JP4084835B2 - フリップチップ実装方法および基板間接続方法 - Google Patents
フリップチップ実装方法および基板間接続方法 Download PDFInfo
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- JP4084835B2 JP4084835B2 JP2007510387A JP2007510387A JP4084835B2 JP 4084835 B2 JP4084835 B2 JP 4084835B2 JP 2007510387 A JP2007510387 A JP 2007510387A JP 2007510387 A JP2007510387 A JP 2007510387A JP 4084835 B2 JP4084835 B2 JP 4084835B2
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/087—Using a reactive gas
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Description
11 接続端子
12 導電性粒子
13 樹脂
14 アンダーフィル材
20 半導体チップ
21 電極端子
30,30a,30b 気泡
40 フリップチップ実装装置
41 保持手段
42 供給手段
43 加熱手段
44 第1の加熱手段
45 第2の加熱手段
46 押圧手段
Claims (17)
- 複数の接続端子を有する回路基板に対向させて、複数の電極端子を有する半導体チップを配置し、前記回路基板の接続端子と前記半導体チップの電極端子とを電気的に接続するフリップチップ実装方法において、
前記回路基板と前記半導体チップとの隙間に、導電性粒子と気泡発生剤を含有した樹脂を供給する第1の工程と、
前記樹脂を加熱して、前記樹脂中に含有する前記気泡発生剤から気泡を発生させる第2の工程と、
前記半導体チップを、前記回路基板に押圧する第3の工程と、
前記樹脂を硬化する第4の工程と
を含み、
前記第2の工程において、前記樹脂は、前記気泡発生剤から発生した気泡が成長することで該気泡外に押し出されることによって、前記回路基板の接続端子と前記半導体チップの電極端子間に自己集合し、
前記第3の工程において、前記端子間に自己集合した前記樹脂中に含有する導電性粒子同士が互いに接触することによって、前記端子間を電気的に接続し、
前記第4の工程において、前記端子間の前記樹脂を硬化することによって、前記半導体チップを前記回路基板に固定することを特徴とするフリップチップ実装方法。 - 前記気泡発生剤は、前記樹脂が加熱されたときに沸騰する材料からなることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記気泡発生剤は、沸点の異なる2種類以上の材料からなることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記気泡発生剤は、前記樹脂が加熱されたときに、前記気泡発生剤が熱分解することにより気体を発生する材料からなることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記気泡発生剤は、結晶水を含む化合物からなり、前記樹脂が加熱されたとき分解されて水蒸気を発生することを特徴とする、請求項4に記載のフリップチップ実装方法。
- 前記第2の工程は、前記回路基板と前記半導体チップとの隙間の間隔を変動させながら実行されることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記第1の工程は、前記回路基板上に、前記導電性粒子と気泡発生剤を含有した樹脂を供給した後、該樹脂表面に前記半導体チップを配設することにより実行されることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記第4の工程は、前記樹脂を加熱して、該樹脂を熱硬化させることにより行なわれることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記第4の工程の後、前記回路基板と前記半導体チップとの隙間にアンダーフィル材を供給し、然る後、該アンダーフィル材を硬化させること工程をさらに含むことを特徴とする、請求項1に記載のフリップチップ実装方法。
- 前記複数の電極端子を有する半導体チップは、半導体ベアチップが前記複数の電極端子を有するインターポーザに搭載された構成になっていることを特徴とする、請求項1に記載のフリップチップ実装方法。
- 複数の電極を有する第1の基板に対向させて、複数の電極を有する第2の基板を配置し、前記第1の基板の電極と前記第2の基板の電極とを電気的に接続する基板間接続方法において、
前記第1の基板と前記第2の基板との隙間に、導電性粒子と気泡発生剤を含有した樹脂を供給する第1の工程と、
前記樹脂を加熱して、前記樹脂中に含有する前記気泡発生剤から気泡を発生させる第2の工程と、
前記第2の基板を、前記第1の基板に押圧する第3の工程と、
前記樹脂を硬化する第4の工程と
を含み、
前記第2の工程において、前記樹脂は、前記気泡発生剤から発生した気泡が成長することで該気泡外に押し出されることによって、前記第1の基板の電極と前記第2の基板の電極間に自己集合し、
前記第3の工程において、前記電極間に自己集合した前記樹脂中に含有する導電性粒子同士が互いに接触することによって、前記電極間を電気的に接続し、
前記第4の工程において、前記電極間に自己集合した前記樹脂を硬化することによって、前記第1の基板を前記第2の基板に固定することを特徴とする基板間接続方法。 - 前記気泡発生剤は、前記樹脂が加熱されたときに沸騰する材料からなることを特徴とする、請求項11に記載の基板間接続方法。
- 前記第2の工程は、前記第1の基板と前記第2の基板との隙間の間隔を変動させながら実行されることを特徴とする、請求項11に記載の基板間接続方法。
- 前記第1の工程は、前記第1の基板上に、前記導電性粒子と気泡発生剤を含有した樹脂を供給した後、該樹脂表面に前記第2の基板を配設することにより実行されることを特徴とする、請求項11に記載の基板間接続方法。
- 前記第4の工程の後、前記第1の基板と前記第2の基板との隙間にアンダーフィル材を供給し、然る後、該アンダーフィル材を硬化させる工程をさらに含むことを特徴とする、請求項11に記載の基板間接続方法。
- 複数の接続端子を有する回路基板に対向させて、複数の電極端子を有する半導体チップが配置され、前記回路基板の接続端子と前記半導体チップの電極端子とが電気的に接続されたフリップチップ実装体において、
前記接続端子と前記電極端子は、前記回路基板と前記半導体チップとの隙間に供給された導電性粒子と気泡発生剤を含有する樹脂が、前記接続端子と前記電極端子間に自己集合し、該自己集合した前記樹脂中の導電性粒子同士が接触することによって、電気的に接続されていることを特徴とするフリップチップ実装体。 - 前記フリップチップ実装体は、前記回路基板と前記半導体チップとの隙間に供給されたアンダーフィル材で固定されていることを特徴とする、請求項16に記載のフリップチップ実装体。
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JP2005094233 | 2005-03-29 | ||
PCT/JP2006/305274 WO2006103949A1 (ja) | 2005-03-29 | 2006-03-16 | フリップチップ実装方法および基板間接続方法 |
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JP2007317969A Pending JP2008078682A (ja) | 2005-03-29 | 2007-12-10 | フリップチップ実装装置 |
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US (2) | US7531385B1 (ja) |
EP (1) | EP1865550A4 (ja) |
JP (2) | JP4084835B2 (ja) |
KR (1) | KR101181140B1 (ja) |
CN (1) | CN100495676C (ja) |
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- 2006-03-16 JP JP2007510387A patent/JP4084835B2/ja not_active Expired - Fee Related
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US10025227B2 (en) | 2013-05-30 | 2018-07-17 | Ricoh Company, Ltd. | Toner container, developing device, process cartridge, and image forming apparatus that include a toner container contacting surface to contact with a developing device engagement releasing structure |
KR20180087471A (ko) | 2013-05-30 | 2018-08-01 | 가부시키가이샤 리코 | 토너 용기, 프로세스 카트리지, 및 화상 형성 장치 |
US20180253032A1 (en) | 2013-05-30 | 2018-09-06 | Tomofumi Yoshida | Toner container, developing device, process cartridge, and image forming apparatus that include a toner container contacting surface to contact with a developing device engagement releasing structure |
KR20190080983A (ko) | 2013-05-30 | 2019-07-08 | 가부시키가이샤 리코 | 토너 용기, 프로세스 카트리지, 및 화상 형성 장치 |
US10365584B2 (en) | 2013-05-30 | 2019-07-30 | Ricoh Company, Ltd. | Toner container, developing device, process cartridge, and image forming apparatus that include a toner container contacting surface to contact with a developing device engagement releasing structure |
KR20190120428A (ko) | 2013-05-30 | 2019-10-23 | 가부시키가이샤 리코 | 토너 용기, 프로세스 카트리지, 및 화상 형성 장치 |
US10564572B2 (en) | 2013-05-30 | 2020-02-18 | Ricoh Company, Ltd. | Toner container with an operating structure disposed on a first side, and a shutter disposed on a second side |
KR20200035504A (ko) | 2013-05-30 | 2020-04-03 | 가부시키가이샤 리코 | 토너 용기, 프로세스 카트리지, 및 화상 형성 장치 |
EP3660592A1 (en) | 2013-05-30 | 2020-06-03 | Ricoh Company, Ltd. | Toner container, process cartridge, and image forming apparatus |
US10915040B2 (en) | 2013-05-30 | 2021-02-09 | Ricoh Company, Ltd. | Toner container with an operating structure disposed on a first side, a shutter disposed on a second side, and a lock |
KR20210027542A (ko) | 2013-05-30 | 2021-03-10 | 가부시키가이샤 리코 | 토너 용기, 프로세스 카트리지, 및 화상 형성 장치 |
US11231664B2 (en) | 2013-05-30 | 2022-01-25 | Ricoh Company, Ltd. | Toner container having a shutter, a lever disposed on one side, and a pivoting portion on the other side which rotate together with a common shaft |
Also Published As
Publication number | Publication date |
---|---|
WO2006103949A1 (ja) | 2006-10-05 |
US7531385B1 (en) | 2009-05-12 |
US7820021B2 (en) | 2010-10-26 |
US20090126876A1 (en) | 2009-05-21 |
KR101181140B1 (ko) | 2012-09-14 |
JP2008078682A (ja) | 2008-04-03 |
US20090115071A1 (en) | 2009-05-07 |
KR20070115957A (ko) | 2007-12-06 |
CN100495676C (zh) | 2009-06-03 |
CN101142664A (zh) | 2008-03-12 |
EP1865550A1 (en) | 2007-12-12 |
EP1865550A4 (en) | 2012-07-11 |
JPWO2006103949A1 (ja) | 2008-09-04 |
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