DE69233232D1 - Elektrischer Verbindungskörper und Herstellungsverfahren dafür - Google Patents

Elektrischer Verbindungskörper und Herstellungsverfahren dafür

Info

Publication number
DE69233232D1
DE69233232D1 DE69233232T DE69233232T DE69233232D1 DE 69233232 D1 DE69233232 D1 DE 69233232D1 DE 69233232 T DE69233232 T DE 69233232T DE 69233232 T DE69233232 T DE 69233232T DE 69233232 D1 DE69233232 D1 DE 69233232D1
Authority
DE
Germany
Prior art keywords
manufacturing
electrical connector
connector body
method therefor
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69233232T
Other languages
English (en)
Other versions
DE69233232T2 (de
Inventor
Takashi Sakaki
Tetsuo Yoshizawa
Toyohide Miyazaki
Hiroshi Kondo
Yoshimi Terayama
Yuichi Ikegami
Takahiro Okabayashi
Kazuo Kondo
Yoichi Tamura
Yasuo Nakatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Nippon Steel Corp
Original Assignee
Canon Inc
Sumitomo Metal Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP5389891A external-priority patent/JP3038361B2/ja
Priority claimed from JP5389791A external-priority patent/JPH04269474A/ja
Priority claimed from JP3087596A external-priority patent/JP2832560B2/ja
Priority claimed from JP3089828A external-priority patent/JP3057206B2/ja
Application filed by Canon Inc, Sumitomo Metal Industries Ltd filed Critical Canon Inc
Application granted granted Critical
Publication of DE69233232D1 publication Critical patent/DE69233232D1/de
Publication of DE69233232T2 publication Critical patent/DE69233232T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Wire Bonding (AREA)
DE69233232T 1991-02-22 1992-02-21 Elektrischer Verbindungskörper und Herstellungsverfahren dafür Expired - Fee Related DE69233232T2 (de)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP5389791 1991-02-22
JP5389891A JP3038361B2 (ja) 1991-02-22 1991-02-22 電気的接続部材の製造方法
JP5389891 1991-02-22
JP5389791A JPH04269474A (ja) 1991-02-22 1991-02-22 電気的接続部材
JP8759691 1991-03-26
JP3087596A JP2832560B2 (ja) 1991-03-26 1991-03-26 電気的接続部材及びその製造方法
JP3089828A JP3057206B2 (ja) 1991-03-27 1991-03-27 電気的接続部材及びその製造方法
JP8982891 1991-03-27

Publications (2)

Publication Number Publication Date
DE69233232D1 true DE69233232D1 (de) 2003-11-20
DE69233232T2 DE69233232T2 (de) 2004-08-05

Family

ID=27462976

Family Applications (2)

Application Number Title Priority Date Filing Date
DE69233684T Expired - Lifetime DE69233684D1 (de) 1991-02-22 1992-02-21 Elektrischer Verbindungskörper und Herstellungsverfahren dafür
DE69233232T Expired - Fee Related DE69233232T2 (de) 1991-02-22 1992-02-21 Elektrischer Verbindungskörper und Herstellungsverfahren dafür

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE69233684T Expired - Lifetime DE69233684D1 (de) 1991-02-22 1992-02-21 Elektrischer Verbindungskörper und Herstellungsverfahren dafür

Country Status (3)

Country Link
US (2) US5860818A (de)
EP (2) EP0805493B1 (de)
DE (2) DE69233684D1 (de)

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US6271482B1 (en) * 1994-08-23 2001-08-07 Thomas & Betts International, Inc. Conductive elastomer interconnect
US5613861A (en) * 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
US6703565B1 (en) * 1996-09-06 2004-03-09 Matsushita Electric Industrial Co., Ltd. Printed wiring board
DE19650461A1 (de) * 1996-12-05 1998-06-10 Schlafhorst & Co W Verfahren zur Herstellung eines Spinnkopses in einer Topfspinnvorrichtung
FR2766618B1 (fr) * 1997-07-22 2000-12-01 Commissariat Energie Atomique Procede de fabrication d'un film conducteur anisotrope a inserts conducteurs
US6194053B1 (en) * 1998-02-26 2001-02-27 International Business Machines Corporation Apparatus and method fabricating buried and flat metal features
US6565954B2 (en) 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
SG86345A1 (en) 1998-05-14 2002-02-19 Matsushita Electric Ind Co Ltd Circuit board and method of manufacturing the same
US6019610A (en) * 1998-11-23 2000-02-01 Glatts, Iii; George F. Elastomeric connector
US6281452B1 (en) * 1998-12-03 2001-08-28 International Business Machines Corporation Multi-level thin-film electronic packaging structure and related method
TW396462B (en) * 1998-12-17 2000-07-01 Eriston Technologies Pte Ltd Bumpless flip chip assembly with solder via
US6518514B2 (en) * 2000-08-21 2003-02-11 Matsushita Electric Industrial Co., Ltd. Circuit board and production of the same
US6840777B2 (en) * 2000-11-30 2005-01-11 Intel Corporation Solderless electronics packaging
US7011530B2 (en) * 2002-05-24 2006-03-14 Sitaraman Suresh K Multi-axis compliance spring
US6799977B2 (en) * 2002-07-11 2004-10-05 Hewlett-Packard Development Company, L.P. Socket having foam metal contacts
US7479318B2 (en) * 2003-09-08 2009-01-20 E.I. Du Pont De Nemours And Company Fibrillar microstructure and processes for the production thereof
US7282932B2 (en) * 2004-03-02 2007-10-16 Micron Technology, Inc. Compliant contact pin assembly, card system and methods thereof
EP1850419B1 (de) * 2005-02-16 2013-06-19 JSR Corporation Zusammengesetzte leitfähige folie, verfahren zu ihrer herstellung, anisotroper leitfähiger verbinder, adapter und untersuchungseinrichtung
US7922497B2 (en) * 2005-10-11 2011-04-12 Jsr Corporation Anisotropic conductive connector and inspection equipment of circuit device
US8618647B2 (en) * 2011-08-01 2013-12-31 Tessera, Inc. Packaged microelectronic elements having blind vias for heat dissipation
JP5367914B2 (ja) * 2011-08-11 2013-12-11 古河電気工業株式会社 配線基板およびその製造方法ならびに半導体装置
US10037941B2 (en) 2014-12-12 2018-07-31 Qualcomm Incorporated Integrated device package comprising photo sensitive fill between a substrate and a die
CN110545637B (zh) * 2018-05-29 2021-08-24 鹏鼎控股(深圳)股份有限公司 电路板及其制作方法
US11201426B2 (en) * 2018-08-13 2021-12-14 Apple Inc. Electrical contact appearance and protection

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US3040119A (en) * 1960-12-27 1962-06-19 Granzow Clarence Edward Electric circuit board
US3495207A (en) * 1968-05-28 1970-02-10 Martin Marietta Corp Wire terminals
US3541222A (en) * 1969-01-13 1970-11-17 Bunker Ramo Connector screen for interconnecting adjacent surfaces of laminar circuits and method of making
US3889350A (en) * 1971-03-29 1975-06-17 Ford Motor Co Method of producing a forged article from prealloyed water-atomized ferrous alloy powder
US3819430A (en) * 1973-02-05 1974-06-25 Gen Dynamics Corp Method of manufacturing circuit board connectors
US3880486A (en) * 1973-03-05 1975-04-29 Epis Corp Apparatus and system for interconnecting circuits and electronic components
US3904934A (en) * 1973-03-26 1975-09-09 Massachusetts Inst Technology Interconnection of planar electronic structures
US4240198A (en) * 1979-02-21 1980-12-23 International Telephone And Telegraph Corporation Method of making conductive elastomer connector
US4349620A (en) * 1979-06-15 1982-09-14 E. I. Du Pont De Nemours And Company Solvent developable photoresist film
FR2505094A1 (fr) * 1981-04-29 1982-11-05 Trt Telecom Radio Electr Procede de realisation des circuits hyperfrequences
US4413051A (en) * 1981-05-04 1983-11-01 Dynamics Research Corporation Method for providing high resolution, highly defined, thick film patterns
JPS59139636A (ja) * 1983-01-20 1984-08-10 Matsushita Electric Ind Co Ltd ボンデイング方法
JPS60214532A (ja) * 1984-04-11 1985-10-26 Nippon Telegr & Teleph Corp <Ntt> パタ−ン形成方法
JPS6187396A (ja) * 1984-10-05 1986-05-02 株式会社日立製作所 電子回路装置とその製造方法
US4683024A (en) * 1985-02-04 1987-07-28 American Telephone And Telegraph Company, At&T Bell Laboratories Device fabrication method using spin-on glass resins
JPS61236192A (ja) * 1985-04-12 1986-10-21 株式会社日立製作所 セラミツク基板の電極形成方法
JPS62241345A (ja) * 1986-04-11 1987-10-22 Mitsui Mining & Smelting Co Ltd バンプ付フィルムキャリヤの製造法
EP0284820A3 (de) * 1987-03-04 1989-03-08 Canon Kabushiki Kaisha Elektrisches Verbindungsteil und elektrisches Schaltungsteil und elektrische Schaltungsanordnung mit dem Verbindungsteil
JPS63246835A (ja) * 1987-04-02 1988-10-13 Canon Inc 電気的接続部材及びそれを用いた電気回路部材
JPS63228726A (ja) * 1987-03-18 1988-09-22 Canon Inc 電気的接続部材及びそれを用いた電気回路部材
JPS63222437A (ja) * 1987-03-11 1988-09-16 Canon Inc 電気回路部材
JPH01118126A (ja) * 1987-10-31 1989-05-10 Fujitsu Ltd パターン形成方法
ATE137064T1 (de) * 1988-02-05 1996-05-15 Raychem Ltd Verfahren zum herstellen eines uniaxial elektrisch leitenden artikels
JP2758053B2 (ja) * 1988-02-05 1998-05-25 レイケム・リミテッド 単一軸状電気伝導部品の使用
JP2573016B2 (ja) * 1988-02-27 1997-01-16 アンプ インコーポレーテッド マイクロ入出力ピンおよびその製造方法
DE68917231T2 (de) 1988-05-18 1994-12-15 Canon Kk Sondenkarte, Verfahren zur Messung eines zu messenden Teiles mit derselben und elektrischer Schaltungsteil.
EP0349756A3 (de) * 1988-05-30 1991-03-20 Canon Kabushiki Kaisha Herstellung einer elektrischen Schaltkreisvorrichtung
US5283468A (en) 1988-05-30 1994-02-01 Canon Kabushiki Kaisha Electric circuit apparatus
US5197892A (en) 1988-05-31 1993-03-30 Canon Kabushiki Kaisha Electric circuit device having an electric connecting member and electric circuit components
JP2702507B2 (ja) * 1988-05-31 1998-01-21 キヤノン株式会社 電気的接続部材及びその製造方法
JP2764098B2 (ja) * 1988-08-02 1998-06-11 株式会社荏原シンワ 紫外線殺菌灯を利用した液体殺菌装置
US4885662A (en) * 1988-08-12 1989-12-05 Leonard A. Alkov Circuit module connection system
US4931134A (en) * 1989-08-15 1990-06-05 Parlex Corporation Method of using laser routing to form a rigid/flex circuit board
US5049084A (en) * 1989-12-05 1991-09-17 Rogers Corporation Electrical circuit board interconnect
US5135606A (en) 1989-12-08 1992-08-04 Canon Kabushiki Kaisha Process for preparing electrical connecting member
US5379515A (en) 1989-12-11 1995-01-10 Canon Kabushiki Kaisha Process for preparing electrical connecting member
US5145552A (en) 1989-12-21 1992-09-08 Canon Kabushiki Kaisha Process for preparing electrical connecting member
FR2659495B1 (fr) * 1990-03-06 1997-01-24 Andre Schiltz Connecteur elastomerique pour circuits integres ou analogues, et son procede de fabrication.
US5071359A (en) * 1990-04-27 1991-12-10 Rogers Corporation Array connector
DE69233088T2 (de) 1991-02-25 2003-12-24 Canon K.K., Tokio/Tokyo Elektrisches Verbindungsteil und sein Herstellungsverfahren
JP3053675B2 (ja) * 1991-09-09 2000-06-19 ローム株式会社 半導体装置およびその製造方法
US5376226A (en) * 1993-01-28 1994-12-27 Trw Inc. Method of making connector for integrated circuit chips
KR960016007B1 (ko) * 1993-02-08 1996-11-25 삼성전자 주식회사 반도체 칩 범프의 제조방법
US5447871A (en) * 1993-03-05 1995-09-05 Goldstein; Edward F. Electrically conductive interconnection through a body of semiconductor material
GB9401869D0 (en) * 1994-02-01 1994-03-30 Heinze Dyconex Patente Improvements in and relating to printed circuit boards

Also Published As

Publication number Publication date
US5860818A (en) 1999-01-19
DE69233684D1 (de) 2007-04-12
DE69233232T2 (de) 2004-08-05
EP0805493B1 (de) 2007-02-28
EP0805493A3 (de) 1998-02-04
US6511607B1 (en) 2003-01-28
EP0504614A1 (de) 1992-09-23
EP0805493A2 (de) 1997-11-05
EP0504614B1 (de) 2003-10-15

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee