JPWO2006123554A1 - フリップチップ実装体およびフリップチップ実装方法 - Google Patents
フリップチップ実装体およびフリップチップ実装方法 Download PDFInfo
- Publication number
- JPWO2006123554A1 JPWO2006123554A1 JP2007516252A JP2007516252A JPWO2006123554A1 JP WO2006123554 A1 JPWO2006123554 A1 JP WO2006123554A1 JP 2007516252 A JP2007516252 A JP 2007516252A JP 2007516252 A JP2007516252 A JP 2007516252A JP WO2006123554 A1 JPWO2006123554 A1 JP WO2006123554A1
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- resin
- solder
- semiconductor chip
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
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- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H01L24/92—Specific sequence of method steps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H01L2224/161—Disposition
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Abstract
Description
本発明の電子部品実装体の製造方法は、電極端子が配列された表面を有する電子部品を用意する工程(a)と、前記電子部品の電極端子に対応して配列された電極端子が配列された表面を有する回路基板を用意する工程(b)と、前記電子部品または回路基板の少なくとも一方に、前記電極端子を有する面上の前記電極端子部以外に、複数個のスペーサが形成されてなり(c)、樹脂中に、半田粉と、当該樹脂が加熱されたときに沸騰する対流添加剤とが含有された半田樹脂ペーストを、前記回路基板上に付与する工程(d)と、前記電子部品を、半田樹脂ペーストを挟んで、前記回路基板の上に配置する工程(e)と、前記半田樹脂ペーストを加熱することにより、前記対流添加剤を沸騰させて前記樹脂により、前記電子部品が有する電極端子と、前記電極端子に対応して前記回路基板に形成されている電極端子とを電気的に接続する工程(f)を包含し、前記工程で用意されている複数個のスペーサにより、前記電子部品に配列した電極端子と、それに対応して回路基板面上に配列された電極端子間には、一定の間隙が形成されている。
前記電子部品に配列した電極端子と、それに対応して回路基板面上に配列された電極端子間には、一定の間隙が形成されている。
11 裏面電極端子
20 スペーサ
21、22 接合パッド
23 コア材料
24 樹脂材料
30 半田樹脂ペースト
31 対流
40 回路基板
41 電極端子
50 半田バンプ
100 電子部品実装体
110 回路基板
111 接続端子
112 対流添加剤
113 半田樹脂ペースト
121 素子電極
122 半田バンプ
201,307,401,510 回路基板
204,308,402,511 接続端子
407 樹脂
306 樹脂組成物
206,304,404,507 半導体チップ
207,305,406,508 電極端子
208,313,405,514 はんだ層
200,400 フリップチップ実装体
202,302 突起部
203,407,509 樹脂組成物
205,301 板状体
209,314 擬似バンプ
210,309 電極
403,504 箱状体
303 真空吸引装置
310 接合電極
311,512 ヒータ
312,513 ガス
408,506 孔
409,505 鍔
501 搬送装置
502 ヒンジ
これにより、半導体チップ120の素子電極121と、回路基板110の接続端子111との間を電気的に接続する接続体122が形成される。その後、半田樹脂ペースト113中の樹脂を硬化させて、半導体チップ120を回路基板110に固定させる。
図4(a)〜図4(e)は、本実施形態の改変例にかかる電子部品実装体の主要工程中及び完成時の概略断面図である。さらに、図5はこの実装工程のフローチャートである。
図8(a)は、本発明の実施の形態1におけるフリップチップ実装体の斜視図であり、図8(b)は、図8(a)のA−A線断面図である。
図11(a)は、本発明の実施の形態2におけるフリップチップ実装体の斜視図であり、図11(b)は、図11(a)のA−A線断面図である。
本発明の電子部品実装体の製造方法は、電極端子が配列された表面を有する電子部品を用意する工程(a)と、前記電子部品の電極端子に対応して配列された電極端子が配列された表面を有する回路基板を用意する工程(b)と、前記電子部品または回路基板の少なくとも一方に、前記電極端子を有する面上の前記電極端子部以外に、複数個のスペーサが形成されてなり(c)、樹脂中に、半田粉と、当該樹脂が加熱されたときに沸騰する対流添加剤とが含有された半田樹脂ペーストを、前記回路基板上に付与する工程(d)と、前記電子部品を、半田樹脂ペーストを挟んで、前記回路基板の上に配置する工程(e)と、前記半田樹脂ペーストを加熱することにより、前記対流添加剤を沸騰させて前記樹脂により、前記電子部品が有する電極端子と、前記電極端子に対応して前記回路基板に形成されている電極端子とを電気的に接続する工程(f)を包含し、前記工程で用意されている複数個のスペーサにより、前記電子部品に配列した電極端子と、それに対応して回路基板面上に配列された電極端子間には、一定の間隙が形成されている。
前記電子部品に配列した電極端子と、それに対応して回路基板面上に配列された電極端子間には、一定の間隙が形成されている。
図4(a)〜図4(e)は、本実施形態の改変例にかかる電子部品実装体の主要工程中及び完成時の概略断面図である。さらに、図5はこの実装工程のフローチャートである。
図8(a)は、本発明の実施の形態1におけるフリップチップ実装体の斜視図であり、図8(b)は、図8(a)のA−A線断面図である。
図11(a)は、本発明の実施の形態2におけるフリップチップ実装体の斜視図であり、図11(b)は、図11(a)のA−A線断面図である。
11 裏面電極端子
20 スペーサ
21、22 接合パッド
23 コア材料
24 樹脂材料
30 半田樹脂ペースト
31 対流
40 回路基板
41 電極端子
50 半田バンプ
100 電子部品実装体
110 回路基板
111 接続端子
112 対流添加剤
113 半田樹脂ペースト
121 素子電極
122 半田バンプ
201,307,401,510 回路基板
204,308,402,511 接続端子
407 樹脂
306 樹脂組成物
206,304,404,507 半導体チップ
207,305,406,508 電極端子
208,313,405,514 はんだ層
200,400 フリップチップ実装体
202,302 突起部
203,407,509 樹脂組成物
205,301 板状体
209,314 擬似バンプ
210,309 電極
403,504 箱状体
303 真空吸引装置
310 接合電極
311,512 ヒータ
312,513 ガス
408,506 孔
409,505 鍔
501 搬送装置
502 ヒンジ
Claims (35)
- 電子部品と、
前記電子部品が実装される回路基板と
を備えた実装体であって、
前記電子部品には、前記回路基板に面する電子部品表面に複数の電極端子が形成されており、
前記回路基板には、前記複数の電極端子のそれぞれに対応して、電極端子が形成されており、
前記接続した回路基板の電極端子と電子部品の電極端子部以外の領域に、複数個のスペーサ部材を配した構成をしており、
前記回路基板の電極端子と、前記電子部品の電極端子とは、自己集合的に形成された半田バンプによって電気的に接続されている、電子部品実装体。 - 前記複数個のスペーサの高さは、
前記半田バンプの高さが、
前記電子部品の電極端子において最も短い辺の長さの半分と、
前記回路基板の電極端子において最も短い辺の長さの半分を
加えた高さ以下となるようにして設定した、請求項1記載の電子部品実装体。 - 前記複数個のスペーサ部材が、半田材料である、請求項1または請求項2記載の電子部品実装体。
- 前記複数個のスペーサ部材が、熱硬化型樹脂材料である、請求項1または請求項2記載の電子部品実装体。
- 前記複数個のスペーサ部材が、光硬化型樹脂材料である、請求項1または請求項2記載の電子部品実装体。
- 前記複数個のスペーサ部材が、熱可塑性樹脂材料である、請求項1または請求項2記載の電子部品実装体。
- 前記複数個のスペーサ部材が、ホットメルト型樹脂材料である、請求項1または請求項2記載の電子部品実装体。
- 前記複数個のスペーサ部材が、コア材を樹脂材料で被覆した構成を有している、請求項1または請求項2記載の電子部品実装体。
- 請求項1から8記載の何れか一つに記載の電子部品実装体を備えた電子機器。
- 電極端子が配列された表面を有する電子部品を用意する工程(a)、
前記電子部品の電極端子に対応して配列された電極端子が配列された表面を有する回路基板を用意する工程(b)、
前記電子部品または回路基板の少なくとも一方に、前記電極端子を有する面上の前記電極端子部以外に、複数個のスペーサが形成されてなり(c)、
樹脂中に、半田粉と、当該樹脂が加熱されたときに沸騰する対流添加剤とが含有された半田樹脂ペーストを、前記電子部品または前記回路基板の少なくとも一方の面上に付与する工程(d)、
前記電子部品を、前記半田樹脂ペーストを挟んで、前記回路基板の上に配置する工程(e)および、
前記半田樹脂ペーストを加熱することにより、前記対流添加剤を沸騰させて前記樹脂により、前記電子部品が有する電極端子と、前記電極端子に対応して前記回路基板に形成されている電極端子とを、前記樹脂中で溶融した前記半田粉を前記樹脂中で流動させ、前記半田粉を自己集合および成長させることにより電気的に接続する工程(f)、
を包含し、前記工程で用意されている複数個のスペーサにより、前記電子部品に配列した電極端子と、それに対応して回路基板面上に配列された電極端子間には、一定の間隙が形成されている、請求項1から請求項8いずれかに記載の電子部品実装体の製造方法。 - 電極端子が配列された表面を有する電子部品を用意する工程(a)、
前記電子部品の電極端子に対応して配列された電極端子が配列された表面を有する回路基板を用意する工程(b)、
前記電子部品または回路基板の少なくとも一方に、前記電極端子を有する面上の前記電極端子部以外に、複数個のスペーサが形成されてなり(c)、
前記電子部品を、前記回路基板の上に配置する工程(d)、
樹脂中に、半田粉と、当該樹脂が加熱されたときに沸騰する対流添加剤とが含有された半田樹脂ペーストを、前記電子部品と回路基板間に形成された空間に充填する工程(e)および、
前記半田樹脂ペーストを加熱することにより、前記対流添加剤を沸騰させて前記樹脂により、前記電子部品が有する電極端子と、前記電極端子に対応して前記回路基板に形成されている電極端子とを、前記樹脂中で溶融した前記半田粉を前記樹脂中で流動させ、前記半田粉を自己集合および成長させることにより電気的に接続する工程(f)、
を包含し、前記工程で用意されている複数個のスペーサにより、前記電子部品に配列した電極端子と、それに対応して回路基板面上に配列された電極端子との間に、一定の間隙が形成されている、請求項1から請求項8いずれかに記載の電子部品実装体の製造方法。 - 前記電子部品を、前記回路基板の上に配置する工程において、前記複数個のスペーサによって電子部品と回路基板との付着、保持を行う、請求項10または請求項11に記載の電子部品実装体の製造方法。
- 複数の接続端子を有する回路基板と、
前記接続端子と対向して配置される複数の電極端子を有する半導体チップと、
前記半導体チップが内側で位置合わせされ接着された、少なくとも端部に2つの突起部を有する板状体とを有し、
前記回路基板の前記接続端子と前記半導体チップの前記電極端子とがはんだ層で電気的に接続されるとともに、少なくとも前記回路基板と前記半導体チップが樹脂で固定されていることを特徴とするフリップチップ実装体。 - 前記回路基板の前記接続端子を囲うように電極を設け、前記電極の上に擬似バンプが形成されていることを特徴とする請求項13に記載のフリップチップ実装体。
- 前記電極が、離散的に形成されていることを特徴とする請求項14に記載のフリップチップ実装体。
- 少なくとも前記板状体の前記突起部の先端が金属または金属を被覆した樹脂からなり、はんだに対して濡れ性を有していることを特徴とする請求項13または請求項14に記載のフリップチップ実装体。
- 前記回路基板と前記板状体の前記突起部が圧着または超音波接合によって接合されていることを特徴とする請求項13または請求項14に記載のフリップチップ実装体。
- 前記回路基板と前記板状体が前記樹脂組成物の樹脂によって接合されたことを特徴とする請求項13から請求項17までのいずれかに記載のフリップチップ実装体。
- 複数の接続端子を有する回路基板と対向させて、複数の電極端子を有する半導体チップを配置し、前記回路基板の接続端子と前記半導体チップの電極端子とを電気的に接続するフリップチップ実装方法であって、
少なくとも端部に2つの突起部を有する板状体に前記半導体チップを位置合わせして接着させる工程と、
はんだ粉と対流添加剤および樹脂を主成分とする樹脂組成物を前記回路基板または前記半導体チップに塗布または付着する工程と、
前記回路基板の上に前記半導体チップを接着した前記板状体の前記突起部を位置合わせして配置するとともに、前記突起部により前記回路基板と前記半導体チップとの間隔を一定にして固定する工程と、
前記樹脂組成物を前記はんだ粉が溶融する温度に加熱し、前記対流添加剤の沸騰または分解によりガスを発生させる工程と、
前記ガスが対流し前記板状体の前記突起部の間から排出する過程で、溶融した前記はんだ粉を前記樹脂組成物中で流動させ、前記はんだ粉を自己集合および成長させることにより前記接続端子と前記電極端子とを電気的に接続させる工程とを有することを特徴とするフリップチップ実装方法。 - 前記樹脂組成物が、板状樹脂、シート状樹脂またはペースト状樹脂からなり、前記回路基板または前記半導体チップに付着させることが可能であることを特徴とする請求項19に記載のフリップチップ実装方法。
- 前記板状体の前記突起部を前記回路基板に固定する工程が、予め前記回路基板の上に形成された固定用のはんだによって固定されていることを特徴とする請求項19または請求項20に記載のフリップチップ実装方法。
- 前記板状体の前記突起部を前記回路基板に固定する工程が、
前記回路基板に前記板状体の前記突起部を圧着または超音波接合によって接合したことを特徴とする請求項19または請求項20に記載のフリップチップ実装方法。 - 複数の接続端子を有する回路基板と、
前記接続端子と対向して配置される複数の電極端子を有する半導体チップと、
前記半導体チップが内側で位置合わせされ接着された、少なくとも1方向が開口した通気可能な孔を有する箱状体とを有し、
前記回路基板の前記接続端子と前記半導体チップの前記電極端子とがはんだ層で電気的に接続されるとともに、少なくとも前記回路基板と前記半導体チップが樹脂で固定されていることを特徴とするフリップチップ実装体。 - 前記箱状体が、前記半導体チップを覆い、前記箱状体の開口した周辺部に周端辺が突き出した鍔を有する箱形状に加工されたことを特徴とする請求項23に記載のフリップチップ実装体。
- 前記箱状体の通気可能な前記孔が、前記箱状体の前記半導体チップを接着させていない側壁部にのみ開口されていることを特徴とする請求項23または請求項24に記載のフリップチップ実装体。
- 前記回路基板の前記接続端子を囲うように電極を設け、前記電極の上に擬似バンプが形成されていることを特徴とする請求項23から請求項25までのいずれかに記載のフリップチップ実装体。
- 前記電極が、離散的に形成されていることを特徴とする請求項26に記載のフリップチップ実装体。
- 前記箱状体が金属または金属を被覆した樹脂からなり、はんだに対して濡れ性を有していることを特徴とする請求項23から請求項26までのいずれかに記載のフリップチップ実装体。
- 前記回路基板と前記箱状体が圧着または超音波接合によって接合されていることを特徴とする請求項23から請求項26までのいずれかに記載のフリップチップ実装体。
- 前記回路基板と前記箱状体が前記樹脂組成物の樹脂によって接合されたことを特徴とする請求項23から請求項26までのいずれかに記載のフリップチップ実装体。
- 複数の接続端子を有する回路基板と対向させて、複数の電極端子を有する半導体チップを配置し、前記回路基板の接続端子と前記半導体チップの電極端子とを電気的に接続するフリップチップ実装方法であって、
少なくとも1方向が開口した通気可能な孔を有する箱状体の内側に前記半導体チップを位置合わせして接着する工程と、
はんだ粉と対流添加剤および樹脂を主成分とする樹脂組成物を前記回路基板または前記半導体チップに塗布または付着する工程と、
前記回路基板の上に前記半導体チップを接着した前記箱状体を位置合わせして配置とともに、前記箱状体の開口した側の側端部により前記回路基板と前記半導体チップとの間隔を一定にして固定する工程と、
前記樹脂組成物を前記はんだ粉が溶融する温度に加熱し、前記対流添加剤の沸騰または分解によりガスを発生させる工程と、前記ガスが対流し前記箱状体の前記孔から排出する過程で、溶融した前記はんだ粉を前記樹脂組成物中で流動させ、前記はんだ粉を自己集合および成長させることにより前記接続端子と前記電極端子とを電気的に接続させる工程とを有することを特徴とするフリップチップ実装方法。 - 前記樹脂組成物が、板状樹脂、シート状樹脂またはペースト状樹脂からなり、前記回路基板または前記半導体チップに付着させることが可能であることを特徴とする請求項31に記載のフリップチップ実装方法。
- 前記箱状体の開口した側の側端部を前記回路基板に固定する工程が、予め前記回路基板の上に形成された固定用のはんだによって固定されていることを特徴とする請求項31に記載のフリップチップ実装方法。
- 前記箱状体の開口した側の側端部を前記回路基板に固定する工程が、前記回路基板に前記箱状体を圧着または超音波接合によって接合したことを特徴とする請求項31に記載のフリップチップ実装方法。
- 前記箱状体の開口した側の側端部を前記回路基板に固定する工程が、前記樹脂組成物を前記回路基板と前記半導体チップとの間に介在させて、前記箱状体が前記開口した側の側端部が前記回路基板と接するまで押しつける工程であることを特徴とする請求項31に記載のフリップチップ実装方法。
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PCT/JP2006/309339 WO2006123554A1 (ja) | 2005-05-17 | 2006-05-09 | フリップチップ実装体およびフリップチップ実装方法 |
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