KR20010030190A - 플렉시블 배선 기판, 전기 광학 장치 및 전자기기 - Google Patents
플렉시블 배선 기판, 전기 광학 장치 및 전자기기 Download PDFInfo
- Publication number
- KR20010030190A KR20010030190A KR1020000051028A KR20000051028A KR20010030190A KR 20010030190 A KR20010030190 A KR 20010030190A KR 1020000051028 A KR1020000051028 A KR 1020000051028A KR 20000051028 A KR20000051028 A KR 20000051028A KR 20010030190 A KR20010030190 A KR 20010030190A
- Authority
- KR
- South Korea
- Prior art keywords
- sided flexible
- flexible substrate
- wiring
- substrate
- sided
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
- H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structure Of Printed Boards (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Description
Claims (12)
- 제 1 편면(片面) 플렉시블 기판과, 제 2 편면 플렉시블 기판을 포함하고,상기 제 1 편면 플렉시블 기판은 절연성을 가진 제 1 베이스체와, 상기 제 1 베이스체 상에 소정의 패턴으로 형성된 제 1 배선층을 포함하며,상기 제 2 편면 플렉시블 기판은 절연성을 가진 제 2 베이스체와, 상기 제 2 베이스체 상에 소정의 패턴으로 형성된 제 2 배선층을 포함하고,상기 제 1 및 제 2 편면 플렉시블 기판중 적어도 한쪽에, 상기 배선층을 덮는 절연층이 설치되고, 상기 절연층에는 상기 제 1 배선층과 제 2 배선층을 소정의 영역에서 전기적으로 접속하기 위한 콘택트부를 구성하는 홀이 설치되며,상기 제 1 편면 플렉시블 기판 및 상기 제 2 편면 플렉시블 기판은 상기 제 1 배선층과 상기 제 2 배선층이 대향하는 상태로 배치되고, 또한, 이방성 도전 접착층에 의해 접합되어 있는 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 2 편면 플렉시블 기판은, 상기 제 1 편면 플렉시블 기판의 일부에 설치되어 있는 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 1 편면 플렉시블 기판은, 플렉시블 배선 기판의 전체 형상에 대응한 형상을 가진 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 2 편면 플렉시블 기판은, 그 일부분이 상기 제 1 편면 플렉시블 기판에 접합되고, 다른 부분이 상기 제 1 편면 플렉시블 기판과 접합되어 있지 않은 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 1 편면 플렉시블 기판은, 입력측 단자 영역과 출력측 단자 영역을 가진 플렉시블 배선 기판.
- 제 4 항에 있어서,상기 제 1 편면 플렉시블 기판은, 입력측 단자 영역과, 제 1 출력측 단자 영역을 가지며, 상기 제 2 편면 플렉시블 기판은 제 2 출력측 단자 영역을 가진 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 콘택트부는, 상기 홀 내에 범프를 가진 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 제 1 및 제 2 편면 플렉시블 기판은, 각각 상기 절연층을 가진 플렉시블 배선 기판.
- 제 1 항에 있어서,상기 이방성 도전 접착층은, 이방성 도전막을 개재시켜 상기 제 1 편면 플렉시블 기판과 상기 제 2 편면 플렉시블 기판을 열 압착시킴으로써 형성되는 플렉시블 배선 기판.
- 서로 대향하는 제 1 기판과 제 2 기판과의 사이에 전기 광학 재료층을 가진 전기 광학 패널을 포함하는 전기 광학 장치로서,상기 제 1 기판은 상기 제 2 기판에 대해 겹치지 않은 제 1 배선 접합 영역을 가지고,상기 제 2 기판은 상기 제 1 기판에 대해 겹치지 않은 제 2 배선 접합 영역을 가지며,상기 제 1 배선 접합 영역 및 상기 제 2 배선 접합 영역중 적어도 한쪽은 제 1 항 내지 제 9 항 중 어느 한 항의 플렉시블 배선 기판과 접속되는 전기 광학 장치.
- 제 10 항에 있어서,상기 전기 광학 재료층은, 액정층인 전기 광학 장치.
- 제 1O 항에 기재된 전기 광학 장치를 포함하는 전자기기.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP99-249463 | 1999-09-03 | ||
JP24946399A JP2001077501A (ja) | 1999-09-03 | 1999-09-03 | フレキシブル配線基板、電気光学装置および電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010030190A true KR20010030190A (ko) | 2001-04-16 |
KR100393948B1 KR100393948B1 (ko) | 2003-08-09 |
Family
ID=17193344
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2000-0051028A KR100393948B1 (ko) | 1999-09-03 | 2000-08-31 | 플렉시블 배선 기판, 전기 광학 장치 및 전자기기 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6506978B1 (ko) |
EP (1) | EP1081991B1 (ko) |
JP (1) | JP2001077501A (ko) |
KR (1) | KR100393948B1 (ko) |
CN (1) | CN1160588C (ko) |
DE (1) | DE60029524T2 (ko) |
TW (1) | TW548497B (ko) |
Families Citing this family (38)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3729092B2 (ja) * | 2001-06-19 | 2005-12-21 | ソニー株式会社 | 導電性接合材、多層型プリント配線基板及び多層型プリント配線基板の製造方法 |
JP2003298232A (ja) * | 2002-04-02 | 2003-10-17 | Sony Corp | 多層配線基板の製造方法および多層配線基板 |
US6823582B1 (en) | 2002-08-02 | 2004-11-30 | National Semiconductor Corporation | Apparatus and method for force mounting semiconductor packages to printed circuit boards |
US6864586B2 (en) * | 2003-02-28 | 2005-03-08 | Silicon Integrated Systems Corp. | Padless high density circuit board |
US8518304B1 (en) | 2003-03-31 | 2013-08-27 | The Research Foundation Of State University Of New York | Nano-structure enhancements for anisotropic conductive material and thermal interposers |
WO2004093508A1 (ja) | 2003-04-18 | 2004-10-28 | Ibiden Co., Ltd. | フレックスリジッド配線板 |
KR20050035970A (ko) * | 2003-10-14 | 2005-04-20 | 삼성전자주식회사 | 연성 인쇄회로기판 및 이를 이용한 액정표시장치 |
US20050265650A1 (en) * | 2004-05-27 | 2005-12-01 | Sunil Priyadarshi | Small profile, pluggable optical transceiver subassembly |
JP4536430B2 (ja) | 2004-06-10 | 2010-09-01 | イビデン株式会社 | フレックスリジッド配線板 |
KR100594299B1 (ko) * | 2004-10-29 | 2006-06-30 | 삼성전자주식회사 | 유연성 인쇄 회로 및 이것이 구비된 하드 디스크 드라이브 |
US20060139551A1 (en) * | 2004-12-27 | 2006-06-29 | Yohei Kimura | Display device |
JP4699136B2 (ja) * | 2005-08-17 | 2011-06-08 | 日本メクトロン株式会社 | フレキシブルプリント回路基板の製造方法 |
KR100684726B1 (ko) * | 2005-09-27 | 2007-02-20 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 장치 |
TWI434119B (zh) * | 2006-06-28 | 2014-04-11 | Creator Technology Bv | 用於可撓性顯示器之改良的共同接點佈局 |
US8320133B1 (en) * | 2006-12-05 | 2012-11-27 | Raytheon Company | Rigid/flexible circuit board |
JP5525692B2 (ja) * | 2007-02-22 | 2014-06-18 | 三星ディスプレイ株式會社 | 表示基板とその製造方法、及びこれを具備した表示装置 |
KR101365118B1 (ko) * | 2007-02-22 | 2014-02-25 | 삼성디스플레이 주식회사 | 표시 기판과, 이의 제조 방법 및 이를 구비한 표시 장치 |
JP2008277508A (ja) * | 2007-04-27 | 2008-11-13 | Matsushita Electric Ind Co Ltd | フレキシブル回路基板および、それを備えたモータ、ハードディスクドライブ装置 |
WO2008149443A1 (ja) * | 2007-06-07 | 2008-12-11 | Hitachi, Ltd. | フレキシブル配線基板及びこれを用いたプラズマディスプレイ装置 |
JP5184335B2 (ja) | 2008-12-26 | 2013-04-17 | 株式会社フジクラ | プリント配線板およびその製造方法、プリント配線板の接続方法 |
TW201124007A (en) * | 2009-12-30 | 2011-07-01 | Au Optronics Corp | Substrate and substrate bonding device using the same |
CN103517558B (zh) * | 2012-06-20 | 2017-03-22 | 碁鼎科技秦皇岛有限公司 | 封装基板制作方法 |
CN103607855B (zh) * | 2013-10-26 | 2016-06-08 | 溧阳市东大技术转移中心有限公司 | 一种复合挠性基板的制造方法 |
CN103607839A (zh) * | 2013-10-26 | 2014-02-26 | 溧阳市东大技术转移中心有限公司 | 一种复合挠性基板 |
CN104093263B (zh) * | 2014-05-19 | 2018-08-14 | 北京国联万众半导体科技有限公司 | 用于柔性基板的桥接模块和基板组件 |
JP6518451B2 (ja) * | 2015-02-02 | 2019-05-22 | 株式会社フジクラ | 伸縮性回路基板 |
EP3258752A4 (en) | 2015-02-13 | 2018-10-17 | Pi-Crystal Incorporation | Method for forming laminated circuit board, and laminated circuit board formed using same |
JP2016178121A (ja) * | 2015-03-18 | 2016-10-06 | タツタ電線株式会社 | ストレッチャブルケーブルおよびストレッチャブル回路基板 |
KR102593532B1 (ko) * | 2016-06-03 | 2023-10-26 | 삼성디스플레이 주식회사 | 이방성 도전 필름 및 이를 이용한 디스플레이 장치 |
CN106507613A (zh) * | 2016-10-11 | 2017-03-15 | 江苏博敏电子有限公司 | 一种采用高分子导电聚合工艺的hdi线路板制作方法 |
WO2018168627A1 (ja) * | 2017-03-14 | 2018-09-20 | パナソニックIpマネジメント株式会社 | タッチセンサ |
CN111511109B (zh) * | 2019-01-30 | 2021-11-23 | 京东方科技集团股份有限公司 | 柔性电路板及制作方法、电子装置模组及电子装置 |
US11500489B2 (en) | 2019-01-30 | 2022-11-15 | Chengdu Boe Optoelectronics Technology Co., Ltd. | Flexible circuit board and manufacturing method, display device, circuit board structure and display panel thereof |
JP6930681B2 (ja) * | 2019-03-25 | 2021-09-01 | 株式会社村田製作所 | 伸縮性実装基板 |
CN110346957A (zh) * | 2019-06-27 | 2019-10-18 | 深圳市华星光电技术有限公司 | 液晶模组及其制备方法 |
CN111399290B (zh) * | 2020-04-26 | 2022-11-08 | 上海中航光电子有限公司 | 显示面板及显示装置 |
CN111511098B (zh) * | 2020-06-10 | 2021-08-20 | 京东方科技集团股份有限公司 | 一种柔性线路板fpc及显示装置 |
CN114199898A (zh) * | 2021-12-01 | 2022-03-18 | 深圳市鑫达辉软性电路科技有限公司 | 多层板规避aoi扫描结构、配置方法和扫描方法 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4659872A (en) * | 1985-04-30 | 1987-04-21 | Amp Incorporated | Flexible flat multiconductor cable |
US4740657A (en) * | 1986-02-14 | 1988-04-26 | Hitachi, Chemical Company, Ltd | Anisotropic-electroconductive adhesive composition, method for connecting circuits using the same, and connected circuit structure thus obtained |
JPH0738502B2 (ja) * | 1989-10-17 | 1995-04-26 | シャープ株式会社 | 回路基板の接続方法 |
DE69218319T2 (de) * | 1991-07-26 | 1997-07-10 | Nec Corp., Tokio/Tokyo | Mehrschichtige Leiterplatte aus Polyimid und Verfahren zur Herstellung |
JP2543281B2 (ja) | 1992-03-02 | 1996-10-16 | 松下電器産業株式会社 | 液晶表示パネルと表示装置 |
JPH0637451A (ja) | 1992-07-20 | 1994-02-10 | Hitachi Chem Co Ltd | 多層印刷配線板及びその製造方法 |
JPH081499B2 (ja) * | 1993-01-05 | 1996-01-10 | 日本電気株式会社 | 液晶表示装置 |
US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
DE69414686T2 (de) * | 1993-07-27 | 1999-05-06 | Citizen Watch Co., Ltd., Tokio/Tokyo | Elektrische verbindungsstruktur und verfahren zum elektrischen verbinden von anschluessen untereinander |
JP2867209B2 (ja) * | 1993-08-27 | 1999-03-08 | 日東電工株式会社 | フレキシブル回路基板と接触対象物との接続方法およびその構造 |
US5527998A (en) * | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
WO1995013625A1 (en) * | 1993-11-12 | 1995-05-18 | Seiko Epson Corporation | Structure and method for mounting semiconductor device and liquid crystal display device |
US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
US5661042A (en) * | 1995-08-28 | 1997-08-26 | Motorola, Inc. | Process for electrically connecting electrical devices using a conductive anisotropic material |
JPH09318965A (ja) * | 1996-05-30 | 1997-12-12 | Nippon Seiki Co Ltd | 液晶表示装置 |
KR100232680B1 (ko) * | 1997-01-22 | 1999-12-01 | 구본준 | Acf 구조 |
JPH10261849A (ja) * | 1997-03-19 | 1998-09-29 | Fujitsu Ltd | フレキシブルプリント基板および接続プリント基板構造 |
KR100269947B1 (ko) * | 1997-09-13 | 2000-10-16 | 윤종용 | 인쇄회로기판및이를이용한엘씨디모듈 |
US6063647A (en) * | 1997-12-08 | 2000-05-16 | 3M Innovative Properties Company | Method for making circuit elements for a z-axis interconnect |
JP2000208698A (ja) * | 1999-01-18 | 2000-07-28 | Toshiba Corp | 半導体装置 |
-
1999
- 1999-09-03 JP JP24946399A patent/JP2001077501A/ja active Pending
-
2000
- 2000-07-24 TW TW089114757A patent/TW548497B/zh not_active IP Right Cessation
- 2000-08-31 KR KR10-2000-0051028A patent/KR100393948B1/ko active IP Right Grant
- 2000-09-01 CN CNB001268821A patent/CN1160588C/zh not_active Expired - Lifetime
- 2000-09-01 EP EP00307577A patent/EP1081991B1/en not_active Expired - Lifetime
- 2000-09-01 DE DE60029524T patent/DE60029524T2/de not_active Expired - Lifetime
- 2000-09-01 US US09/654,119 patent/US6506978B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
TW548497B (en) | 2003-08-21 |
EP1081991A3 (en) | 2003-04-02 |
DE60029524D1 (de) | 2006-09-07 |
KR100393948B1 (ko) | 2003-08-09 |
CN1287285A (zh) | 2001-03-14 |
EP1081991B1 (en) | 2006-07-26 |
CN1160588C (zh) | 2004-08-04 |
US6506978B1 (en) | 2003-01-14 |
DE60029524T2 (de) | 2007-07-26 |
EP1081991A2 (en) | 2001-03-07 |
JP2001077501A (ja) | 2001-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100393948B1 (ko) | 플렉시블 배선 기판, 전기 광학 장치 및 전자기기 | |
JP3952125B2 (ja) | 複合フレキシブル配線基板、電気光学装置、電子機器 | |
US6519021B1 (en) | Wiring board for connection of electro-optical panel, electro-optical device and electronic apparatus | |
US6542374B1 (en) | Circuit board, method for manufacturing the circuit board, and display device and electronic equipment employing the circuit board | |
EP1039331B1 (en) | Display device and electronic apparatus | |
US6657696B2 (en) | Flexible substrate, electro-optical device and electronic equipment | |
JP2003273476A (ja) | 実装構造体及びその製造方法、電気光学装置、並びに電子機器 | |
JP2006030368A (ja) | 電気光学装置、実装構造体及び電子機器 | |
US6831841B2 (en) | Flexible substrate, electro-optical device and electronic device | |
KR20040088347A (ko) | 전기 광학 장치, 이 전기 광학 장치를 구비한 전자 기기,및 이 전기 광학 장치의 제조 방법 | |
JP4122807B2 (ja) | 電気光学装置および半導体素子、並びに電子機器 | |
KR100859804B1 (ko) | 실장 구조 및 이를 이용한 액정 표시 장치 | |
JP2003273486A (ja) | 実装構造体及びその製造方法、電気光学装置、並びに電子機器 | |
JP3760973B2 (ja) | 電気光学装置およびその製造方法ならびに電子機器 | |
JPH11317252A (ja) | 液晶装置の実装構造及び電子機器 | |
JP3757671B2 (ja) | 表示装置および電子機器 | |
JP2000058985A (ja) | 配線基板、液晶装置及び電子機器 | |
CN116978282A (zh) | 可折叠显示装置及其制作方法、以及终端设备 | |
JP2001094220A (ja) | フレキシブル配線基板、電気光学装置およびその製造方法、電子機器 | |
JP2002072241A (ja) | 電気光学パネルの接続用配線基板、電気光学装置および電子機器 | |
JP2002072240A (ja) | 電気光学パネルの接続用配線基板、電気光学装置および電子機器 | |
JP2000305476A (ja) | 表示装置及び電子機器 | |
JP2002023189A (ja) | 電気光学パネルの接続用配線基板 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130618 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20140716 Year of fee payment: 12 |
|
FPAY | Annual fee payment |
Payment date: 20150626 Year of fee payment: 13 |
|
FPAY | Annual fee payment |
Payment date: 20160701 Year of fee payment: 14 |
|
FPAY | Annual fee payment |
Payment date: 20170704 Year of fee payment: 15 |
|
FPAY | Annual fee payment |
Payment date: 20180719 Year of fee payment: 16 |