea
- Prior art keywords
- flexible
- wiring
- substrate
- flexible substrate
- wiring board
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Abstract
Description
Claims (12)
- 절연성을 갖는 제 1 베이스체의 편면(片面) 상에 배치된 제 1 배선층을 갖는 제 1 플렉시블 기판과,절연성을 갖는 제 2 베이스체의 편면 상에 배치된 제 2 배선층을 갖고, 상기 제 1 배선층과 상기 제 2 배선층이 마주보도록 상기 제 1 플렉시블 기판과 대향하여 배치된 제 2 플렉시블 기판과,상기 제 1 및 제 2 배선층들중 적어도 한쪽을 덮도록 배치된 절연층과,상기 제 1 및 제 2 플렉시블 기판 사이에 배치되고, 상기 제 1 및 제 2 플렉시블 기판을 접합하는 이방성 도전 접착층을 구비하고,상기 절연층에는 상기 제 1 배선층과 상기 제 2 배선층을 전기적으로 접속하기 위한 콘택트부를 구성하는 홀이 설치되어 이루어진 것을 특징으로 하는 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 2 플렉시블 기판은 상기 제 1 플렉시블 기판의 일부에 설치되어 이루어진 것을 특징으로 하는 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 1 플렉시블 기판은 플렉시블 배선 기판의 전체 형상에 대응한 형상을 갖는 것을 특징으로 하는 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 2 플렉시블 기판은 그 일부분이 상기 제 1 플렉시블 기판에 접합되어 이루어진 것을 특징으로 하는 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 1 플렉시블 기판은 입력측 단자 영역과 출력측 단자 영역을 갖는 것을 특징으로 하는 플렉시블 배선 기판.
- 제 4 항에 있어서,상기 제 1 플렉시블 기판은 입력측 단자 영역과 제 1 출력측 단자 영역을 갖고,상기 제 2 플렉시블 기판은 제 2 출력측 단자 영역을 갖는 것을 특징으로 하는 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 콘택트부를 구성하는 상기 홀에 범프가 설치되어 이루어진 것을 특징으로 하는 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 절연층은 상기 제 1 및 제 2 배선층의 각각의 위에 설치되어 이루어진 것을 특징으로 하는 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 이방성 도전 접착층은 이방성 도전막을 개재시키고, 상기 제 1 플렉시블 기판과 상기 제 2 플렉시블 기판을 열압착시킴으로써 형성되는 것을 특징으로 하는 플렉시블 배선 기판.
- 서로 대향하는 제 1 기판과 제 2 기판과의 사이에 전기 광학 재료층을 가진 전기 광학 패널을 포함하는 전기 광학 장치로서,상기 제 1 기판은 상기 제 2 기판에 대해 겹치지 않은 제 1 배선 접합 영역을 가지고,상기 제 2 기판은 상기 제 1 기판에 대해 겹치지 않은 제 2 배선 접합 영역을 가지며,상기 제 1 배선 접합 영역 및 상기 제 2 배선 접합 영역중 적어도 한쪽은 청구항1 내지 청구항9 중 어느 한 항의 플렉시블 배선 기판과 접속되는 전기 광학 장치.
- 제 10 항에 있어서,상기 전기 광학 재료층은 액정층인 전기 광학 장치.
- 청구항10 에 기재된 전기 광학 장치를 포함하는 전자기기.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP99-249463 | 1999-09-03 | ||
JP24946399A JP2001077501A (ja) | 1999-09-03 | 1999-09-03 | フレキシブル配線基板、電気光学装置および電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010030190A KR20010030190A (ko) | 2001-04-16 |
KR100393948B1 true KR100393948B1 (ko) | 2003-08-09 |
Family
ID=17193344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR10-2000-0051028A KR100393948B1 (ko) | 1999-09-03 | 2000-08-31 | 플렉시블 배선 기판, 전기 광학 장치 및 전자기기 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6506978B1 (ko) |
EP (1) | EP1081991B1 (ko) |
JP (1) | JP2001077501A (ko) |
KR (1) | KR100393948B1 (ko) |
CN (1) | CN1160588C (ko) |
DE (1) | DE60029524T2 (ko) |
TW (1) | TW548497B (ko) |
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KR100232680B1 (ko) * | 1997-01-22 | 1999-12-01 | 구본준 | Acf 구조 |
JPH10261849A (ja) * | 1997-03-19 | 1998-09-29 | Fujitsu Ltd | フレキシブルプリント基板および接続プリント基板構造 |
KR100269947B1 (ko) * | 1997-09-13 | 2000-10-16 | 윤종용 | 인쇄회로기판및이를이용한엘씨디모듈 |
US6063647A (en) * | 1997-12-08 | 2000-05-16 | 3M Innovative Properties Company | Method for making circuit elements for a z-axis interconnect |
JP2000208698A (ja) * | 1999-01-18 | 2000-07-28 | Toshiba Corp | 半導体装置 |
-
1999
- 1999-09-03 JP JP24946399A patent/JP2001077501A/ja active Pending
-
2000
- 2000-07-24 TW TW089114757A patent/TW548497B/zh not_active IP Right Cessation
- 2000-08-31 KR KR10-2000-0051028A patent/KR100393948B1/ko active IP Right Grant
- 2000-09-01 DE DE60029524T patent/DE60029524T2/de not_active Expired - Lifetime
- 2000-09-01 CN CNB001268821A patent/CN1160588C/zh not_active Expired - Lifetime
- 2000-09-01 US US09/654,119 patent/US6506978B1/en not_active Expired - Lifetime
- 2000-09-01 EP EP00307577A patent/EP1081991B1/en not_active Expired - Lifetime
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR0157330B1 (ko) * | 1992-03-02 | 1998-11-16 | 다니이 아끼오 | 액정표시패널과 표시장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2001077501A (ja) | 2001-03-23 |
DE60029524T2 (de) | 2007-07-26 |
EP1081991A2 (en) | 2001-03-07 |
CN1160588C (zh) | 2004-08-04 |
EP1081991B1 (en) | 2006-07-26 |
CN1287285A (zh) | 2001-03-14 |
US6506978B1 (en) | 2003-01-14 |
DE60029524D1 (de) | 2006-09-07 |
EP1081991A3 (en) | 2003-04-02 |
KR20010030190A (ko) | 2001-04-16 |
TW548497B (en) | 2003-08-21 |
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