JPH11204435A5 - - Google Patents
Info
- Publication number
- JPH11204435A5 JPH11204435A5 JP1998018098A JP1809898A JPH11204435A5 JP H11204435 A5 JPH11204435 A5 JP H11204435A5 JP 1998018098 A JP1998018098 A JP 1998018098A JP 1809898 A JP1809898 A JP 1809898A JP H11204435 A5 JPH11204435 A5 JP H11204435A5
- Authority
- JP
- Japan
- Prior art keywords
- silicon film
- amorphous silicon
- semiconductor device
- crystalline silicon
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01809898A JP4376979B2 (ja) | 1998-01-12 | 1998-01-12 | 半導体装置の作製方法 |
| US09/227,577 US6693044B1 (en) | 1998-01-12 | 1999-01-08 | Semiconductor device and method of manufacturing the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01809898A JP4376979B2 (ja) | 1998-01-12 | 1998-01-12 | 半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH11204435A JPH11204435A (ja) | 1999-07-30 |
| JPH11204435A5 true JPH11204435A5 (enExample) | 2005-08-04 |
| JP4376979B2 JP4376979B2 (ja) | 2009-12-02 |
Family
ID=11962164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01809898A Expired - Fee Related JP4376979B2 (ja) | 1998-01-12 | 1998-01-12 | 半導体装置の作製方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US6693044B1 (enExample) |
| JP (1) | JP4376979B2 (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4376979B2 (ja) | 1998-01-12 | 2009-12-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6515648B1 (en) | 1999-08-31 | 2003-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Shift register circuit, driving circuit of display device, and display device using the driving circuit |
| US6580094B1 (en) * | 1999-10-29 | 2003-06-17 | Semiconductor Energy Laboratory Co., Ltd. | Electro luminescence display device |
| JP2001147446A (ja) | 1999-11-19 | 2001-05-29 | Hitachi Ltd | 液晶表示装置とその製造方法 |
| US7232742B1 (en) * | 1999-11-26 | 2007-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device that includes forming a material with a high tensile stress in contact with a semiconductor film to getter impurities from the semiconductor film |
| JP2001168363A (ja) * | 1999-12-10 | 2001-06-22 | Toyota Central Res & Dev Lab Inc | 太陽電池の製造方法 |
| TW473800B (en) * | 1999-12-28 | 2002-01-21 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
| US7503975B2 (en) | 2000-06-27 | 2009-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method therefor |
| JP2002246310A (ja) * | 2001-02-14 | 2002-08-30 | Sony Corp | 半導体薄膜の形成方法及び半導体装置の製造方法、これらの方法の実施に使用する装置、並びに電気光学装置 |
| JP5072147B2 (ja) * | 2001-05-24 | 2012-11-14 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6897477B2 (en) | 2001-06-01 | 2005-05-24 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device, manufacturing method thereof, and display device |
| JP4267266B2 (ja) | 2001-07-10 | 2009-05-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TWI282126B (en) * | 2001-08-30 | 2007-06-01 | Semiconductor Energy Lab | Method for manufacturing semiconductor device |
| US7238557B2 (en) | 2001-11-14 | 2007-07-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of fabricating the same |
| JP3626734B2 (ja) * | 2002-03-11 | 2005-03-09 | 日本電気株式会社 | 薄膜半導体装置 |
| KR100475077B1 (ko) * | 2002-05-31 | 2005-03-10 | 삼성전자주식회사 | 캐패시터의 유전막 형성방법 |
| US6882010B2 (en) * | 2002-10-03 | 2005-04-19 | Micron Technology, Inc. | High performance three-dimensional TFT-based CMOS inverters, and computer systems utilizing such novel CMOS inverters |
| JP4928045B2 (ja) * | 2002-10-31 | 2012-05-09 | 大日本印刷株式会社 | 相変化型メモリ素子およびその製造方法 |
| US7374976B2 (en) * | 2002-11-22 | 2008-05-20 | Semiconductor Energy Laboratory Co., Ltd. | Method for fabricating thin film transistor |
| JP2005228819A (ja) * | 2004-02-10 | 2005-08-25 | Mitsubishi Electric Corp | 半導体装置 |
| US7618898B2 (en) * | 2004-03-31 | 2009-11-17 | Nec Corporation | Method and apparatus for forming contact hole |
| TWI256515B (en) * | 2004-04-06 | 2006-06-11 | Quanta Display Inc | Structure of LTPS-TFT and fabricating method thereof |
| US7291522B2 (en) * | 2004-10-28 | 2007-11-06 | Hewlett-Packard Development Company, L.P. | Semiconductor devices and methods of making |
| JP4272142B2 (ja) * | 2004-12-07 | 2009-06-03 | 株式会社ルネサステクノロジ | スイッチング素子並びにそれを用いたアンテナスイッチ回路及び高周波モジュール |
| US7897971B2 (en) * | 2007-07-26 | 2011-03-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| JP2009070861A (ja) * | 2007-09-11 | 2009-04-02 | Hitachi Displays Ltd | 表示装置 |
| KR100957780B1 (ko) | 2007-12-17 | 2010-05-13 | 한국전자통신연구원 | 투명 전자 소자 및 그 제조 방법 |
| US8314765B2 (en) | 2008-06-17 | 2012-11-20 | Semiconductor Energy Laboratory Co., Ltd. | Driver circuit, display device, and electronic device |
| JP5515276B2 (ja) * | 2008-10-31 | 2014-06-11 | 大日本印刷株式会社 | 半導体装置の製造方法及び半導体装置 |
| KR101049806B1 (ko) | 2008-12-30 | 2011-07-15 | 삼성모바일디스플레이주식회사 | 다결정 실리콘의 제조방법, 박막트랜지스터, 그의 제조방법및 이를 포함하는 유기전계발광표시장치 |
| KR101049805B1 (ko) | 2008-12-30 | 2011-07-15 | 삼성모바일디스플레이주식회사 | 다결정 실리콘의 제조방법, 박막트랜지스터, 그의 제조방법및 이를 포함하는 유기전계발광표시장치 |
| TWI535028B (zh) * | 2009-12-21 | 2016-05-21 | 半導體能源研究所股份有限公司 | 薄膜電晶體 |
| KR101836067B1 (ko) * | 2009-12-21 | 2018-03-08 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 박막 트랜지스터와 그 제작 방법 |
| US20120256185A1 (en) * | 2009-12-21 | 2012-10-11 | Sharp Kabushiki Kaisha | Semiconductor device and process for production thereof, and display device |
| US8476744B2 (en) | 2009-12-28 | 2013-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistor with channel including microcrystalline and amorphous semiconductor regions |
| KR101041147B1 (ko) | 2010-04-07 | 2011-06-13 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터, 박막 트랜지스터의 액티브층의 제조 방법 및 표시 장치 |
| US8629438B2 (en) * | 2010-05-21 | 2014-01-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US9230826B2 (en) | 2010-08-26 | 2016-01-05 | Semiconductor Energy Laboratory Co., Ltd. | Etching method using mixed gas and method for manufacturing semiconductor device |
| US8704230B2 (en) | 2010-08-26 | 2014-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| US11791159B2 (en) * | 2019-01-17 | 2023-10-17 | Ramesh kumar Harjivan Kakkad | Method of fabricating thin, crystalline silicon film and thin film transistors |
| KR20210085377A (ko) * | 2019-12-30 | 2021-07-08 | 엘지디스플레이 주식회사 | 표시 장치 |
| KR20220033596A (ko) * | 2020-09-08 | 2022-03-17 | 삼성디스플레이 주식회사 | 다결정 실리콘층의 제조 방법, 표시 장치 및 이의 제조 방법 |
| JP7616771B2 (ja) * | 2021-04-06 | 2025-01-17 | 東京エレクトロン株式会社 | アモルファスシリコン膜の結晶化方法 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3300400A1 (de) | 1982-01-06 | 1983-07-14 | Canon K.K., Tokyo | Halbleiterbauelement |
| US4871920A (en) | 1988-04-18 | 1989-10-03 | General Electric Company | High power wide band amplifier using optical techniques and impedance matching to source and load |
| JPH02222546A (ja) | 1989-02-23 | 1990-09-05 | Nec Corp | Mos型電界効果トランジスタの製造方法 |
| JPH0824146B2 (ja) | 1989-10-19 | 1996-03-06 | 株式会社東芝 | Mos型集積回路 |
| US5147826A (en) | 1990-08-06 | 1992-09-15 | The Pennsylvania Research Corporation | Low temperature crystallization and pattering of amorphous silicon films |
| US5578520A (en) | 1991-05-28 | 1996-11-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for annealing a semiconductor |
| TW226478B (en) | 1992-12-04 | 1994-07-11 | Semiconductor Energy Res Co Ltd | Semiconductor device and method for manufacturing the same |
| CN1052110C (zh) | 1993-02-15 | 2000-05-03 | 株式会社半导体能源研究所 | 制造半导体器件的方法 |
| US5275851A (en) | 1993-03-03 | 1994-01-04 | The Penn State Research Foundation | Low temperature crystallization and patterning of amorphous silicon films on electrically insulating substrates |
| US6413805B1 (en) | 1993-03-12 | 2002-07-02 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device forming method |
| TW278219B (enExample) | 1993-03-12 | 1996-06-11 | Handotai Energy Kenkyusho Kk | |
| JP2762215B2 (ja) | 1993-08-12 | 1998-06-04 | 株式会社半導体エネルギー研究所 | 薄膜トランジスタおよび半導体装置の作製方法 |
| US5923962A (en) | 1993-10-29 | 1999-07-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing a semiconductor device |
| JP3431033B2 (ja) | 1993-10-29 | 2003-07-28 | 株式会社半導体エネルギー研究所 | 半導体作製方法 |
| TW264575B (enExample) | 1993-10-29 | 1995-12-01 | Handotai Energy Kenkyusho Kk | |
| JP2759415B2 (ja) | 1993-11-05 | 1998-05-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| TW299897U (en) * | 1993-11-05 | 1997-03-01 | Semiconductor Energy Lab | A semiconductor integrated circuit |
| JP2873669B2 (ja) | 1993-12-24 | 1999-03-24 | 株式会社半導体エネルギー研究所 | 半導体装置およびその作製方法 |
| JP3221473B2 (ja) * | 1994-02-03 | 2001-10-22 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US5401982A (en) | 1994-03-03 | 1995-03-28 | Xerox Corporation | Reducing leakage current in a thin-film transistor with charge carrier densities that vary in two dimensions |
| JP3192546B2 (ja) * | 1994-04-15 | 2001-07-30 | シャープ株式会社 | 半導体装置およびその製造方法 |
| JP3540012B2 (ja) * | 1994-06-07 | 2004-07-07 | 株式会社半導体エネルギー研究所 | 半導体装置作製方法 |
| TW406861U (en) | 1994-07-28 | 2000-09-21 | Semiconductor Energy Lab | Laser processing system |
| JP3464287B2 (ja) | 1994-09-05 | 2003-11-05 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP2616741B2 (ja) | 1995-04-27 | 1997-06-04 | 日本電気株式会社 | 多結晶シリコン−ゲルマニウム薄膜トランジスタの製造方法 |
| JPH09321305A (ja) | 1996-05-24 | 1997-12-12 | Sharp Corp | 薄膜トランジスタ及びそれを用いた液晶表示装置 |
| JP3645377B2 (ja) | 1996-10-24 | 2005-05-11 | 株式会社半導体エネルギー研究所 | 集積回路の作製方法 |
| TW379360B (en) | 1997-03-03 | 2000-01-11 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
| JP3032801B2 (ja) | 1997-03-03 | 2000-04-17 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6066547A (en) | 1997-06-20 | 2000-05-23 | Sharp Laboratories Of America, Inc. | Thin-film transistor polycrystalline film formation by nickel induced, rapid thermal annealing method |
| US5998804A (en) * | 1997-07-03 | 1999-12-07 | Hna Holdings, Inc. | Transistors incorporating substrates comprising liquid crystal polymers |
| JP4376979B2 (ja) | 1998-01-12 | 2009-12-02 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US6388270B1 (en) | 1998-03-27 | 2002-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and process for producing same |
| US6482684B1 (en) | 1998-03-27 | 2002-11-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a TFT with Ge seeded amorphous Si layer |
| JP2000114172A (ja) | 1998-08-07 | 2000-04-21 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| US6559036B1 (en) | 1998-08-07 | 2003-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing the same |
| US7503975B2 (en) | 2000-06-27 | 2009-03-17 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and fabrication method therefor |
| JP4267266B2 (ja) | 2001-07-10 | 2009-05-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
-
1998
- 1998-01-12 JP JP01809898A patent/JP4376979B2/ja not_active Expired - Fee Related
-
1999
- 1999-01-08 US US09/227,577 patent/US6693044B1/en not_active Expired - Fee Related
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