DE69024669D1 - Elektrische Verbinderstruktur und Verfahren, einen elektrischen Verbindungsaufbau zu erhalten - Google Patents

Elektrische Verbinderstruktur und Verfahren, einen elektrischen Verbindungsaufbau zu erhalten

Info

Publication number
DE69024669D1
DE69024669D1 DE69024669T DE69024669T DE69024669D1 DE 69024669 D1 DE69024669 D1 DE 69024669D1 DE 69024669 T DE69024669 T DE 69024669T DE 69024669 T DE69024669 T DE 69024669T DE 69024669 D1 DE69024669 D1 DE 69024669D1
Authority
DE
Germany
Prior art keywords
obtaining
connector structure
electrical
electrical connection
electrical connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69024669T
Other languages
English (en)
Other versions
DE69024669T2 (de
Inventor
John Behun
Anson Call
Frances Cappo
Marie Cole
Karl Hoebener
Bruno Klingel
John Milliken
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE69024669D1 publication Critical patent/DE69024669D1/de
Publication of DE69024669T2 publication Critical patent/DE69024669T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/66—Testing of connections, e.g. of plugs or non-disconnectable joints
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8138—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/81399—Material
    • H01L2224/814—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
DE69024669T 1990-07-18 1990-10-17 Elektrische Verbinderstruktur und Verfahren, einen elektrischen Verbindungsaufbau zu erhalten Expired - Fee Related DE69024669T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/555,120 US5060844A (en) 1990-07-18 1990-07-18 Interconnection structure and test method
PCT/US1990/005962 WO1992002039A1 (en) 1990-07-18 1990-10-17 Improved interconnection structure and test method

Publications (2)

Publication Number Publication Date
DE69024669D1 true DE69024669D1 (de) 1996-02-15
DE69024669T2 DE69024669T2 (de) 1996-07-04

Family

ID=24216049

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69024669T Expired - Fee Related DE69024669T2 (de) 1990-07-18 1990-10-17 Elektrische Verbinderstruktur und Verfahren, einen elektrischen Verbindungsaufbau zu erhalten

Country Status (5)

Country Link
US (1) US5060844A (de)
EP (1) EP0550432B1 (de)
JP (1) JP2567993B2 (de)
DE (1) DE69024669T2 (de)
WO (1) WO1992002039A1 (de)

Families Citing this family (102)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5203075A (en) * 1991-08-12 1993-04-20 Inernational Business Machines Method of bonding flexible circuit to cicuitized substrate to provide electrical connection therebetween using different solders
US5261155A (en) * 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders
US5186383A (en) * 1991-10-02 1993-02-16 Motorola, Inc. Method for forming solder bump interconnections to a solder-plated circuit trace
US5255839A (en) * 1992-01-02 1993-10-26 Motorola, Inc. Method for solder application and reflow
US5222014A (en) * 1992-03-02 1993-06-22 Motorola, Inc. Three-dimensional multi-chip pad array carrier
US5163605A (en) * 1992-04-30 1992-11-17 Allied-Signal Inc. Method for mounting components to a circuit board
US5234149A (en) * 1992-08-28 1993-08-10 At&T Bell Laboratories Debondable metallic bonding method
US5221038A (en) * 1992-10-05 1993-06-22 Motorola, Inc. Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
KR960005042B1 (ko) * 1992-11-07 1996-04-18 금성일렉트론주식회사 반도체 펙케지
US5324569A (en) * 1993-02-26 1994-06-28 Hewlett-Packard Company Composite transversely plastic interconnect for microchip carrier
US5275330A (en) * 1993-04-12 1994-01-04 International Business Machines Corp. Solder ball connect pad-on-via assembly process
US5401913A (en) * 1993-06-08 1995-03-28 Minnesota Mining And Manufacturing Company Electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
US5371328A (en) * 1993-08-20 1994-12-06 International Business Machines Corporation Component rework
US5442852A (en) * 1993-10-26 1995-08-22 Pacific Microelectronics Corporation Method of fabricating solder ball array
US5591941A (en) * 1993-10-28 1997-01-07 International Business Machines Corporation Solder ball interconnected assembly
US5435482A (en) * 1994-02-04 1995-07-25 Lsi Logic Corporation Integrated circuit having a coplanar solder ball contact array
US5540377A (en) * 1994-07-15 1996-07-30 Ito; Carl T. Solder ball placement machine
US5629835A (en) * 1994-07-19 1997-05-13 Olin Corporation Metal ball grid array package with improved thermal conductivity
US5532612A (en) * 1994-07-19 1996-07-02 Liang; Louis H. Methods and apparatus for test and burn-in of integrated circuit devices
JPH0846136A (ja) * 1994-07-26 1996-02-16 Fujitsu Ltd 半導体装置
US5492266A (en) * 1994-08-31 1996-02-20 International Business Machines Corporation Fine pitch solder deposits on printed circuit board process and product
US5551627A (en) * 1994-09-29 1996-09-03 Motorola, Inc. Alloy solder connect assembly and method of connection
US5493075A (en) * 1994-09-30 1996-02-20 International Business Machines Corporation Fine pitch solder formation on printed circuit board process and product
FR2726397B1 (fr) * 1994-10-28 1996-11-22 Commissariat Energie Atomique Film conducteur anisotrope pour la microconnectique
US5773195A (en) * 1994-12-01 1998-06-30 International Business Machines Corporation Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic structures including the cap, and a process of forming the cap and for forming multi-layer electronic structures including the cap
US5601675A (en) * 1994-12-06 1997-02-11 International Business Machines Corporation Reworkable electronic apparatus having a fusible layer for adhesively attached components, and method therefor
US5783870A (en) * 1995-03-16 1998-07-21 National Semiconductor Corporation Method for connecting packages of a stacked ball grid array structure
TW267265B (en) * 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
US6939173B1 (en) 1995-06-12 2005-09-06 Fci Americas Technology, Inc. Low cross talk and impedance controlled electrical connector with solder masses
US5685477A (en) * 1995-06-28 1997-11-11 Intel Corporation Method for attaching and handling conductive spheres to a substrate
JP3432982B2 (ja) * 1995-12-13 2003-08-04 沖電気工業株式会社 表面実装型半導体装置の製造方法
JP3116130B2 (ja) 1995-12-19 2000-12-11 住友金属工業株式会社 Ｂｇａ接続構造の形成方法
US5839188A (en) 1996-01-05 1998-11-24 Alliedsignal Inc. Method of manufacturing a printed circuit assembly
US6147870A (en) * 1996-01-05 2000-11-14 Honeywell International Inc. Printed circuit assembly having locally enhanced wiring density
JP3116273B2 (ja) * 1996-04-26 2000-12-11 日本特殊陶業株式会社 中継基板、その製造方法、基板と中継基板と取付基板とからなる構造体、基板と中継基板の接続体
US6093035A (en) * 1996-06-28 2000-07-25 Berg Technology, Inc. Contact for use in an electrical connector
US6024584A (en) 1996-10-10 2000-02-15 Berg Technology, Inc. High density connector
US5868304A (en) * 1996-07-02 1999-02-09 International Business Machines Corporation Socketable bump grid array shaped-solder on copper spheres
US5748452A (en) * 1996-07-23 1998-05-05 International Business Machines Corporation Multi-electronic device package
US5831336A (en) * 1996-07-25 1998-11-03 International Business Machines Corporation Ternary solder for the enhancement of C-4 fatigue life
TW406454B (en) 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US6042389A (en) * 1996-10-10 2000-03-28 Berg Technology, Inc. Low profile connector
US6241535B1 (en) 1996-10-10 2001-06-05 Berg Technology, Inc. Low profile connector
US6139336A (en) * 1996-11-14 2000-10-31 Berg Technology, Inc. High density connector having a ball type of contact surface
US5787580A (en) * 1996-11-19 1998-08-04 Lg Information & Communications, Ltd. Method for making radio-frequency module by ball grid array package
US5757073A (en) * 1996-12-13 1998-05-26 International Business Machines Corporation Heatsink and package structure for wirebond chip rework and replacement
US5956573A (en) * 1997-01-17 1999-09-21 International Business Machines Corporation Use of argon sputtering to modify surface properties by thin film deposition
US6330967B1 (en) 1997-03-13 2001-12-18 International Business Machines Corporation Process to produce a high temperature interconnection
US5953623A (en) * 1997-04-10 1999-09-14 International Business Machines Corporation Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection
JP3081559B2 (ja) 1997-06-04 2000-08-28 ニッコー株式会社 ボールグリッドアレイ型半導体装置およびその製造方法ならびに電子装置
US6195268B1 (en) * 1997-06-09 2001-02-27 Floyd K. Eide Stacking layers containing enclosed IC chips
US6120885A (en) 1997-07-10 2000-09-19 International Business Machines Corporation Structure, materials, and methods for socketable ball grid
US6337522B1 (en) 1997-07-10 2002-01-08 International Business Machines Corporation Structure employing electrically conductive adhesives
US6297559B1 (en) * 1997-07-10 2001-10-02 International Business Machines Corporation Structure, materials, and applications of ball grid array interconnections
DE1025587T1 (de) * 1997-07-21 2001-02-08 Aguila Technologies Inc Halbleiter-flipchippackung und herstellungsverfahren dafür
US6037658A (en) * 1997-10-07 2000-03-14 International Business Machines Corporation Electronic package with heat transfer means
US5956235A (en) * 1998-02-12 1999-09-21 International Business Machines Corporation Method and apparatus for flexibly connecting electronic devices
US6324754B1 (en) * 1998-03-25 2001-12-04 Tessera, Inc. Method for fabricating microelectronic assemblies
US6070782A (en) * 1998-07-09 2000-06-06 International Business Machines Corporation Socketable bump grid array shaped-solder on copper spheres
US6137693A (en) * 1998-07-31 2000-10-24 Agilent Technologies Inc. High-frequency electronic package with arbitrarily-shaped interconnects and integral shielding
JP4239310B2 (ja) * 1998-09-01 2009-03-18 ソニー株式会社 半導体装置の製造方法
US6595408B1 (en) * 1998-10-07 2003-07-22 Micron Technology, Inc. Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
US6268275B1 (en) 1998-10-08 2001-07-31 Micron Technology, Inc. Method of locating conductive spheres utilizing screen and hopper of solder balls
JP3407275B2 (ja) * 1998-10-28 2003-05-19 インターナショナル・ビジネス・マシーンズ・コーポレーション バンプ及びその形成方法
US6281452B1 (en) 1998-12-03 2001-08-28 International Business Machines Corporation Multi-level thin-film electronic packaging structure and related method
GB2389460A (en) * 1998-12-22 2003-12-10 Nec Corp Mounting semiconductor packages on substrates
US6583354B2 (en) * 1999-04-27 2003-06-24 International Business Machines Corporation Method of reforming reformable members of an electronic package and the resultant electronic package
US6225206B1 (en) 1999-05-10 2001-05-01 International Business Machines Corporation Flip chip C4 extension structure and process
US6090633A (en) * 1999-09-22 2000-07-18 International Business Machines Corporation Multiple-plane pair thin-film structure and process of manufacture
US6142361A (en) * 1999-12-09 2000-11-07 International Business Machines Corporation Chip C4 assembly improvement using magnetic force and adhesive
US6399896B1 (en) 2000-03-15 2002-06-04 International Business Machines Corporation Circuit package having low modulus, conformal mounting pads
AT413062B (de) * 2000-07-12 2005-10-15 Tridonic Optoelectronics Gmbh Verfahren zur herstellung einer led-lichtquelle
US6858941B2 (en) * 2000-12-07 2005-02-22 International Business Machines Corporation Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array
JP3819806B2 (ja) * 2002-05-17 2006-09-13 富士通株式会社 バンプ電極付き電子部品およびその製造方法
US6818988B2 (en) * 2002-07-25 2004-11-16 International Business Machines Corporation Method of making a circuitized substrate and the resultant circuitized substrate
US7538440B2 (en) * 2003-04-30 2009-05-26 Intel Corporation Method for improved high current component interconnections
US7297003B2 (en) 2003-07-16 2007-11-20 Gryphics, Inc. Fine pitch electrical interconnect assembly
US7537461B2 (en) * 2003-07-16 2009-05-26 Gryphics, Inc. Fine pitch electrical interconnect assembly
EP1645173A2 (de) * 2003-07-16 2006-04-12 Gryphics, Inc. Elektrische verbindungsbaugruppe mit verriegelndem kontaktsystem
US7445141B2 (en) * 2004-09-22 2008-11-04 International Business Machines Corporation Solder interconnection array with optimal mechanical integrity
US20060196917A1 (en) * 2004-12-02 2006-09-07 International Business Machines Corporation Metallic plating for socket application in ball grid array packages
US7524698B2 (en) * 2004-12-02 2009-04-28 International Business Machines Corporation Handling and positioning of metallic plated balls for socket application in ball grid array packages
US7825512B2 (en) * 2005-09-12 2010-11-02 Hewlett-Packard Development Company, L.P. Electronic package with compliant electrically-conductive ball interconnect
US8044502B2 (en) 2006-03-20 2011-10-25 Gryphics, Inc. Composite contact for fine pitch electrical interconnect assembly
US20080308932A1 (en) * 2007-06-12 2008-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package structures
US8366485B2 (en) 2009-03-19 2013-02-05 Fci Americas Technology Llc Electrical connector having ribbed ground plate
US8969734B2 (en) 2009-04-01 2015-03-03 Advanced Interconnections Corp. Terminal assembly with regions of differing solderability
US8119926B2 (en) * 2009-04-01 2012-02-21 Advanced Interconnections Corp. Terminal assembly with regions of differing solderability
FR2948493B1 (fr) * 2009-07-27 2012-02-10 St Microelectronics Grenoble 2 Procede de connexion electrique d'un fil a un plot d'une puce de circuits integres et dispositif electronique
US20120002386A1 (en) * 2010-07-01 2012-01-05 Nokia Corporation Method and Apparatus for Improving the Reliability of Solder Joints
EP2624034A1 (de) 2012-01-31 2013-08-07 Fci Abbaubare optische Kupplungsvorrichtung
WO2013142335A1 (en) * 2012-03-20 2013-09-26 Fry's Metals, Inc. Solder preforms and solder alloy assembly methods
USD718253S1 (en) 2012-04-13 2014-11-25 Fci Americas Technology Llc Electrical cable connector
US8944831B2 (en) 2012-04-13 2015-02-03 Fci Americas Technology Llc Electrical connector having ribbed ground plate with engagement members
US9257778B2 (en) 2012-04-13 2016-02-09 Fci Americas Technology High speed electrical connector
USD727268S1 (en) 2012-04-13 2015-04-21 Fci Americas Technology Llc Vertical electrical connector
USD727852S1 (en) 2012-04-13 2015-04-28 Fci Americas Technology Llc Ground shield for a right angle electrical connector
US9543703B2 (en) 2012-07-11 2017-01-10 Fci Americas Technology Llc Electrical connector with reduced stack height
USD751507S1 (en) 2012-07-11 2016-03-15 Fci Americas Technology Llc Electrical connector
USD745852S1 (en) 2013-01-25 2015-12-22 Fci Americas Technology Llc Electrical connector
USD720698S1 (en) 2013-03-15 2015-01-06 Fci Americas Technology Llc Electrical cable connector
TWI760230B (zh) * 2020-06-09 2022-04-01 台灣愛司帝科技股份有限公司 晶片檢測方法、晶片檢測結構以及晶片承載結構

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1353671A (en) * 1971-06-10 1974-05-22 Int Computers Ltd Methods of forming circuit interconnections
JPS5034743A (de) * 1973-07-31 1975-04-03
US4012832A (en) * 1976-03-12 1977-03-22 Sperry Rand Corporation Method for non-destructive removal of semiconductor devices
JPS53149763A (en) * 1977-06-01 1978-12-27 Citizen Watch Co Ltd Mounting method of semiconductor integrate circuit
JPS5446365A (en) * 1977-09-20 1979-04-12 Nippon Electric Co Hybrid integrated circuit device
US4376505A (en) * 1981-01-05 1983-03-15 Western Electric Co., Inc. Methods for applying solder to an article
JPS58103198A (ja) * 1981-12-15 1983-06-20 シャープ株式会社 電子部品の取付け方法
US4545610A (en) * 1983-11-25 1985-10-08 International Business Machines Corporation Method for forming elongated solder connections between a semiconductor device and a supporting substrate
JPS6187396A (ja) * 1984-10-05 1986-05-02 株式会社日立製作所 電子回路装置とその製造方法
US4604644A (en) * 1985-01-28 1986-08-05 International Business Machines Corporation Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making
DE3676832D1 (de) * 1985-02-15 1991-02-21 Ibm Loetverbindung zwischen chip und substrat und verfahren zur herstellung.
US4585157A (en) * 1985-04-04 1986-04-29 General Motors Corporation Tape bonding of two integrated circuits into one tape frame
JPS61271319A (ja) * 1985-05-24 1986-12-01 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
US4661192A (en) * 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
DE3684602D1 (de) * 1986-10-08 1992-04-30 Ibm Verfahren zum herstellen von loetkontakten fuer ein keramisches modul ohne steckerstifte.
US4749120A (en) * 1986-12-18 1988-06-07 Matsushita Electric Industrial Co., Ltd. Method of connecting a semiconductor device to a wiring board
JPH0750759B2 (ja) * 1988-07-01 1995-05-31 シャープ株式会社 半導体装置
JPH0666358B2 (ja) * 1989-01-03 1994-08-24 モトローラ・インコーポレーテッド 高密度ソルダ・バンプの製造方法と高密度ソルダ・バンプ用基板ソケット

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DE69024669T2 (de) 1996-07-04
EP0550432A1 (de) 1993-07-14
JP2567993B2 (ja) 1996-12-25
JPH05508736A (ja) 1993-12-02
EP0550432B1 (de) 1996-01-03
WO1992002039A1 (en) 1992-02-06
US5060844A (en) 1991-10-29

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