DE69414686T2 - Elektrische verbindungsstruktur und verfahren zum elektrischen verbinden von anschluessen untereinander - Google Patents

Elektrische verbindungsstruktur und verfahren zum elektrischen verbinden von anschluessen untereinander

Info

Publication number
DE69414686T2
DE69414686T2 DE69414686T DE69414686T DE69414686T2 DE 69414686 T2 DE69414686 T2 DE 69414686T2 DE 69414686 T DE69414686 T DE 69414686T DE 69414686 T DE69414686 T DE 69414686T DE 69414686 T2 DE69414686 T2 DE 69414686T2
Authority
DE
Germany
Prior art keywords
connections
electrically connecting
electrical
connecting structure
electrical connecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69414686T
Other languages
English (en)
Other versions
DE69414686D1 (de
Inventor
Akihiko Okano
Terutaka Okano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Holdings Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Application granted granted Critical
Publication of DE69414686D1 publication Critical patent/DE69414686D1/de
Publication of DE69414686T2 publication Critical patent/DE69414686T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/023—Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0233—Deformable particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion
DE69414686T 1993-07-27 1994-07-27 Elektrische verbindungsstruktur und verfahren zum elektrischen verbinden von anschluessen untereinander Expired - Fee Related DE69414686T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP20465893 1993-07-27
PCT/JP1994/001240 WO1995004387A1 (en) 1993-07-27 1994-07-27 An electrical connecting structure and a method for electrically connecting terminals to each other

Publications (2)

Publication Number Publication Date
DE69414686D1 DE69414686D1 (de) 1998-12-24
DE69414686T2 true DE69414686T2 (de) 1999-05-06

Family

ID=16494149

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69414686T Expired - Fee Related DE69414686T2 (de) 1993-07-27 1994-07-27 Elektrische verbindungsstruktur und verfahren zum elektrischen verbinden von anschluessen untereinander

Country Status (5)

Country Link
US (2) US5679928A (de)
EP (1) EP0662256B1 (de)
JP (1) JP3415845B2 (de)
DE (1) DE69414686T2 (de)
WO (1) WO1995004387A1 (de)

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US6223429B1 (en) * 1995-06-13 2001-05-01 Hitachi Chemical Company, Ltd. Method of production of semiconductor device
KR100544033B1 (ko) * 1996-09-30 2006-01-23 지멘스 악티엔게젤샤프트 샌드위치 구조의 마이크로 전자 부품
CN1218439C (zh) * 1997-02-27 2005-09-07 精工爱普生株式会社 连接结构体、液晶装置、电子装置和各向异性导电性粘接剂及其制造方法
CA2319539A1 (en) * 1998-01-30 1999-08-05 Loctite Corporation A method of forming a coating onto a non-random monolayer of particles, and products formed thereby
JP2000058593A (ja) * 1998-08-03 2000-02-25 Nec Corp 表面弾性波素子の実装構造及びその実装方法
JP4239310B2 (ja) * 1998-09-01 2009-03-18 ソニー株式会社 半導体装置の製造方法
JP3539315B2 (ja) * 1999-06-22 2004-07-07 株式会社村田製作所 電子デバイス素子の実装方法、および弾性表面波装置の製造方法
JP2001077501A (ja) * 1999-09-03 2001-03-23 Seiko Epson Corp フレキシブル配線基板、電気光学装置および電子機器
US6608258B1 (en) 1999-11-18 2003-08-19 Nortel Networks Limited High data rate coaxial interconnect technology between printed wiring boards
GB2365816B (en) * 2000-08-09 2002-11-13 Murata Manufacturing Co Method of bonding conductive adhesive and electrode,and bonded structure
TW540281B (en) * 2001-08-09 2003-07-01 Matsushita Electric Ind Co Ltd Manufacturing method of conductive paste material and manufacturing method of printing wiring base board
JP2003309338A (ja) * 2002-04-15 2003-10-31 Fujitsu Ltd 基板、接続構造及び電子装置
TWI286381B (en) * 2002-08-27 2007-09-01 Gigno Technology Co Ltd Multi-chip integrated module
US7164192B2 (en) * 2003-02-10 2007-01-16 Skyworks Solutions, Inc. Semiconductor die package with reduced inductance and reduced die attach flow out
EP1766726A1 (de) 2004-05-28 2007-03-28 Molex Incorporated Flexibles ringverbindungssystem
JP4456149B2 (ja) * 2004-05-28 2010-04-28 モレックス インコーポレイテド スプリング接触子及び基板
TWI285357B (en) * 2004-07-14 2007-08-11 Chi Mei Optoelectronics Corp Driving circuit of liquid crystal display device
US7687906B2 (en) * 2006-03-31 2010-03-30 Brother Kogyo Kabushiki Kaisha Connecting structure, method for forming bump, and method for producing device-mounting substrate
CN101141027B (zh) * 2007-09-20 2012-02-29 友达光电（苏州）有限公司 平面显示器基板的电路连接结构与其连接方法
JP5546353B2 (ja) * 2010-05-28 2014-07-09 京セラ株式会社 入力装置、およびこれを備えた表示装置
KR20130091521A (ko) * 2012-02-08 2013-08-19 삼성디스플레이 주식회사 이방성 도전층을 포함하는 미세 전자 소자 및 미세 전자 소자 형성 방법
KR102326117B1 (ko) * 2014-10-28 2021-11-15 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름, 그 제조 방법, 및 접속 구조체
CN111919165A (zh) * 2018-04-05 2020-11-10 凸版印刷株式会社 调光单元

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Publication number Priority date Publication date Assignee Title
US4696764A (en) * 1983-12-02 1987-09-29 Osaka Soda Co., Ltd. Electrically conductive adhesive composition
JPS63249393A (ja) * 1987-04-03 1988-10-17 シャープ株式会社 電子部品の接続方法
JPH0623350B2 (ja) * 1988-01-20 1994-03-30 信越ポリマー株式会社 異方導電性接着剤
AU612771B2 (en) * 1988-02-26 1991-07-18 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
US5031308A (en) * 1988-12-29 1991-07-16 Japan Radio Co., Ltd. Method of manufacturing multilayered printed-wiring-board
US5235741A (en) * 1989-08-18 1993-08-17 Semiconductor Energy Laboratory Co., Ltd. Electrical connection and method for making the same
JPH0817109B2 (ja) * 1989-08-18 1996-02-21 株式会社半導体エネルギー研究所 電気配線およびその接続方法
JPH0831350B2 (ja) * 1989-10-03 1996-03-27 日本黒鉛工業株式会社 ファインピッチ用導電異方性ヒートシールコネクタ部材の製造法
US5147084A (en) * 1990-07-18 1992-09-15 International Business Machines Corporation Interconnection structure and test method
JPH04301817A (ja) * 1991-03-29 1992-10-26 Rohm Co Ltd 液晶表示装置とその製造方法
US5225966A (en) * 1991-07-24 1993-07-06 At&T Bell Laboratories Conductive adhesive film techniques
JP3035021B2 (ja) * 1991-08-29 2000-04-17 株式会社リコー 液晶表示素子およびその製造方法
US5328087A (en) * 1993-03-29 1994-07-12 Microelectronics And Computer Technology Corporation Thermally and electrically conductive adhesive material and method of bonding with same

Also Published As

Publication number Publication date
WO1995004387A1 (en) 1995-02-09
DE69414686D1 (de) 1998-12-24
US6101708A (en) 2000-08-15
US5679928A (en) 1997-10-21
JPH08505001A (ja) 1996-05-28
EP0662256A1 (de) 1995-07-12
EP0662256B1 (de) 1998-11-18
JP3415845B2 (ja) 2003-06-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8328 Change in the person/name/address of the agent

Free format text: PATENTANWAELTE RUFF, WILHELM, BEIER, DAUSTER & PARTNER, 70173 STUTTGART

8327 Change in the person/name/address of the patent owner

Owner name: CITIZEN HOLDINGS CO., LTD., NISHITOKYO, TOKIO/, JP

8339 Ceased/non-payment of the annual fee